Kyocera's series of Multilayer Ceramic Chip Capacitors
are designed to meet a wide variety of needs. We offer
a complete range of products for both general and
specialized applications, including CM series for general-
purpose, CT series for low profile, CU series for Hi-Q,
DM series for automotive, CF series for high-voltage,
AT series for Au termination, and ST series for soft
termination.
Features
We have factories worldwide in order to supply our global customer
bases quickly and efficiently and to maintain our reputation as one
of the highest−volume producers in the industry.
All our products are highly reliable due to their monolithic structure
of high−purity and superfine uniform ceramics and their integral
internal electrodes.
By combining superior manufacturing technology and materials
with high dielectric constants, we produce extremely compact
components with exceptional specifications.
Our stringent quality control in every phase of production from
material procurement to shipping ensures consistent manufacturing
and super quality.
Kyocera components are available in a wide choice of dimensions,
temperature characteristics, rated voltages, and terminations to
meet specific configurational requirements.
CM
series
General
ST
series
Soft Termination
AT
series
Au Termination
CU
series
High-Q
CF
series
High-Voltage
CT
series
Low Profile
DM
series
Automotive
Multilayer
Ceramic Chip
Capacitors
RoHS Compliant
Tape and Reel Bulk Case
Please contact your local AVX, Kyocera sales office or distributor for
specifications not covered in this catalog.
Our products are continually being improved. As a result, the
capacitance range of each series is subject to change without notice.
Please contact an sales representative to confirm compatibility with
your application.
External Termination
Electrodes
Internal Electrodes
(Pd, Pd/ Ag or Ni or Cu)
Dielectric Ceramic Layer
Temperature compensation: Titanate family
Zirconate family
High dielectric constant:
Barium Titanate family
Nickel Barrier Termination Products
Ag or Cu or CuNi
Ni Plating
Sn or Au or Cu Plating
Structure
Multilayer Ceramic Chip Capacitors
Kyocera Ceramic Chip Capacitors are available for different applications as classified below:
Series Dielectric Options Typical Applications Features Terminations Available Size
CM
C0G (NP0)
X5R
X7R
X6S
X7S
General purpose Wide cap range Nickel barrier/ Tin
01005, 0201, 0402
0603, 0805, 1206
1210, 1812
CT X5R
X7R
IC card
(Decoupling) Low profile Nickel barrier/ Tin 0201, 0402, 0603
0805, 1206, 1210
CU C0G (NP0) Power amplifier High-Q Nickel barrier/ Tin 01005
DM X7R Automotive
Thermal shock
Resistivity
High reliability
Nickel barrier/ Tin 0603,0805,1206
CF C0G (NP0)
X7R
High voltage
&
Power circuits
High voltage
250VDC, 630VDC
1000VDC, 2000VDC
3000VDC, 4000VDC
Nickel barrier/ Tin
0805, 1206, 1210
1812, 2208, 1808
2220
AT X5R
X7R
Optical
communications Au termination Nickel barrier/ Au 0201,0402
ST
X5R
X7R
X7S
PCB with
severe bending
conditions
Soft termination Nickel barrier/ Tin
(Soft Termination) 1206,1210
Option
Negative temperature coefficient dielectric types are available on request.
Multilayer Ceramic Chip Capacitors
Multilayer Ceramic Chip Capacitors
Dimensions
W
T
L
PP
PP
Dimensions and Packaging Quantities
Size Code Dimension
Code
Dimensions (mm) Maximum quantity per reel
JIS EIA L W T P min. P max.
P to P min.
φ180 Reelφ330 Reel
02 0402 01005 A0.4±0.02 0.2±0.02 0.2±0.02 0.07 0.14 0.13 40kp (E4/1) -
20kp (P8/2) -
03 0603 0201
A
0.6±0.03 0.3±0.03
0.22 max.
0.10 0.20 0.20
30kp (P8/1) 150kp (P8/1)
15kp (P8/2) 50kp (P8/2)
B0.3±0.03 30kp (P8/1) 150kp (P8/1)
15kp (P8/2) 50kp (P8/2)
C0.6±0.05 0.3±0.05 0.3±0.05 0.13 0.23 0.19 30kp (P8/1) 150kp (P8/1)
15kp (P8/2) 50kp (P8/2)
D0.6±0.09 0.3±0.09 0.3±0.09 0.10 0.20 0.20 15kp (P8/2) -
E0.25 max. 15kp (P8/2) -
05 1005 0402
A
1.0±0.05 0.5±0.05
0.22 max.
0.15 0.35 0.30
20kp (P8/1) 100kp (P8/1)
10kp (P8/2) 50kp (P8/2)
B0.25 max. 20kp (P8/1) 100kp (P8/1)
10kp (P8/2) 50kp (P8/2)
C0.33 max. 20kp (P8/1) 100kp (P8/1)
10kp (P8/2) 50kp (P8/2)
D0.35 max. 20kp (P8/1) 100kp (P8/1)
10kp (P8/2) 50kp (P8/2)
E0.5±0.05 20kp (P8/1) 100kp (P8/1)
10kp (P8/2) 50kp (P8/2)
F
1.0±0.10 0.5±0.10
0.35 max. 20kp (P8/1) 100kp (P8/1)
10kp (P8/2) 50kp (P8/2)
G0.5±0.10 20kp (P8/1) 50kp (P8/2)
10kp (P8/2)
H1.0±0.15 0.5±0.15 0.5±0.15 20kp (P8/1) 50kp (P8/2)
10kp (P8/2)
J1.0±0.20 0.5±0.20 0.33 max. 10kp (P8/2) -
K0.5±0.20 10kp (P8/2) -
105 1608 0603
A
1.6±0.10 0.8±0.10
0.55 max.
0.20 0.60 0.50
4kp (P8/4) 10kp (P8/4)
B0.8±0.10 8kp (P8/2) 20kp (P8/2)
4kp (P8/4) 10kp (P8/4)
C
1.6±0.15 0.8±0.15
0.55 max. 8kp (P8/2) 20kp (P8/2)
4kp (P8/4) 10kp (P8/4)
D0.8±0.15 8kp (P8/2) 20kp (P8/2)
4kp (P8/4) 10kp (P8/4)
E1.6±0.20 0.8±0.20 0.55 max. 8kp (P8/2) 20kp (P8/2)
4kp (P8/4) 10kp (P8/4)
F0.8±0.20 -
21 2012 0805
A
2.0±0.10 1.25±0.10
0.55 max.
