REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes IAW NOR 5962-R204-94. - jak 94-06-07 Monica L. Poelking B Changes IAW NOR 5962-R045-95. - jak 95-10-31 Monica L. Poelking C Update boilerplate to MIL-PRF-38535. Editorial changes throughout. - jak 00-11-29 Thomas M. Hess D Update boilerplate paragraphs to the current MIL-PRF-38535 requirements. - LTG 09-03-24 Thomas M. Hess REV SHEET REV D D D SHEET 15 16 17 REV STATUS REV D D D D D D D D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Joseph A. Kerby STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http://www.dscc.dla.mil CHECKED BY Thanh V. Nguyen APPROVED BY THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A Monica L. Poelking DRAWING APPROVAL DATE 94-01-18 REVISION LEVEL D MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON SIZE CAGE CODE A 67268 SHEET DSCC FORM 2233 APR 97 5962-93220 1 OF 17 5962-E217-09 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 93220 Federal stock class designator \ RHA designator (see 1.2.1) 01 Q R A Device type (see 1.2.2) Device class designator (see 1.2.3) Case outline (see 1.2.4) Lead finish (see 1.2.5) / \/ Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number 01 Circuit function 54ABT574 Octal edge-triggered D-type flip-flop with three-state outputs, TTL compatible inputs 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, nonJAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter R S 2 Descriptive designator GDIP1-T20 or CDIP2-T20 GDFP2-F20 or CDFP3-F20 CQCC1-N20 Terminals 20 20 20 Package style Dual-in-line Flat pack Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-93220 A REVISION LEVEL D SHEET 2 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) .................................................................................. -0.5 V dc to +7.0 V dc DC input voltage range (VIN) ................................................................................ -0.5 V dc to +7.0 V dc 4/ DC output voltage range (VOUT) ........................................................................... -0.5 V dc to +5.5 V dc 4/ DC input clamp current (IIK) (VIN < 0.0 V) ............................................................. -18 mA DC output clamp current (IOK) (VOUT < 0.0 V) ....................................................... -50 mA DC output current (IOL) (per output) ..................................................................... +96 mA Storage temperature range (TSTG)....................................................................... -65C to +150C Lead temperature (soldering, 10 seconds)........................................................... +300C Thermal resistance, junction-to-case (JC) ........................................................... See MIL-STD-1835 Junction temperature (TJ) .................................................................................... +175C Maximum power dissipation (PD) ......................................................................... 500 mW 1.4 Recommended operating conditions. 2/ 3/ 5/ Supply voltage range (VCC) .................................................................................. +4.5 V dc to +5.5 V dc Input voltage range (VIN) ...................................................................................... +0.0 V dc to VCC Output voltage range (VOUT)................................................................................. +0.0 V dc to VCC Maximum low level input voltage (VIL).................................................................. 0.8 V Minimum high level input voltage (VIH) ................................................................. 2.0 V Case operating temperature range (TC) ............................................................... -55C to +125C Maximum input rise or fall rate (t/V)................................................................. 5 ns/V Maximum high level output current (IOH) .............................................................. -24 mA Maximum low level output current (IOL) ................................................................ 