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LM4675 Ultra-Low EMI, Filterless, 2.65W, Mono, Class D
Audio Power Amplifier with Spread Spectrum
Check for Samples: LM4675,LM4675SDBD,LM4675TLBD
1FEATURES DESCRIPTION
The LM4675 is a single supply, high efficiency,
2• Spread Spectrum Architecture Reduces EMI 2.65W, mono, Class D audio amplifier. A spread
• Mono Class D Operation spectrum, filterless PWM architecture reduces EMI
• No Output Filter Required for Inductive Loads and eliminates the output filter, reducing external
component count, board area consumption, system
• Externally Configurable Gain cost, and simplifying design.
• Very Fast Turn On Time: 17μs (typ) The LM4675 is designed to meet the demands of
• Minimum External Components mobile phones and other portable communication
• "Click and Pop" Suppression Circuitry devices. Operating on a single 5V supply, it is
• Micro-Power Shutdown Mode capable of driving a 4Ωspeaker load at a continuous
average output of 2.2W with less than 1% THD+N. Its
• Available in Space-Saving 0.5mm Pitch flexible power supply requirements allow operation
DSBGA and WSON Packages from 2.4V to 5.5V. The wide band spread spectrum
architecture of the LM4675 reduces EMI-radiated
APPLICATIONS emissions due to the modulator frequency.
• Mobile Phones The LM4675 has high efficiency with speaker loads
• PDAs compared to a typical Class AB amplifier. With a 3.6V
• Portable Electronic Devices supply driving an 8Ωspeaker, the IC's efficiency for a
100mW power level is 80%, reaching 89% at 400mW
output power.
KEY SPECIFICATIONS The LM4675 features a low-power consumption
• Efficiency at 3.6V, 400mW into 8ΩSpeaker: shutdown mode. Shutdown may be enabled by
89% (typ) driving the Shutdown pin to a logic low (GND).
• Efficiency at 3.6V, 100mW into 8ΩSpeaker: The gain of the LM4675 is externally configurable
80% (typ) which allows independent gain control from multiple
• Efficiency at 5V, 1W into 8ΩSpeaker: 89% sources by summing the signals. Output short circuit
(typ) and thermal overload protection prevent the device
• Quiescent Current, 3.6V Supply: 2.2mA (typ) from damage during fault conditions.
• Total Shutdown Power Supply Current: 0.01µA
(typ)
• Single Supply Range: 2.4V to 5.5V
• PSRR, f = 217Hz: 82dB
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2006–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
FET
Drivers
Spread Spectrum
PWM Modulator
Click/Pop
Suppression
Bias
Circuit
Internal
Oscillator
Shutdown
Control
Shutdown
VO1
VO2
-IN
+IN
+
-
Ri
Ri
Input
GND PGND
VDD
+
CS
4.7 PF
VDD PVDD
30 60 80 100 120 140 160 180 200 220 240 260 280 300
FREQUENCY (MHz)
15
20
25
30
35
40
45
50
AMPLITUDE (dbmV/m)
FCC Class B Limit
LM4675TL Output Spectrum
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Figure 1. LM4675 Rf Emissions — 6in cable
Typical Application
Figure 2. Typical Audio Amplifier Application Circuit
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C
B
A
PGND
Vo1
Vo2
IN+
VDD
IN-
2
GND
SHUTDOWN PVDD
31
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Connection Diagrams xxx
Figure 4. 8-Pin WSON - Top View
See NGQ0008A Package
Figure 3. 9-Bump DSBGA - Top View
See YZR0009 Package
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)(2)(3)
Supply Voltage(1) 6.0V
Storage Temperature −65°C to +150°C
Voltage at Any Input Pin VDD + 0.3V ≥V≥GND - 0.3V
Power Dissipation(4) Internally Limited
ESD Susceptibility, all other pins(5) 2.0kV
ESD Susceptibility(6) 200V
Junction Temperature (TJMAX) 150°C
Thermal Resistance θJA (DSBGA) 220°C/W
θJA (WSON) 73°C/W
Soldering Information See (SNVA009) "microSMD Wafers Level Chip Scale
Package."
(1) All voltages are measured with respect to the ground pin, unless otherwise specified.