0.20 0.75 0.70
4kp (P8/4) 10kp (P8/4)
B0.95 max. 4kp (P8/4) 10kp (P8/4)
C1.00 max. 4kp (E8/4) 10kp (E8/4)
D0.6±0.1 4kp (P8/4) 10kp (P8/4)
E0.85±0.10 4kp (P8/4) 10kp (P8/4)
F1.05±0.10 3kp (E8/4) 10kp (E8/4)
G1.25±0.10 3kp (E8/4) 10kp (E8/4)
H
2.0±0.15 1.25±0.15
0.55 max. 4kp (P8/4) 10kp (P8/4)
J0.95 max. 4kp (P8/4) 10kp (P8/4)
K1.25±0.15 3kp (E8/4) 10kp (E8/4)
L2.0±0.20 1.25±0.20 0.95 max. 4kp (P8/4) 10kp (P8/4)
M1.25±0.20 3kp (E8/4) 10kp (E8/4)
316 3216 1206
A
3.2±0.20 1.6±0.15
0.85±0.10
0.30 0.85 1.40
4kp (P8/4) 10kp (P8/4)
B0.95 max. 4kp (P8/4) 10kp (P8/4)
C1.00 max. 4kp (E8/4) 10kp (E8/4)
D1.15±0.10 3kp (E8/4) 10kp (E8/4)
E1.25±0.10 3kp (E8/4) 10kp (E8/4)
F1.6±0.15 2.5kp (E8/4) 5kp (E8/4)
G
3.2±0.20 1.6±0.20
0.95 max. 4kp (P8/4) 10kp (P8/4)
H1.00 max. 4kp (E8/4) 10kp (E8/4)
J1.6±0.20 2.5kp (E8/4) 5kp (E8/4)
K3.2±0.30 1.6±0.30 1.6±0.30 0.50 0.70 1.90 2kp (E8/4) -
L3.2±0.35 2kp (E8/4) -
32 3225 1210
A
3.2±0.20 2.5±0.20
1.00 max.
0.30 1.00 1.40
4kp (E8/4) 10kp (E8/4)
B1.40 max. 3kp (E8/4) 10kp (E8/4)
C1.60 max. 2.5kp (E8/4) 5kp (E8/4)
D1.6±0.15 2.5kp (E8/4) 5kp (E8/4)
E2.20 max. 2kp (E8/4) 5kp (E8/4)
F2.0±0.2 2kp (E8/4) 5kp (E8/4)
G2.5±0.2 1kp (E8/4) 4kp (E8/4)
42 4520 1808 A4.5±0.20 2.0±0.20 1.6 max. 0.15 0.85 2.60 2kp (E12/4) -
B2.2 max. 2kp (E12/4) -
43 4532 1812
A
4.5±0.30 3.2±0.20
2.0 max.
0.30 1.10 2.00
1kp (E12/8) -
B2.0±0.2 1kp (E12/8) -
C2.5 max. 0.5kp (E12/8) -
D2.5±0.2 0.5kp (E12/8) -
E2.8 max. 0.5kp (E12/8) -
F2.8±0.2 0.5kp (E12/8) -
52 5720 2208 A5.7±0.40 2.0±0.20 2.2 max. 0.15 0.85 4.20 2kp (E12/4) -
55 5750 2220
A
5.7±0.40 5.0±0.40
2.0 max.
0.30 1.40 2.50
1kp (E12/8) -
B2.5 max. 0.5kp (E12/8) -
C2.8 max. 0.5kp (E12/8) -
Note: Taping denotes the quantity packaged per reel (kp means 1000 pieces).  Please contact us.
Packaging Code
E8/
Taping Material Taping Width Pitch
2
Code
E
P
Material
Plastic
Paper
Code
4
8
12
Width
4mm
8mm
12mm
Code
1
2
4
8
Pitch
1mm
2mm
4mm
8mm
KYOCERA PART NUMBER CM 21 X7R 104 K 50 A T □□□
SERIES CODE
CM = General Purpose
CT = Low Profile
CU = High-Q
DM = Automotive
CF = High Voltage
AT = Au termination
ST = Soft termination
SIZE CODE
SIZE EIA (JIS)
02 = 01005 (0402)
03 = 0201 (0603)
05 = 0402 (1005)
105 = 0603 (1608)
21 = 0805 (2012)
316 = 1206 (3216)
SIZE EIA (JIS)
32 = 1210 (3225)
42 = 1808 (4520)
43 = 1812 (4532)
52 = 2208 (5720)
55 = 2220 (5750)
DIELECTRIC CODE
CODE EIA CODE
CG = C0G (NPO)
X5R = X5R
X7R = X7R
X7S = X7S (Option)
X6S = X6S (Option)
Negative temperature coefficient dielectric types are available on request.
CAPACITANCE CODE
Capacitance expressed in pF.
Two significant digits plus number of zeros.
For Values < 10pF, Letter R denotes decimal point,
eg.
100000pF = 104
0.1μF = 104
4700pF = 472
1.5pF = 1R5
0.5pF = R50
100μF = 107
TOLERANCE CODE
A = ±0.05pF (option)
B = ±0.1pF
C = ±0.25pF
D = ±0.5pF
G = ±2% (option)
J = ±5%
K = ±10%
M
= ±20%
VOLTAGE CODE
04 = 4VDC
06 = 6.3VDC
10 = 10VDC
16 = 16VDC
25 = 25VDC
50 = 50VDC
100 = 100VDC
250 = 250VDC
400 = 400VDC
630 = 630VDC
1000 = 1000VDC
2000 = 2000VDC
3000 = 3000VDC
4000 = 4000VDC
TERMINATION CODE
A = Nickel Barrier/ Tin G = Nickel Barrier/ Au Y = Nickel Barrier/ Cu S = Nickel Barrier/ Tin
(Soft Termination)
K = Nickel Barrier/ Au
G : AuSn solder and conductive adhesive.
K : Wire bonding and conductive adhesive.
PACKAGING CODE
B = Bulk
C = Bulk Cassette (option)
T = 7" Reel Taping & 4mm or 8mm1 Cavity pitch
Q = 7" Reel Taping & 1mm Cavity pitch
L = 13" Reel Taping & 4mm Cavity pitch
H = 7" Reel Taping & 2mm Cavity pitch
N = 13" Reel Taping & 2mm Cavity pitch
W = 13" Reel Taping & 1mm Cavity pitch
P = 7" Reel Taping & 1mm Cavity pitch
Carrier tape width 4mm.
1 Applied for size 43 to 55.
OPTION
Thickness max. value is indicated in CT series
EX. 125 1.25mm max.
095 0.95mm max.
Multilayer Ceramic Chip Capacitors
Ordering Information
Multilayer Ceramic Chip Capacitors
Temperature Characteristics and Tolerance
Temperature Compensation Type
Code ppm/ °C Temperature Range
CG 0±30 55 to 125°C
CH ±60
Note: All parts of C0G will be marked as “CG” but will conform to the above table.
Temperature coefficients are determined by calculation based on measurement at 20°C and 85°C.
High Dielectric Constant Type
EIA Dielectric Temperature Range ΔC max.
