NZX24A,133 - NXP Semiconductors

1. Product profile

1.1 General description

General-purpose Zener diodes in a SOD27 (SC-40) small hermetically sealed glass

package.

1.2 Features and benefits

Total power dissipation: Ptot 500 mW

Low differential resistance

Low leakage current

1.3 Applications

General regulation functions

1.4 Quick reference data

[1] Pulse test: tp300 s; 0.02.

2. Pinning information

[1] The marking band indicates the cathode.

NZX series

Single Zener diodes

Rev. 4 — 28 November 2011 Product data sheet

Table 1. Quick reference data

Tj=25



C unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

VFforward voltage IF=200mA [1] --1.5V

Table 2. Pinning

Pin Description Simplified outline Graphic symbol

1 cathode [1]

2 anode

006aaa152

Product data sheet Rev. 4 — 28 November 2011 2 of 13

NXP Semiconductors NZX series

Single Zen er di od e s

3. Ordering information

[1] The series consists of 112 types with nominal working voltages from 2.1 V to 36 V.

4. Marking

5. Limiting values

6. Thermal characteristics

[1] Device mounted on an FR4 Printed-Circuit Board (PCB) without metallization pad;

maximum lead length 8 mm.

Tabl e 3. Ordering i nfo rmation

Type number Package

Name Description Version

NZX2V1B to NZX36X[1] SC-40 hermetically sealed glass package; axial leaded;

2 leads SOD27

Table 4. Marking codes

Type number Marking code

NZX2V1B to NZX36X the diodes are type branded

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

IFforward current - 250 mA

Ptot total power dissipation Ttp 25 C-500mW

Tjjunction temperature - 175 C

Tamb ambient temperature 55 +175 C

Tstg storage temperature 65 +175 C

Table 6. Thermal characteristics

Symbol Parameter Conditions Min Typ Max Unit

Rth(j-a) thermal resistance from

junction to ambient in free air [1] --380K/W

Rth(j-t) thermal resistance from

junction to tie-point [1] --300K/W

Product data sheet Rev. 4 — 28 November 2011 3 of 13

NXP Semiconductors NZX series

Single Zen er di od e s

7. Characteristics

[1] Pulse test: tp300 s; 0.02.

Fig 1. Transient thermal impedan ce from junc tio n to ambi ent as a function of pulse duration; typical values

006aab601

(ms)

−1

110

th(j-a)

(K/W)

δ = 1

0.75

0.50

0.33

0.20

0.10

0.05

0.02

0.01

≤0.001

Table 7. Characteristics

Tj=25



C unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

VFforward voltage IF= 200 mA [1] --1.5V

Table 8. Characteristics per type ; NZX2V1B to NZX18C

Tj=25



C unless otherwise specified.

NZXxxx Sel Working voltage

VZ(V) Differential

resistance

rdif ()

Reverse current

IR(A)

IZ=5mA IZ=5mA

Min Max Max Max VR(V)

2V1 B 2.0 2.2 100 5 0.5

2V4 A 2.3 2.5 100 50 1

B2.42.6

2V7 A 2.5 2.7 100 20 1

B2.62.8

C2.72.9

3V0 A 2.8 3.0 100 10 1

B2.93.1

C3.03.2

3V3 A 3.1 3.3 100 5 1

B3.23.4

C3.33.5

Product data sheet Rev. 4 — 28 November 2011 4 of 13

NXP Semiconductors NZX series

Single Zen er di od e s

3V6 A 3.4 3.6 100 5 1

B3.53.7

C3.63.8

3V9 A 3.7 3.9 100 3 1

B3.84.0

C3.94.1

4V3 A 4.0 4.2 100 3 1

B4.14.3

C4.24.4

D4.34.5

4V7 A 4.4 4.6 100 3 2

B4.54.7

C4.64.8

D4.74.9

5V1 A 4.8 5.0 100 2 2

B4.95.1

C5.05.2

D5.15.3

5V6 A 5.2 5.5 40 1 2

B5.35.6

C5.45.7

D5.55.8

E5.65.9

6V2 A 5.7 6.0 15 3 4

B5.86.1

C6.06.3

D6.16.4

E6.36.6

6V8 A 6.4 6.7 15 2 4

B6.66.9

C6.77.0

D6.97.2

Table 8. Characteristics per type ; NZX2V1B to NZX18C …continued

Tj=25



C unless otherwise specified.