(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical
specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the
Operating Ratings. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication
of device performance.
(3) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
(4) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX,θJA, and the ambient temperature
TA. The maximum allowable power dissipation is PDMAX = (TJMAX–TA)/θJA or the number given in Absolute Maximum Ratings, whichever
is lower. For the LM4675, TJMAX = 150°C. The typical θJA is 99.1°C/W for the DSBGA package.
(5) Human body model, 100pF discharged through a 1.5kΩresistor.
(6) Machine Model, 220pF – 240pF discharged through all pins.
Operating Ratings(1)(2)
Temperature Range TMIN ≤TA≤TMAX −40°C ≤TA≤85°C
Supply Voltage 2.4V ≤VDD ≤5.5V
(1) All voltages are measured with respect to the ground pin, unless otherwise specified.
(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical
specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the
Operating Ratings. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication
of device performance.
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Electrical Characteristics(1)(2)
The following specifications apply for AV= 2V/V (RI= 150kΩ), RL= 15µH + 8Ω+ 15µH unless otherwise specified. Limits
apply for TA= 25°C. LM4675 Units
Symbol Parameter Conditions (Limits)
Typical(3) Limit(4)(5)
Differential Output Offset VI= 0V, AV= 2V/V,
|VOS| 3 mV
Voltage VDD = 2.4V to 5.0V
|IIH| Logic High Input Current VDD = 5.0V, VI= 5.5V 17 100 μA (max)
|IIL| Logic Low Input Current VDD = 5.0V, VI= –0.3V 0.9 5 μA (max)
VIN = 0V, No Load, VDD = 5.0V 2.8 3.9 mA (max)
VIN = 0V, No Load, VDD = 3.6V 2.2 2.9 mA
VIN = 0V, No Load, VDD = 2.4V 1.6 2.3 mA (max)
Quiescent Power Supply
IDD Current VIN = 0V, RL= 8Ω, VDD = 5.0V 2.8
VIN = 0V, RL= 8Ω, VDD = 3.6V 2.2
VIN = 0V, RL= 8Ω, VDD = 2.4V 1.6
VSHUTDOWN = 0V
ISD Shutdown Current(6) 0.01 1.0 μA (max)
VDD = 2.4V to 5.0V
VSDIH Shutdown voltage input high 1.4 V (min)
VSDIL Shutdown voltage input low 0.4 V (max)
ROSD Output Impedance VSHUTDOWN = 0.4V 100 kΩ
V/V (min)
AVGain 300kΩ/RIV/V (max)
Resistance from Shutdown Pin
RSD 300 kΩ
to GND
fSW Switching Frequency 300±30% kHz
RL= 15μH + 4Ω+ 15μH VDD = 5V 2.7 W
THD = 10% (max) VDD = 3.6V 1.3 W
f = 1kHz, 22kHz BW VDD = 2.5V 560 mW
RL= 15μH + 4Ω+ 15μH VDD = 5V 2.2 W
THD = 1% (max) VDD = 3.6V 1.08 W
f = 1kHz, 22kHz BW VDD = 2.5V 450 mW
POOutput Power RL= 15μH + 8Ω+ 15μH VDD = 5V 1.6 W
THD = 10% (max) VDD = 3.6V 820 mW
f = 1kHz, 22kHz BW VDD = 2.5V 350 mW
RL= 15μH + 8Ω+ 15μH VDD = 5V 1.3 W
THD = 1% (max) VDD = 3.6V 650 600 mW
f = 1kHz, 22kHz BW VDD = 2.5V 290 mW
VDD = 5V, PO= 0.1W, f = 1kHz 0.03 %
Total Harmonic Distortion +
THD+N VDD = 3.6V, PO= 0.1W, f = 1kHz 0.02 %
Noise VDD = 2.5V, PO= 0.1W, f = 1kHz 0.04 %
(1) All voltages are measured with respect to the ground pin, unless otherwise specified.
(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical
specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the
Operating Ratings. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication
of device performance.
(3) Typical specifications are specified at 25°C and represent the parametric norm.
(4) Tested limits are specified to TI's AOQL (Average Outgoing Quality Level).
