ams Datasheet Page 1
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AS7262
6-Channel Visible Spectral_ID Device
with Electronic Shutter and Smart
Interface
The AS7262 is a cost-effective multi-spectral sensor-on-chip
solution designed to address spectral ID applications. This
highly integrated device delivers 6-channel multi-spectral
sensing in the visible wavelengths from approximately 430nm
to 670nm with full-width half-max (FWHM) of 40nm. An
integrated LED driver with programmable current is provided
for electronic shutter applications.
The AS7262 integrates Gaussian filters into standard CMOS
silicon via nano-optic deposited interference filter technology
and is packaged in an LGA package that provides a built in
aperture to control the light entering the sensor array.
Control and spectral data access is implemented through either
the I²C register set, or with a high level AT Spectral Command
set via a serial UART.
Ordering Information and Content Guide appear at end of
datasheet.
Key Benefits & Features
The benefits and features of AS7262, 6-Channel Visible
Spectral_ID Device with Electronic Shutter and Smart Interface
are listed below:
Figure 1:
Added Value of Using AS7262
Benefits Features
•Compact 6-channel spectrometry solution •6 visible channels: 450nm, 500nm, 550nm, 570nm,
600nm and 650nm, each with 40nm FWHM
•Simple text-based command interface via
UART, or direct register read and write with
interrupt on sensor ready option on I²C
•UART or I²C slave digital Interface
•Lifetime-calibrated sensing with minimal drift
over time or temperature •Visible filter set realized by silicon interference filters
•No additional signal conditioning required •16-bit ADC with digital access
•Electronic shutter control/synchronization •Programmable LED drivers
•Low voltage operation •2.7V to 3.6V with I²C interface
•Small, robust package, with built-in aperture •20-pin LGA package 4.5mm x 4.7mm x 2.5mm
-40°C to 85°C temperature range
General Description
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AS7262 − General Description
Applications
The AS7262 applications include:
•Portable spectrometry
•Horticulture
•Color matching and identification
•Authentication and brand protection
•Precision color tuning/calibration
Block Diagram
The system blocks of this device are shown below.
Figure 2:
AS7262 Visible Spectral_ID System
10 0nF
RX / SCL_S
GND
LED_DRV
SCK
CSN_EE
MISO
MOSI
VDD1 VDD2
AS7262
μP
10μF
3V
3V
TX / SDA_S LED_IND
3V
Flash
Memory
6-channel
Visible
Senso r
Light
Source
Light in
Reflective
Surface
INT
ams Datasheet Page 3
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AS7262 − Pin Assignments
The device pin assignments are described below.
Figure 3:
Pin Diagram of AS7262 (Top View)
Figure 4:
Pin Description of AS7262
Pin Number Pin Name Description
1 NF Not Functional. Do not connect.
2RESNReset, Active LOW
3 SCK SPI Serial Clock
4MOSISPI Master Out Slave In
5MISOSPI Master In Slave Out
6CSN_EEChip Select for external serial Flash memory, Active LOW
7 CSN_SD Chip Select for SD Card Interface, Active LOW
8 I²C_ENB Select UART (Low) or I²C (High) Operation
9 NF Not Functional. Do not connect.
10 NF Not Functional. Do not connect.
11 RX/SCL_S RX (UART) or SCL_S (I²C Slave) Depending on I²C_ENB
12 TX/SDA_S TX (UART) or SDA_S (I²C Slave) Depending on I²C_ENB
13 INT Interrupt, Active LOW
14 VDD2 Voltage Supply
Pin Assignments
1
5
610
11
15
1620
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AS7262 − Pin Assignments
15 LED_DRV LED Driver Output for Driving LED, Current Sink
16 GND Ground
17 VDD1 Voltage Supply
18 LED_IND LED Driver Output for Indicator LED, Current Sink
19 NF Not Functional. Do not connect.
20 NF Not Functional. Do not connect.
Pin Number Pin Name Description
ams Datasheet Page 5
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AS7262 − Absolute Maximum Ratings
Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. These are stress
ratings only. Functional operation of the device at these or any
other conditions beyond those indicated under Electrical
Characteristics is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device
reliability.
The device is not designed for high energy UV (ultraviolet)
environments, including upward looking outdoor applications,
which could affect long term optical performance.
Figure 5:
Absolute Maximum Ratings of AS7262
Symbol Parameter Min Max Units Comments
Electrical Parameters
VDD1_MAX Supply Voltage VDD1 -0.3 5 V Pin VDD1 to GND
VDD2_MAX Supply Voltage VDD2 -0.3 5 V Pin VDD2 to GND
VDD_IO Input/Output Pin Voltage -0.3 VDD+0.3 V Input/Output Pin to GND
ISCR Input Current
(latch-up immunity) ± 100 mA JESD78D
Electrostatic Discharge
ESDHBM Electrostatic Discharge HBM ± 1000 V JS-001-2014
ESDCDM Electrostatic Discharge CDM ± 500 V JSD22-C101F
Temperature Ranges and Storage Conditions
TSTRG Storage Temperature Range -40 85 °C
TBODY Package Body Temperature 260 °C
IPC/JEDEC J-STD-020
The reflow peak soldering
temperature (body
temperature) is specified
according to IPC/JEDEC
J-STD-020 “Moisture/Reflow
Sensitivity Classification for
Non-hermetic Solid State
Surface Mount Devices.”
RHNC Relative Humidity
(non-condensing) 585%
MSL Moisture Sensitivity Level 3 Maximum floor life time of
168 hours
Absolute Maximum Ratings
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AS7262 − Electrical Characteristics
All limits are guaranteed with VDD = VDD1 = VDD2 = 3.3V,
TAMB = 25°C. The parameters with min and max values are
guaranteed with production tests or SQC (Statistical Quality
Control) methods.
