Spread Spectrum Timing Solution for Serverworks Chipset
CY28158
Cypress Semiconductor Corporation 3901 North First Street San Jose CA 95134 408-943-2600
Document #: 38-07039 Rev. *B Revised June 25, 2004
Features
Maximized EMI suppression using Cypress’s spread
spectrum technology
Based on Industry Standard CK133 Pinout with all out-
puts compliant to CK98 specifications
0.5% downspread outputs deliver up to 10dB lower EMI
6 skew-controlled copies of CPU output
6 copies of PCI output (synchronous w/CPU output)
2 copies of 66 MHz fixed frequency 3.3V clock
3 copies of 16.67 MHz IOAPIC clock, synchronous to
CPU clock
1 copy of 48 MHz USB output
2 copies of 14.31818 MHz reference clock
Programmable to 133 or 100 MHz operation
Power management control pins for clock stop and
shut down
Available in 56-pin SSOP
Key Specifications
Supply Voltages:...................................... VDD33 = 3.3V ± 5%
................................................................ VDD25 = 2.5V ± 5%
CPU Output Jitter: ....................................................<150 ps
CPU Output Skew: ....................................................<175 ps
CPU to 3V66 Output Offset: 0.0 to1.5 ns (CPU leads)
CPU to IOAPIC Output Offset 1.5 to 4.0 ns (CPU leads)
CPU to PCI Output Offset................. 0 to 4.0 ns (CPU leads)
Table 1. Pin Selectable Frequency.
SEL133/100# CPU0:5 (MHz) PCI
1 133 33.3
0 100 33.3
Block Diagram Pin Configuration
GND_REF
REF0
REF1
VDD_REF
X1
X2
GND_PCI
GND_PCI
PCI_F
VDD_PCI
PCI1
PCI2
GND_PCI
PCI3
PCI4
VDD_PCI
VDD_PCI
PCI5
GND_PCI
GND_3V66
GND_3V66
VDD_3V66
VDD_3V66
GND_3V66
CY28158
VDD_IOAPIC
IOAPIC2
IOAPIC1
IOAPIC0
GND_IOAPIC
VDD_CPU
CPU5
CPU4
GND_CPU
VDD_CPU
CPU3
CPU2
GND_CPU
VDD_CPU
CPU1
CPU0
GND_CPU
VDDA
GNDA
PCI_STOP#
CPU_STOP#
PWR_DWN#
SPREAD#
SEL1
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
32
31
30
29
3V66_0
3V66_1
VDD_3V66
SEL133/100#
SEL0
VDD_48MHZ
48MHZ
GND_48MHZ
REF0:1
CPU0:5
3V66_0:1
XTAL
PLL 1
SPREAD#
X2
X1
PCI_F
PCI1:5
IOAPIC0:2
PLL2
OSC
STOP
Logic
Power
Tristate
Logic
SEL0
SEL1
SEL133/100#
Clock
CPU_STOP#
÷2/÷1.5
STOP
Logic
Clock
Down
Logic
÷2
STOP
Logic
Clock
÷2
2
6
2
1
5
3
1
PCI_STOP#
PWRDWN#
48MHz
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Document #: 38-07039 Rev. *B Page 2 of 10
Pin Definitions
Name Pins Description
X1[1] 5 Reference crystal input
X2[1] 6 Reference crystal feedback
CPU [0–5] 41, 42, 45, 46, 49, 50 CPU clock outputs
PCI [1–5] 11, 12, 14, 15, 18 PCI clock outputs, synchronously running at 33.33 MHz
PCI_F 9 Free running PCI clock
3V66 [0–1] 25, 26 3V66 clock outputs, running at 66.66 MHz
IOAPIC [0–2] 53, 54, 55 IOAPIC clock outputs, running at 16.67 MHz
REF [0–1] 2, 3 Reference clock outputs, 14.318 MHz