48 mA 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 MIL-STD-1835 - Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 MIL-HDBK-780 - List of Standard Microcircuit Drawings. Standard Microcircuit Drawings. (Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 1/ 2/ 3/ 4/ 5/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. Unless otherwise noted, all voltages are referenced to GND. The limits for the parameters specified herein shall apply over the full specified VCC range and case temperature range of -55C to +125C. The input and output negative voltage ratings may be exceeded provided that the input and output clamp current ratings are observed. Unused inputs must be held high or low to prevent them from floating. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-93220 A REVISION LEVEL D SHEET 3 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Ground bounce test circuit and waveforms. The ground bounce test circuit and waveforms shall be as specified on figure 4. 3.2.6 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 5. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 127 (see MIL-PRF-38535, appendix A). STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-93220 A REVISION LEVEL D SHEET 4 TABLE I. Electrical performance characteristics. Test and MIL-STD-883 test method 1/ High level output voltage 3006 Symbol VOH1 VOH2 VOH3 Low level output voltage 3007 VOL Three-state output leakage current high 3021 IOZH Three-state output leakage current low 3020 Negative input clamp voltage 3022 Off-state leakage current 4/ 5/ IOZL 4/ 5/ VIC- IOFF High-state leakage current ICEX Input current high 3010 Input current low 3009 Output current 3011 IIH IIL IOUT 6/ Test condition 2/ -55C TC +125C 4.5 V VCC 5.5 V unless otherwise specified Device type VCC For all inputs affecting output under test VIN = 2.0 V or 0.8 V IOH = -3 mA For all inputs affecting output under test VIN = 2.0 V or 0.8 V IOH = -3 mA For all inputs affecting output under test VIN = 2.0 V or 0.8 V IOH = -24 mA For all inputs affecting output under test VIN = 2.0 V or 0.8 V IOL = 48 mA For control inputs affecting output under test VIN = VIH or VIL VIH = 2.0 V VIL = 0.8 V VOUT = 2.7 V For control inputs affecting output under test VIN = VIH or VIL VIH = 2.0 V VIL = 0.8 V VOUT = 0.5 V For input under test IIN = -18 mA All 4.5 V 1, 2, 3 Min 2.5 All 5.0 V 1, 2, 3 3.0 All 4.5 V 1, 2, 3 2.0 All 4.5 V 1, 2, 3 0.55 V All 5.5 V 1, 2, 3 10.0 A All 5.5 V 1, 2, 3 -10.0 A All 4.5 V 1, 2, 3 -1.2 V For output under test VIN or VOUT = 4.5 V All other pins at 0.0 V For output under test VOUT = 5.5 V Outputs at high logic state For input under test VIN = VCC For input under test VIN = GND VOUT = 2.5 V All 0.0 V 1 100.0 A All 5.5 V 1, 2, 3 50.0 A All 5.5 V 1, 2, 3 +2.0 A All 5.5 V 1, 2, 3 -2.0 A All 5.5 V 1, 2, 3 -180.0 mA Group A subgroups Unit Limits 3/ -50.0 Max V See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-93220 A REVISION LEVEL D SHEET 5 TABLE I. Electrical performance characteristics - Continued. Test and MIL-STD-883 test method 1/ Symbol Test condition 2/ -55C TC +125C 4.5 V VCC 5.5 V unless otherwise specified Device type VCC Group A subgroups Unit Limits 3/ Min Max Quiescent supply current delta, TTL input levels 3005 ICC 7/ For input under test, VIN = 3.4 V For all other inputs VIN = VCC or GND All 5.5 V 1, 2, 3 2.5 mA Quiescent supply current, output high 3005 ICCH VIN = VCC or GND IOUT = 0.0 A All 5.5 V 1, 2, 3 250.0 A Quiescent supply current, output low 3005 ICCL VIN = VCC or GND IOUT = 0.0 A All 5.5 V 1, 2, 3 30.0 mA Quiescent supply current, output three-state 3005 ICCZ VIN = VCC or GND IOUT = 0.0 A All 5.5 V 1, 2, 3 250.0 A Input capacitance 3012 CIN See 4.4.1c TC = +25C All 5.0 V 4 8.5 pF Output capacitance 3012 COUT See 4.4.1c TC = +25C All 5.0 V 4 14.5 pF Low level ground bounce noise VOLP 8/ All 5.0 V 4 800 mV Low level ground bounce noise VOLV 8/ VIH = 3.0 V VIL = 0.0 V TA = +25C See figure 4 See 4.4.1d All 5.0 V 4 -1700 mV High level VCC bounce noise VOHP 8/ All 5.0 V 4 1300 mV High level VCC bounce noise VOHV 8/ All 5.0 V 4 -800 mV Functional test 3014 9/ Propagation delay time, CLK to mQ output 3003 tPLH 10/ VIL = 0.8 V VIH = 2.0 V Verify output VOUT See 4.4.1b CL = 50 pF minimum RL = 500 See figure 5 tPHL 10/ All 4.5 V 7, 8 L H All 5.5 V 7, 8 L H All 5.0 V 9 1.5 6.2 4.5 V and 5.5 V 10, 11 1.5 7.0 5.0 V 9 1.5 7.0 4.5 V and 5.5 V 10, 11 1.5 7.4 All ns ns See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-93220 A REVISION LEVEL D SHEET 6 TABLE I. Electrical performance characteristics - Continued. Test and MIL-STD-883 test method 1/ Propagation delay time, output enable OE to mQ output 3003 Symbol tPZH 10/ Device type Test condition 2/ -55C TC +125C 4.5 V VCC 5.5 V unless otherwise specified