Figure 6:
Electrical Characteristics of AS7262
Symbol Parameter Conditions Min Typ Max Unit
General Operating Conditions
VDD1 /VDD2 Voltage Operating Supply UART Interface 2.97 3.3 3.6 V
VDD1 /VDD2 Voltage Operating Supply I²C Interface 2.7 3.3 3.6 V
TAMB Operating Temperature -40 25 85 °C
IVDD Operating Current 5 mA
Internal RC Oscillator
FOSC Internal RC Oscillator
Frequency 15.7 16 16.3 MHz
tJITTER (1) Internal Clock Jitter @25°C 1.2 ns
Temperature Sensor
DTEMP
Absolute Accuracy of the
Internal Temperature
Measurement
-8.5 8.5 °C
Indicator LED
IIND LED Current 1 4 8 mA
IACC Accuracy of Current -30 30 %
VLED Voltage Range of Connected
LED Vds of current sink 0.3 VDD V
LED_DRV
ILED1 LED Current 12.5, 25, 50 or 100 12.5 100 mA
IACC Accuracy of Current -10 10 %
VLED Voltage Range of Connected
LED Vds of current sink 0.3 VDD V
Electrical Characteristics
ams Datasheet Page 7
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AS7262 − Electrical Characteristics
Note(s):
1. Guaranteed, not tested in production
Digital Inputs and Outputs
IIH, IIL Logic Input Current Vin=0V or VDD -1 1 A
IIL RESN Logic Input Current (RESN
pin) Vin=0V -1 -0.2 mA
VIH CMOS Logic High Input
0.7* VDD
VDD
V
VIL CMOS Logic Low Input
0
0.3* VDD
V
VOH CMOS Logic High Output I=1mA
VDD-0.4
V
VOL CMOS Logic Low Output I=1mA 0.4 V
tRISE (1) Current Rise Time C(Pad)=30pF 5 ns
tFALL (1) Current Fall Time C(Pad)=30pF 5 ns
Symbol Parameter Conditions Min Typ Max Unit
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AS7262 − Timin g Charac teristics
Figure 7:
AS7262 I²C Slave Timing Characteristics
Figure 8:
I²C Slave Timing Diagram
Symbol Parameter Conditions Min Typ Max Unit
I²C Interface
fSCLK SCL Clock Frequency 0 400 kHz
tBUF Bus Free Time Between a STOP
and START 1.3 µs
tHS:STA Hold Time (Repeated) START 0.6 µs
tLOW LOW Period of SCL Clock 1.3 µs
tHIGH HIGH Period of SCL Clock 0.6 µs
tSU:STA Setup Time for a Repeated START 0.6 µs
tHS:DAT Data Hold Time 0 0.9 µs
tSU:DAT Data Setup Time 100 ns
tRRise Time of Both SDA and SCL 20 300 ns
tFFall Time of Both SDA and SCL 20 300 ns
tSU:STO Setup Time for STOP Condition 0.6 µs
CBCapacitive Load for Each Bus Line CB — total capacitance of
one bus line in pF 400 pF
CI/O I/O Capacitance (SDA, SCL) 10 pF
Timing Characteristics
SCL
SDA
t
SU:STA
t
LOW
t
HIGH
t
F
t
R
t
HD:STA
t
SU:STO
t
SU:DAT
t
HD:DAT
t
BUF
V
IH
V
IL
PS SP
Stop Start
ams Datasheet Page 9
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AS7262 − Timing Characteristics
Figure 9:
AS7262 SPI Timing Characteristics
Figure 10:
SPI Master Write Timing Diagram
Symbol Parameter Conditions Min Typ Max Unit
SPI Interface
fSCK Clock Frequency 0 16 MHz
tSCK_H Clock High Time 40 ns
tSCK_L Clock Low Time 40 ns
tSCK_RISE SCK Rise Time 5 ns
tSCK_FALL SCK Fall Time 5 ns
tCSN_S CSN Setup Time Time between CSN high-low
transition to first SCK high transition 50 ns
tCSN_H CSN Hold Time Time between last SCK falling edge
and CSN low-high transition 100 ns
tCSN_DIS CSN Disable Time 100 ns
tDO_S Data-Out Setup Time 5 ns
tDO_H Data-Out Hold Time 5 ns
tDI_V Data-In Valid 10 ns
t
DO_H
t
CSN_H
CSN
MOSI
MISO
SCK
t
CSN_S
MSB
t
DO_S
LSB
HI-Z HI-Z
t
CS N_ D I S
t
SCK_RISE
t
SCK_FALL
ams Datasheet Page 11
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AS7262 − Optical Characteristics
Figure 12:
Optical Characteristics of AS7262 (Pass Band) (1)
Note(s):
1. Calibration and measurements are made using diffused light
2. Each channel is tested with GAIN = 16x, Integration Time (INT_T) = 166ms and VDD = VDD1 = VDD2 = 3.3V, TAMB=25°C
3. The accuracy of the channel counts/W/cm2 is ±12%
4. The light source is either a 5700K white LED with an irradiance of ~600W/cm2, or an incandescent light with an irradiance of
~1500 W/cm2 (300-1000nm). The energy at each channel (V, B, G, Y, O, R) is calculated with a ±40nm bandwidth around the center
wavelengths (450nm, 500nm, 550nm, 570nm, 600nm, 650nm).
Symbol Parameter Test Conditions Channel
(nm) Min Typ Max Unit
V Channel V 5700K White LED (2), (4) 450 45 (3), (4)
counts/
(W/cm
2
)
B Channel B 5700K White LED (2), (4) 500 45 (3), (4)
counts/
(W/cm
2
)
G Channel G 5700K White LED (2), (4) 550 45 (3), (4)
counts/
(W/cm
2
)
Y Channel Y 5700K White LED (2), (4) 570 45 (3), (4)
counts/
(W/cm
2
)
O Channel O 5700K White LED (2), (4) 600 45 (3), (4)
counts/
(W/cm
2
)
R Channel R Incandescent (2), (4) 650 45 (3), (4)
counts/
(W/cm
2
)
FWHM Full Width Half Max 40 40
nm
Wacc Wavelength Accuracy ±5
nm
dark Dark Channel Counts GAIN=64, TAMB=25°C 5
counts
PFOV Package Field of View ±20.0
deg
Optical Characteristics
ams Datasheet Page 13
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AS7262 − Detailed Description
Figure 14:
AS7262 Functional Block Diagram
6-Channel Visible Spectral_ID Detector
The AS7262 6-channel Spectral_ID is a next-generation digital
spectral sensor device. Each channel has a Gaussian filter
characteristic with a full width half maximum (FWHM)
bandwidth of 40nm.
The sensor contains analog-to-digital converters (16-bit
resolution ADC), which integrate the current from each
channel’s photodiode. Upon completion of the conversion
cycle, the integrated result is transferred to the corresponding
data registers. The transfers are double-buffered to ensure that
the integrity of the data is maintained.
Interference filters enable high temperature stability and
minimal lifetime drift. Filter accuracy will be affected by the
angle of incidence which itself is limited by integrated aperture
and internal micro-lens structure. The aperture-limited field of
view is ±20.0° to deliver specified accuracy.
