SIEMENS CFY25 HiRel X-Band GaAs Low Noise / General Purpose MESFET HiFfel Discrete and Microwave Semiconductor 4A 3 @ For professional pre- and driver-amplifiers For frequencies from 500 MHz to 20 GHz Hermetically sealed microwave package 1 9 Low noise figure, high gain, moderate power -@S@ Space Qualification Expected 1998 ESA/SCC Detail Spec. No.: 5613/008, Type Variant No.s 01 to 05 ESD: Electrostatic discharge sensitive device, observe handling precautions! Type Marking | Ordering Code | Pin Configuration Package 1 2 3 4 CFY25-P (ql) - see below G Ss DBD | S |Micro-xX CFY25-23 (ql) CFY25-23P (ql) CFY25-20 (ql) CFY25-20P (ql) CFY25-nnl: specifies noise, gain and output power level (see electrical characteristics) (ql) Quality Level: P: Professional Quality, Ordering Code: Q62703F120 H: High Rel Quality, Ordering Code: on request S: Space Quality, Ordering Code: on request ES: ESA Space Quality, Ordering Code: Q62703F119 (see order instructions for ordering example) Semiconductor Group 1 of 8 Draft D, Jul. 98SIEMENS CFY25 Maximum Ratings Parameter Symbol | Values Unit Drain-source voltage Vos 5 Vv Drain-gate voltage Voc 7 Vv Gate-source voltage (reverse /forward) | V.. -5...4+0.5 Vv Drain current I, 80 mA Gate forward current I, 1.5 mA RF Input Power, C- and X-Band P.., +17 dBm Junction temperature T, 175 C Storage temperature range Tag -65...4+175 C Total power dissipation P.., 250 mW Soldering temperature * T.., 230 C Thermal Resistance Junction-soldering point Ris <410 KAW Notes.: 1) For V,, <3 V. For V,, > 3 V, derating is required. DS 2) ALT, = + 72.5 C. For I, > + 72.5 C derating is required. 3) During 15 sec. maximum. The same terminal shall not be resoldered until 3 minutes have elapsed. Semiconductor Group 2o0f 8 Draft D, Jul. 98SIEMENS CFY25 Electrical Characteristics (at T,=25C; unless otherwise specified) Parameter Symbol Values Unit min. typ. max. DC Characteristics Drain-source saturation current bes 15 30 60 mA Vis =3V.V,,=0V Gate threshold voltage Voth 0.3 1.0 3.0 Vv Vis= 3 V, =1 mA Drain current at pinch-off op - <100 |- LA Vig=S ViVi G=-4V Gate leakage current at pinch-off le, - < 100 |200 LA Visa SV. Vog=-4V Transconductance Dns 35 40 - ms Vie = 3 V,1,=15 mA Gate leakage current at operation lots - <1 2 LA Vis = 3 V.1,=15 mA Thermal resistance Rivus - 370 - K/W junction to soldering point Semiconductor Group 3 of 8 Draft D, Jul. 98SIEMENS CFY25 Electrical Characteristics (continued) Parameter Symbol Values Unit min. typ. max. AC Characteristics Noise figure NF dB V,,=3V, |, = 15 mA, f= 12 GHz CFY25-P <2.3 CFY25-20, -20P 1.9 2.1 CFY25-23, -23P 2.2 2.4 Associated gain. G, dB V,,=3V, |, = 15 mA, f= 12 GHz CFY25-P > 85 CFY25-20, -20P 8.5 9 CFY25-23, -23P 8.0 8.7 Output power at 1 dB gain compression | P,,, dBm Vos = 3 V, lynean = 20 MA, f = 12 GHz CFY25-20, -23 15 CFY25-20P, 23P, -P 14 15 Linear power gain G,, dB Vis =3V, |, = 20 mA, f = 12 GHz, P_=0dBm CFY25-20 9.2 CFY25-23 8.5 CFY25-20P, -P 8.5 9.2 CFY25-23P 8.0 8.5 1) Noise figure / sssociated gain characteristics given for minimum noise figure matching conditions (fixed generic matching, no fine-tuning). 2) Output power / linear power gain characteristics given for optimum output power matching conditions (fixed generic matching, no fine-tuning). Semiconductor Group 4of8 Draft D, Jul. 98SIEMENS CFY25 Typical Common Source S-Parameters CFY25-20 f [Sii| 8.5 dB, P,,, > 14 dBm @ 12 GHz in ESA Space Quality Level Further Informations: See our WWW-Pages: - Discrete and RF-Semiconductors (Small Signal Semiconductors) www.siemens.de/semiconductor/products/35/35.htm - HiRel Discrete and Microwave Semiconductors www .siemens.de/semiconductor/products/35/353 .htm Please contact also our marketing division : Tel.: Fax.: e-mail: Address: Semiconductor Group +4+89 6362 4480 +489 6362 5568 martin. wimmers@siemens-scg.com Siemens Semiconductors, High Frequency Products Marketing, P.O.Box 801709, D-81617 Munich 7ots Draft D, Jul. 98SIEMENS CFY25 Micro-X Package _ 41,0240, $ ae KY 1 DN fr s FO {JF a! -4 b Nate Bow : | o T $ 1,78 39 * biz og = - Q al -_ o af. O1,6520,1 Semiconductor Group Published by Siemens Semiconductors, High Frequency Products Marketing, P.G.Box 801709, D-81617 Munich. Siemens AG 1998. All Rights Reserved. As far as patents or other rights of third parties are concerned, liability is only assumed for components per se, not for applications, processes and circuits implemented within components or assemblies. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. For questions on technology, delivery and prices please contact the Offices of Semiconductor Group in Germany or the Siemens Companies and Representatives woldwide (see address list). Due to technical requirements components may contain dangerous substances. For information on the type in question please contact your nearest Siemens Office, Semiconductor Group. Siemens Semiconductors is a certified CECC and Q89000 manufacturer (this includes ISO 9000). 8of 8 Draft D, Jul. 98