X5R 55 to 85°C±15%
X7R 55 to 125°C
X7S 55 to 125°C±22%
X6S 55 to 105°C
option
Available Tolerances
Dielectric materials, capacitance values and tolerances are
available in the following combinations only:
EIA Dielectric Tolerance Capacitance
C0G
3 A0.05pF
B0.1pF
<0.5pF
5pF
C0.25pF
D0.50pF
1 <10pF
3 G2%
J5%
K10%
10pF
E12 Series
2 K10%
M20%
4 E3 Series
3 X6S
X7S
X5R
X7R
Note:
1 Nominal values below 10pF are available in the standard values of 0.5pF, 1.0pF, 1.5pF,
2.0pF, 3.0pF, 4.0pF, 5.0pF, 6.0pF, 7.0pF, 8.0pF, 9.0pF
2 J = ±5% for X7R (X5R) is available on request.
3 option
4 E6 series is available on request.
E Standard Number
E3 E6 E12 E24 (Option)
1.0
1.0
1.0 1.0 1.1
1.2 1.2 1.3
1.5
1.5 1.5 1.6
1.8 1.8 2.0
2.2
2.2
2.2 2.2 2.4
2.7 2.7 3.0
3.3
3.3 3.3 3.6
3.9 3.9 4.3
4.7
4.7
4.7 4.7 5.1
5.6 5.6 6.2
6.8
6.8 6.8 7.5
8.2 8.2 9.1
Temperature Compensation Dielectric
Size
(EIA Code)
CM02
(01005)
CM03
(0201)
CM05
(0402)
CM105
(0603)
CM21
(0805)
Temperature
CΔ1CΔ1CΔ1CΔ1CΔ1
Rated Voltage (VDC)
16 25 50 50 50 16 25 50
Capacitance (pF)
R20 0.2
R50 0.5
1R0 1.0
1R5 1.5
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
100 10
120 12
15
18
22
27
33
39
47
56
68
82
101 100
AB
B
121 120
150
180
220
270
330
390
470
E
560
680
820
102 1000
B
122 1200
1500
1800
2200
E
2700 E
3300
3900
4700
G
5600
6800
8200
103 10000
G
123 12000
15000
18000
<Standard Capacitance Value>
E12 Series
Please contact for capacitance value other than standard.
1: CG,CH
Alphabets in capacitance chart denote dimensions.
Please refer to the below table for detail.
Size Size
Code
Dimension (mm)
LWT
02 A 0.4±0.02 0.2±0.02 0.2±0.02
03 B 0.6±0.03 0.3±0.03 0.3±0.03
05 E 1.0±0.05 0.5±0.05 0.5±0.05
105 B 1.6±0.10 0.8±0.10 0.8±0.10
21 E2.0±0.10 1.25±0.10 0.85±0.10
G2.0±0.10 1.25±0.10 1.25±0.10
(Example)
In case of “B” for CM03;
L : 0.6±0.03mm
W : 0.3±0.03mm
T : 0.3±0.03mm
[RoHS Compliant Products]
CM Series
General
Features
We offer a diverse product line ranging from ultra−compact
(0.4×0.2mm) to large (4.5×3.2mm) components configured for a
variety of temperature characteristics, rated voltages, and packages.
We offer the choice and flexibility for almost any applications.
Applications
This standard type is ideal for use in a wide range of applications,
from commercial to industrial equipment.
CM Series
General
[RoHS Compliant Products]
X5R Dielectric
Size
(EIA Code) CM316
(1206) CM32
(1210) CM43
(1812)
Rated Voltage (VDC)
6.3 10 16 25 50 100 4 6.3 10 16 25 50 6.3 50
Capacitance (pF)
220000
470000
105 1000000 B3 F1
2200000 F3 D1
4700000
F3
J3 C3 G3
106 10000000 F5 F4 F3
J8 F4 G3
22000000 J8 J8 G4 G3 G8
47000000 J5 G5
107 100000000 G5 F5
J3
<Standard Capacitance Value>
CM21 size and smaller : E6 Series
CM316 size and larger / capacitance value of 0.1μF and larger : E3 Series
Please contact for capacitance value other than standard.
Optional Spec.
Two digits alphanumerics in capacitance chart denote dimensions and tan δ.
Please refer to the below table for detail.
Size Size
Code
Dimension (mm)
LWT
316
D3.2±0.20 1.6±0.15 1.15±0.10
F3.2±0.20 1.6±0.15 1.6±0.15
J3.2±0.20 1.6±0.20 1.6±0.20
K3.2±0.30 1.6±0.30 1.6±0.30
32
B3.2±0.20 2.5±0.20 1.40 max.
C3.2±0.20 2.5±0.20 1.60 max.
F3.2±0.20 2.5±0.20 2.0±0.2
G3.2±0.20 2.5±0.20 2.5±0.2
43 D4.5±0.30 3.2±0.20 2.5±0.2
F4.5±0.30 3.2±0.20 2.8±0.2
Size Size
Code
Dimension (mm)
LWT
02 A 0.4±0.02 0.2±0.02 0.2±0.02
03
B0.6±0.03 0.3±0.03 0.3±0.03
C0.6±0.05 0.3±0.05 0.3±0.05
D0.6±0.09 0.3±0.09 0.3±0.09
05
E1.0±0.05 0.5±0.05 0.5±0.05
G1.0±0.10 0.5±0.10 0.5±0.10
H1.0±0.15 0.5±0.15 0.5±0.15
K1.0±0.20 0.5±0.20 0.5±0.20
105 B1.6±0.10 0.8±0.10 0.8±0.10
D1.6±0.15 0.8±0.15 0.8±0.15
21
G2.0±0.10 1.25±0.10 1.25±0.10
K2.0±0.15 1.25±0.15 1.25±0.15
M2.0±0.20 1.25±0.20 1.25±0.20
Tan δ
Code Tan δ
12.5% max.
23.5% max.
35.0% max.
47.0% max.
57.5% max.
7
10.0% max.
8
12.5% max.
9
15.0% max.
10
20.0% max.
(Example)
In case of “B2” for CM03;
L : 0.6±0.03mm
W : 0.3±0.03mm
T : 0.3±0.03mm
Tan
δ : 3.5% max.
Size
(EIA Code) CM02
(01005) CM03
(0201) CM05
(0402) CM105
(0603) CM21
(0805)
Rated Voltage (VDC)
6.3 10 16 6.3 10 16 25 4 6.3 10 16 25 4 6.3 10 16 25 50 4 6.3 10 16 25 50
Capacitance (pF)
101 100
151 150
220
330
470
680
102 1000
152 1500
2200
3300
4700
6800
103 10000
A8 A8
B4
B3
B3
153 15000
22000
33000
47000
68000
104 100000
A8
E3 E3 B1
G1
220000 A8
B7 B7
E5 E8 E8
B3
470000 B8
105 1000000 C8
D10
E7 E8 G7 B4
B3 D8
G3
G8
2200000 D8 D9 G8 E8
E8
B5 B8 B8 G3
4700000
H10
H8 K8 D5 D8 G5 G4 K8
106 10000000 D8 M5 M8 M8
M8
22000000 M7
47000000
107 100000000
Two digits alphanumerics in capacitance chart denote dimensions and tan δ.
Please refer to the below table for detail.