Detailed Description
RC Osc
Spectral_ID
Engine
VDD1 VDD2
GND
16MHz
MISO
SCK
MOSI
CSN_SD
RESN
°C
SPI
Master
TX / SDA_S
RX / SCL_S
UART / I
2
CLED_DRV
VBG
Multi
Spectral
Sensor
Y
LED_IND
OR
I2C_ENB
INT
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AS7262 − Detailed Description
Data Conversion Description
AS7262 spectral conversion is implemented via two
photodiode banks per device. Bank 1 consists of data from the
V, G, B, Y photodiodes. Bank 2 consists of data from the G, Y, O,
R photodiodes. Spectral conversion requires the integration
time (IT in ms) set to complete. If both photodiode banks are
required to complete the conversion, the 2nd bank requires an
additional IT ms. Minimum IT for a single bank conversion is
2 .8 m s. I f d at a i s re q ui re d fro m all 6 photodiodes then the device
must perform 2 full conversions (2 x Integration Time).
The spectral conversion process is controlled with BANK Mode
settings as follows:
BANK Mode 0: Data will be available in registers V, B, G & Y (O
and R registers will be zero) with conversions occurring
continuously.
BANK Mode 1: Data will be available in registers G, Y, O & R (V
and B registers will be zero) with conversions occurring
continuously.
BANK Mode 2: Data will be available in registers V, B, G, Y, O &
R with conversions occurring continuously.
When the bank setting is Mode 0, Mode 1, or Mode 2, the
spectral data conversion process operates continuously, with
new data available after each IT ms period. In the continuous
modes, care should be taken to assure prompt interrupt
servicing so that integration values from both banks are all
derived from the same spectral conversion cycle.
BANK Mode 3: Data will be available in registers V, B, G, Y, O &
R in One-Shot mode
When the bank setting is set to Mode 3 the device initiates
One-Shot operation. The DATA_RDY bit is set to 1 once data is
available, indicating spectral conversion is complete. One-Shot
mode is intended for use when it is critical to ensure spectral
conversion results are obtained contemporaneously. An
example use for one-shot mode is when a digitally controlled
illumination source is briefly turned on for the purpose of taking
a set of filter readings.
ams Datasheet Page 15
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AS7262 − Detailed Description
Figure 15:
Photo Diode Array
Figure 16:
Bank Mode and Data Conversion
G Y B
O V R
Photo Diode Array
BANK Mode 0
One Conversion V, B, G, Y
Integration Time
G, Y, O, R
One Conversion
BANK Mode 1
Integration Time
V, B, G, Y
1st Conversion
BANK Mode 2
Integration Time G, Y, O, R
2nd Conversion
Integration Time
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AS7262 − Detailed Description
RC Oscillator
The timing generation circuit consists of an on-chip 16MHz,
temperature compensated oscillator, which provides the
master clock for the AS7262.
Temperature Sensor
The temperature sensor is constantly measuring the on-chip
temperature and enables temperature compensation
procedures.
Reset
Pulling down the RESN pin for longer than 100ms resets the
AS7262.
Figure 17:
Reset Circuit
Indicator LED
The LED, connected to pin LED_IND, can be used to indicate
programming progress of the device.
While programming the AS7262 via the external SD card the
indicator LED starts flashing (500ms pulses). When
programming is completed the indicator LED is switched off.
The LED (LED0) can be turned ON/OFF via AT commands or via
I²C register control. The LED sink current is programmable from
1mA, 2mA, 4mA and 8mA.
Reset
AS72 62
Spectral_ID
Engine
RESN
Push > 100ms
ams Datasheet Page 17
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AS7262 − Detailed Description
Electronic Shutter with LED_DRV Driver Control
There are two LED driver outputs that can be used to control
up to 2 LEDs. This will allow different wavelength light sources
to be used in the same system. The LED output sink currents are
programmable and can drive external LED sources: LED_IND
from 1mA, 2mA, 4mA and 8mA and LED_DRV from 12.5mA,
25mA, 50mA and 100mA. The sources can be turned off and on
via I²C registers control or AT commands and provides the
device with an electronic shutter.
Interrupt Operation
If BANK is set to Mode 0 or Mode 1 then the data is ready after
the 1st integration time. If BANK is set to Mode 2 or Mode 3 then
the data is ready after two integration times. If the interrupt is
enabled (INT = 1) then when the data is ready, the INT line is
pulled low and DATA_RDY is set to 1. The INT line is released
(returns high) when the control register is read. DATA_RDY is
cleared to 0 when any of the sensor registers V, B, G, Y, O & R are
read. For multi-byte sensor data (2 or 4 bytes), after the 1st byte
is read the remaining get shadow buffer protected in case an
integration cycle completes just after the 1st byte is read.
In continuous spectral conversion mode (BANK setting of Mode
0, 1, or 2), the sensors continue to gather information at the rate
of the integration time, hence if the sensor registers are not read
when the interrupt line goes low, it will stay low and the next
cycle’s sensor data will be available in the registers at the end
of the next integration cycle.
When the control register BANK bits are written with a value of
Mode 3, One-Shot Spectral Conversion mode is entered. When
a single set of contemporaneous sensor readings is desired,
writing BANK Mode 3 to the control register immediately
triggers exactly two spectral data conversion cycles. At the end
of these two conversion cycles, the DATA_RDY bit is set as for
the other BANK modes. To perform a new One-Shot sequence,
the control register BANK bits should be written with a value of
Mode 3 again. This process may continue until the user writes
a different value into the BANK bits.
I²C Slave Interface
If selected by the I²C_ENB pin setting, interface and control can
be accomplished through an I²C compatible slave interface to
a set of registers that provide access to device control functions
and output data. These registers on the AS7262 are, in reality,
implemented as virtual registers in software. The actual I²C
slave hardware registers number only three and are described
in the table below. The steps necessary to access the virtual
registers defined in the following are explained in pseudocode
for external I²C master writes and reads below.
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AS7262 − Detailed Description
I²C Feature List
•Fast mode (400kHz) and standard mode (100kHz) support.
•7+1-bit addressing mode.
•Write format: Byte.
•Read format: Byte.
•SDA input delay and SCL spike filtering by integrated
RC-components.
