145 Adams Avenue, Hauppauge, NY 11788 USA Tel: (631) 435-1110 * Fax: (631) 435-1824 Package Details - TO-92 Mechanical Drawing SYMBOL A (DIA) B C D E F G H I DIMENSIONS INCHES MILLIMETERS MIN MAX MIN MAX 0.175 0.205 4.45 5.21 0.170 0.210 4.32 5.33 0.500 12.70 0.016 0.022 0.41 0.56 0.100 2.54 0.050 1.27 0.125 0.165 3.18 4.19 0.080 0.105 2.03 2.67 0.015 0.38 TO-92 (REV: R1) LEAD CODE: * SCR 1) ANODE 2) GATE 3) CATHODE * FET 1) DRAIN 2) SOURCE 3) GATE Packing Code: D D = White corrugated box with black conductive coating (surface resistivity of <105 ohms per square). Standard Packing Quantity: 2.5K Also available in the following lead form options TO-92-SF, TO-92-ST, TO-92-ST1, TO-92-18F, TO-92-18R Central TM Semiconductor Corp. w w w. c e n t r a l s e m i . c o m 1) CATHODE or 2) GATE 3) ANODE or 1) DRAIN 2) GATE 3) SOURCE 1) SOURCE 2) DRAIN 3) GATE 1) GATE 2) SOURCE 3) DRAIN TRIAC 1) MT1 2) GATE 3) MT2 PUT 1) ANODE 2) GATE 3) CATHODE * TRANSISTOR 1) EMITTER 1) EMITTER 2) BASE 2) COLLECTOR 3) COLLECTOR 3) BASE or 1) COLLECTOR 1) BASE 2) EMITTER 2) BASE 3) COLLECTOR 3) EMITTER * Note: See individual device datasheet for pinout information 1 R0 (21-June 2004) Package Details - TO-92 TR Tape and Reel Specifications 1.0. Purpose: This specification defines the tape and reel packaging requirements for TO-92 devices. Devices supplied to this specification are taped in accordance with Electronic Industries Association Standard EIA-468-B. 2.0 Requirements: 2.1 Tape and Reel Requirements: Devices to be taped and reeled in accordance with Figures 2 and 3. 2.2 Style Type: A suffix is added to part number to indicate Style Type. Example: CS92B TRE (CS92B taped and reeled in accordance with STYLE E). Note: STYLE E is preferred. 2.3 Packaging Base: Devices to be taped 2000 pieces per reel. FIGURE 1. PHYSICAL DIMENSIONS ALL DIMENSIONS IN INCHES (mm). Central 2 TM Semiconductor Corp. w w w. c e n t r a l s e m i . c o m Package Details - TO-92 TR Tape and Reel Specifications (Continued) FIGURE 2. TAPING SPECIFICATIONS SYMBOL A A1 D F1 F2 H H1 H2 P P1 T T1 T2 W W1 W2 W3 NOTES: 1) 2) 3) 4) 5) 6) 7) 8) DESCRIPTION FRONT TO REAR DEFLECTION LEFT TO RIGHT DEFLECTION FEED HOLE DIAMETER COMPONENT LEAD PITCH COMPONENT LEAD PITCH FEED HOLE TO BOTTOM OF COMPONENT HEIGHT OF SEATING PLANE HEIGHT OF FEED HOLE LOCATION FEED HOLE PITCH CENTER OF SEATING PLANE LOCATION CARRIER TAPE THICKNESS OVERALL TAPE THICKNESS TOTAL TAPED PACKAGE THICKNESS CARRIER TAPE WIDTH ADHESIVE TAPE WIDTH LEAD ENCLOSURE ADHESIVE TAPE POSITION INCHES MIN MAX --0.039 --0.039 0.15 0.17 0.09 0.11 0.09 0.11 0.75 0.79 0.61 0.65 0.33 0.37 0.49 0.51 0.23 0.26 0.015 0.027 0.020 0.035 --0.057 0.69 0.75 0.20 0.28 0.18 ----0.020 MM MIN ----3.8 2.4 2.4 19.0 15.5 8.5 12.5 5.95 0.38 0.50 --17.5 5.0 4.5 --- MAX 1.0 1.0 4.2 2.9 2.9 20.0 16.5 9.5 12.9 6.75 0.68 0.90 1.44 19.0 7.0 --0.5 NOTE 1 6 6 2 7,8 3 4 4 5 5 MAXIMUM ALIGNMENT DEVIATION BETWEEN LEADS NOT TO BE GREATER THAN 0.2mm. AS ILLUSTRATED, THE CLEARANCE TO THE LEAD STANDOFF FORM SHALL BE DEFINED TO THE POINT OF RADIUS FOR THE STANDOFF FORM. MAXIMUM CUMULATIVE VARIATION BETWEEN TAPE FEED HOLES SHALL NOT EXCEED 1.0mm IN 20 PITCHES. OVERALL TAPED PACKAGE THICKNESS, INCLUDING COMPONENT LEADS AND TAPE SPLICES SHALL NOT EXCEED 1.44mm. HOLDDOWN TAPE NOT TO EXTEND BEYOND THE EDGES OF CARRIER TAPE AND THERE SHALL BE NO EXPOSURE OF ADHESIVE. NO MORE THAN 0.1% MISSING AND NO CONSECUTIVE MISSING COMPONENTS PER REEL IS PERMITTED. A TAPE LEADER AND TRAILER, HAVING AT LEAST 3 SPROCKET HOLES IS REQUIRED. NO MORE THAN 10 SPLICES PER REEL IS PERMITTED AND SPLICES SHALL NOT INTERFERE WITH SPROCKET FEED HOLES. Central TM Semiconductor Corp. w w w. c e n t r a l s e m i . c o m 3 Package Details - TO-92 TR Tape and Reel Specifications (Continued) FIGURE3. TAPING STYLE Central 4 TM Semiconductor Corp. w w w. c e n t r a l s e m i . c o m Package Details - TO-92 AP Ammopack Specifications 1.0. PURPOSE: This specification defines the TO-92 Ammopack requirements. Devices supplied to this specification are taped in accordance with Electronic Industries Association Standard EIA-468-B. 2.0 REQUIREMENTS: 2.1 Tape Requirements: Devices to be taped in accordance with Figure 2. 