48MHZ 30 48-MHz USB clock output
CPU_STOP# 36 Active LOW input, disables CPU and 3V66 clocks when asserted
PCI_STOP# 37 Active LOW input, disables PCI clocks when asserted
PWR_DWN# 35 Active LOW input, powers down part when asserted
SPREAD# 34 Active LOW input, enables spread spectrum when asserted
SEL1 33 CPU frequency select input (See Function Table)
SEL0 32 CPU frequency select input (See Function Table)
SEL133/100# 28 CPU frequency select input (See Function Table)
GND_REF 1 3.3V Reference ground
GND_PCI 7, 8, 13, 19 3.3V PCI ground
GND_3V66 20, 21, 24 3.3V 66-MHz (AGP) ground
GND_48MHZ 29 3.3V 48-MHz (USB) ground
GND_IOAPIC 52 2.5V APIC ground
GND_CPU 40, 44, 48 2.5V CPU ground
GNDA 38 Analog ground to PLL and Core
VDD_REF 4 3.3V Reference voltage supply
VDD_PCI 10, 16, 17 3.3V PCI voltage supply
VDD_3V66 22, 23, 27 3.3V 66-MHz (AGP) voltage supply
VDD_48MHZ 31 3.3V 48-MHz (USB) voltage supply
VDD_IOAPIC 56 2.5V APIC voltage supply
VDD_CPU 43, 47, 51 2.5V CPU voltage supply
VDDA 39 Analog voltage supply to PLL and Core
Note:
1. For best accuracy, use a parallel-resonant crystal, CLOAD = 18 pF. For crystals with different CLOAD, please refer to the application note, “Crystal Oscillator
Topics.”
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Document #: 38-07039 Rev. *B Page 3 of 10
Function Table[2]
SEL133
/100#SEL1SEL0
CPU
(MHz)
3V66
(MHz)
PCI
(MHz)
48MHZ
(MHz)
REF
(MHz)
IOAPIC
(MHz)
0 0 0 Hi-Z Hi-Z Hi-Z Hi-Z Hi-Z Hi-Z
0 0 1 100.227[3] 66.818[3] 33.409[3] 48.008[3] 14.318[3] 16.705[3]
0 1 0 100 66.67 33.33 OFF 14.318 16.67
0 1 1 100 66.67 33.33 48.008[3] 14.318 16.67
1 0 0 TCLK/2 TCLK/4 TCLK/8 TCLK/2 TCLK TCLK/16
1 0 1 N/A N/A N/A N/A N/A N/A
1 1 0 133.33 66.67 33.33 OFF 14.318 16.67
1 1 1 133.33 66.67 33.33 48.008[3] 14.318 16.67
Actual Clock Frequency Values
Clock Output
Target
Frequency
(MHz)
Actual
Frequency
(MHz)
PPM
CPU 100.0 99.126 –8740
CPU 133.33 132.769 –4208
48MHZ 48.0 48.008 167
Clock Enable Configuration
CPU_STOP# PWR_DWN# PCI_STOP# CPU 3V66 PCI PCI_F
REF
IOAPIC OSC. VCOs
X 0 X LOW LOW LOW LOW LOW OFF OFF
0 1 0 LOW LOW LOW ON ON ON ON
011LOWLOWONONONONON
1 1 0 ON ON LOW ON ON ON ON
1 1 1 ON ONONON ON ONON
Clock Driver Impedances
Impedance
Buffer Name VDD Range Buffer Type
Minimum
Typical
Maximum
CPU, IOAPIC 2.375V – 2.625V Type 1 13.5 29 45
48MHZ, REF 3.135V – 3.465V Type 3 20 40 60
PCI, 3V66 3.135V – 3.465V Type 5 12 30 55
Note:
2. TCLK is a test clock driven in on the X1 input in test mode.
3. This selection is defined as “N/A” or “Reserved.”
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Maximum Ratings
(Above which the useful life may be impaired. For user guide-
lines, not tested.)
