MBRS3201T3 - ON Semiconductor

August, 2005 − Rev. 2 1Publication Order Number:

MBRS3201T3/D

MBRS3201T3

200V, 3A Schottky

Fast Soft−Recovery

Power Rectifier

SMC Power Surface Mount Package

Features

•Lower Forward Voltage than any Ultrafast Rectifier:

VF < 0.59 V at 150°C

•Fast Switching Speed: Reverse Recovery Time (tRR) < 35 ns

•Soft Recovery Characteristics: Softness Factor (tb/ta) w 1

•Highly Stable Over Temperature

•Pb−Free Package is Available

Benefits

•Significantly Reduced EMI

•Eliminates the Need of Snubber Circuits

•Low Switching and Heat Losses

•Improved Thermal Management

Applications

•Engine and Convenience Control Systems

•Motor Controls

•Battery Chargers and Switching Power Supplies

Mechanical Characteristics

•Small Compact Surface Mount Package with J–Bend Leads

•Rectangular Package for Automated Handling

•Weight: 217 mg (Approximately)

•Finish: All External Surfaces Corrosion Resistant and Terminal

Leads are Readily Solderable

•Lead and Mounting Surface Temperature for Soldering Purposes:

260°C Maximum for 10 Seconds

•Polarity: Notch in Plastic Body Indicates Cathode Lead

MAXIMUM RATINGS

Characteristic Symbol Value Unit

Peak Repetitive Reverse Voltage

Working Peak Reverse Voltage

DC Blocking Voltage

VRRM

VRWM

200 V

Average Rectified Forward Current

(Rated VR, TC = 70°C) IF(AV) 3 A

Nonrepetitive Peak Surge Current IFSM 100 A

Operating Junction Temperature TJ−55 to +150 °C

Maximum ratings are those values beyond which device damage can occur.

Maximum ratings applied to the device are individual stress limit values (not

normal operating conditions) and are not valid simultaneously. If these limits are

exceeded, device functional operation is not implied, damage may occur and

reliability may be affected.

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Device Package Shipping†

ORDERING INFORMATION

MBRS3201T3 SMC 2500 / Tape & Ree

SCHOTTKY RECTIFIER

3 AMPS, 200 VOLTS

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specification

Brochure, BRD8011/D.

MBRS3201T3G SMC

(Pb−Free) 2500 / Tape & Ree

B321 = Specific Device Code

A = Assembly Location

Y = Year

WW = Work Week

G= Pb−Free Package

(Note: Microdot may be in either location)

AYWW

B321G

MARKING DIAGRAM

SMC

CASE 403

PLASTIC

MBRS3201T3

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THERMAL CHARACTERISTICS

Characteristic Symbol Value Unit

Thermal Resistance, Junction−to−Lead RqJL 12 °C/W

Thermal Resistance, Junction−to−Ambient RqJA 60 °C/W

ELECTRICAL CHARACTERISTICS

Characteristic Symbol Value Unit

Maximum Instantaneous Forward Voltage (IF = 3 A, TJ = 25°C)

(IF = 3 A, TJ = 150°C)

VF0.84

0.59

Maximum Instantaneous Reverse Current (Rated VR)(Rated DC Voltage, TJ = 25°C)

(Rated DC Voltage, TJ = 150°C)

IR1.0

5.0 mA

Maximum Reverse Recovery Time (IF = 1 A, di/dt = 100 A/us, VR = 30 V) trr 35 ns

0.1

1.0

100

0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2

VF, INSTANTANEOUS VOLTAGE (V)

IF, FORWARD CURRENT (A)

25°C

150°C

100°C

Figure 1. Typical Forward Voltage

0.1

1.0

100

0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2

VF, INSTANTANEOUS VOLTAGE (V)

IF, FORWARD CURRENT (A)

25°C

150°C

100°C

Figure 2. Maximum Forward Voltage

VR, REVERSE VOLTAGE (V)

, REVERSE CURRENT (A)

Figure 3. Typical Reverse Current

1E−9

1E−8

1E−7

1E−6

1E−5

1E−4

1E−3

1E−2

1E−1

0 20 40 60 80 100 120 140 160 180 200

150°C

100°C

25°C

Figure 4. Maximum Reverse Current

1.0E−06 1600 20 40 60 80 100

VR, REVERSE VOLTAGE (V)

120 140 180 20

IR, MAXIMUM REVERSE CURRENT (A

)

TC = 25°C

TC = 150°C

1.0E−05

1.0E−04

1.0E−03

1.0E−02

1.0E−01

MBRS3201T3

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C, CAPACITANCE (pF)

1.0

100

1000

0 20 40 60 80 100 120 140 160 180 200

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5

SQUARE

VR, REVERSE VOLTAGE (V)

PFO, AVERAGE POWER DISSIPATION (W)

Figure 5. Typical Capacitance

IO, AVERAGE FORWARD CURRENT

Figure 6. Power Dissipation

80 90 100 110 120 130 140 150 160

IF, AVERAGE FORWARD CURRENT (A)

TL, LEAD TEMPERATURE (°C)

Figure 7. Derating Curve

SQUAREWAVE

MBRS3201T3

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PACKAGE DIMENSIONS

SMC

CASE 403−03

ISSUE E

DIM

AMIN NOM MAX MIN

MILLIMETERS

1.90 2.13 2.41 0.075

INCHES

A1 0.05 0.10 0.15 0.002

b2.92 3.00 3.07 0.115

c0.15 0.23 0.30 0.006

D5.59 5.84 6.10 0.220

E6.60 6.86 7.11 0.260

L0.76 1.02 1.27 0.030

0.084 0.095

0.004 0.006

0.118 0.121

0.009 0.012

0.230 0.240

0.270 0.280

0.040 0.050

NOM MAX

7.75 7.94 8.13 0.305 0.313 0.320

4.343

0.171

3.810

0.150

2.794

0.110 ǒmm

inchesǓ

SCALE 4:1

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

L1L A1

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.

4. 403−01 THRU −02 OBSOLETE, NEW STANDARD 403−03.

0.020 REF

0.51 REF

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

to any products herein. SCILLC makes no warranty , representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

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2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051

Phone: 81−3−5773−3850

MBRS3201T3/D

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