NZXxxx Sel Working voltage

VZ(V) Differential

resistance

rdif ()

Reverse current

IR(A)

IZ=5mA IZ=5mA

Min Max Max Max VR(V)

Product data sheet Rev. 4 — 28 November 2011 5 of 13

NXP Semiconductors NZX series

Single Zen er di od e s

7V5 A 7.0 7.3 15 1 5

B7.27.6

C7.37.7

D7.57.9

X 7.07 7.45

8V2 A 7.7 8.1 20 0.7 5

B7.98.3

C8.18.5

D8.38.7

9V1 A 8.5 8.9 20 0.5 6

B8.79.1

C8.99.3

D9.19.5

E9.39.7

10 A 9.5 9.9 25 0.2 7

B 9.7 10.1

C 9.9 10.3

D 10.2 10.6

11 A 10.4 10.8 25 0.1 8

B10.711.1

C10.911.3

D 11.1 11.6

12 A 11.4 11.9 35 0.1 8

B 11.6 12.1

C 11.9 12.4

D 12.2 12.7

X 11.44 12.03

13 A 12.4 12.9 35 0.1 8

B 12.6 13.1

C 12.9 13.4

14 A 13.2 13.7 35 0.05 9.8

B 13.5 14.0

C 13.8 14.3

Table 8. Characteristics per type ; NZX2V1B to NZX18C …continued

Tj=25



C unless otherwise specified.

NZXxxx Sel Working voltage

VZ(V) Differential

resistance

rdif ()

Reverse current

IR(A)

IZ=5mA IZ=5mA

Min Max Max Max VR(V)

Product data sheet Rev. 4 — 28 November 2011 6 of 13

NXP Semiconductors NZX series

Single Zen er di od e s

15 A 14.1 14.7 40 0.05 10.5

B 14.5 15.1

C 14.9 15.5

X 14.35 15.09

16 A 15.3 15.9 45 0.05 11.2

B 15.7 16.5

C 16.3 17.1

18 A 16.9 17.7 55 0.05 12.6

B 17.5 18.3

C 18.1 19.0

Table 8. Characteristics per type ; NZX2V1B to NZX18C …continued

Tj=25



C unless otherwise specified.

NZXxxx Sel Working voltage

VZ(V) Differential

resistance

rdif ()

Reverse current

IR(A)

IZ=5mA IZ=5mA

Min Max Max Max VR(V)

Product data sheet Rev. 4 — 28 November 2011 7 of 13

NXP Semiconductors NZX series

Single Zen er di od e s

Table 9. Characteristics per type; NZX20A to NZX36X

Tj=25



C unless otherwise specified.

NZXxxx Sel Working voltage

VZ(V) Differential

resistance

rdif ()

Reverse current

IR(A)

IZ=2mA IZ=2mA

Min Max Max Max VR(V)

20 A 18.8 19.7 60 0.05 14

B 19.5 20.4

C 20.2 21.2

22 A 20.9 21.9 65 0.05 15.4

B 21.6 22.6

C 22.3 23.3

24 A 22.9 24.0 70 0.05 16.8

B 23.6 24.7

C 24.3 25.5

X 22.61 23.77

27 A 25.2 26.6 80 0.05 18.9

B 26.2 27.6

C 27.2 28.6

X 26.99 28.39

30 A 28.2 29.6 100 0.05 21

B 29.2 30.6

C 30.2 31.6

X 29.02 30.51

33 A 31.2 32.6 120 0.05 23.1

B 32.2 33.6

C 33.2 34.5

36 A 34.2 35.7 140 0.05 25.2

B 35.3 36.8

C 36.4 38.0

X 35.36 37.19

Product data sheet Rev. 4 — 28 November 2011 8 of 13

NXP Semiconductors NZX series

Single Zen er di od e s

Tj=25C NZX2V1 to NZX4V3

Tj=25C to 150 C

Fig 2. Forward current as a function of forward

voltage; typical values Fig 3. Temperature coefficient as a function of

working current; typical va lues

NZX4V7 to NZX12

Tj=25C to 150 C

Fig 4. Temperature coefficient as a function of working curr ent; typical values

VF (V)