CL = 50 pF minimum RL = 500 See figure 5 All VCC Group A subgroups Unit Limits 3/ Min Max 5.0 V 9 1.0 5.5 4.5 V and 5.5 V 10, 11 1.0 6.5 5.0 V 9 1.0 5.9 4.5 V and 5.5 V 10, 11 1.0 7.2 5.0 V 9 1.0 6.2 4.5 V and 5.5 V 10, 11 1.0 7.2 ns tPZL 10/ All tPHZ 10/ All tPLZ 10/ All 5.0 V 9 1.0 5.8 10, 11 1.0 6.7 Maximum clock frequency fMAX 11/ All 4.5 V and 5.5 V 5.0 V 9, 10, 11 150 MHz Pulse duration, CLK high or low tw 11/ All 5.0 V 9, 10, 11 3.3 ns Setup time high, data before clock rising ts1 11/ All 5.0 V 9, 10, 11 1.5 ns Setup time low, data before clock rising ts2 11/ All 5.0 V 9, 10, 11 2.0 ns Hold time high or low, data after clock rising th 11/ All 5.0 V 9, 10, 11 2.0 ns Propagation delay time, output disable, OE to mQ output 3003 ns ns ns 1/ For tests not listed in the referenced MIL-STD-883 (e.g. ICC), utilize the general test procedure of 883 under the conditions listed herein. 2/ Each input/output, as applicable, shall be tested at the specified temperature, for the specified limits, to the tests in table I herein. Output terminals not designated shall be high level logic, low level logic, or open, except for all ICC and ICC tests, where the output terminals shall be open. When performing these tests, the current meter shall be placed in the circuit such that all current flows through the meter. For input terminals not designated, VIN= GND or VIN = 3.0 V. 3/ For negative and positive voltage and current values, the sign designates the potential difference in reference to GND and the direction of current flow respectively; the absolute value of the magnitude, not the sign, is relative to the minimum and maximum limits, as applicable, listed herein. All devices shall meet or exceed the limits specified in table I at 4.5 V VCC 5.5 V. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-93220 A REVISION LEVEL D SHEET 7 TABLE I. Electrical performance characteristics - Continued. 4/ This test shall be guaranteed, if not tested, to the limits specified in table I herein, when performed with control inputs that affect the state of the output under test at VIN = 0.8 V or 2.0 V. 5/ Due to tester limitations, this test may be performed at VIH = 3.0 V but shall be guaranteed at VIH = 2.0 V. 6/ Not more than one output should be tested at one time and the duration of the test condition should not exceed one second. 7/ This test may be performed either one input at a time (preferred method) or with all input pins simultaneously at VIN = VCC -2.1 V (alternate method). Classes Q, and V shall use the preferred method. When the test is performed using the alternate test method the maximum limit is equal to the number of inputs at a high TTL input level times 2.5 mA, and the preferred method and limits are guaranteed. 8/ This test is for qualification only. Ground and VCC bounce tests are performed on a non-switching (quiescent) output and are used to measure the magnitude of induced noise caused by other simultaneously switching outputs. The test is performed on a low noise bench test fixture. For the device under test, all outputs shall be loaded with 500 of load resistance and a minimum of 50 pF of load capacitance (see figure 4). Only chip capacitors and resistors shall be used. The output load components shall be located as close as possible to the device outputs. It is suggested, that whenever possible, this distance be kept to less than 0.25 inches. Decoupling capacitors shall be placed in parallel from VCC to ground. The values of these decoupling capacitors shall be determined by the device manufacturer. The low and high level ground and VCC bounce noise is measured at the quiet output using a 1 GHz minimum bandwidth oscilloscope with a 50 input impedance. The device inputs shall be conditioned such that all outputs are at a high nominal VOH level. The device inputs shall then be conditioned such that they switch simultaneously and the output under test remains at VOH as all other outputs possible are switched from VOH to VOL. VOHV and VOHP are then measured from the nominal VOH level to the largest negative and positive peaks, respectively (see figure 4). This is then repeated with the same outputs not under test switching from VOL to VOH. The device inputs shall be conditioned such that all outputs are at a low nominal VOL level. The device inputs shall then be conditioned such that they switch simultaneously and the output under test remains at VOL as all