[RoHS Compliant Products]
CM Series
General
X7R Dielectric
Size
(EIA Code)
CM02
(01005)
CM03
(0201)
CM05
(0402)
CM105
(0603)
CM21
(0805)
Rated Voltage (VDC)
16 10 16 25 16 25 6.3 10 16 25 50 6.3 10 16 25 50
Capacitance (pF)
101 100
151 150
220
330
B2
`
470
680
102 1000
B2
152 1500
2200
A8
3300
4700
6800
103 10000
B3
E3
153 15000
22000 E2
33000
47000
68000
104 100000
E8 E8
B2 B2
B1
G1
220000 B3 G2
470000 D8 G2
105 1000000 B8 B8 G3 G8 G8 M3
2200000 D8 M8
4700000 M8 M8
106 10000000 M8 M8
22000000
Size
(EIA Code)
CM316
(1206)
CM32
(1210)
CM43
(1812)
Rated Voltage (VDC)
6.3 10 16 25 50 100 10 16 25 50 100 50 100
Capacitance (pF)
47000 D1
104 100000
220000 F1
470000 B1 G1
105 1000000 D2 F2 B2 F1 B1 D1
2200000 F3 J3 F2 D1
4700000 J8 J3 G2
106 10000000 J8 J8 J3 G8 G3
22000000 J8 J5 G8 G8
Optional Spec.
Size Size
Code
Dimension (mm)
LWT
02 A 0.4±0.02 0.2±0.02 0.2±0.02
03 B 0.6±0.03 0.3±0.03 0.3±0.03
05 E 1.0±0.05 0.5±0.05 0.5±0.05
105 B1.6±0.10 0.8±0.10 0.8±0.10
D1.6±0.15 0.8±0.15 0.8±0.15
21 G2.0±0.10 1.25±0.10 1.25±0.10
M2.0±0.20 1.25±0.20 1.25±0.20
Size Size
Code
Dimension (mm)
LWT
316
A3.2±0.20 1.6±0.15 0.85±0.10
D3.2±0.20 1.6±0.15 1.15±0.10
F3.2±0.20 1.6±0.15 1.6±0.15
J3.2±0.20 1.6±0.20 1.6±0.20
K3.2±0.30 1.6±0.30 1.6±0.30
32
B3.2±0.20 2.5±0.20 1.40 max.
F3.2±0.20 2.5±0.20 2.0±0.2
G3.2±0.20 2.5±0.20 2.5±0.2
43 B4.5±0.30 3.2±0.20 2.0±0.2
D4.5±0.30 3.2±0.20 2.5±0.2
(Example)
In case of “B3” for CM03;
L : 0.6±0.03mm
W : 0.3±0.03mm
T : 0.3±0.03mm
Tan
δ : 5.0% max.
Tan δ
Code Tan δ
12.5% max.
23.5% max.
35.0% max.
57.5% max.
8
12.5% max.
<Standard Capacitance Value>
CM21 size and smaller : E6 Series
CM316 size and larger / capacitance value of 0.1μF and larger : E3 Series
Please contact for capacitance value other than standard.
Size
(EIA Code)
CM316
(1206)
Rated Voltage (VDC)
100
Capacitance (pF)
47000
104 100000
220000
470000
105 1000000
2200000
4700000 K3
106 10000000
22000000
Size Size
Code
Dimension (mm)
LWT
316 K 3.2±0.30 1.6±0.30 1.6±0.30
Tan δ
Code Tan δ
35.0% max.
X7S Dielectric
Two digits alphanumerics in capacitance chart denote dimensions and tan δ.
Please refer to the below table for detail.
Optional Spec.
Multilayer Ceramic Chip Capacitors
Test Conditions and Standards
Test Conditions and Specifications for Temperature Compensation Type (CΔ Characteristics)
CM/ CT/ CU/ CF Series
Test Items Test Conditions Specifications
Capacitance Value (C)
Capacitance
Frequency Volt
C1000pF 1MHz±10% 0.5 to 5Vrms
C>1000pF 1kHz±10%
Within tolerance
QC30pF : Q1000
C<30pF : Q400+20C
Insulation Resistance (IR)
Measured after the rated voltage is applied for 1
minute at room ambient.
For the rated voltage of over 630V, apply 500V
for 1 minute at room ambient.
The charge and discharge current of the capacitor
must not exceed 50mA.
Over 10000MΩ or 500MΩ μF, whichever is less
Dielectric Resistance
Apply 3 times of the rated voltage for 1 to 5 seconds.
Apply 1.5 times when the rated voltage is 250V or over.
Apply 1.2 times when the rated voltage is 630V or over.
The charge and discharge current of the capacitor
must not exceed 50mA.
No problem observed
Appearance Microscope No problem observed
Termination Strength
Apply a sideward force of 500g (5N) to a PCB-
mounted sample. Apply 2N for 0201, and 1N for
01005 size.
No problem observed
Bending Strength
Glass epoxy PCB: Fulcrum spacing: 90mm, duration
time 10 seconds.
No significant damage at 1mm bent
Vibration
Test
Appearance Vibration frequency: 10 to 55 (Hz)
Amplitude: 1.5mm
Sweeping condition: 105510Hz/ 1 minute in X,
Y and Z
Directions: 2 hours each, 6 hours total.
No problem observed
ΔCWithin Tolerance
QC30pF : Q1000
C<30pF : Q400+20C
Soldering
Heat
Resistance
Appearance Soak the sample in 260°C±5°C solder for 10±0.5
seconds and place in room ambient, and measure
after 24±2 hours.
(Pre-heating conditions)
Order Temperature Time
180 to 100°C 2 minutes
2150 to 200°C 2 minutes
The charge and discharge current of the capacitor
must not exceed 50mA for IR and withstanding
voltage measurement.
No problem observed
ΔCWithin ±2.5% or ±0.25pF, whichever is larger
QC30pF : Q1000
C<30pF : Q400+20C
IR Over 10000MΩ or 500MΩ μF whichever is less
Withstanding
Voltage Resist without problem
Solderablity
Soaking condition
Sn-3Ag-0.5Cu
245±5°C3
±0.5 sec.
Sn63 Solder
235±5°C2
±0.5 sec.
Solder coverage : 90% min.
Temperature
Cycle
Appearance (Cycle)
Room temperature (3min.)
Lowest operation temperature (30min.)
Room temperature (3min.)
Highest operation temperature(30min.)
After 5 cycles, measure after 24±2 hours.
The charge and discharge current of the capacitor
must not exceed 50mA for IR and withstanding
voltage measurement.
No problem observed
ΔCWithin ±2.5% or ±0.25pF, whichever is larger
QC30pF : Q1000
C<30pF : Q400+20C
IR Over 10000MΩ or 500MΩ μF, whichever is less
Withstanding
Voltage Resist without problem
Load
Humidity
Test
(Except CF
Series)
Appearance After applying rated voltage for 500+12/ 0 hours
in pre-condition at 40°C±2°C, humidity 90 to
95%RH, allow parts to stabilize for 24±2 hours, at
room temperature before measurement.
The charge and discharge current of the capacitor
must not exceed 50mA for IR measurement.
No problem observed
ΔCWithin ±7.5% or ±0.75pF, whichever is larger
QC30pF : Q200
C<30pF : Q100+10C/ 3
IR Over 500MΩ or 25MΩ μF, whichever is less
High-
Temperature
with Loading
Appearance After applying twice the rated voltage at the
temperature of 125±3°C for 1000+12/ 0 hours,
measure the sample after 24±2 hours.