Figure 18:
I²C Slave Device Address and Physical Registers
I²C Virtual Register Write Access
I²C Virtual Register Byte Write shows the pseudocode necessary
to write virtual registers on the AS7262. Note that, because the
actual registers of interest are realized as virtual registers, a
means of indicating whether there is a pending read or write
operation of a given virtual register is needed. To convey this
information, the most significant bit of the virtual register
address is used as a marker. If it is 1, then a write is pending,
otherwise the slave is expecting a virtual read operation. The
pseudocode illustrates the proper technique for polling of the
I²C slave status register to ensure the slave is ready for each
transaction.
Entity Description Note
Device Slave Address 8-bit Slave Address
Byte = 1001001x (device address = 49 hex)
x= 1 for Master Read (byte = 93 hex)
x= 0 for Master Write (byte = 92 hex)
STATUS Register
I²C slave interface
STATUS register
Read-only
Register Address = 0x00
Bit 1: TX_VALID
0 → New data may be written to WRITE register
1 → WRITE register occupied. Do NOT write.
Bit 0: RX_VALID
0 → No data is ready to be read in READ register.
1 → Data byte available in READ register.
WRITE Register
I²C slave interface
WRITE register
Write-only
Register Address = 0x01
8-Bits of data written by the I²C Master intended
for receipt by the I²C slave. Used for both virtual
register addresses and write data.
READ Register
I²C slave interface
READ register
Read-only
Register Address = 0x02
8-Bits of data to be read by the I²C Master.
ams Datasheet Page 19
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AS7262 − Detailed Description
I²C Virtual Register Byte Write
Pseudocode
Poll I²C slave STATUS register;
If TX_VALID bit is 0, a write can be performed on the interface;
Send a virtual register address and set the MSB of the register address to 1 to indicate the pending write;
Poll I²C slave STATUS register;
If TX_VALID bit is 0, the virtual register address for the write has been received and the data may now be written;
Write the data.
Sample Code:
#define I2C_AS72XX_SLAVE_STATUS_REG 0x00
#define I2C_AS72XX_SLAVE_WRITE_REG 0x01
#define I2C_AS72XX_SLAVE_READ_REG 0x02
#define I2C_AS72XX_SLAVE_TX_VALID 0x02
#define I2C_AS72XX_SLAVE_RX_VALID 0x01
void i2cm_AS72xx_write(uint8_t virtualReg, uint8_t d)
{
volatile uint8_t status;
while (1)
{
// Read slave I²C status to see if the write buffer is ready.
status = i2cm_read(I2C_AS72XX_SLAVE_STATUS_REG);
if ((status & I2C_AS72XX_SLAVE_TX_VALID) == 0)
// No inbound TX pending at slave. Okay to write now.
break;
}
// Send the virtual register address (setting bit 7 to indicate a pending write).
i2cm_write(I2C_AS72XX_SLAVE_WRITE_REG, (virtualReg | 0x80));
while (1)
{
// Read the slave I²C status to see if the write buffer is ready.
status = i2cm_read(I2C_AS72XX_SLAVE_STATUS_REG);
if ((status & I2C_AS72XX_SLAVE_TX_VALID) == 0)
// No inbound TX pending at slave. Okay to write data now.
break;
}
// Send the data to complete the operation.
i2cm_write(I2C_AS72XX_SLAVE_WRITE_REG, d);
}
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AS7262 − Detailed Description
I²C Virtual Register Read Access
I²C Virtual Register Byte Read shows the pseudocode necessary
to read virtual registers on the AS7262. Note that in this case,
reading a virtual register, the register address is not modified.
I²C Virtual Register Byte Read
Pseudocode
Poll I²C slave STATUS register;
If TX_VALID bit is 0, the virtual register address for the read may be written;
Send a virtual register address;
Poll I²C slave STATUS register;
If RX_VALID bit is 1, the read data is ready;
Read the data.
Sample Code:
uint8_t i2cm_AS72xx_read(uint8_t virtualReg)
{
volatile uint8_t status, d;
while (1)
{
// Read slave I²C status to see if the read buffer is ready.
status = i2cm_read(I2C_AS72XX_SLAVE_STATUS_REG);
if ((status & I2C_AS72XX_SLAVE_TX_VALID) == 0)
// No inbound TX pending at slave. Okay to write now.
break;
}
// Send the virtual register address (setting bit 7 to indicate a pending write).
i2cm_write(I2C_AS72XX_SLAVE_WRITE_REG, virtualReg);
while (1)
{
// Read the slave I²C status to see if our read data is available.
status = i2cm_read(I2C_AS72XX_SLAVE_STATUS_REG);
if ((status & I2C_AS72XX_SLAVE_RX_VALID) != 0)
// Read data is ready.
break;
}
// Read the data to complete the operation.
d = i2cm_read(I2C_AS72XX_SLAVE_READ_REG);
return d; s
}
The details of the i2cm_read() and i2cm_write()
functions in previous Figures are dependent upon the nature
and implementation of the external I²C master device.
ams Datasheet Page 21
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AS7262 − Detailed Description
4-Byte Floating-Point (FP) Registers
Several 4-byte registers (hex) are used by the AS7262. Here is
an example of how these registers are used to represent floating
point data (based on the IEEE 754 standard):
Figure 19:
Example of the IEEE 754 Standard
The floating point (FP) value assumed by 32 bit binary32 data
with a biased exponent e (the 8 bit unsigned integer) and a
23 bit fraction is (for the above example):
0 0 1 1 1 1 1 0
31
0 0 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
3E (hex) 20 (hex) 00 (hex) 00 (hex)
byte 3 byte 2 byte 1 byte 0
0 0 1 1 1 1 1 0 0 0 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
exponent (8 bits) fraction (23 bits)
24 23 16 15 8 7 0
31 2330 22 0
sign
= 0.15625
FP value 1–()
sign 1b
23 i– 2i–
i1=
23
+
2e127–()
×⋅=
FP value 1–()
01b
23 i–2i–
i1=
23
+
2124 127–()
×⋅=
FP value 1 1 2 2–
+()23–
××= 0.15625=
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AS7262 − Detailed Description
I²C Virtual Register Set
Figure 20 provides a summary of the AS7262 I²C register set.
Figures after that provide additional register details. All register
data is hex, and all multi-byte entities are Big Endian (most
significant byte is situated at the lowest register address).
Multiple byte registers (2 byte integer, or, 4 byte floating point)
must be read in the order of ascending register addresses (low
to high). And if capable of being written to, must also be written
in the order of ascending register addresses.