(5) Datasheet min/max specification limits are ensured by design, test, or statistical analysis.
(6) Shutdown current is measured in a normal room environment. Exposure to direct sunlight will increase ISD by a maximum of 2µA. The
Shutdown pin should be driven as close as possible to GND for minimal shutdown current and to VDD for the best THD performance in
PLAY mode. See the Application Information section under SHUTDOWN FUNCTION for more information.
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Electrical Characteristics(1)(2) (continued)
The following specifications apply for AV= 2V/V (RI= 150kΩ), RL= 15µH + 8Ω+ 15µH unless otherwise specified. Limits
apply for TA= 25°C. LM4675 Units
Symbol Parameter Conditions (Limits)
Typical(3) Limit(4)(5)
VRipple = 200mVPP Sine,
fRipple = 217Hz, VDD = 3.6, 5V 82 dB
Inputs to AC GND, CI= 2μF
Power Supply Rejection Ratio
PSRR (Input Referred) VRipple = 200mVPP Sine,
fRipple = 1kHz, VDD = 3.6, 5V 80 dB
Inputs to AC GND, CI= 2μF
SNR Signal to Noise Ratio VDD = 5V, PO= 1WRMS 97 dB
VDD = 3.6V, f = 20Hz – 20kHz
Inputs to AC GND, CI= 2μF 28 μVRMS
Output Noise No Weighting
εOUT (Input Referred) VDD = 3.6V, Inputs to AC GND 22 μVRMS
CI= 2μF, A Weighted
Common Mode Rejection VDD = 3.6V, VRipple = 1VPP Sine
CMRR Ratio fRipple = 217Hz 80 dB
(Input Referred)
TWU Wake-up Time VDD = 3.6V 17 μs
TSD Shutdown Time 140 μs
VDD = 3.6V, POUT = 400mW 89 %
RL= 8Ω
ηEfficiency VDD = 5V, POUT = 1W 89 %
RL= 8Ω
External Components Description
(Figure 2)
Components Functional Description
1. CSSupply bypass capacitor which provides power supply filtering. Refer to the POWER SUPPLY BYPASSING section
for information concerning proper placement and selection of the supply bypass capacitor.
2. CIInput AC coupling capacitor which blocks the DC voltage at the amplifier's input terminals.
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10 100 1000 10000 100000
FREQUENCY (Hz)
THD+N (%)
0.001
0.01
0.1
1
10
100
10 100 1000 10000 100000
FREQUENCY (Hz)
THD+N (%)
0.001
0.01
0.1
1
10
100
10 100 1000 10000 100000
FREQUENCY (Hz)
THD+N (%)
0.001
0.01
0.1
1
10
100
0.001
0.01
0.1
1
10
100
10 100 1000 10000 100000
FREQUENCY (Hz)
THD+N (%)
0.001 0.01 0.1 1 10
OUTPUT POWER (W)
THD+N (%)
VDD = 5V
VDD = 3.6V
VDD = 3.0V
0.01
0.1
1
10
100
0.001 0.01 0.1 1 10
OUTPUT POWER (W)
THD+N (%)
VDD = 5V
VDD = 3.6V
0.01
0.1
1
10
100
VDD = 3.0V
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Typical Performance Characteristics
The performance graphs were taken using the Audio Precision AUX-0025 Switching Amplifier measurement Filter in series
with the LC filter on the demo board.
THD + N vs Output Power THD + N vs Output Power
f = 1kHz, RL= 8Ωf = 1kHz, RL= 4Ω
Figure 5. Figure 6.
THD + N vs Frequency THD + N vs Frequency
VDD = 2.5V, POUT = 100mW, RL= 8ΩVDD = 3.6V, POUT = 150mW, RL= 8Ω
Figure 7. Figure 8.
THD + N vs Frequency THD + N vs Frequency
VDD = 5V, POUT = 200mW, RL= 8ΩVDD = 2.5V, POUT = 100mW, RL= 4Ω
Figure 9. Figure 10.
