(S) MOTOROLA Binary Counter ELECTRICALLY TESTED PER: MPG 10578 The 10578 is a four-bit counter capable of divide-by-two, divide-by-four, divide- by-eight ora divide-by-sixteen function. Clock inputs trigger on the positive going edge of the clock pulse. Set and Resetinputs override the clock, allowing asynch- ronous set or clear. Individual Set and common Reset inputs are provided, as well as complementary outputs for the first and fourth bits. True outputs are available at all bits. 505 mW Max/Pkg (No Load) * ftoggie = 150 MHz (typ) tr, t= 2.7 ns typ (20% - 80%) Military 10578 MPO nn AVAILABLE AS 1) JAN: N/A 2) SMD: N/A 3) 883: 10578/BXAJC PIN ASSIGNMENTS X = CASE OUTLINE AS FOLLOWS: FUNCTI DIL FLATS LC BURN-IN UNCTION FLATS LCC N PACKAGE: CERDIP: E (CONDITION c) CERFLAT: F Voc1 1 5 2 GND Lec: 2 Q3 2 6 3 _ 51Q to VIT The letter "M appears before Q3 3 7 4 51QtoVTT the slash on LCC. Q2 4 8 5 51 Qto VT $3 5 9 7 GND Ww S2 6 10 8 GND voor C1 5] voce S1 7 1 9 GND os E] 5] ap VEE 8 12 10 VEE a GI i] % Reset 9 13 12 OPEN > [a 7 Clock 2 10 1443 OPEN 5s a 5 1 so 11544 GND Clock 1 Clock 1 12 16 15 OPEN s BI fT sp Qt 3117 st Oto VeT s & [0] Clock 2 Go 42 18 st to vey Yee f2] Reset Qo 15 3 19 51 Q to VT Voce 16 4 20 GND BURN - IN CONDITIONS: VT = 2.2 V MIN/ - 2.0 V MAX VEE =- 5.7 V MAX/ ~ 5.2 V MIN LOGIC DIAGRAM So Qo S Qy So Qo 83 Q3 9 9 9 9 9 9 11 15 7 13 6 5 2 12 LU S ~ | LL S . | L Ss L Sa i Clock bp & bn 6G o1 G bi 1c1 5 CG C1 8 C1 Q 10 | Clock 2 o1 62 Q Q Q _ rR Q | R R RQ 9 Reset o- | | 14 I 3 a Q3 MOTOROLA MILITARY MECL DATA 3-205INPUTS OUTOUTS R So | Ss So S3 C1 Ce Qo Qy Q2 Q3 H L L L L 9 L c L L H H H H H H H H L L L L L H No Count L L L L L H No Count L L L L L oo oo L L L L L L L L L eo oo H L L L L L L L L oe oo L H L L L L L L L oo eo H H L L L L L L L os oo L L H L L L L L L ee ee H L H L 3 L L L L L oo eo t H H L L L L L L oo oe H H H L L L L L L eo ee L L L H L L L L L oo oo H L L H L L L L L oo o L H L H L L L L L oe oe H H L H L L L L L oe ee L L H H L L L L L oe oe H L H H L L L L L oo oo L H H H L L L L L oo ee H H H H @ = Dont Care ee Sf Vin Vi Clock transition from VjL_ to ViH may be applied to C1 or C2 or both for same effect. Channel A Voon20 Channel B = aur [ok otue (cu + 20% rt Tt + 20% = = a Pulse ai. DUT. NOTES 1. The Pulse generator must be capable of rise and fall 8 times of 2.0 ns + 0.2 ns 2. Length of Coaxa and Coaxg should be of equal | lengths for equal time delay. 3 | 0.1 pF 3. at divider may be used. Veet = -3.2 Voc Tt + 20% 4. ty = ty = 2.0 ns (20% 80%) + 0.2 ns. 0.005 V 5. RL = 50 Q resistor in series with 50 Q coax , constituting 100 Q load. 6. Unused outputs should be loaded 100 to ground. Figure 1. Switching Test Circuit MOTOROLA MILITARY MECL DATA 3-20610578 VIN 80% 80% 50% 50% 20% 20% Vout i PL i tH Vout NOTES 1. Vin waveform has the following characteristics: a) Pulse width 2 20 ns. b) frequency = 1.0 