other outputs possible are switched from VOL to VOH. VOLP and VOLV are then measured from the nominal VOL level to the largest positive and negative peaks, respectively (see figure 4). This is then repeated with the same outputs not under test switching from VOH to VOL. 9/ Tests shall be performed in sequence, attributes data only. Functional tests shall include the truth table and other logic patterns used for fault detection. The test vectors used to verify the truth table shall, at a minimum, test all functions of each input and output. All possible input to output logic patterns per function shall be guaranteed, if not tested, to the truth table in figure 2, herein. Functional tests shall be performed in sequence as approved by the qualifying activity on qualified devices. After incorporating allowable tolerances per MIL-STD-883, VIL = 0.4 V and VIH = 2.4 V. For outputs, L 0.8 V, H 2.0 V. 10/ For propagation delay tests, all paths must be tested. 11/ This parameter shall be guaranteed, if not tested, to the limits specified in table I herein. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-93220 A REVISION LEVEL D SHEET 8 Device type All Case outlines R, S, 2 Terminal number Terminal symbol 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 OE 1D 2D 3D 4D 5D 6D 7D 8D GND CLK 8Q 7Q 6Q 5Q 4Q 3Q 2Q 1Q VCC Terminal symbol Pin description Description mD (m = 1 to 8) Data inputs OE Output enable control input (active low) mQ (m = 1 to 8) Outputs CLK Clock input (active rising edge) FIGURE 1. Terminal connections. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-93220 A REVISION LEVEL D SHEET 9 INPUTS OUTPUTS OE CLK mD mQ L H H L L L L L X Q0 H X X Z H= L= X= Z= = Q0 = High voltage level Low voltage level Irrelevant Disabled Low-to-high clock transition The value Q after the most recent positive transition of CLK FIGURE 2. Truth table. FIGURE 3. Logic diagram. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-93220 A REVISION LEVEL D SHEET 10 NOTES: 1. CL includes a 47 pF chip capacitor (-0 percent, +20 percent) and at least 3 pF of equivalent capacitance from the test jig and probe. 2. RL = 450 1 percent, chip resistor in series with a 50 termination. For monitored outputs, the 50 termination shall be the 50 characteristic impedance of the coaxial connector to the oscilloscope. 3. Input signal to the device under test: a. VIN = 0.0 V to 3.0 V; duty cycle = 50 percent; fIN 1 MHz. b. tr, tf = 3.0 ns 1.0 ns. For input signal generators incapable of maintaining these values of tr and tf, the 3.0 ns limit may be increased up to 10 ns, as needed, maintaining the 1.0 ns tolerance and guaranteeing the results at 3.0 ns 1.0 ns; skew between any two switching inputs signals (tsk) 250 ps. FIGURE 4. Ground bounce test circuit and waveforms. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-93220 A REVISION LEVEL D SHEET 11 FIGURE 5. Switching waveforms and test circuit. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-93220 A REVISION LEVEL D SHEET 12 NOTES: 1. When measuring tPLZ and tPZL VTEST = 7.0 V. 2. When measuring tPHZ, tPZH, tPLH and tPHL: VTEST = open. 3. The tPZL and tPLZ reference waveform is for the output under test with internal conditions such that the output is at VOL except when disabled by the output enable control. The tPZH and tPHZ reference waveform is for the output under test with internal conditions such that the output is at VOH except when disabled by the output enable control. 4. CL = 50 pF minimum or equivalent (includes test jig and probe capacitance). 5. RL = 500 or equivalent, RT= 50 or equivalent. 6. Input signal from pulse generator: VIN = 0.0 V to 3.0 V; PRR 10 MHz; tr 2.5 ns; tf 2.5 ns; tr and tf shall be measured from 0.3 to 2.7 V and 2.7 V to 0.3 V, respectively; duty cycle = 50 percent. 