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0 250 500 750 1000 1250 1500
OUTPUT POWER (mW)
POWER DISSIPATION (mW)
VDD = 5V
VDD = 3.6V
VDD = 2.5V
0
50
100
150
200
250
0
100
200
300
400
500
0 500 1000 1500 2000
OUTPUT POWER (mW)
POWER DISSIPATION (mW)
VDD = 5V
VDD = 3.6V
VDD = 2.5V
0 500 1000 1500 2000
OUTPUT POWER (mW)
EFFICIENCY (%)
VDD = 5V
VDD = 3.6VVDD = 2.5V
0
10
20
30
40
50
60
70
80
90
100
0 500 1000 1500 2000
OUTPUT POWER (mW)
EFFICIENCY (%)
VDD = 2.5V
0
10
20
30
40
50
60
70
80
90
100
VDD = 3.6V VDD = 5V
10 100 1000 10000 100000
FREQUENCY (Hz)
THD+N (%)
0.001
0.01
0.1
1
10
100
10 100 1000 10000 100000
FREQUENCY (Hz)
THD+N (%)
0.001
0.01
0.1
1
10
100
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Typical Performance Characteristics (continued)
The performance graphs were taken using the Audio Precision AUX-0025 Switching Amplifier measurement Filter in series
with the LC filter on the demo board.
THD + N vs Frequency THD + N vs Frequency
VDD = 3.6V, POUT = 100mW, RL= 4ΩVDD = 5V, POUT = 150mW, RL= 4Ω
Figure 11. Figure 12.
Efficiency vs. Output Power Efficiency vs. Output Power
RL= 4Ω, f = 1kHz RL= 8Ω, f = 1kHz
Figure 13. Figure 14.
Power Dissipation vs. Output Power Power Dissipation vs. Output Power
RL= 4Ω, f = 1kHz RL= 8Ω, f = 1kHz
Figure 15. Figure 16.
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2.5 3 3.5 4 4.5 5 5.5
SUPPLY VOLTAGE (V)
0
0.01
0.02
0.03
0.04
0.05
SUPPLY CURRENT (PA)
2.5 3 3.5 4 4.5 5 5.5
SUPPLY VOLTAGE (V)
SUPPLY CURRENT (mA)
0
1
2
3
4
5
10 100 1000 10000 100000
FREQUENCY (Hz)
PSRR (dB)
-90
-80
-70
-60
-50
-40
-30
-20
-10
0
-100
-90
-80
-70
-60
-50
-40
-30
-20
-10
0
10 100 1000 10000 100000
FREQUENCY (Hz)
CMRR(dB)
2.5 3 3.5 4 4.5 5 5.5
SUPPLY VOLTAGE (V)
OUTPUT POWER (W)
THD+N = 1%
THD+N = 10%
0
0.5
1
1.5
2
2.5 3 3.5 4 4.5 5 5.5
SUPPLY VOLTAGE (V)
OUTPUT POWER (W)
THD+N = 1%
THD+N = 10%
0
1
2
3
4
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Typical Performance Characteristics (continued)
The performance graphs were taken using the Audio Precision AUX-0025 Switching Amplifier measurement Filter in series
with the LC filter on the demo board.
Output Power vs. Supply Voltage Output Power vs. Supply Voltage
RL= 4Ω, f = 1kHz RL= 8Ω, f = 1kHz
Figure 17. Figure 18.
PSRR vs. Frequency CMRR vs. Frequency
VDD = 3.6V ,VRIPPLE = 200mVP-P, RL= 8ΩVDD = 3.6V, VCM = 1VP-P, RL= 8Ω
Figure 19. Figure 20.
Supply Current vs. Supply Voltage Shutdown Supply Current vs. Supply Voltage
No Load No Load
Figure 21. Figure 22.
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20 Hz 10 MHz
-100
0 dB 0
-40
-50
-70
-80
-30
-90
-60
-20
-10
20 Hz 10 MHz
-100
0 dB
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
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Typical Performance Characteristics (continued)
The performance graphs were taken using the Audio Precision AUX-0025 Switching Amplifier measurement Filter in series
with the LC filter on the demo board.
Fixed Frequency FFT Spread Spectrum FFT
VDD = 3.6V VDD = 3.6V
Figure 23. Figure 24.