Figure 20:
I²C Virtual Register Set Overview
Addr Name <D7> <D6> <D5> <D4> <D3> <D2> <D1> <D0>
Version Registers
0x00:0x01 HW_Version Hardware Version
0x02:0x03 FW_Version Firmware Version
Control Registers
0x04 Control_Setup RST INT GAIN Bank DATA_RDY RSVD
0x05 INT_T Integration Time
0x06 Device_Temp Device Temperature
0x07 LED_Control RSVD ICL_DRV
LED_DRV
ICL_IND LED_IND
Sensor Raw Data Registers
0x08 V_High Channel V High Data Byte
0x09 V_Low Channel V Low Data Byte
0x0A B_High Channel B High Data Byte
0x0B B_Low Channel B Low Data Byte
0x0C G_High Channel G High Data Byte
0x0D G_Low Channel G Low Data Byte
0x0E Y_High Channel Y High Data Byte
0x0F Y_Low Channel Y Low Data Byte
0x10 O_High Channel O High Data Byte
0x11 O_Low Channel O Low Data Byte
0x12 R_High Channel R High Data Byte
0x13 R_Low Channel R Low Data Byte
ams Datasheet Page 23
[v1-01] 2017-Mar-17 Document Feedback
AS7262 − Detailed Description
Sensor Calibrated Data Registers
0x14:0x17 V_Cal Channel V Calibrated Data (floating point)
0x18:0x1B B_Cal Channel B Calibrated Data (floating point)
0x1C:0x1F G_Cal Channel G Calibrated Data (floating point)
0x20:0x23 Y_Cal Channel Y Calibrated Data (floating point)
0x24:0x27 O_Cal Channel O Calibrated Data (floating point)
0x28:0x2B R_Cal Channel R Calibrated Data (floating point)
Addr Name <D7> <D6> <D5> <D4> <D3> <D2> <D1> <D0>
Page 24 ams Datasheet
Document Feedback [v1-01] 2017-Mar-17
AS7262 − Detailed Description
Detailed Register Description
Figure 21:
HW Version Registers
Figure 22:
FW Version Registers
Addr: 0x00 HW_Version
Bit Bit Name Default Access Bit Description
7:0 Device Type 01000000 R Device type number
Addr: 0x01 HW_Version
Bit Bit Name Default Access Bit Description
7:0 HW Version 00111110 R Hardware version
Addr: 0x02 FW_Version
Bit Bit Name Default Access Bit Description
7:6 Minor Version R Minor version [1:0]
5:0 Sub Version R Sub version
Addr: 0x03 FW_Version
Bit Bit Name Default Access Bit Description
7:4 Major version R Major version
3:0 Minor version R Minor version [5:2]
ams Datasheet Page 25
[v1-01] 2017-Mar-17 Document Feedback
AS7262 − Detailed Description
Figure 23:
Control Setup Register
Figure 24:
Integration Time Register
Figure 25:
Device Temperature Register
Addr: 0x04/0x84 Control_Setup
Bit Bit Name Default Access Bit Description
7RST 0R/W
Soft Reset, Set to 1 for soft reset, goes to 0
automatically after the reset
6INT 0R/W
Enable interrupt pin output (INT),
1: Enable, 0: Disable
5:4 GAIN 0 R/W Sensor Channel Gain Setting (all channels)
‘b00=1x; ‘b01=3.7x; ‘b10=16x; ‘b11=64x
3:2 BANK 10 R/W
Data Conversion Type (continuous)
‘b00=Mode 0; ‘b01=Mode 1; ‘b10=Mode 2;
‘b11=Mode 3 One-Shot
1 DATA_RDY 0 R/W
1: Data Ready to Read, sets INT active if interrupt is
enabled.
Can be polled if not using INT.
0 RSVD 0 R Reserved; Unused
Addr: 0x05/0x85 INT_T
Bit Bit Name Default Access Bit Description
7:0 INT_T 0xFF R/W Integration time = <value> * 2.8ms
Addr: 0x06 Device_Temp
Bit Bit Name Default Access Bit Description
7:0 Device_Temp R Device temperature data byte (°C)
Page 26 ams Datasheet
Document Feedback [v1-01] 2017-Mar-17
AS7262 − Detailed Description
Figure 26:
LED Control Register
Addr: 0x07/0x87 LED Control
Bit Bit Name Default Access Bit Description
7:6 RSVD 0 R Reserved
5:4 ICL_DRV 00 R/W LED_DRV current limit
‘b00=12.5mA; ‘b01=25mA; ‘b10=50mA; ‘b11=100mA
3LED_DRV 0 R/W
Enable LED_DRV
1: Enabled; 0: Disabled
2:1 ICL_IND 00 R/W LED_IND current limit
‘b00=1mA; ‘b01=2mA; ‘b10=4mA; ‘b11=8mA
0LED_IND 0 R/W
Enable LED_IND
1: Enabled; 0: Disabled
ams Datasheet Page 27
[v1-01] 2017-Mar-17 Document Feedback
AS7262 − Detailed Description
Figure 27:
Sensor Raw Data Registers
Addr: 0x08 V_High
Bit Bit Name Default Access Bit Description
7:0 V_High R Channel V High Data Byte
Addr: 0x09 V_Low
Bit Bit Name Default Access Bit Description
7:0 V_Low R Channel V Low Data Byte
Addr: 0x0A B_High
Bit Bit Name Default Access Bit Description
7:0 B_High R Channel B High Data Byte
Addr: 0x0B B_Low
Bit Bit Name Default Access Bit Description
7:0 B_Low R Channel B Low Data Byte
Addr: 0x0C G_High
Bit Bit Name Default Access Bit Description
7:0 G_High R Channel G High Data Byte
Addr: 0x0D G_Low
Bit Bit Name Default Access Bit Description
7:0 G_Low R Channel G Low Data Byte
Addr: 0x0E Y_High
Bit Bit Name Default Access Bit Description
7:0 Y_High R Channel Y High Data Byte
Addr: 0x0F Y_Low
Bit Bit Name Default Access Bit Description
7:0 Y_Low R Channel Y Low Data Byte
Page 28 ams Datasheet
Document Feedback [v1-01] 2017-Mar-17
AS7262 − Detailed Description
Addr: 0x10 O_High
Bit Bit Name Default Access Bit Description
7:0 O_High R Channel O High Data Byte
Addr: 0x11 O_Low
Bit Bit Name Default Access Bit Description
7:0 O_Low R Channel O Low Data Byte
Addr: 0x12 R_High
Bit Bit Name Default Access Bit Description
7:0 R_High R Channel R High Data Byte
Addr: 0x13 R_Low
Bit Bit Name Default Access Bit Description
7:0 R_Low R Channel R Low Data Byte
ams Datasheet Page 29
[v1-01] 2017-Mar-17 Document Feedback
AS7262 − Detailed Description
Figure 28:
Sensor Calibrated Data Registers
Addr: 0x14:0x17 V_Cal
Bit Bit Name Default Access Bit Description
31:0 V_Cal R Channel V Calibrated Data (floating point)
Addr: 0x18:0x1B B_Cal
Bit Bit Name Default Access Bit Description
31:0 B_Cal R Channel B Calibrated Data (floating point)
Addr: 0x1C:0x1F G_Cal
Bit Bit Name Default Access Bit Description
31:0 G_Cal R Channel G Calibrated Data (floating point)
Addr: 0x20:0x23 Y_Cal
Bit Bit Name Default Access Bit Description
31:0 Y_Cal R Channel Y Calibrated Data (floating point)
Addr: 0x24:0x27 O_Cal
Bit Bit Name Default Access Bit Description
31:0 O_Cal R Channel O Calibrated Data (floating point)
Addr: 0x28:0x2B R_Cal
Bit Bit Name Default Access Bit Description
31:0 R_Cal R Channel R Calibrated Data (floating point)
Page 30 ams Datasheet
Document Feedback [v1-01] 2017-Mar-17
AS7262 − Detailed Description
UART Interface
If selected by the I²C_ENB pin setting, the UART module
implements the TX and RX signals as defined in the RS-232 /
V.24 standard communication protocol.
