NE5532
,
NE5532A
,
SA5532
,
SA5532A
SLOS075J –NOVEMBER 1979–REVISED JANUARY 2015
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC+ 0 22 V
VCC Supply voltage(2) VCC– –22 0 V
Input voltage, either input(2)(3) VCC– VCC+ V
Input current(4) –10 10 mA
Duration of output short circuit(5) Unlimited
TJOperating virtual-junction temperature 150 °C
Tstg Storage temperature range –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential voltages, are with respect to the midpoint between VCC+ and VCC–.
(3) The magnitude of the input voltage must never exceed the magnitude of the supply voltage.
(4) Excessive input current will flow if a differential input voltage in excess of approximately 0.6 V is applied between the inputs, unless
some limiting resistance is used.
(5) The output may be shorted to ground or either power supply. Temperature and/or supply voltages must be limited to ensure the
maximum dissipation rating is not exceeded.
7.2 ESD Ratings VALUE UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all 2000
pins(1)
V(ESD) Electrostatic discharge V
Charged device model (CDM), per JEDEC specification JESD22- 1000
C101, all pins(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions MIN MAX UNIT
VCC+ Supply voltage 5 15 V
VCC– Supply voltage –5 –15 V
NE5532, NE5532A 0 70
TAOperating free-air temperature °C
SA5532, SA5532A –40 85
7.4 Thermal Information NE5532, NE5532A, SA5532, and SA5532A
THERMAL METRIC(1) D P PS UNIT
8 PINS
RθJA Junction-to-ambient thermal resistance (2)(3) 97 85 95 °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The package thermal impedance is calculated in accordance with JESD 51-7.
(3) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD= (TJ(max) – TA) / θJA. Operating at the absolute maximum TJof 150°C can affect reliability.
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