Supply Voltage..................................................–0.5 to +7.0V
Input Voltage.............................................. –0.5V to VDD+0.5
Storage Temperature (Non-Condensing) ... –65°C to +150°C
Max. Soldering Temperature (10 sec) ...................... +260°C
Junction Temperature............................................... +150°C
Package Power Dissipation.............................................. 1W
Static Discharge Voltage
(per MIL-STD-883, Method 3015) ............................. >2000V
Operating Conditions[4] Over which Electrical Parameters are Guaranteed
Parameter Description Min. Max. Unit
VDD_REF
, VDD_PCI, VDDA,
VDD_3V66, VDD_48MHZ
3.3V Supply Voltages 3.135 3.465 V
VDD_CPU CPU Supply Voltage 2.375 2.625 V
VDD_IOAPIC IOAPIC Supply Voltage 2.375 2.625 V
TAOperating Temperature, Ambient 0 70 °C
CLMax. Capacitive Load on
CPU, 48MHZ, REF, IOAPIC
PCI, 3V66
20
30
pF
f(REF) Reference Frequency, Oscillator Nominal Value 14.318 14.318 MHz
Electrical Characteristics Over the Operating Range
Parameter Description Test Conditions Min. Max. Unit
VIH High-level Input Voltage Except Crystal Pads. Threshold voltage for crystal pads = VDD/2 2.0 V
VIL Low-level Input Voltage Except Crystal Pads 0.8 V
VOH High-level Output Voltage CPU, IOAPIC IOH = –1 mA 2.0 V
48 MHZ, REF, PCI, 3V66 IOH = –1 mA 2.4
VOL Low-level Output Voltage CPU, IOAPIC IOL = 1 mA 0.4 V
48 MHZ, REF, PCI, 3V66 IOL = 1 mA 0.4
IIH Input High Current 0 < VIN < VDD 10 µA
IIL Input Low Current 0 < VIN < VDD 10 µA
IOH High-level Output Current CPU VOH = 2.0V –16 mA
–60
IOAPIC VOH = 2.0V –20
–72
48 MHZ, REF VOH = 2.4V –15
–51
3V66, PCI VOH = 2.4V –30
–100
IOL Low-level Output Current CPU VOL = 0.4V 19 mA
49
IOAPIC VOL = 0.4V 25
58
48 MHZ, REF VOL = 0.4V 10
24
3V66, PCI VOL = 0.4V 20
49
IOZ Output Leakage Current Three-state 10 µA
IDD2 2.5V Power Supply Cur-
rent
VDDA/VDD33 = 3.465V, VDD25 = 2.625V, FCPU = 133 MHz 90 mA
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Document #: 38-07039 Rev. *B Page 5 of 10
IDD3 3.3V Power Supply Cur-
rent
VDDA/VDD33 = 3.465V, VDD25 = 2.625V, FCPU = 133 MHz 160 mA
IDDPD2 2.5V Shutdown Current VDDA/VDD33 = 3.465V, VDD25 = 2.625V 100 µA
IDDPD3 3.3V Shutdown Current VDDA/VDD33 = 3.465V, VDD25 = 2.625V 200 µA
Switching Characteristics[5] Over the Operating Range
Parameter Output Description Test Conditions Min. Max. Unit
t1All Output Duty Cycle[6] t1A/t1B 45 55 %
t2CPU,
IOAPIC
Rising Edge Rate Between 0.4V and 2.0V 1.0 4.0 V/ns
t248MHZ, REF Rising Edge Rate Between 0.4V and 2.4V 0.5 2.0 V/ns
t2PCI, 3V66 Rising Edge Rate Between 0.4V and 2.4V 1.0 4.0 V/ns
t3CPU,
IOAPIC
Falling Edge Rate Between 2.0V and 0.4V 1.0 4.0 V/ns
t348MHZ, REF Falling Edge Rate Between 2.4V and 0.4V 0.5 2.0 V/ns
t3PCI, 3V66 Falling Edge Rate Between 2.4V and 0.4V 1.0 4.0 V/ns
t6CPU CPU-CPU Skew Measured at 1.25V 175 ps
t8IOAPIC IOAPIC-IOAPIC Skew Measured at 1.25V 250 ps
t93V66 3V66-3V66 Skew Measured at 1.5V 250 ps
t10 PCI PCI-PCI Skew Measured at 1.5V 500 ps
t11 CPU, 3V66 CPU-3V66 Clock Skew CPU leads. Measured at 1.25V for
2.5V clocks and 1.5V for 3.3V clocks
01.5ns
t12 3V66, PCI 3V66-PCI Clock Skew 3V66 leads. Measured at 1.5V 0.5 2.5 ns
t13 CPU, IOAPIC CPU-IOAPIC Clock Skew CPU leads. Measured at 1.25V 1.5 4 ns
CPU Cycle-Cycle Clock Jitter With all outputs running 150 ps
IOAPIC Cycle-Cycle Clock Jitter 500 ps
48MHZ Cycle-Cycle Clock Jitter 500 ps
3V66 Cycle-Cycle Clock Jitter 500 ps
REF Cycle-Cycle Clock Jitter 1000 ps
CPU, PCI Settle Time CPU and PCI clock stabilization from
power-up
3ms
Notes:
4. Multiple Supplies: The voltage on any input or I/O pin cannot exceed the power pin during power-up. Power supply sequencing is NOT required.