It has on both, receive and transmit path, a 16 entry deep FIFO.
It can generate interrupts as required.
UART Feature List1
•Full Duplex Operation (Independent Serial Receive and
Transmit Registers) with FIFO buffer of 8 byte for each.
•At a clock rate of 16MHz it supports communication at
115200 Baud.
•Supports Serial Frames with 8 Data Bits, no Parity and 1
Stop Bit
Theory of Operation
Transmission
If data is available in the transmit FIFO, it will be moved into the
output shift register and the data will be transmitted at the
configured Baud Rate, starting with a Start Bit (logic zero) and
followed by a Stop Bit (logic one).
Reception
At any time, with the receiver being idle, if a falling edge of a
start bit is detected on the input, a byte will be received and
stored in the receive FIFO. The following Stop Bit will be checked
to be logic one.
Figure 29:
UART Protocol
1. With UART operation, min VDD of 2.97V is required as shown in Electrical Characteristics Figures.
Start Bit
TX D0 D1 D2 D3 D4 D5 D6 D7 D0
D0 D1 D2 D3 D4 D5 D6 D7 D0
T
bit
=1/Baude Rate Stop Bit Next Start
Sample Points
Start Bit detected
After T
bit
/2: Sampling of Start Bit
After T
bit
: Sampling of Data
RX
Always Low Always High
Data Bits
ams Datasheet Page 31
[v1-01] 2017-Mar-17 Document Feedback
AS7262 − Detailed Description
AT Command Interface
The microprocessor interface to control the Visible Spectral_ID
sensor is via the UART, using the AT Commands across the UART
interface.
The 6-channel Spectral _ID sensor provides a text-based serial
command interface borrowed from the “AT Command” model
used in early Hayes modems. For example:
•Read DATA value: ATDATA → <data>OK
•Set the gain of the sensor to 1x: ATGAIN =0 → OK
The “AT Command Interface Block Diagram”, shown below
between the network interface and the core of the system,
provides access to the Spectral_ID engine’s control and
configuration functions.
Figure 30:
AT Command Interface Block Diagram
In Figure 31, numeric values may be specified with no leading
prefix, in which case they will be interpreted as decimals, or with
a leading “0x” to indicate that they are hexadecimal numbers,
or with a leading “‘b” to indicate that they are binary numbers.
The commands are loosely grouped into functional areas. Texts
appearing between angle brackets (‘<‘ and ‘>‘) are commands
or response arguments. A carriage return character, a linefeed
character, or both may terminate commands and responses.
Note that any command that encounters an error will generate
the “ERROR” response shown, for example, in the NOP
command at the top of the first table, but has been omitted
elsewhere in the interest of readability and clarity.
AT Command Interface
Spectral_ID
Engine
AT
Command
Interface
RX
μP
TX
AS726x
AT Command Int erface
AT Commands
Page 32 ams Datasheet
Document Feedback [v1-01] 2017-Mar-17
AS7262 − Detailed Description
Figure 31:
AT Commands
Command Response Description/Parameters
Spectral Data per Channel
ATDATA
<V_value>,
<B_value>,
<G_value>,
<Y_value>,
<O_value>,
<R_value> OK
Read V, B, G, Y, O & R data. Returns comma-separated
16-bit integers.
ATCDATA
<Cal_V_value>,
<Cal_B_value>,
<Cal_G_value>,
<Cal_Y_value>,
<Cal_O_value>,
<Cal_R_value> OK
Read calibrated V, B, G, Y, O & R data. Returns
comma-separated 32-bit floating point values.
Sensor Configuration
ATINTTIME=<value>OK
Set sensor integration time. Values should be in the range
[1..255], with integration time = <value> * 2.8ms
ATINTTIME <value> OK Read sensor integration time, with
integration time = <value> * 2.8ms
ATGAIN=<value> OK Set sensor gain: 0=1x, 1=3.7x, 2=16x, 3=64x
ATGAIN <value>OK Read sensor gain setting, returning 0, 1, 2, or 3 as defined
immediately above.
ATTEMP <value>OK Read temperature of chip in degree Celsius
ATTCSMD=<value> OK
Set Sensor Mode
0 = BANK Mode 0;
1 = BANK Mode 1;
2 = BANK Mode 2;
3 = BANK Mode 3 One-Shot;
4 = Sensors OFF
In One-Shot mode, each ATTCSMD=3 command triggers a
One-Shot reading
ATTCSMD <value> OK Read Sensor Mode, see above
ATBURST=<value> OK
<value>= # of samples
(ATBURST=1 means run until ATBURST=0 is received (a
special case for continuous output)
ams Datasheet Page 33
[v1-01] 2017-Mar-17 Document Feedback
AS7262 − Detailed Description
LED Driver Controls
ATLED0=<value> OK Sets LED_IND: 100=ON, 0=OFF
ATLED0 <100|0>OK Reads LED_IND setting: 100=ON, 0=OFF
ATLED1=<value> OK Sets LED_DRV: 100=ON, 0=OFF
ATLED1 <100|0>OK Reads LED_DRV setting: 100=ON, 0=OFF
ATLEDC=<value> OK
Sets LED_IND and LED_DRV current
LED_IND: bits 3:0; LED_DRV: 7:4 bits
LED_IND: ‘b00=1mA; ‘b01=2mA; ‘b10=4mA; ‘b11=8mA
LED_DRV: ‘b00=12.5mA; ‘b01=25mA; ‘b10=50mA;
‘b11=100mA
ATLEDC <value>OK Reads LED_IND and LED_DRV current settings as shown
above
NOP, Version Access, System Reset
AT OK → Success
ERROR → Failure NOP
ATRST None Software Reset – no response
ATVERSW <SWversion#>OK
ERROR → Failure Returns the system software version number
ATVERHW <HWversion#>OK
ERROR → Failure
Returns the system hardware revision and product ID,
with bits 7:4 containing the part ID, and bits 3:0 yielding
the chip revision value.