Apply 1.5 times when the rated voltage is 250V or over.
Apply 1.2 times when the rated voltage is 630V or over.
The charge and discharge current of the capacitor
must not exceed 50mA for IR measurement.
No problem observed.
ΔCWithin ±3% or ±0.3pF, whichever is larger
Q
C30pF : Q350
10pF<C<30pF : Q275+5C/ 2
C<10pF : Q200+10C
IR Over 1000MΩ or 50MΩ μF, whichever is less
Please ask for individual specification for the hatched range in previous chart.
Multilayer Ceramic Chip Capacitors
Test Conditions and Standards
Test Conditions and Specifications for High Dielectric Type (X5R, X7R)
CM/ CT Series
Test Items Test Conditions Specifications
Capacitance Value (C) Measure after heat treatment
Capacitance
Frequency Volt
C10μF 1kHz±10% 1.0±0.2Vrms
C>10μF 120Hz±10% 0.5±0.2Vrms
Within tolerance
Tan δ (%) Refer to capacitance chart
Insulation Resistance (IR)
Measured after the rated voltage is applied for 1
minute at room ambient.
The charge and discharge current of the capacitor
must not exceed 50mA.
Over 10000MΩ or 500MΩ μF, whichever is less
Dielectric Resistance
Apply 2.5 times of the rated voltage for 1 to 5 seconds.
The charge and discharge current of the capacitor
must not exceed 50mA.
No problem observed
Appearance Microscope No problem observed
Termination Strength
Apply a sideward force of 500g (5N) to a PCB-mounted sample.
note : 2N for 0201 size in for 01005 size.
Exclude CT series with thickness of less than 0.66mm.
No problem observed
Bending Strength
Glass epoxy PCB: Fulcrum spacing: 90mm, duration
time 10 seconds.
Exclude CT series with thickness of less than 0.66mm.
No significant damage at 1mm bent
Vibration
Test
Appearance Take the initial value after heat treatment.
Vibration frequency: 10 to 55 (Hz)
Amplitude: 1.5mm
Sweeping condition: 105510Hz/ 1 minute in X, Y and Z
Directions: 2 hours each, 6 hours total.
No problem observed
ΔCWithin tolerance
Tan δ (%) Within tolerance
Soldering
Heat
Resistance
Appearance Take the initial value after heat treatment.
Soak the sample in 260°C±5°C solder for 10±0.5
seconds and place in room ambient, and measure
after 24±2 hours.
(Pre-heating conditions)
Order Temperature Time
180 to 100°C 2 minutes
2150 to 200°C 2 minutes
The charge and discharge current of the capacitor must not
exceed 50mA for IR and withstanding voltage measurement.
No problem observed
ΔCWithin ±7.5%
Tan δ (%) Within tolerance
IR Over 10000MΩ or 500MΩ μF, whichever is less
Withstanding
Voltage Resist without problem
Solderablity
Soaking condition
Sn-3Ag-0.5Cu 245±5°C3
±0.5 sec.
Sn63 Solder 235±5°C2
±0.5 sec.
Solder coverage : 90% min.
Temperature
Cycle
Appearance Take the initial value after heat treatment.
(Cycle)
Room temperature (3min.)
Lowest operation temperature (30min.)
Room temperature (3min.)
Highest operation temperature(30min.)
After 5 cycles, measure after 24±2 hours.
The charge and discharge current of the capacitor must not
exceed 50mA for IR and withstanding voltage measurement.
No problem observed
ΔCWithin ±7.5%
Tan δ (%) Within tolerance
IR Over 10000MΩ or 500MΩ μF, whichever is less
Withstanding
Voltage Resist without problem
Load
Humidity
Test
Appearance Take the initial value after voltage treatment.
After applying rated voltage for 500+12/ 0 hours
in pre-condition at 40°C±2°C, humidity 90 to
95%RH, allow parts to stabilize for 24±2 hours, at
room temperature before measurement.
The charge and discharge current of the capacitor
must not exceed 50mA for IR measurement.
No problem observed
ΔCWithin ±12.5%
Tan δ (%) 200% max. of initial value
IR Over 500MΩ or 25MΩ μF, whichever is less
High-
Temperature
with
Loading
Appearance Take the initial value after voltage treatment.
After applying twice the rated voltage at the highest
operation temperature for 1000+12/ 0 hours,
measure the sample after 24±2 hours.
The charge and discharge current of the capacitor
must not exceed 50mA for IR measurement.
Apply 1.5 times when the rated voltage is 10V or less. Applied
voltages for respective products are indicated in the below chart.
No problem observed
ΔCWithin ±12.5%
Tan δ (%) 200% max. of initial value
IR Over 1000MΩ or 50MΩ μF, whichever is less
Pre-treat-
ment
Heat Keep specimen at 150+0/ 10°C for 1 hour, leave specimen at room ambient for 24±2 hours.
Voltage Apply the same test condition for 1 hour, then leave the specimen at room ambient for 24±2 hours.
High-temperature with Loading Applied Voltage (Rated Voltage × )
Applied Voltage
Rated Voltage
Products
×1.3
4V CT03X5R104
6.3V CM105X5R475, CM316X5R476, CM02X5R153
-
104
CT05X5R104, CT21X5R106, CT03X5R104
×1.5
16V
CM105X7R474-105, CM21X7R105-475, CM316X7R475-106, CM32X7R106-226, CM05X5R224, CM105X5R225, CM21X5R475-106, CM316X5R226
CT105X5R105, CT21X5R225-475, CT316X5R106, CM03X5R332-103, CM02X5R101
-
103
25V
CM105X7R474, CM21X7R105-225, CM316X7R475, CM32X7R106, CM105X5R474-105, CM21X5R225-106, CM316X5R106, CM32X5R106-226
CT316X5R225-106, CM03X5R152-103, CM05X7R103-104
50V CM21X5R105, CM32X5R106, CM32X7R106
CT21X5R225, CT316X5R105-475
100V CM32X7RK74, CM43X7R105
Please ask for individual specification for the hatched range in previous chart.
Test Conditions and Specifications for High Dielectric Type (X7R)
CF Series
Test Items Test Conditions Specifications
Capacitance Value (C) Measure after heat treatment
Capacitance
Frequency Volt
C10μF 1kHz±10% 1.0±0.2Vrms
Within tolerance
Tan δ (%) Within ±2.5%
Insulation Resistance (IR)
Measured after the rated voltage is applied
for 1 minute at room ambient.
Measured after the 500V is applied for 1
minute at room ambient for the rated voltage
over 630V.
The charge and discharge current of the
capacitor must not exceed 50mA.
Over 10000MΩ or 500MΩ μF, whichever is less
Over
100MΩ
μF for CF316X7R104/ 250V and CF43X7R474/ 250V
CF55X7R105/ 250V and CF55X7R224/ 630V
Dielectric Resistance
Apply 1.5 times when the rated voltage is
250V or over, apply 1.2 times when the rated
voltage is 630V or over for 1 to 5 seconds.