5. All parameters specified with loaded outputs.
6. Duty cycle is measured at 1.5V when VDD = 3.3V. When VDD = 2.5V, duty cycle is measured at 1.25V.
Electrical Characteristics Over the Operating Range (continued)
Parameter Description Test Conditions Min. Max. Unit
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Document #: 38-07039 Rev. *B Page 6 of 10
Switching Waveforms
Duty Cycle Timing
t1A
t1B
All Outputs Rise/Fall Time
OUTPUT
t2
VDD
0V
t3
CPU-CPU Clock Skew
t6
CPUCLK
CPUCLK
IOAPIC-IOAPIC Clock Skew
t8
IOAPIC
IOAPIC
3V66 - 3V66 Clock Skew
t9
3V66
3V66
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Document #: 38-07039 Rev. *B Page 7 of 10
Notes:
7. CPU on and CPU off latency is 2 or 3 CPU cycles.
8. CPU_STOP# may be applied asynchronously. It is synchronized internally.
Switching Waveforms (continued)
PCI-PCI Clock Skew
t10
PCI
PCI
CPU - 3V66 Clock Skew
t11
CPU
3V66
3V66 - PCI Clock Skew
t12
3V66
PCI
CPU-IOAPIC Clock Skew
CPU
t13
IOAPIC
CPU_STOP# Timing
CPU
(Internal)
PCI
(Internal)
PCI_F
(Free-Running)
CPU_STOP#
CPU, 3V66
(External)
[7, 8]
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Document #: 38-07039 Rev. *B Page 8 of 10
Switching Waveforms (continued)
PCI_STOP#
CPU
(Internal)
PCI
(Internal)
PCI_F
PCI_STOP#
PCI
(External)
(Free-Running)
PWR_DWN#
CPU
(Internal)
PCI
(Internal)
PWR_DWN#
PCI
CPU
(External)
(External)
VCO
Crystal
Shaded section on the VCO and Crystal waveforms indicates that the VCO and crystal oscillator are active, and there is a valid clock.
Test Circuit
Note: All capacitors must be placed as close to the pins as is physically possible.
1, 7, 8, 13, 19, 20, 21, 24, 29, 40, 44, 48, 52
4, 10, 16, 17, 22, 23, 27, 31, 39
VDD_PCI, VDD_3V66,
CLOAD
OUTPUTS
VDD_CPU,
CY28158
43, 47, 51, 56
Note: Each supply pin must have an individual decoupling capacitor on test circuit at 0.1 µF.
VDD_48MHZ, VDD_REF,
VDD_IOAPIC
VDDA
Ordering Information
Ordering Code Package Name Package Type Operating Range
CY28158PVC O56 56-Pin SSOP Commercial
CY28158PVCT O56 56-Pin SSOP- Tape and Reel Commercial
Lead Free
CY28158OXC O56 56-Pin SSOP Commercial
CY28158OXCT O56 56-Pin SSOP- Tape and Reel Commercial
CY28158
Document #: 38-07039 Rev. *B Page 9 of 10
© Cypress Semiconductor Corporation, 2004. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Package Diagram
56-LeadShrunkSmallOutlinePackageO56
51-85062-C
CY28158
Document #: 38-07039 Rev. *B Page 10 of 10
Document Title: CY28158 Spread Spectrum Timing Solution for Serverworks Chipset
Document Number: 38-07039
REV. ECN NO.
Issue
Date
Orig. of
Change Description of Change
** 107005 08/08/01 IKA New Data Sheet
*A 122732 12/16/02 RBI Added power-up requirements to operating conditions information.
*B 237871 See ECN RGL Added Lead Free Devices