MHz. C) ty and t = 2.0 ns + 0.2 ns. Clock 1 Ps2 Clock 2 Figure 2. Switching Test Circuit Waveforms MOTOROLA MILITARY MECL DATA 3-207Wa Wa Wa Hla | (d tHIA J (@d HA LI {ld SALON JUBMIND g ort 8 yu OL- 26- OL - 26- Ol - 88- ujesg Aiddng semog| 22! zi-6'2-S | 91 8 vg wi $0 0 $0 moj jueung indy] Ty 6 QIb 8 6 ya 002 002 Ole YBIH weUND indy} ZHI] LLL-S OL'L Q iz-g] owe Sle Sze ozz YBiH weuNg indy} FHI ZL OL oL'L 8 Zh OL yi Sip Si Sbz YBiH yueLIND yndu| Hl Sl-el'ye'% | OL'h 8 re A eg'o- | ot- | ego- | speo-]| ezo- | seo- eBeyoA nding yb | bHOA SL-elp'e'2 | OL't 8 we a A | Gegt-] zeL- | sege-]} zet | o94- | set- aBeyoa indino Moz} 10, pier v'e'e | ont 8 oe A |sso1-! zou- | spst-|] zer- | zor- | sei- | e6encaindingmo7| 10, peerp'e'z | OL't 8 oe A | evo- } sor- | exo- | szeo-| azo- | eeo- | aBenoqyndyng yo | HO, Lad 99a 34, | lg Wa Hi, xew uIW xew uw xew UW A0'Z~01B OOL = PEOT INdINO A. 0 = DIA dnosBqng z dnouBqns i dnosBqns Seuonound sjuewuBissy Uid 93849 aBexyoed Wd 40) a18 pasuesajai SNOU|d 2. S- 9. S2L+ 3. S+ MO149@ SNid OL GalddV 3DVLIOA LSaL sun sy Jayouleied joquiAg ze- | ag | ezor! tort | orge-| sszi-| zeit | eeo- | 2 S9-= VL SHOA O'Z - OF 40}SISOJ 75 OO}. & YBnosU payeuiwa} ale Ss}NdjnO paureyuyew si Wdj seaUy OOS UeUY Ze: zs- | geot | petit | oort-| oool-| zei- | ego- | Oo S7t= VL 4072016 Mol 412 BSIBASUBA PUP PJEOg }INDUIO PajuLd & UO PS}UNOW JO 194908 }S9} B Ul ze zs reot | uete | eee | cout | seau- | ezo- 9.9= V1 SI}{INoUID UL PaYstiqejse ueeq sey WNUIINbe fewUJEU) Joye a(qe} 1S9}] Oy} Ul UMOUS suoneoipjoads op au} jaaw 0} peublsep ueeq sey jINduIO Savas YOL TOAW YyorRg 133, | 353A eq \Sq bla LHI, Wa Hi, | ainjesadway se, SOMSIZSALOVYVHS TVD LOATA (syoA) sonjea aBeyoa JsaL + 2TEVL LINIT LNADS3INO 8ZSOlL MOTOROLA MILITARY MECL DATA 3-208Sk bb 8 git | Zt or " 7 SL yh ZHW SzL Set Gz Aouenbei4 9660, | 501, SL-L ' Ge St-eL LL 6 . . . . . . jose b-Z e | ot Lb 2 9 2 1g su 9S ae 9 gh os oI induj seuAes | jas, SI -4 ups SL-L 6 . . . . m fH 01 9019 yee @ | ot Wee} UTS tg | at ee Zt ov | svt | ov keiaq voneBbedoiy | PO SL-4 ye SL-4L 1L'6 . . . 2 04 9019) pee @ | 4 Mie] Aylg veg | Y el 62 rt o zk oe kejeq uoneBedoiy | PO SL-L . et SL-L LL 6 : . . . . . be 04 49019 poz @ | ot u2'9 y-2 1-8 su 66 6 g0L oz 26 02 fejoq uoweBedoss Pd, St-eb aye Si -b LL 6 . . . . . . 09 0p 0} 49019 poe @ | 9b'L LZ '9 poe 1g su os ve gs st ar sk kejeq voweBedosy Pdy SL -b . oe SL-eL LL 6 . . . . . . 4H be @ | gL bb 2 9 y-Z 1s su 6'y VE es Vk sv Ve owl, (e4 Ly SL -L bys SL-L 6 . . . . . . HI y-2 @ | ot bb '2'9 y-2 1S su 6 be es he Sy th ew, asiy Ly Lind | TARA] 99, | XeUy | Sy Sq Ina NIA xew uiW xeW uIW xew uIW AND 0375 001 = PEO? nding A O'z = 99A ti dnos6qns | 04 dnosBqns 6 dnosBqns euonoung squewuBbissy ulg 499Y49 ebeyxed 7G 10) ae paduesaje! S}NOUld 2. $$ - 90 SZh + 9.8% + MO139 SNid OL G3MddV ADVLIOA 1S3L syun syyuly Jeyoueled joquiAs ze- | zs- | azotr| tort | orsi-| sczs-| zeu- | ego- | O.S9-=Va SOA 0'0 0} ze- | os | geot | pet+ | oops-| ooor- | zer- | ego- | Gers VL JoysISal ZOO} & YBnouy; payeuiue) ae SsindinoO peuyeyuyew Ss! wWdy seaU!| OOS UBY) ze- 25 weot | unut | zeae] sont] set | ecco 9. z= VL Jeyees6 Mo} se @SseASUeZ) Ue Pse0g }INdJ10 peyuLd B UO pequnow JO JOOS }$9}] B UI SI}IND0 SUL ~PEYSI|qe}se Ueeq sey NLIINbe jeEWeL) JeYye e;qe] }Se} 84) Ul UMOUS Ta3,q | 35, | 2a | Sa | bla | Hla | Wa HIA_| eunyeseduiey suoneoyioeds op ey) jeew 0} peuBisep ueeq sey jINDIO SeUS YOL TOAW yea yeL (sua) senien o6EHOA 1801 SOLLSINSLOVUVHO WWOlHLOa TA. s 31EV1 LINIT LNSDS3SINO 8ZSOL MOTOROLA MILITARY MECL DATA 3-209E. te ann . MOTOROLA SC LOGIC nye o ff eaez2s2 ooazaso 7 f T- 76-20 PACKAGE OUTLINE DIMENSIONS A letter suffix to the MECL logic function part number is used to specify the package style (see drawings below). See appropriate selector guide for specific packaging available for a given device type. _____ & _______ L SUFFIX CERAMIC PACKAGE CASE 620-09 rc iV Hts L colle de Me & SUFFIX CERAMIC PACKAGE CASE 623-05 13 | _| (LW SUFFIX FOR MC10H181 ONLY) NOTES: 1. LEAD POSITIONAL TOLERANCE: [ols o.13 0008) 8] T]A@ [BO] Z OIMENSION 1 TO CENTER OF LEADS WHEN FORMED PARALLEL 4. PACKAGE CONTOUR OPTIONAL (ROUND OA SQUARE CORNERS). 4 DIMENSIONS A AND B ARE DATUMS. 5, DIMENSIONING AND TOLERANCING PER ANS! YL4SM, 1962. ye aii iT RADIUS OF TRUE a Di LTO CENTER OF * POSTION AT SEATING PARE AT RDG LEADS WHEN FORWED MATERIAL CONDITION. *ARALLE 2, PACKAGE INDEX: NOTCH IN LEAD NOTCH IN 2. LEADS WITHEN 0.13 mm CERAMIC OA INK DOT. (0.005) RADIUS OF TRUE 4. OIM L TO CENTER OF LEADS WHEN FORMED Fa ATA EATING PLANE PARALLEL pani CONDITION. (HEN FORMED PARALLEL. P SUFFIX PFA] L SUFFIX Felhe O adhe BE my BO als OE cle OD PSO eae * | 7 CERAMIC PACKAGE CASE 632-08 | 1 riot re ' c+ ht to - A Bo | # font sore K i a py ae 1 i F o -el6 n~ | | Yd elhe Dun Jun | \ T 3 0.25 (0.010) O 025 (0.010) N She tle NOTES: 1. EHMENS:ONING AND TOLERANCING PER ANSI 2 CONTROLLING DIMENSION: INCH. 3, DIMENSION C 10 CENTER OF LEAD WHEN 4, OM F MAY NARROW TO 0.76 (0.090] WHERE THE YIGSM, 1982. FORMED PARALLEL, LEAD ENTERS THE CERAMHC BODY, 1-26= -_ = MOTOROLA :SC - LOGIC PACKAGE OUTLINE DIMENSIONS (continued) nue 0 Pfuaez2s2 ooszssi 9 f 7-90-20 P SUFFIX PLASTIC PACKAGE CASE 646-06 AAAAAASL 4 t ? 1 TPT TY A ROTE 4 i | Ty ms oy +f J ume mod le NOTES: 1. LEADS WITHIN 0.13 mm 10.005] RAD-US OF TAUE POSITION AT SEATLNG PLANE AT MAXUM MATERTAL CONDITION. 2. CHMENSION "L TO CENTER OF LEADS WHEN FORMED PARALLEL. 3. OLMENSION B DOES NOT INCLUOE MOLD P SUFFIX PLASTIC PACKAGE CASE 648-08 -{} AAAAAAAY 16 1 t WU ay Lee al ii ape Vt ep 744025 10010) Tas) NOTES. 1. DIMENSION-NG AND TOLERANCING PER ANSI Y14.5M, 1982. 2 CONTROLLING OIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4 OIMERSION 8 DOES NOT INCLUDE MOLD POSITION AT SEATING PLANE AT MAXCMUM MATERIAL CONDITION 2. GIMENSION LTO CENTER OF LEADS WHEN FORMED PARALLEL FLASH. FLASH. 4 ROUNDED CORNERS OPTIONAL. . ROUNDED CORNERS OPTIONAL. P SUFFIX (PW SUFFIX F SUFFIX PLASTIC PACKAGE FOR MC10Hi81 CERAMIC PACKAGE CASE 649-03 ONLY) CASE 650-05 L P Pnnaae A | ey w . | a a t | oO 8 1 ela Dun N mire io [Forsioce [ta [eo | N tt cf 1 | rt kK ~ lel tno rook, Mahe i {} caren Yota yl] Elm NOTES: NOTES: 1. DIMENS:ONING AND TOLERANCING PER +. LEADS WITHIN 0.13 em [0.0652 RAD-US OF TALE ANS! YIA6M, 1992. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND 6 ALLOW FOR UD MISALIGNMENT, ANO GLASS BENISCUS. 4 DIMENSION H SHALL BE MEASURED AT THE POINT OF EXIT OF THE LEAD FROM THE BODY. 5. LEAD NUMBER 1 IDENTIFIED BY TAS ON LEAD CA OOT ON COVER. 6. DIMENSION J INCLUDES SOLDEA LEAD FINISH. 7. LEAD NUMBERS SHOWN FOA REFERENCE ONLY. 1-27a Ep. MOTORCLA SC LOGIC PACKAGE OUTLINE DIMENSIONS (continued) nue 0 Pfese7252 ooazas2 o ff T-90-20 L SUFFIX CERAMIC PACKAGE CASE 693-02 P SUFFIX PLASTIC PACKAGE CASE 707-02 AAAAAAAAY 1 10 p a s pee A | TT is | [ Nae K FH Pag PT \ sume Paty tbe LX +}o2s0008 frfe | [Hozsco Jrfa@} NOTES: 1. CHAMFERAED CONTOUR OPTIONAL. 2. OFM L" TO CENTER OF LEADS WHEN FORMED PARALLEL. 3. DIMENSIONS AKD TOLERANCES PEA ANSI YI4.5M, 1982. 4. CONTROLUNG DIMENSION: INCH. NOTES: HOTES: 1, POSITIONAL TOLERANCE OF LEADS (0), SHALL 8& T.LEADS WITHEN 0.13 mm (0.005) RAD OF TRUE WITHN 0.25mm(0.010) AT MAXIMUM MATERIAL POSITION AT SEATING PLANE AT MAXIMUM CONDITION, IN RELATION TO SEATING PLANE MATERIAL CONDITION. AND EACH OTHER. 2. OIMENSION LY TO CENTER OF LEADS WHEN 2. DIMENS:ON L TO CENTER OF LEADS WHEN. FORMED PARALLEL FORMED PARALLEL 3. D/MENSKON B DOES NOT INCLUDE MOLD FLASH. P SUFFIX L SUFFIX PLASTIC PACKAGE CERAMIC PACKAGE CASE 724-03 CASE 726-04 T OFTIOMAL LEAD CONAG. [8.1810 L+ r NOTES: 1. LEADS, TRUE POSITIONED WITHEN 0.25 mm {0.010) DIA. AT SEATING PLANE, AT MAXiMUM MATERIAL CONGHTION.. 2. DM L7 TO CENTER OF LEADS WHEN FORMED PARALLEL. 3. DiM AY & "B" INCLUDES MENISCUS. 4. F* DEMENSION IS FOA FULL LEADS. HALF LEADS ARE OPTIONAL AT LEAD POSITIONS 1, 9. 10, ANO 18, 1-28a ne & . a) MOTOROLA SC LOGIC PACKAGE OUTLINE DIMENSIONS (continued) 14e 0 Ppeaezas2 coseasa 2 i T-90-20 L SUFFIX CERAMIC PACKAGE CASE 732-03 NOTES: 1. LEADS WITHIN 0.25 om (0.010) OLA, TRUE POSITION AT SEATING PLANE, AT MAXIMUM P SUFFIX PLASTIC PACKAGE ' CASE 738-03 LAE DBA t 20 aw oO 0 8 Tt pe ro co al OT Ry 4 t a cl VU VAIN ef JURE eel. N We wal ghe F ode J PL Dan [+fozsoo1 [r]e | [Fozsoma [t]A@ | NOTES: 1. DIMENSIONING AND TOLERANCING PER ANS! YI4.5M, 1982. 2. CONTROLLING DIMENSION: INCH, 3. DIMENSION L TO CENTER OF LEAD WHEN 2 | phan oO a aol _- qe TIS ADATUM SURFACE. YI4SM, 1982, MOLD PROTRUS:ON, SIDE. ose Uh pelle tk M pl LEs [elozsioc Oris OLA O} ROTES: 1. DIMENSIONS AT AND "B" ARE DATUMS AND 2. OMENSONING AND TOLERANCING PER ANSI 2 CONTROLUNG O:M: AULUMETER. 4. DIMENSION "A" AND B DO NOTINCLUDE 5, MAXIMUM MOLO PROTRUSION 0.15 10.006] PER MATER'AL CONDITION. 2 QML TOCENTER OF LEADS WHEN FORMED FORMED PARALLEL. 2. DIM A AND B INCLUDES MENISCUS. Ss oe D SUFFIX L SUFFIX PLASTIC SOIC PACKAGE CERAMIC PACKAGE CASE 751-03 CASE 758-01 -A:} fH At 4 s Sau! Ere (= Fe a : coe wle_-D tr Gi DESIDE OF LEADS TES: 1, BAMENSON AIS OATUM. 7. POSITIONAL TOLERANCE FOR LEADS: 24 PLACES 2. Ce] is SEATING PLANE. 4, DIMENS?ON L TO CENTER OF LEADS WHEN FORMED PARALLEL. 5. DIMENSION!NG AND-TOLERANCING PER ANST 145, 1973. 1-29Bo ee a MOTOROLA SC LOGIC nue o ff ese72s2 ooszes 4 i T-90-20 7 r= YeRk 8 a a | ocean TROFSTSR q 0 t ef m Zz q n Ww qd H [ an [ho [ ek | Ly | a ; kk Fasano Toro ous) a VIEW D-0 _4 fo Afelcenon [PLOno[ wOro] on OHO! WOP@ 7 aft ssio0n @ [11 LO-vO[NO-FG) ae * * [e}orsiaon [tT] x@rO]L@-uG@ ST _ it mts f aL Le Eefsinen L_, Fame PproweTe-ra DETAR. TF lounam [TIN OlLO-4Gl NOTES: 1. OATUMS -L-, -M-, -N-. AND -P- DETERMINED WHERE TOP OF LEAD SHOULOEA EXIT PLASTIC 8ODY AT MOLD PARTING LINE. 2. DIM Gi, TRUE POSTION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIM R AND U DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE MOLD PROTRUSION 1S 0.25 (0.010) PER SIDE. 4, DIMENSIONING AND TOLERANCING PER ANS} Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. sfomnenS fiaua sara FN SUFFIX PLASTIC PACKAGE CASE 776-02 DETAILS Gt [arsno@ [tT] LOuGpR@?rol L FN SUFFIX PLASTIC PACKAGE CASE 775-02 NOTES: 1. DUE TO SPACE LIMITATION, CASE 776-02 SHALL BE REPRESENTED BY A GENERAL (SMALLER) CASE OUTLINE - SAK A '# olasen @ ot sired peut DRAWING RATHER THAN SHOWING | a ALL 28 LEADS. annoan ko u Faso S Pvber i bus: 2. DATUMS -L.. -@-.-N-. AND -P- DETERM.NED Cm Le non a amaeaanen om 7 . aODY Al RNG UN q 2h. Pit rere 3. OM GI, TRUE POSITION TO BE MEASURED AT ro actu Pew a DATUM -T-, SEATING PLANE, q hy 4. DIM R AND U 00 NOT INCLUDE MOLD os i PROTRUSION. ALLOWASLE MOLD PROTRUSION my 7 i (NOTE na | fc kes t Ly tt Low YIASM, 1982. aah Wass Vase sua} 6. CONTROLUNG O-MENS'ON: INCH, A Feo SD eri, Ru Ty Dees VIEW D-D z oe Silougnn D LSP sa her. r$0taoon S tBu SNe BR [4iow307 cried sy Re 5. _ i H youagre Nhe SDs } | o + c Ur) te mel TT Shane: widen ale Kb Seeman ap Eine ET aasSrG] \ petan DETARS ipianoxn SPP aug Gi-+ 1-30nue o Pfosu72s2 ooazass & Ef 7-90-20 MECL Logic Surface Mount WHY SURFACE MOUNT? Surface Mount Technology is now being utilized to offer answers to many problems that have been created in the use of insertion technology. Limitations have been reached with insertion packages and PC board technology. Surface Mount Technology offers the opportunity to continue to advance the State- of-the-Art designs that cannot be accomplished with Insertion Technology. Surface Mount Packages allow more optimum device performance with the smaller Surface Mount configu- ration. Internal fead lengths, parasitic capacitance and inductance that placed limitations on chip performance have been reduced. The lower profile of Surface Mount Packages allows more boards to be utilized in a given amount of space. They are stacked closer together and utilize less total volume than insertion populated PC boards. Printed circuit costs are lowered with the reduction of the number of board layers required. The elimination or reduction of the number of plated through holes in the board, contribute significantly to lower PC board prices. Surface Mount assembly does not require the prepa- ration of components that are common on insertion tech- nology lines. Surface Mount components are sent directly to the assembly line, eliminating an intermediate step. Automatic placement equipment is available that can place Surface Mount components at the rate of a few thousand per hour to hundreds of thousands of com- ponents per hour. Surface Mount Technology is cost effective, allowing the manufacturer the opportunity to produce smaller units and offer increased functions with the same size product. MECL AVAILABILITY IN SURFACE MOUNT Motorola is now offering MECL 10K and MECL 10KH in the PLCC (Plastic Leaded Chip Carrier) packages. MECL in PLCC may be ordered in conventional plastic rails or on Tape and Reel. Refer to the Tape and Reel section for ordering details. TAPE AND REEL Motorola has now added the convenience of Tape and Reel packaging for our growing family of standard Inte- grated Circuit products. The packaging fully conforms to the latest ELA RS-481A specification. The antistatic embossed tape provides a secure cavity sealed with a peel-back cover tape. GENERAL INFORMATION @ Reel Size 13 inch (330 mm) Suffix: R2 Tape Width 16mm @ Units/Reel 1000 MECHANICAL POLARIZATION Typical View from tape side Linear direction of travel ORDERING INFORMATION Minimum Lot Size/Device Type = 3000 Pieces. @ No Partial Reel Counts Available. @ To order devices which are to be delivered in Tape and Reel, add the appropriate suffix to the device number being ordered. EXAMPLE: ORDERING CODE SHIPMENT METHOD MC10100FN Magazines (Rails) MC10100FNR2 13 inch Tape and Reel MC10H100FN Magazines (Rails) MC10H100FNR2 13 inch Tape and Reel MC12015D Magazines (Rails) MC12015DR2 13 inch Tape and Reel DUAL-IN-LINE PACKAGE TO PLCC PIN CONVERSION DATA The following tables give the equivalent /O pinouts of Dual-In-Line (DIL) packages and Plastic Leaded Chip Car- tier (PLCC) packages. Conversion Tables tepinoi |1]2/a|4]s]e[7|8|9[10/11]12)13/14| 15/16 20 PIN PLCC [2|3 7[8| 9 ]10]12}13| 14[15[17]18|19]20 gorin vi. {1|2|3{4{s|6| 7/8] 9{r0[19[12]13]14|15|16]17|18|19]29| 20 PIN PLoc |1/2|3]4| 5] 6] 7] 8|9[10]11]12| 13|14|15] 16] 17] 18] 19[20| 2apin oi |1{2{3]4]s]e]7[8| 9[s0/14]12113{14[15] 16] 17] 18] 19|20|21|22|2324| 3a PIN PLCC |2|3]4] | 6| 2| 9 |ro|s1|12] 13] 14! 16|17|18[ 19] 20]21]23]24|25|26|27)29| 1-31