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APPLICATION INFORMATION
GENERAL AMPLIFIER FUNCTION
The LM4675 features a filterless modulation scheme. The differential outputs of the device switch at 300kHz from
VDD to GND. When there is no input signal applied, the two outputs (VO1 and VO2) switch with a 50% duty cycle,
with both outputs in phase. Because the outputs of the LM4675 are differential, the two signals cancel each
other. This results in no net voltage across the speaker, thus there is no load current during an idle state,
conserving power.
With an input signal applied, the duty cycle (pulse width) of the LM4675 outputs changes. For increasing output
voltages, the duty cycle of VO1 increases, while the duty cycle of VO2 decreases. For decreasing output voltages,
the converse occurs, the duty cycle of VO2 increases while the duty cycle of VO1 decreases. The difference
between the two pulse widths yields the differential output voltage.
SPREAD SPECTRUM MODULATION
The LM4675 features a fitlerless spread spectrum modulation scheme that eliminates the need for output filters,
ferrite beads or chokes. The switching frequency varies by ±30% about a 300kHz center frequency, reducing the
wideband spectral contend, improving EMI emissions radiated by the speaker and associated cables and traces.
Where a fixed frequency class D exhibits large amounts of spectral energy at multiples of the switching
frequency, the spread spectrum architecture of the LM4675 spreads that energy over a larger bandwidth. The
cycle-to-cycle variation of the switching period does not affect the audio reproduction of efficiency.
POWER DISSIPATION AND EFFICIENCY
In general terms, efficiency is considered to be the ratio of useful work output divided by the total energy required
to produce it with the difference being the power dissipated, typically, in the IC. The key here is “useful” work. For
audio systems, the energy delivered in the audible bands is considered useful including the distortion products of
the input signal. Sub-sonic (DC) and super-sonic components (>22kHz) are not useful. The difference between
the power flowing from the power supply and the audio band power being transduced is dissipated in the
LM4675 and in the transducer load. The amount of power dissipation in the LM4675 is very low. This is because
the ON resistance of the switches used to form the output waveforms is typically less than 0.25Ω. This leaves
only the transducer load as a potential "sink" for the small excess of input power over audio band output power.
The LM4675 dissipates only a fraction of the excess power requiring no additional PCB area or copper plane to
act as a heat sink.
DIFFERENTIAL AMPLIFIER EXPLANATION
As logic supply voltages continue to shrink, designers are increasingly turning to differential analog signal
handling to preserve signal to noise ratios with restricted voltage swing. The LM4675 is a fully differential
amplifier that features differential input and output stages. A differential amplifier amplifies the difference between
the two input signals. Traditional audio power amplifiers have typically offered only single-ended inputs resulting
in a 6dB reduction in signal to noise ratio relative to differential inputs. The LM4675 also offers the possibility of
DC input coupling which eliminates the two external AC coupling, DC blocking capacitors. The LM4675 can be
used, however, as a single ended input amplifier while still retaining it's fully differential benefits. In fact,
completely unrelated signals may be placed on the input pins. The LM4675 simply amplifies the difference
between the signals. A major benefit of a differential amplifier is the improved common mode rejection ratio
(CMRR) over single input amplifiers. The common-mode rejection characteristic of the differential amplifier
reduces sensitivity to ground offset related noise injection, especially important in high noise applications.
PCB LAYOUT CONSIDERATIONS
As output power increases, interconnect resistance (PCB traces and wires) between the amplifier, load and
power supply create a voltage drop. The voltage loss on the traces between the LM4675 and the load results is
lower output power and decreased efficiency. Higher trace resistance between the supply and the LM4675 has
the same effect as a poorly regulated supply, increased ripple on the supply line also reducing the peak output
power. The effects of residual trace resistance increases as output current increases due to higher output power,
decreased load impedance or both. To maintain the highest output voltage swing and corresponding peak output
power, the PCB traces that connect the output pins to the load and the supply pins to the power supply should
be as wide as possible to minimize trace resistance.
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The use of power and ground planes will give the best THD+N performance. While reducing trace resistance, the
use of power planes also creates parasite capacitors that help to filter the power supply line.