2.2 Style Type: STYLE M (PREFERRED) or STYLE P (See Figures 3 and 4). 2.3 Ordering Info: Add suffix to part number to indicate Style Type . Suffix APM For STYLE M (Equivalent to reel pack STYLE E). Example: CS92B APM (CS92B SCR, Ammopack STYLE M). or Suffix APP For STYLE P (Equivalent to reel pack STYLE A). Example: CS92B APP (CS92B SCR, Ammopack STYLE P). 2.4 Packaging Base: Devices to be taped 2000 pieces per Ammopack. FIGURE 1. PHYSICAL DIMENSIONS All Dimensions in Inches (mm) Central TM Semiconductor Corp. w w w. c e n t r a l s e m i . c o m 5 Package Details - TO-92 AP TO-92 Ammopack Specifications (Continued) SYMBOL A A1 D F1 F2 H H1 H2 P P1 T T1 T2 W W1 W2 W3 NOTES: 1) 2) 3) 4) 5) 6) 7) 8) FIGURE 2. (TAPING SPECIFICATIONS) DESCRIPTION FRONT TO REAR DEFLECTION LEFT TO RIGHT DEFLECTION FEED HOLE DIAMETER COMPONENT LEAD PITCH COMPONENT LEAD PITCH FEED HOLE TO BOTTOM OF COMPONENT HEIGHT OF SEATING PLANE HEIGHT OF FEED HOLE LOCATION FEED HOLE PITCH CENTER OF SEATING PLANE LOCATION CARRIER TAPE THICKNESS OVERALL TAPE THICKNESS TOTAL TAPED PACKAGE THICKNESS CARRIER TAPE WIDTH ADHESIVE TAPE WIDTH LEAD ENCLOSURE ADHESIVE TAPE POSITION INCHES MIN MAX --0.039 --0.039 0.15 0.17 0.09 0.11 0.09 0.11 0.75 0.79 0.61 0.65 0.33 0.37 0.49 0.51 0.23 0.26 0.015 0.027 0.020 0.035 --0.057 0.69 0.75 0.20 0.28 0.18 ----0.020 MM MIN ----3.8 2.4 2.4 19.0 15.5 8.5 12.5 5.95 0.38 0.50 --17.5 5.0 4.5 --- MAX 1.0 1.0 4.2 2.9 2.9 20.0 16.5 9.5 12.9 6.75 0.68 0.90 1.44 19.0 7.0 --0.5 NOTE 1 6 6 2 7,8 3 4 4 5 5 MAXIMUM ALIGNMENT DEVIATION BETWEEN LEADS NOT TO BE GREATER THAN 0.2mm. AS ILLUSTRATED, THE CLEARANCE TO THE LEAD STANDOFF FORM SHALL BE DEFINED TO THE POINT OF RADIUS FOR THE STANDOFF FORM. MAXIMUM CUMULATIVE VARIATION BETWEEN TAPE FEED HOLES SHALL NOT EXCEED 1.0mm IN 20 PITCHES. OVERALL TAPED PACKAGE THICKNESS, INCLUDING COMPONENT LEADS AND TAPE SPLICES SHALL NOT EXCEED 1.44mm. HOLDDOWN TAPE NOT TO EXTEND BEYOND THE EDGES OF CARRIER TAPE AND THERE SHALL BE NO EXPOSURE OF ADHESIVE. NO MORE THAN 0.1% MISSING AND NO CONSECUTIVE MISSING COMPONENTS PER REEL IS PERMITTED. A TAPE LEADER AND TRAILER, HAVING AT LEAST 3 SPROCKET HOLES IS REQUIRED. NO MORE THAN 10 SPLICES PER REEL IS PERMITTED AND SPLICES SHALL NOT INTERFERE WITH SPROCKET FEED HOLES. Central 6 TM Semiconductor Corp. w w w. c e n t r a l s e m i . c o m Package Details - TO-92 AP Ammopack Specifications (Continued) Note: The box is accessible from either side depending upon whether PIN 1 or PIN 3 is required at the leading edge. Central TM Semiconductor Corp. w w w. c e n t r a l s e m i . c o m 7 Material Composition Specification TO-92 (Eutectic Die Attach) Pb (lead)-free plating** Device average mass . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 206 mg Fluctuation margin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +/-10% Material Component Material Substance Substance CAS No. (%wt) (mg) (%wt) (mg) (ppm) active device doped Si 0.034% 0.07 Si 7440-21-3 0.034% 0.07 340 bond wire gold 0.016% 0.032 Au 7440-57-5 0.016% 0.032 155 Cu 7440-50-8 44.641% 91.96 446,408 Fe 7439-89-6 0.045% 0.092 447 P 7723-14-0 0.016% 0.032 155 Ag 7440-22-4 0.123% 0.254 1,233 silica 7631-86-9 40.694% 83.83 406,942 epoxy resin 29690-82-2 5.267% 10.85 52,670 phenol resin 