The charge and discharge current of the
capacitor must not exceed 50mA.
No problem observed
Appearance Microscope No problem observed
Termination Strength Apply a sideward force of 500g (5N) to a
PCB-mounted sample. No problem observed
Bending Strength Glass epoxy PCB: Fulcrum spacing: 90mm,
duration time 10 seconds. No significant damage at 1mm bent
Vibration
Test
Appearance Take the initial value after heat treatment.
Vibration frequency: 10 to 55 (Hz)
Amplitude: 1.5mm
Sweeping condition: 105510Hz/ 1 minute
in X, Y and Z
Directions: 2 hours each, 6 hours total.
No problem observed
ΔCWithin tolerance
Tan δ (%) Within tolerance
Soldering
Heat
Resistance
Appearance Take the initial value after heat treatment.
Soak the sample in 260°C±5°C solder for
10±0.5 seconds and place in room ambient,
and measure after 24±2 hours.
(Pre-heating conditions)
Order Temperature Time
180 to 100°C 2 minutes
2150 to 200°C 2 minutes
The charge and discharge current of the
capacitor must not exceed 50mA for IR and
withstanding voltage measurement.
No problem observed
ΔCWithin ±7.5%
Tan δ (%) Within tolerance
IR
Over 10000MΩ or 500MΩ μF, whichever is less
Over
100MΩ
μF for CF316X7R104/ 250V and CF43X7R474/ 250V
CF55X7R105/ 250V and CF55X7R224/ 630V
Withstanding
Voltage Resist without problem
Solderablity
Soaking condition
Sn-3Ag-0.5Cu
245±5°C3
±0.5 sec.
Sn63 Solder
235±5°C2
±0.5 sec.
Solder coverage : 90% min.
Temperature
Cycle
Appearance Take the initial value after heat treatment.
(Cycle)
Room temperature (3min.)
Lowest operation temperature (30min.)
Room temperature (3min.)
Highest operation temperature(30min.)
After 5 cycles, measure after 24±2 hours.
The charge and discharge current of the
capacitor must not exceed 50mA for IR and
withstanding voltage measurement.
No problem observed
ΔCWithin ±7.5%
Tan δ (%) Within tolerance
IR
Over 10000MΩ or 500MΩ μF, whichever is less
Over
100MΩ
μF for CF316X7R104/ 250V and CF43X7R474/ 250V
CF55X7R105/ 250V and CF55X7R224/ 630V
Withstanding
Voltage Resist without problem
High-
Temperature
with
Loading
Appearance
Take the initial value after voltage treatment.
After applying specified voltage at the highest
operation temperature for 1000
+12/ 0
hours,
then measure the sample after 24±2 hours.
The applied voltage shall be;
1.5 times the rated voltage when the rated
voltage is 250V or over.
1.2 times when the rated voltage is 630V or over.
The charge and discharge current of the capacitor
must not exceed 50mA for IR measurement.
No problem observed
ΔCWithin ±12.5%
Tan δ (%) 200% max. of initial value
IR Over 1000MΩ or 50MΩ μF, whichever is less
Pre-treat-
ment
Heat Keep specimen at 150+0/ 10°C for 1 hour, leave specimen at room ambient for 24±2 hours.
Voltage Apply the same test condition for 1 hour, then leave the specimen at room ambient for 24±2 hours.
Multilayer Ceramic Chip Capacitors
Test Conditions and Standards
Substrate for Electrical Tests (Unit: mm)
c
a
b
Size
(EIA Code) abc
02 (01005) 0.15 0.50 0.20
03 (0201) 0.26 0.92 0.32
05 (0402) 0.4 1.4 0.5
105 (0603) 1.0 3.0 1.2
21 (0805) 1.2 4.0 1.65
316 (1206) 2.2 5.0 2.0
32 (1210) 2.2 5.0 2.9
42 (1808) 3.5 7.0 3.7
43 (1812) 3.5 7.0 3.7
52 (2208) 4.5 8.0 5.6
55 (2220) 4.5 8.0 5.6
40
b
100
1±0.1
1.6
a
c
90mm
R5
Soldering
Load
Support φ5mm
Testing Board
Testing Table
Testing Board : Glass Epoxy Board (CE4 or FR4)
Testing Board Thickness: 1.6±0.2mm
Circuit Thickness : 0.04±0.01mm
Pressure
ab
c
Substrate for Bending Test (Unit: mm) Substrate for Adhesion Strength Test
02, 03, 05 and array: 0.8±0.1mm
Multilayer Ceramic Chip Capacitors
Test Conditions and Standards
Multilayer Ceramic Chip Capacitors
Packaging Options
Carrier Tape (Unit: mm)
Size
(EIA Code) A B F
02 (01005)0.23±0.02 0.43±0.02 1.0±0.02
0.25±0.03 0.45±0.03 2.0±0.05
03 (0201)0.37±0.03 0.67±0.03 1.0±0.05
2.0±0.05
05 (0402)0.65±0.1 1.15±0.1 1.0±0.05
2.0±0.05
105 (0603) 1.0±0.2 1.8±0.2 4.0±0.1
21 (0805) 1.5±0.2 2.3±0.2 4.0±0.1
316 (1206) 2.0±0.2 3.6±0.2 4.0±0.1
32 (1210) 2.9±0.2 3.6±0.2 4.0±0.1
42 (1808) 2.4±0.2 4.9±0.2 4.0±0.1
43 (1812) 3.6±0.2 4.9±0.2 8.0±0.1
52 (2208) 2.4±0.2 6.0±0.2 4.0±0.1
55 (2220) 5.3±0.2 6.0±0.2 8.0±0.1
Option
(Unit: mm)
F Carrier Tape C D E G H J
1.0
±0.02
4mm
Plastic
4.0
+0.08
1.8
±0.02
0.9
±0.05 2.0
±0.04
0.8
±0.04
1.0
±0.05
8mm
Paper
8.0
+0.3/ 0.1
3.5
±0.05
1.75
±0.1
2.0
±0.05
4.0
±0.05
1.5
+0.1/ 0
2.0
±0.05
8.0
±0.3
4.0
±0.1
4.0
±0.1
8mm
Plastic
12mm
Plastic
12.0
±0.3
5.5
±0.05
8.0
±0.1
0.6 max.
GHF
(Plastic)
3.0 max.
A
BC
E
D
Feed Hole Punched rectangular hole to hold capacitor
J
Holes only for plastic carrier tape. φ0.3 min.
F=8mm (43, 55 Type)
(Paper) (Plastic)
0.6 max. 1.1 max.
H G F
A
B
2.8 max.
C
E
D
Feed Hole Punched rectangular hole to hold capacitor
Holes only for plastic carrier tape. φ0.3 min.
J
F=4mm (105, 21, 316, 32, 42, 52 Type)
Feed Hole Punched rectangular hole to hold capacitor
J
F H 02 Type: 0.4 max.