The inductive nature of the transducer load can also result in overshoot on one or both edges, clamped by the
parasitic diodes to GND and VDD in each case. From an EMI standpoint, this is an aggressive waveform that can
radiate or conduct to other components in the system and cause interference. It is essential to keep the power
and output traces short and well shielded if possible. Use of ground planes, beads, and micro-strip layout
techniques are all useful in preventing unwanted interference.
As the distance from the LM4675 and the speaker increase, the amount of EMI radiation will increase since the
output wires or traces acting as antenna become more efficient with length. What is acceptable EMI is highly
application specific. Ferrite chip inductors placed close to the LM4675 may be needed to reduce EMI radiation.
The value of the ferrite chip is very application specific.
POWER SUPPLY BYPASSING
As with any power amplifier, proper supply bypassing is critical for low noise performance and high power supply
rejection ratio (PSRR). The capacitor (CS) location should be as close as possible to the LM4675. Typical
applications employ a voltage regulator with a 10µF and a 0.1µF bypass capacitors that increase supply stability.
These capacitors do not eliminate the need for bypassing on the supply pin of the LM4675. A 4.7µF tantalum
capacitor is recommended.
SHUTDOWN FUNCTION
In order to reduce power consumption while not in use, the LM4675 contains shutdown circuitry that reduces
current draw to less than 0.01µA. The trigger point for shutdown is shown as a typical value in the Electrical
Characteristics Tables and in the Shutdown Hysteresis Voltage graphs found in the Typical Performance
Characteristics section. It is best to switch between ground and supply for minimum current usage while in the
shutdown state. While the LM4675 may be disabled with shutdown voltages in between ground and supply, the
idle current will be greater than the typical 0.01µA value.
The LM4675 has an internal resistor connected between GND and Shutdown pins. The purpose of this resistor is
to eliminate any unwanted state changes when the Shutdown pin is floating. The LM4675 will enter the shutdown
state when the Shutdown pin is left floating or if not floating, when the shutdown voltage has crossed the
threshold. To minimize the supply current while in the shutdown state, the Shutdown pin should be driven to
GND or left floating. If the Shutdown pin is not driven to GND, the amount of additional resistor current due to the
internal shutdown resistor can be found by Equation 1 below.
(VSD - GND) / 300kΩ(1)
With only a 0.5V difference, an additional 1.7µA of current will be drawn while in the shutdown state.
PROPER SELECTION OF EXTERNAL COMPONENTS
The gain of the LM4675 is set by the external resistors, Ri in Figure 2, The Gain is given by Equation 2 below.
Best THD+N performance is achieved with a gain of 2V/V (6dB).
AV= 2 * 150 kΩ/ Ri(V/V) (2)
It is recommended that resistors with 1% tolerance or better be used to set the gain of the LM4675. The Ri
resistors should be placed close to the input pins of the LM4675. Keeping the input traces close to each other
and of the same length in a high noise environment will aid in noise rejection due to the good CMRR of the
LM4675. Noise coupled onto input traces which are physically close to each other will be common mode and
easily rejected by the LM4675.
Input capacitors may be needed for some applications or when the source is single-ended (see Figure 26,
Figure 28). Input capacitors are needed to block any DC voltage at the source so that the DC voltage seen
between the input terminals of the LM4675 is 0V. Input capacitors create a high-pass filter with the input
resistors, Ri. The –3dB point of the high-pass filter is found using Equation 3 below.
fC= 1 / (2πRiCi) (Hz) (3)
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The input capacitors may also be used to remove low audio frequencies. Small speakers cannot reproduce low
bass frequencies so filtering may be desired . When the LM4675 is using a single-ended source, power supply
noise on the ground is seen as an input signal by the +IN input pin that is capacitor coupled to ground (See
Figure 28 –Figure 30). Setting the high-pass filter point above the power supply noise frequencies, 217Hz in a
GSM phone, for example, will filter out this noise so it is not amplified and heard on the output. Capacitors with a
tolerance of 10% or better are recommended for impedance matching.
DIFFERENTIAL CIRCUIT CONFIGURATIONS
The LM4675 can be used in many different circuit configurations. The simplest and best performing is the DC
coupled, differential input configuration shown in Figure 25.Equation 2 above is used to determine the value of
the Riresistors for a desired gain.