Firmware Update
ATFWU=<value>OK
<value>= 16-bit checksum. Initializes the firmware update
process. Number of bytes that follow are always 56k bytes
ATFW=<value>OK
Download new firmware
Up to 7 Bytes represented as hex chars with no leading or
trailing 0x.
Repeat command till all 56k bytes of firmware are
downloaded
ATFWA OK
Causes target address for FW updates to advance. Should
be called after every successful “OK” returned after
“ATFW=<value>” command usage.
ATFWS OK Causes the active image to switch between the two
possible current images and then resets the IC
Command Response Description/Parameters
Page 34 ams Datasheet
Document Feedback [v1-01] 2017-Mar-17
AS7262 − Application Information
Schematic
Figure 32:
AS7262 Typical Application Circuit
PCB Layout
Figure 33:
Typical Layout Routing
In order to prevent interference, avoid trace routing
feedthroughs with exposure directly under the AS7262. An
example routing is illustrated in the diagram.
Application Information
AS7262
1
17
14
2
7
6
5
4
3
8
16
15
18
11
12
13 9
10
20
19
VDD1
VDD2
RESN
GND
LED_DRV
LED_IND
RX/SCL_S
TX/SDA_S
INT
CSN_SD
CSN_EE
MISO
MOSI
SCK
I2C_ENB
NC
NC
NC
NC
NC
Flash
Memory
1/CS
2
6
5
DO
DI
CLK
VCCGND
/HOLD
/WP
84
3
7
3V3
3V3
3V3
Vled
RST
RX
TX
INT
100 nF 10uF 10K
1uF
DNP
0R
Page 36 ams Datasheet
Document Feedback [v1-01] 2017-Mar-17
AS7262 − PCB Pad Layout
Suggested PCB pad layout guidelines for the LGA device are
shown.
Figure 35:
Recommended PCB Pad Layout
Note(s):
1. Unless otherwise specified, all dimensions are in millimeters.
2. Dimensional tolerances are ±0.05mm unless otherwise noted.
3. This drawing is subject to change without notice.
PCB Pad Layout
1
4.40
0.30
0.65
1.10
4.60
Unit: mm
Page 38 ams Datasheet
Document Feedback [v1-01] 2017-Mar-17
AS7262 − Soldering & Storage Information
Soldering Information
The module has been tested and has demonstrated an ability
to be reflow soldered to a PCB substrate. The solder reflow
profile describes the expected maximum heat exposure of
components during the solder reflow process of product on a
PCB. Temperature is measured on top of component. The
components should be limited to a maximum of three passes
through this solder reflow profile.
Figure 37:
Solder Reflow Profile
Figure 38:
Solder Reflow Profile Graph
Parameter Reference Device
Average temperature gradient in preheating 2.5°C/s
Soak time tSOAK 2 to 3 minutes
Time above 217°C(T1)t
1Max 60s
Time above 230°C(T2)t
2Max 50s
Time above Tpeak - 10°C(T3)t
3Max 10s
Peak temperature in reflow Tpeak 260°C
Temperature gradient in cooling Max -5°C/s
Soldering & Storage
Information
ams Datasheet Page 39
[v1-01] 2017-Mar-17 Document Feedback
AS7262 − Soldering & Storage Information
Manufacturing Process Considerations
The AS7262 package is compatible with standard reflow
no-clean and cleaning processes including aqueous, solvent or
ultrasonic techniques. However, as an open-aperture device,
precautions must be taken to avoid particulate or solvent
contamination as a result of any manufacturing processes,
including pick and place, reflow, cleaning, integration assembly
and/or testing. Temporary covering of the aperture is allowed.
To avoid degradation of accuracy or performance in the end
product, care should be taken that any temporary covering and
associated sealants/debris are thoroughly removed prior to any
optical testing or final packaging.
Storage Information
Moisture Sensitivity
Optical characteristics of the device can be adversely affected
during the soldering process by the release and vaporization of
moisture that has been previously absorbed into the package.
To ensure the package contains the smallest amount of
absorbed moisture possible, each device is baked prior to being
dry packed for shipping.
Devices are dry packed in a sealed aluminized envelope called
a moisture-barrier bag with silica gel to protect them from
ambient moisture during shipping, handling, and storage
before use.
Shelf Life
The calculated shelf life of the device in an unopened moisture
barrier bag is 12 months from the date code on the bag when
stored under the following conditions:
•Shelf Life: 12 months
•Ambient Temperature: <40°C
•Relative Humidity: <90%
Rebaking of the devices will be required if the devices exceed
the 12 month shelf life or the Humidity Indicator Card shows
that the devices were exposed to conditions beyond the
allowable moisture region.
Page 40 ams Datasheet
Document Feedback [v1-01] 2017-Mar-17
AS7262 − Soldering & Storage Information
Floor Life
The module has been assigned a moisture sensitivity level of
MSL 3. As a result, the floor life of devices removed from the
moisture barrier bag is 168 hours from the time the bag was
opened, provided that the devices are stored under the
following conditions:
•Floor Life: 168 hours
•Ambient Temperature: <30°C
•Relative Humidity: <60%
If the floor life or the temperature/humidity conditions have
been exceeded, the devices must be rebaked prior to solder
reflow or dry packing.
Rebaking Instructions
When the shelf life or floor life limits have been exceeded,
rebake at 50°C for 12 hours.
ams Datasheet Page 41
[v1-01] 2017-Mar-17 Document Feedback
AS7262 − Ordering & Contact Information
Figure 39:
Ordering Information (1)
Note(s):
1. Required companion serial flash memory (must be ams verified) is ordered from the flash memory supplier (e.g. AT25SF041-SSHD-B
from Adesto Technologies).