03 Type: 0.6 max.
05 Type: 0.75 max.
105 Type: 1.1 max.
(Paper)
F
A
B C
E
D
F=2mm (02, 03, 05, 105 Type)
(Paper)
H
FF
A
B
C
E
D
Feed Hole Parts insertion cavity
J
02 Type: 0.4 max.
03 Type: 0.5 max.
05 Type: 0.75 max.
F=1mm (02, 03, 05 Type)
(Plastic)
Feed Hole Punched rectangular
hole to hold
0.5 max.
HF
A
B
C
E
D
J
F=1mm (02 Type)
A
R
E
C
D
W1
W2
B
Tape and Reel
• Reel
Reel (Unit: mm)
Code ABCD
Reel
7−inch Reel
(CODE: T, H, Q) 180 +0
2.0
φ60 min. 13±0.5 21±0.8
7−inch Reel
(CODE: P) 178±2.0
13−inch Reel
(CODE: L, N, W) 330±2.0
Code EW
1W2R
Reel
7−inch Reel
(CODE: T, H, Q)
2.0±0.5
10.5±1.5 16.5 max.
1.0
7−inch Reel
(CODE: P) 4.35±0.3 6.95±1.0
13−inch Reel
(CODE: L, N, W) 9.5±1.0 16.5 max.
Carrier tape width 8mm.
For size 42 (1808) or over, Tape width 12mm and W1: 14±1.5, W2: 18.4mm max.
Carrier Tape
Peeling Direction
Unrolling Direction
165° to180°
Top Tape
Exfoliating angle: 165 to 180 degrees to the carrier tape.
Exfoliating speed: 300 mm/min.
Adhesive tape
1)
The exfoliative strength when peeling off the top tape from the carrier tape by
the method of the following figure shall be
0.1 to 0.7N.
02 Size: 0.1 to 0.5N
2)
When the top tape is peeled off, the adhesive stays on the top tape.
3) Chip capacitors will be in a state free without being stuck on the
thermal adhesive tape.
Slider
Shutter
Connection Area
110
36
12
Bulk Case (Unit: mm)
Please contact Kyocera for details.
Multilayer Ceramic Chip Capacitors
Packaging Options
Detail of leader and trailer
160mm min. 100mm min.
400mm min.
Empty Pockets Components
StartEnd
Leader
Multilayer Ceramic Chip Capacitors
Surface Mounting Information
Dimensions for recommended typical land
Since the amount of solder (size of fillet) to be used has direct
influence on the capacitor after mounting, the sufficient consideration
is necessary.
When the amounts of solder is too much, the stress that a capacitor
receives becomes larger. It may become the cause of a crack in
the capacitor. When the land design of printed wiring board is
considered, it is necessary to set up the form and size of land pattern
so that the amount of solder is suitable.
Design of printed circuit and Soldering
The recommended fillet height shall be 1/2 of the thickness of
capacitors or 0.5mm. When mounting two or more capacitors in the
common land, it is necessary to separate the land with the solder resist
strike so that it may become the exclusive land of each capacitor.
General, High-Voltage (Unit: mm)
Size
(EIA Code) L×Wabc
02 (01005) 0.4×0.2 0.13 to 0.20 0.12 to 0.18 0.20 to 0.23
03 (0201) 0.6×0.3 0.20 to 0.30 0.25 to 0.35 0.30 to 0.40
05 (0402) 1.0×0.5 0.30 to 0.50 0.35 to 0.45 0.40 to 0.60
105 (0603) 1.6×0.8 0.70 to 1.00 0.80 to 1.00 0.60 to 0.80
21 (0805) 2.0×1.25 1.00 to 1.30 1.00 to 1.20 0.80 to 1.10
316 (1206) 3.2×1.6 2.10 to 2.50 1.10 to 1.30 1.00 to 1.30
32 (1210) 3.2×2.5 2.10 to 2.50 1.10 to 1.30 1.90 to 2.30
42 (1808) 4.5×2.0 2.50 to 3.20 1.80 to 2.30 1.50 to 1.80
43 (1812) 4.5×3.2 2.50 to 3.20 1.80 to 2.30 2.60 to 3.00
52 (2208) 5.7×2.0 4.20 to 4.70 2.00 to 2.50 1.50 to 1.80
55 (2220) 5.7×5.0 4.20 to 4.70 2.00 to 2.50 4.20 to 4.70
Automotive (Unit: mm)
Size
(EIA Code) L×Wabc
105 (0603) 1.6×0.8 0.60 to 0.90 0.80 to 1.00 0.70 to 1.00
21 (0805) 2.0×1.25 0.90 to 1.20 0.80 to 1.20 0.90 to 1.40
316 (1206) 3.2×1.6 1.40 to 1.90 1.00 to 1.30 1.30 to 1.80
Ideal Solder Height
Chip Capacitor
PCB
Solder
T/ 2 or 0.5mm
T
Item Not recommended example Recommended example/ Separated by solder
Multiple parts mount
Solder resist
Mount with
leaded parts
Leaded parts Leaded parts
Solder resist
Wire soldering
after mounting
Soldering iron
Wire
Solder resist
Overview
Solder resist Solder resist
(General, High-Voltage, Automotive)
Land Pattern
Sample capacitor
Soldering resist
b a
c
Multilayer Ceramic Chip Capacitors
Surface Mounting Information
Mounting Design
The chip could crack if the PCB warps during processing after the chip has been soldered.
(Not recommended) (Ideal)
Crack
Support pin
(Not recommended) (Ideal)
Recommended chip position on PCB to minimize stress from PCB warpage
Actual Mounting
1) If the position of the vacuum nozzle is too low, a large force may be applied to the chip capacitor during mounting, resulting in cracking.
2) During mounting, set the nozzle pressure to a static load of 1 to 3 N.
3) To minimize the shock of the vaccum nozzle, provide a support pin on the back of the PCB to minimize PCB flexture.
4) Bottom position of pick up nozzle should be adjusted to the top surface of a substrate which camber is corrected.
5) To reduce the possibility of chipping and cracks, minimize vibration to chips stored in a bulk case.
6)
The discharge pressure must be adjusted to the part size. Verify the pressure during setup to avoid fracturing or cracking the chips capacitors.
Resin Mold
1) If a large amount of resin is used for molding the chip, cracks may occur due to contraction stress during curing. To avoid such cracks, use
a low shrinkage resin.
2) The insulation resistance of the chip will degrade due to moisture absorption. Use a low moisture absorption resin.
3) Check carefully that the resin does not generate a decomposition gas or reaction gas during the curing process or during normal storage.
Such gases may crack the chip capacitor or damage the device itself.
Multilayer Ceramic Chip Capacitors
Surface Mounting Information
Soldering Method
1) Ceramic is easily damaged by rapid heating or cooling. If some heat shock is unavoidable, preheat enough to limit the temperature
difference (Delta T) to within 150 degree Celsius.
2) The product size 1.6×0.8mm to 3.2×1.6mm can be used in reflow and wave soldering, and the product size of bigger than 3.2×1.6mm, or
smaller than 1.6×0.8mm can be used in reflow.
Circuit shortage and smoking can be created by using capacitors which are used neglecting the above caution.
3) Please see our recommended soldering conditions.