7. Timing parameters shall be tested at a minimum input frequency of 1 MHz. 8 The outputs are measured one at a time with one transition per measurement. FIGURE 5. Switching waveforms and test circuit - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-93220 A REVISION LEVEL D SHEET 13 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA = +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein. 4.2.2 Additional criteria for device classes Q and V. a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table II herein. c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in MIL-PRF-38535, appendix B. 4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified herein. Quality conformance inspection for device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-93220 A REVISION LEVEL D SHEET 14 TABLE II. Electrical test requirements. Test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Subgroups (in accordance with MIL-PRF-38535, table III) Device class M Device class Q Interim electrical parameters (see 4.2) --- --- 1 Final electrical parameters (see 4.2) 1/ 1, 2, 3, 7, 8, 9, 10, 11 1/ 1, 2, 3, 7, 8, 9, 10, 11 2/ 1, 2, 3, 7, 8, 9, 10, 11 Group A test requirements (see 4.4) 1, 2, 3, 4, 7, 8, 9, 10, 11 1, 2, 3, 4, 7, 8, 9, 10, 11 1, 2, 3, 4, 7, 8, 9, 10, 11 Group C end-point electrical parameters (see 4.4) 1, 2, 3 1, 2, 3 1, 2, 3, 7, 8, 9, 10, 11 Group D end-point electrical parameters (see 4.4) 1, 2, 3 1, 2, 3 1, 2, 3 Group E end-point electrical parameters (see 4.4) 1, 7, 9 1, 7, 9 1, 7, 9 Device class V 1/ PDA applies to subgroup 1. 2/ PDA applies to subgroups 1 and 7. 4.4.1 Group A inspection. a. Tests shall be as specified in table II herein. b. For device class M, subgroups 7 and 8 tests shall be sufficient to verify the truth table in figure 2 herein. The test vectors used to verify the truth table shall, at a minimum, test all functions of each input and output. All possible input to output logic patterns per function shall be guaranteed, if not tested, to the truth table in figure 2, herein. For device classes Q and V, subgroups 7 and 8 shall include verifying the functionality of the device. c. CIN and COUT, shall be measured only for initial qualification and after process or design changes which may affect capacitance. CIN and COUT shall be measured between the designated terminal and GND at a frequency of 1 MHz. This test may be performed at 10 MHz and guaranteed, if not tested, at 1 MHz. The DC bias for the pin under test (VBIAS) = 2.5 V or 3.0 V. For CIN and COUT, test all applicable pins on five devices with zero failures. For CIN and COUT, a device manufacturer may qualify devices by functional groups. A specific functional group shall be composed of function types that by design will yield the same capacitance values when tested in accordance with table I, herein. The device manufacturer shall set a function group limit for the CIN and COUT tests. The device manufacturer may then test one device functional group, to the limits and conditions specified herein. All other device functions in that particular functional group shall be guaranteed, if not tested, to the limits and test conditions specified in table I, herein. The device manufacturers shall submit to DSCC-VA the device functions listed in each functional group and the test results for each device tested. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-93220 A REVISION LEVEL D SHEET 15 d. Ground and VCC bounce tests are required for all device classes. These tests shall be performed only for initial qualification, after process or design changes which may affect the performance of the device, and any changes to the test fixture. VOLP, VOLV, VOHP, and VOHV shall be measured for the worst case outputs of the device. All other outputs shall be guaranteed, if not tested, to the limits established for the worst case outputs. The worst case outputs tested are to be determined by the manufacturer. Test 5 devices assembled in the worst case package type supplied to this document. All other package types shall be guaranteed, if not tested, to the limits established for the worst case package. The 5 devices to be tested shall be the worst case device type supplied to this drawing. All other device types shall be guaranteed, if not tested, to the limits established for the worst case device type. The package type and device type to be tested shall be determined by the manufacturer. The device manufacturer will submit to DSCC-VA data that shall include all measured peak values for each device tested and detailed oscilloscope plots for each VOLP, VOLV, VOHP, and VOHV from one sample part per function. The plot shall contain the waveforms of both a switching output and the output under test. Each device manufacturer shall test product on the fixtures they currently use. When a new fixture is used, the device manufacturer shall inform DSCC-VA of this change and test the 5 devices on both the new and old test fixtures. The device manufacturer shall then submit to DSCC-VA data from testing on both fixtures, that