Input capacitors can be used in a differential configuration as shown in Figure 26.Equation 3 above is used to
determine the value of the Cicapacitors for a desired frequency response due to the high-pass filter created by
Ciand Ri.Equation 2 above is used to determine the value of the Riresistors for a desired gain.
The LM4675 can be used to amplify more than one audio source. Figure 27 shows a dual differential input
configuration. The gain for each input can be independently set for maximum design flexibility using the Ri
resistors for each input and Equation 2. Input capacitors can be used with one or more sources as well to have
different frequency responses depending on the source or if a DC voltage needs to be blocked from a source.
SINGLE-ENDED CIRCUIT CONFIGURATIONS
The LM4675 can also be used with single-ended sources but input capacitors will be needed to block any DC at
the input terminals. Figure 28 shows the typical single-ended application configuration. The equations for Gain,
Equation 2, and frequency response, Equation 3, hold for the single-ended configuration as shown in Figure 28.
When using more than one single-ended source as shown in Figure 29, the impedance seen from each input
terminal should be equal. To find the correct values for Ci3 and Ri3 connected to the +IN input pin the equivalent
impedance of all the single-ended sources are calculated. The single-ended sources are in parallel to each other.
The equivalent capacitor and resistor, Ci3 and Ri3, are found by calculating the parallel combination of all
Civalues and then all Rivalues. Equation 4 and Equation 5 below are for any number of single-ended sources.
Ci3 = Ci1 + Ci2 + Cin (F) (4)
Ri3 = 1 / (1/Ri1 + 1/Ri2 + 1/Rin) (Ω) (5)
The LM4675 may also use a combination of single-ended and differential sources. A typical application with one
single-ended source and one differential source is shown in Figure 30. Using the principle of superposition, the
external component values can be determined with the above equations corresponding to the configuration.
Figure 25. Differential Input Configuration
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SNAS353C –AUGUST 2006–REVISED MAY 2013
Figure 26. Differential Input Configuration with Input Capacitors
Figure 27. Dual Differential Input Configuration
Figure 28. Single-Ended Input Configuration
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Figure 29. Dual Single-Ended Input Configuration
Figure 30. Dual Input with a Single-Ended Input and a Differential Input
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LM4675, LM4675SDBD, LM4675TLBD
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SNAS353C –AUGUST 2006–REVISED MAY 2013
REFERENCE DESIGN BOARD SCHEMATIC
In addition to the minimal parts required for the application circuit, a measurement filter is provided on the
evaluation circuit board so that conventional audio measurements can be conveniently made without additional
equipment. This is a balanced input, grounded differential output low pass filter with a 3dB frequency of
approximately 35kHz and an on board termination resistor of 300Ω(see schematic). Note that the capacitive load
elements are returned to ground. This is not optimal for common mode rejection purposes, but due to the
independent pulse format at each output there is a significant amount of high frequency common mode
component on the outputs. The grounded capacitive filter elements attenuate this component at the board to
reduce the high frequency CMRR requirement placed on the analysis instruments.
Even with the grounded filter the audio signal is still differential, necessitating a differential input on any analysis
instrument connected to it. Most lab instruments that feature BNC connectors on their inputs are NOT differential
responding because the ring of the BNC is usually grounded.
The commonly used Audio Precision analyzer is differential, but its ability to accurately reject high frequency
signals is questionable necessitating the on board measurement filter. When in doubt or when the signal needs
to be single-ended, use an audio signal transformer to convert the differential output to a single ended output.
Depending on the audio transformer's characteristics, there may be some attenuation of the audio signal which
needs to be taken into account for correct measurement of performance.
Measurements made at the output of the measurement filter suffer attenuation relative to the primary, unfiltered
outputs even at audio frequencies. This is due to the resistance of the inductors interacting with the termination
resistor (300Ω) and is typically about -0.25dB (3%). In other words, the voltage levels (and corresponding power
levels) indicated through the measurement filter are slightly lower than those that actually occur at the load
placed on the unfiltered outputs. This small loss in the filter for measurement gives a lower output power reading
than what is really occurring on the unfiltered outputs and its load.