9003-35-4 4.748% 9.78 47,476 carbon black 1333-86-4 0.149% 0.306 1,485 Sb2O3 1309-64-4 1.146% 2.36 11,456 TBBA 79-94-7 0.283% 0.584 2,835 silica 7631-86-9 38.816% 79.96 388,155 epoxy resin 29690-82-2 5.024% 10.35 50,243 52.286% 107.71 phenol resin 9003-35-4 4.529% 9.33 45,291 carbon black 1333-86-4 0.568% 1.17 5,680 metal hydroxide 1309-42-8 3.35% 6.9 33,495 Sn 7440-31-5 2.282% 4.7 22,816 Pb 7439-92-1 0.558% 1.15 5,583 Sn 7440-31-5 2.84% 5.85 28,398 leadframe Cu alloy w/ silver plating EMC 44.824% 92.338 52.286% 107.71 encapsulation* EMC GREEN tin lead process 2.84% 5.85 plating** 100% matte tin 2.84% 5.85 *EMC GREEN molding compound is Halogen Free. **Specify Lead-Free when ordering 100% tin (Pb-free) plating. Disclaimer The information provided in this Material Composition data sheet is, to the best of our knowledge, correct. However, there is no guarantee to completeness or accuracy, as some information is derived from data sources outside the company. R2 (25-October 2010) w w w. c e n t r a l s e m i . c o m Material Composition Specification TO-92 (Solder Die Attach) Pb (lead)-free plating** Device average mass . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 206 mg Fluctuation margin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +/-10% Material Component Material Substance Substance CAS No. (%wt) (mg) (%wt) (mg) (ppm) active device doped Si 0.035% 0.07 Si 7440-21-3 0.035% 0.073 354 bond wire gold 0.016% 0.032 Au 7440-57-5 0.016% 0.032 155 Cu 7440-50-8 44.64% 91.96 446,408 Fe 7439-89-6 0.045% 0.092 447 P 7723-14-0 0.016% 0.032 155 Ag 7440-22-4 0.123% 0.254 1,233 Pb 7439-92-1 0.113% 0.232 1,126 Sn 7440-31-5 0.006% 0.012 58 leadframe die attach Cu alloy w/ silver plating silver epoxy EMC 44.82% 0.121% 52.16% 92.34 0.25 107.46 plating** 52.16% 7440-22-4 0.003% 0.006 29 7631-86-9 40.6% 83.64 406,019 epoxy resin 29690-82-2 5.25% 10.82 52,524 phenol resin 9003-35-4 4.74% 9.76 47,379 carbon black 1333-86-4 0.148% 0.305 1,481 Sb2O3 1309-64-4 1.14% 2.35 11,408 TBBA 79-94-7 0.283% 0.582 2,825 encapsulation* EMC GREEN Ag silica silica 7631-86-9 38.72% 79.77 387,233 epoxy resin 29690-82-2 5.015% 10.33 50,146 107.46 phenol resin 9003-35-4 4.519% 9.31 45,194 carbon black 1333-86-4 0.567% 1.167 5,665 metal hydroxide 1309-42-8 3.34% 6.88 33,398 Sn 7440-31-5 2.282% 4.7 22,816 Pb 7439-92-1 0.558% 1.15 5,583 Sn 7440-31-5 2.84% 5.85 28,398 tin lead process 2.84% 5.85 100% matte tin 2.84% 5.85 *EMC GREEN molding compound is Halogen Free. **Specify Lead-Free when ordering 100% tin (Pb-free) plating. Disclaimer The information provided in this Material Composition data sheet is, to the best of our knowledge, correct. However, there is no guarantee to completeness or accuracy, as some information is derived from data sources outside the company. R2 (25-October 2010) w w w. c e n t r a l s e m i . c o m Central Semiconductor :: RoHS - Lead Free Page 1 of 2 GO Advanced Search Registered user login Products Samples What's New Central Semiconductor's RoHS compliance Engineering Corporate Info Contact Us Literature In the Press Trade Shows Career Opportunites Home RoHS: The European Union has adopted Directive 2002/95/EC - the Restriction of Hazardous Substances (RoHS) in electrical and electronic equipment. This legislation bans the use of lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE) in electrical and electronic devices after July 1, 2006 with certain exemptions. Central's Policy: Central Semiconductor is doing its part to help improve the environment by reducing and removing any substances that are considered harmful to the environment. Central has put procedures in place to comply with legislation pertaining to environmental concerns. Central has implemented