4) In case of using Sn-Zn Solder, please contact us in advance.
5) The following condition is recommended for spot heater application.
Soldering iron
1) Temperature of iron chip
2) Wattage
3) Tip shape of soldering iron
4) Soldering Time
1206 and smaller 350°C max.
1210 and larger 280°C max.
80W max.
φ3.0mm max.
3 sec. max.
5) Cautions
a) Pre−heating is necessary rapid heating must be avoided.
Delta T150°C (product size of bigger than 3.2×1.6mm. Delta T130°C)
b) Avoid direct touching to capacitors.
c) Avoid rapid cooling after soldering. Natural cooling is recommended.
Consult as if it is difficult to keep the temperature 280°C max. for 1210 and larger MLCC’S.
•Recommendedspotheatercondition
Item Condition
Distance 5mm min.
Angle 45°
Projection Temp. 400°C max.
Flow rate Set at the minimum
Nozzle diameter 2φ to 4φ (Single hole type)
Application time 10 sec. max. (1206 and smaller)
30 sec.max. (1210 and larger)
How to point spot heater
Single hole nozzle
Angle 45°
Recommended Temperature Profile (62Sn Solder)
Reflow
ΔT
300
250
200
150
100
50
0
Preheat
60 seconds
Temperature
Peak temperature
230°C±5°C
15 seconds maximum
60 seconds
More than180°C,
40 seconds maximum
Cool at normal room
temperature after
removing from
furnace.
Minimize soldering time.
Ensure that the temperature difference (ΔT) does not exceed 150°C.
Ensure that the temperature difference (ΔT) does not exceed 130°C for 3.2×2.5mm size or larger.
MLCC can withstand the above reflow conditions up to 3 times.
Wave
Ensure that the chip capacitor is preheated adequately.
Ensure that the temperature difference (ΔT) does not exceed 150°C.
Cool naturally after soldering.
Wave soldering is not applicable for chips with size of 3.2×2.5mm or larger of 1.0×0.5mm or smaller and capacitor arrays.
300
250
200
150
100
50
0
Preheat
Temperature (°C)
60 to 120 sec.
5 sec. max.
Cool at normal
room temperature
Peak Temperature
230°C to 260°C
ΔT
Recommended Temperature Profile (Sn−3Ag−0.5Cu)
Reflow
300
250
200
150
100
50
0
Preheat
Temperature
250°C±5°C
5 to 10 sec. max.
90±30 sec.
220°C max.
90 sec. max.
170 to 180°C1 to 3°C/ sec.
Minimize soldering time.
Ensure that allowable temperature difference does not exceed 150°C.
Ensure that allowable temperature difference does not exceed 130°C for 3.2×2.5mm size or larger.
Wave
Ensure that the chip capacitor is preheated adequately.
Ensure that the temperature difference (ΔT) does not exceed 150°C.
Cool naturally after soldering.
Wave soldering is not applicable for chips with size of 3.2×2.5mm or larger of 1.0×0.5mm or smaller and capacitor arrays.
Preheat
300
250
200
150
100
50
Temperature (°C)
0
Cool at normal
room temperature
Peak Temperature
245°C to 260°C
ΔT
60 to 120 sec.
5 sec. max.
Circuit Design
1. Once application and assembly environments have been checked, the capacitor may be used in conformance with the rating and
performance which are provided in both the catalog and the specifications. Use exceeding that which is specified may result in inferior
performance or cause a short, open, smoking, or flaming to occur, etc.
2. Please consult the manufacturer in advance when the capacitor is used in devices such as: devices which deal with human life, i.e. medical
devices; devices which are highly public orientated; and devices which demand a high standard of liability.
Accident or malfunction of devices such as medical devices, space equipment and devices having to do with atomic power could generate
grave consequence with respect to human lives or, possibly, a portion of the public. Capacitors used in these devices may require high
reliability design different from that of general purpose capacitors.
3.
Please use the capacitors in conformance with the operating temperature provided in both the catalog and the specifications.
Be especially cautious not to exceed the maximum temperature. In the situation the maximum temperature set forth in both the catalog and
specifications is exceeded, the capacitor’s insulation resistance may deteriorate, power may suddenly surge and short−circuit may occur.
The capacitor has a loss, and may self−heat due to equivalent series resistance when alternating electric current is passed therethrough. As this
effect becomes especially pronounced in high frequency circuits, please exercise caution.
When using the capacitor in a (self−heating) circuit, please make sure the surface of the capacitor remains under the maximum temperature for
usage. Also, please make certain temperature rises remain below 20°C.
4. Please keep voltage under the rated voltage which is applied to the capacitor. Also, please make certain the peak voltage remains below the
rated voltage when AC voltage is super−imposed to the DC voltage.
In the situation where AC or pulse voltage is employed, ensure average peak voltage does not exceed the rated voltage.
Exceeding the rated voltage provided in both catalog and specifications may lead to defective withstanding voltage or, in worst case
situations, may cause the capacitor to smoke or flame.
5. When the capacitor is to be employed in a circuit in which there is continuous application of a high frequency voltage or a steep pulse
voltage, even though it is within the rated voltage, please inquire to the manufacturer.
In the situation the capacitor is to be employed using a high frequency AC voltage or a extremely fast rising pulse voltage, even though it is
within the rated voltage, it is possible capacitor reliability will deteriorate.
6.
It is a common phenomenon of high−dielectric products to have a deteriorated amount of static electricity due to the application of DC voltage.
Due caution is necessary as the degree of deterioration varies depending on the quality of capacitor materials, capacity, as well as the load voltage
at the time of operation.
7. Do not use the capacitor in an environment where it might easily exceed the respective provisions concerning shock and vibration specified
in the catalog and specifications.
In addition, it is a common piezo phenomenon of high dielectric products to have some voltage due to vibration or to have noise due to
voltage change. Please contact sales in such case.
8. If the electrostatic capacity value of the delivered capacitor is within the specified tolerance, please consider this when designing the
respective product in order that the assembled product function appropriately.
9. Please contact us upon using conductive adhesives.
Storage
1. If the component is stored in minimal packaging (a heat−sealed or zippered plastic bag), the bag should be kept closed. Once the bag has
been opened, reseal it or store it in a desiccator.
2. Keep storage place temperature +5 to +40 degree C, humidity 20 to 70% RH. See JIS C 60721-3-1, class 1K2 for other climatic conditions.
3. The storage atmosphere must be free of corrosive gas such as sulfur dioxide and chlorine. Also, avoid exposing the product to saline
moisture. If the product is exposed to such atmospheres, the terminals will oxidize and solderability will be effected.
4. Precautions 1) to 3) apply to chip capacitors packaged in carrier tapes and bulk cases.
5. The solderability is assured for 12 months from our shipping date if the above storage precautions are followed.
6. Chip capacitors may crack if exposed to hydrogen (H2) gas while sealed or if coated with silicon, which generates hydrogen gas.
Safety application guideline and detailed information of electrical properties are also provided in Kyocera home page;
URL: http://www.kyocera.co.jp/electronic/
Multilayer Ceramic Chip Capacitors
Precautions