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LM4675, LM4675SDBD, LM4675TLBD
SNAS353C –AUGUST 2006–REVISED MAY 2013
www.ti.com
REVISION HISTORY
Rev Date Description
1.0 08/16/06 Initial release.
1.1 09/01/06 Added the DSBGA (YZR009) package.
1.2 10/12/06 Text edit (X-axis label) on Rf Emissions on page 1.
1.3 07/02/08 Text edits.
Changes from Revision B (May 2013) to Revision C Page
• Changed layout of National Data Sheet to TI format .......................................................................................................... 15
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PACKAGE OPTION ADDENDUM
www.ti.com 20-Jan-2017
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM4675SD/NOPB ACTIVE WSON NGQ 8 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM L4675
LM4675SDX/NOPB ACTIVE WSON NGQ 8 4500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM L4675
LM4675TL/NOPB ACTIVE DSBGA YZR 9 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 G
H8
LM4675TLX/NOPB ACTIVE DSBGA YZR 9 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 G
H8
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
PACKAGE OPTION ADDENDUM
www.ti.com 20-Jan-2017
Addendum-Page 2
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM4675SD/NOPB WSON NGQ 8 1000 178.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1
LM4675SDX/NOPB WSON NGQ 8 4500 330.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1
LM4675TL/NOPB DSBGA YZR 9 250 178.0 8.4 1.7 1.7 0.76 4.0 8.0 Q1
LM4675TLX/NOPB DSBGA YZR 9 3000 178.0 8.4 1.7 1.7 0.76 4.0 8.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 8-May-2013
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM4675SD/NOPB WSON NGQ 8 1000 210.0 185.0 35.0
LM4675SDX/NOPB WSON NGQ 8 4500 367.0 367.0 35.0
LM4675TL/NOPB DSBGA YZR 9 250 210.0 185.0 35.0
LM4675TLX/NOPB DSBGA YZR 9 3000 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 8-May-2013
Pack Materials-Page 2
www.ti.com
PACKAGE OUTLINE
C
8X 0.3
0.2
2 0.1
8X 0.5
0.3
2X
1.5
1.6 0.1
6X 0.5
0.8
0.7
0.05
0.00
B3.1
2.9 A
3.1
2.9
(0.1) TYP
WSON - 0.8 mm max heightNGQ0008A
PLASTIC SMALL OUTLINE - NO LEAD
4214922/A 03/2018
PIN 1 INDEX AREA
SEATING PLANE
0.08 C
1
45
8
PIN 1 ID 0.1 C A B
0.05 C
THERMAL PAD
EXPOSED
9
SYMM
SYMM
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
SCALE 4.000
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
(1.6)
6X (0.5)
(2.8)
8X (0.25)
8X (0.6)
(2)
(R0.05) TYP ( 0.2) VIA
TYP
(0.75)
WSON - 0.8 mm max heightNGQ0008A
PLASTIC SMALL OUTLINE - NO LEAD
4214922/A 03/2018
SYMM
1
45
8
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:20X
9
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
SOLDER MASK
OPENING
SOLDER MASK
METAL UNDER
SOLDER MASK
DEFINED
EXPOSED METAL
METAL
SOLDER MASK
OPENING
SOLDER MASK DETAILS
NON SOLDER MASK
DEFINED
(PREFERRED)
EXPOSED METAL
www.ti.com
EXAMPLE STENCIL DESIGN
8X (0.25)
8X (0.6)
6X (0.5)
(1.79)
(1.47)
(2.8)
(R0.05) TYP
WSON - 0.8 mm max heightNGQ0008A
PLASTIC SMALL OUTLINE - NO LEAD
4214922/A 03/2018
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
EXPOSED PAD 9:
82% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:20X
SYMM
1
45
8
SYMM
METAL
TYP
9
MECHANICAL DATA
YZR0009xxx
www.ti.com
TLA09XXX (Rev C)
0.600±0.075 D
E
A
. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994.
B. This drawing is subject to change without notice.
4215046/A 12/12
NOTES:
D: Max =
E: Max =
1.562 mm, Min =
1.562 mm, Min =
1.502 mm
1.502 mm
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