procedures to comply with RoHS banned substances. Table 1 lists the allowable limits for banned substances. Table 1 Maximum Limit Substance (ppm ) Cadmium (Cd) 100 Lead (Pb) 1000 (1) (2) Mercury (Hg) 1000 Hexavalent Chromium (Cr 6+) 1000 Poly Brominated Biphenyls (PBB) 1000 Poly Brominated Diphenyl Ethers (PBDE) 1000 (1) Applicable to products with Pb-free lead finish only. Maximum limit does not apply to applications for which exemptions have been granted by the RoHS directive. (2) Central's current products do not contain any of the following banned substances: Mercury, Cadmium, hexavalent chromium, polybrominated biphenyls (PBB), or polybrominated diphenyl ethers (PBDE). Nearly all of Central's products are currently available with lead free exterior finishes, in the form of 99.9% matte tin plating. Presently most of Central's products are available in both Lead free (99.9% Tin), and Tin/Lead finishes. Special Notations 1. Tin Whisker Mitigation Methods: Central's Pb free plating meets the following criteria: a. External plating composition is 99.9% Matte Tin (Sn) minimum. b. External plating thickness is 315 micro-inches (8m) minimum. c. External plating grain size is 40 micro-inches (1m) minimum. d. External plating carbon content is 0.1% maximum. e. Devices do not have a Nickel (Ni) barrier underlayer. f. Some case types include a post plating anneal bake. 2. 3. 4. 5. 6. 7. 8. 9. Central's Pb free devices are RoHS compliant. Central's Pb free devices are compatible with both tin/lead and lead free solder processes. Central's Pb free devices can withstand a MAX temperature of 260C for 30 seconds maximum. Click here for Central's typical reflow & wave soldering temperature profile. Central's Pb free surface mount devices have a Moisture Sensitivity Level (MSL) of 1. (per JEDEC JSTD-020D) Central's Pb free devices are not a change in form, fit or function. Central's Pb free devices are controlled by an internal lot tracking system. In order to receive Pb free devices please add a suffix of "Lead Free" to the part number when ordering. (Example: CMPD2004S TR LEAD FREE) Devices ordered as Pb free are certified to contain less than 1000ppm Pb content on the terminal plating and will be labeled with Central's Lead Free/RoHS Compliant Logo. Sample Label file://\\blrsndf001\data\production\PARM\Common_Files\DIS\dis\Ordering_INFO\CS... 15-Nov-2010 Central Semiconductor :: RoHS - Lead Free 10. Page 2 of 2 Devices with tin/lead plating are still available for certain customer's requirements. Please contact Central's sales department for additional detail. Central Semiconductor's REACH compliance The European Union's REACH (Registration, Evaluation, Authorization, and restriction of Chemicals) regulation applies to chemical substances manufactured in or imported to the EU in quantities of 1 tonne or more per year. It applies to chemical substances on their own, in preparations, or in articles (manufactured goods). The goal of REACH is to improve the protection of human health and the environment through better and earlier identification of chemical substances. Central's Policy: Central's devices are in compliance with article 57 of Regulation (EC) No. 1907/2006 (the REACH Regulation). They do not contain, nor are they manufactured with, any of the currently identified SVHCs (Substances of Very High Concern). They do not contain any substances meant for intentional release. Click here for a PDF version of this statement. For additional information please contact the Central sales department at (631) 435-1110. 145 Adams Avenue Hauppauge, NY 11788 USA TEL (631) 435-1110 FAX (631) 435-1824 file://\\blrsndf001\data\production\PARM\Common_Files\DIS\dis\Ordering_INFO\CS... 15-Nov-2010