2. AS7262 flash memory software is available from ams.
Buy our products or get free samples online at:
www.ams.com/ICdirect
Technical Support is available at:
www.ams.com/Technical-Support
Provide feedback about this document at:
www.ams.com/Document-Feedback
For further information and requests, e-mail us at:
ams_sales@ams.com
For sales offices, distributors and representatives, please visit:
www.ams.com/contact
Headquarters
ams AG
Tobelbader Strasse 30
8141 Premstaetten
Austria, Europe
Tel: +43 (0) 3136 500 0
Website: www.ams.com
Ordering
Code Package Marking Description Delivery
Form
Delivery
Quantity
AS7262-BLGT 20-pin LGA AS7262
6-Channel Visible Spectral_ID
Device with Electronic Shutter
and Smart Interface
Tape & Reel 2000 pcs/reel
Ordering & Contact Information
Page 42 ams Datasheet
Document Feedback [v1-01] 2017-Mar-17
AS7262 − RoHS Compliant & ams Green Statement
RoHS: The term RoHS compliant means that ams AG products
fully comply with current RoHS directives. Our semiconductor
products do not contain any chemicals for all 6 substance
categories, including the requirement that lead not exceed
0.1% by weight in homogeneous materials. Where designed to
be soldered at high temperatures, RoHS compliant products are
suitable for use in specified lead-free processes.
ams Green (RoHS compliant and no Sb/Br): ams Green
defines that in addition to RoHS compliance, our products are
free of Bromine (Br) and Antimony (Sb) based flame retardants
(Br or Sb do not exceed 0.1% by weight in homogeneous
material).
Important Information: The information provided in this
statement represents ams AG knowledge and belief as of the
date that it is provided. ams AG bases its knowledge and belief
on information provided by third parties, and makes no
representation or warranty as to the accuracy of such
information. Efforts are underway to better integrate
information from third parties. ams AG has taken and continues
to take reasonable steps to provide representative and accurate
information but may not have conducted destructive testing or
chemical analysis on incoming materials and chemicals. ams AG
and ams AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited
information may not be available for release.
RoHS Compliant & ams Green
Statement
ams Datasheet Page 43
[v1-01] 2017-Mar-17 Document Feedback
AS7262 − Copyrights & Disclaimer
Copyright ams AG, Tobelbader Strasse 30, 8141 Premstaetten,
Austria-Europe. Trademarks Registered. All rights reserved. The
material herein may not be reproduced, adapted, merged,
translated, stored, or used without the prior written consent of
the copyright owner.
Devices sold by ams AG are covered by the warranty and patent
indemnification provisions appearing in its General Terms of
Trade. ams AG makes no warranty, express, statutory, implied,
or by description regarding the information set forth herein.
ams AG reserves the right to change specifications and prices
at any time and without notice. Therefore, prior to designing
this product into a system, it is necessary to check with ams AG
for current information. This product is intended for use in
commercial applications. Applications requiring extended
temperature range, unusual environmental requirements, or
high reliability applications, such as military, medical
life-support or life-sustaining equipment are specifically not
recommended without additional processing by ams AG for
each application. This product is provided by ams AG “AS IS”
and any express or implied warranties, including, but not
limited to the implied warranties of merchantability and fitness
for a particular purpose are disclaimed.
ams AG shall not be liable to recipient or any third party for any
damages, including but not limited to personal injury, property
damage, loss of profits, loss of use, interruption of business or
indirect, special, incidental or consequential damages, of any
kind, in connection with or arising out of the furnishing,
performance or use of the technical data herein. No obligation
or liability to recipient or any third party shall arise or flow out
of ams AG rendering of technical or other services.
Copyrights & Disclaimer
Page 44 ams Datasheet
Document Feedback [v1-01] 2017-Mar-17
AS7262 − Document Status
Document Status Product Status Definition
Product Preview Pre-Development
Information in this datasheet is based on product ideas in
the planning phase of development. All specifications are
design goals without any warranty and are subject to
change without notice
Preliminary Datasheet Pre-Production
Information in this datasheet is based on products in the
design, validation or qualification phase of development.
The performance and parameters shown in this document
are preliminary without any warranty and are subject to
change without notice
Datasheet Production
Information in this datasheet is based on products in
ramp-up to full production or full production which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade
Datasheet (discontinued) Discontinued
Information in this datasheet is based on products which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade, but these products have been superseded and
should not be used for new designs
Document Status
ams Datasheet Page 45
[v1-01] 2017-Mar-17 Document Feedback
AS7262 − Revision Information
Note(s):
1. Page and figure numbers for the previous version may differ from page and figure numbers in the current revision.
2. Correction of typographical errors is not explicitly mentioned.
Changes from 1-00 (2016-Dec-16) to current revision 1-01 (2017-Mar-17) Page
Updated Figure 12 and notes below 11
Revision Information
Page 46 ams Datasheet
Document Feedback [v1-01] 2017-Mar-17
AS7262 − Content Guide
1 General Description
1 Key Benefits & Features
2 Applications
2 Block Diagram
3 Pin Assignments
5Absolute Maximum Ratings
6 Electrical Characteristics
8 Timing Characteristics
11 Optical Characteristics
12 Typical Optical Characteristics
13 Detailed Description
13 6-Channel Visible Spectral_ID Detector
14 Data Conversion Description
16 RC Oscillator
16 Temperature Sensor
16 Reset
16 Indicator LED
17 Electronic Shutter with LED_DRV Driver Control
17 Interrupt Operation
17 I²C Slave Interface
18 I²C Feature List
18 I²C Virtual Register Write Access
19 I²C Virtual Register Byte Write
20 I²C Virtual Register Read Access
20 I²C Virtual Register Byte Read
21 4-Byte Floating-Point (FP) Registers
22 I²C Virtual Register Set
24 Detailed Register Description
30 UART Interface
30 UART Feature List
30 Theory of Operation
30 Transmission
30 Reception
31 AT Command Interface
34 Application Information
34 Schematic
34 PCB Layout
35 Package Drawings & Markings
36 PCB Pad Layout
37 Mechanical Data
38 Soldering & Storage Information
38 Soldering Information
39 Manufacturing Process Considerations
39 Storage Information
39 Moisture Sensitivity
39 Shelf Life
40 Floor Life
40 Rebaking Instructions
Content Guide