0.6 10.8

mbg781

100

200

300

(mA)

006aac510

IZ (mA)

0604020

−2

−1

(mV/K)

−3

4V3

3V6

2V1

3V0

2V4

2V7

3V3

3V9

02016

−5

mbg782

4812 IZ (mA)

(mV/K)

4V7

9V1

8V2

7V5

6V8 6V2

5V6

5V1

Product data sheet Rev. 4 — 28 November 2011 9 of 13

NXP Semiconductors NZX series

Single Zen er di od e s

8. Package outline

9. Packing information

[1] For further information and the availability of packing methods, see Section 12.

[2] The series consists of 112 types with nominal working voltages from 2.1 V to 36 V.

Fig 5. Package outline SOD27 (SC-40)

05-12-22Dimensions in mm

1.85

max

25.4

min

0.56

max

25.4

min 4.25

max

Table 10. Packing methods

The indicated -xxx are the last thre e digits of the 12NC ordering code.[1]

Type number[2] Package Description Packing quantity

5000 10000

NZX2V1B to NZX36X SOD27 26 mm tape ammopack, axial -143 -

52 mm tape ammopack, axial - -133

52 mm reel pack, axial - -113

Product data sheet Rev. 4 — 28 November 2011 10 of 13

NXP Semiconductors NZX series

Single Zen er di od e s

10. Revision history

Table 11. Revision history

Document ID Release date Data sheet status Change notice Supersedes

NZX_SER v.4 20111128 Product data sheet - NZX_SER v.3

Modifications: •Section 1.2: corrected.

•Section 11 “Legal information”: updated.

NZX_SER v.3 20110121 Product data sheet - NZX_SER v.2

NZX_SER v.2 20090603 Product data sheet - NZX_SER v.1

NZX_SER v.1 20080724 Product data sheet - -

Product data sheet Rev. 4 — 28 November 2011 11 of 13

NXP Semiconductors NZX series

Single Zen er di od e s

11. Legal information

11.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

11.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short dat a sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall pre vail.

Product specificat ion — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond tho se described in the

Product data sheet.

11.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequ ential damages (including - wit hout limitatio n - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ ag gregate and cumulative l iability toward s

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semicondu ctors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

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authorized or warranted to be suit able for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in perso nal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applic ations that are described herein for any of these

products are for il lustrative purposes only. NXP Semiconductors makes no

representation or warranty tha t such application s will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for th e customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanent ly and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter ms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Not hing in this document may be interpret ed or

construed as an of fer t o sell product s that is open for accept ance or t he grant,

conveyance or implication of any license under any copyri ghts, paten ts or

other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulatio ns. Export might require a prior

authorization from competent authorities.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the objective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] dat a sheet Production This document contains the product specification.

Product data sheet Rev. 4 — 28 November 2011 12 of 13

NXP Semiconductors NZX series

Single Zen er di od e s

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It i s neit her qua lif ied nor tested

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in au tomotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automot ive specifications and standard s, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims resulting from customer design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

11.4 Trademarks

Notice: All refe renced brands, produc t names, service names and trademarks

are the property of their respect i ve ow ners.

12. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors NZX series

Single Zen er di od e s

For more information, please visit: http://www.nxp.co m

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 28 Novem b er 2011

Document identifier : NZX_SE R

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

13. Contents

1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 1

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2

6 Thermal characteristics . . . . . . . . . . . . . . . . . . 2

7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3

8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9

9 Packing information . . . . . . . . . . . . . . . . . . . . . 9

10 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 10

11 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11

11.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11

11.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

11.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 11

11.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12

12 Contact information. . . . . . . . . . . . . . . . . . . . . 12

13 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13