shall include all measured peak values for each device tested and detailed oscilloscope plots for each VOLP, VOLV, VOHP, and VOHV from one sample part per function. The plot shall contain the waveforms of both a switching output and the output under test. For VOHP, VOHV, VOLP, and VOLV, a device manufacturer may qualify devices by functional groups. A specific functional group shall be composed of function types, that by design, will yield the same test values when tested in accordance with table I, herein. The device manufacturer shall set a functional group limit for the VOHP, VOHV, VOLP, and VOLV tests. The device manufacturer may then test one device function from a functional group, to the limits and conditions specified herein. All other device functions in that particular functional group shall be guaranteed, if not tested, to the limits and conditions specified in table I, herein. The device manufacturers shall submit to DSCC-VA the device functions listed in each functional group and test results, along with the oscilloscope plots, for each device tested. 4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table II herein. 4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883: a. Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. b. TA = +125C, minimum. c. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. 4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table II herein. 4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured (see 3.5 herein). a. End-point electrical parameters shall be as specified in table II herein. b. For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All device classes must meet the postirradiation end-point electrical parameter limits as defined in table I at TA = +25C 5C, after exposure, to the subgroups specified in table II herein. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-93220 A REVISION LEVEL D SHEET 16 4.5 Methods of inspection. Methods of inspection shall be specified as follows: 4.5.1 Voltage and current. Unless otherwise specified, all voltages given are referenced to the microcircuit GND terminal. Currents given are conventional current and positive when flowing into the referenced terminal. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing. 6.1.2 Substitutability. Device class Q devices will replace device class M devices. 6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.3 Record of users. Military and industrial users should inform Defense Supply Center Columbus (DSCC) when a system application requires configuration control and which SMD's are applicable to that system. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. 6.4 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephone (614) 692-0547. 6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in MIL-PRF-38535 and MIL-HDBK-1331. 6.6 Sources of supply. 6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535. The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DSCC-VA and have agreed to this drawing. 6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103. The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DSCC-VA. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-93220 A REVISION LEVEL D SHEET 17 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 09-03-24 Approved sources of supply for SMD 5962-93220 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DSCC-VA. This information bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. DSCC maintains an online database of all current sources of supply at http://www.dscc.dla.mil/Programs/Smcr/. Standard microcircuit drawing PIN 1/ Vendor CAGE number 5962-9322001MRA 0C7V7 54ABT574DMQB 5962-9322001MSA 0C7V7 54ABT574FMQB 5962-9322001M2A 0C7V7 54ABT574LMQB 5962-9322001QRA 0C7V7 01295 54ABT574J-QML SNJ54ABT574J 5962-9322001QSA 0C7V7 01295 54ABT574W-QML SNJ54ABT574W 5962-9322001Q2A 0C7V7 01295 54ABT574E-QML SNJ54ABT574FK Vendor similar PIN 2/ 1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the vendor to determine its availability. 2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. Vendor CAGE number Vendor name and address 01295 Texas Instruments Incorporated Semiconductor Group 8505 Forest Ln. P.O. Box 660199 Dallas, TX 75243 Point of contact: U.S. Highway 75 South P.O. Box 84, M/S 853 Sherman, TX 75090-9493 0C7V7 QP Semiconductor 2945 Oakmead Village Court Santa Clara, CA 95051 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin.