Bristol, PA 19007-6810 USA
TEL (215) 781-9956 • FAX (215) 781-9845
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
•INFO@ARIESELEC.COM
WWW.ARIESELEC.COM
FEATURES
• Allows placing an PLCC package on a board laid out for a shrink DIP.
GENERAL SPECIFICATIONS
• BOARD MATERIAL: 0.062 [1.58] thick FR-4 with 1-oz. Cu traces, both sides
• PADS: HASL
• PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M
• PIN PLATING: Sn/Pb 93/7 per ASTM B579-73 over 100µ [2.54µ] Ni per SAE
AMS-QQ-N-290
• OPERATING TEMPERATURE: 221°F [105°C]
• FEMALE SOCKET: AMP or equivalent standard single beam PLCC socket
MOUNTING CONSIDERATIONS
•Solder process like any other surface mount device
18052
Rev. AA
5-Pin PLCC Motorola
MC68HC11E9-to-56-Pin SDIP Adapter
PLCC SDIP PLCC SDIP
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CUSTOMIZATION: In addition to the standard products shown
on this page, Aries specializes in custom design and production.
Special materials, platings, sizes, and configurations can be
furnished, depending on the quantity. NOTE: Aries reserves the
right to change product general specifications without notice.
ALL DIMENSIONS: INCHES [MILLIMETERS]
ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED
CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS
ORDERING INFORMATION
1109252-P
Optional Panelized Form
