FN7786
Rev.6.00
Feb 8, 2019
ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E
±60V Fault Protected, 5V, RS-485/RS-422 Transceivers with ±25V CMR and ESD Protection
DATASHEET
FN7786 Rev.6.00 Page 1 of 22
Feb 8, 2019
The ISL32490E, ISL32492E, ISL32493E, ISL32495E,
ISL32496E, and ISL32498E are fault protected, 5V powered,
differential transceivers that exceed the RS-485 and RS-422
standards for balanced communication. The RS-485 transceiver
pins (driver outputs and receiver inputs) are fault protected up to
±60V and are protected against ±16.5kV ESD strikes without
latch-up. Additionally, the extended Common-Mode Range
(CMR) allows these transceivers to operate in environments with
common-mode voltages up to ±25V (>2x the RS-485
requirement), making this fault protected RS-485 family one of
the most robust on the market.
The transmitters (Tx) deliver an exceptional 2.5V (typical)
differential output voltage into the RS-485 specified 54Ω load.
This yields better noise immunity than standard RS-485 ICs, or
allows up to six 120Ω terminations in star network topologies.
The receiver (Rx) inputs feature a full fail-safe design that
ensures a logic high Rx output if the Rx inputs are floating,
shorted, or on a terminated but undriven (idle) bus. The Rx
outputs have high drive levels; typically, 15mA at VOL = 1V (for
opto-coupled, isolated applications).
Half duplex (Rx inputs and Tx outputs multiplexed together)
and full duplex pinouts are available. See Table 1 on page 3 for
key features and configurations by device number.
For fault protected or wide common-mode range RS-485
transceivers with cable invert (polarity reversal) pins, see the
ISL32483E datasheet.
Related Literature
• For a full list of related documents, visit our website:
-ISL32490E, ISL32492E, ISL32493E, ISL32495E,
ISL32496E, and ISL32498E device pages
Features
• Fault protected RS-485 bus pins . . . . . . . . . . . . . . up to ±60V
• Extended CMR . . . . . . . . . . ±25V (more than twice the range
required for RS-485)
• ±16.5kV HBM ESD protection on RS-485 bus pins
• 1/4 unit load for up to 128 devices on the bus
• High transient overvoltage tolerance. . . . . . . . . . . . . . . . ±80V
• Full fail-safe (open, short, terminated) RS-485 receivers
•High Rx I
OL for opto-couplers in isolated designs
• Hot plug circuitry; Tx and Rx outputs remain three-state
during power-up/power-down
• Choice of RS-485 data rates. . . . . . . . . . 250kbps to 15Mbps
• Low quiescent supply current. . . . . . . . . . . . . . . . . . . . 2.3mA
• Ultra low shutdown supply current. . . . . . . . . . . . . . . . . . 10µA
Applications
• Utility meters/automated meter reading systems
• High node count RS-485 systems
• PROFIBUS and RS-485 based field bus networks, and factory
automation
•Security camera networks
• Building lighting and environmental control systems
• Industrial/process control networks
FIGURE 1. EXCEPTIONAL Rx OPERATES AT >15Mbps EVEN WITH A
±25V COMMON-MODE VOLTAGE
FIGURE 2. ISL3249xE DELIVERS SUPERIOR COMMON-MODE
RANGE vs STANDARD RS-485 DEVICES
TIME (20ns/DIV)
VOLTAGE (V)
-5
0
5
10
15
20
25
30
BVID = ±1V
A
RO
ISL3249xE
COMMON-MODE RANGE
CLOSEST
COMPETITOR
STANDARD RS-485
TRANSCEIVER
-25
-20
-12
-7
0
12
25
ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E
FN7786 Rev.6.00 Page 2 of 22
Feb 8, 2019
Typical Operating Circuits
0.1µF
+
D
R
7
6
8
1
2
3
4
5
VCC
GND
RO
RE
DE
DI
A/Y
B/Z
+5V
0.1µF +
D
R
6
7
8
1
2
3
4
5
VCC
GND
RO
RE
DE
DI
A/Y
B/Z
+5V
RTRT
FIGURE 3. ISL32492E, ISL32495E, ISL32498E HALF DUPLEX EXAMPLE
0.1µF
+
D
R
12
11
10
9
13, 14
2
3
4
5
6, 7
VCC
GND
RO
RE
DE
DI
A
B
Y
Z
+5V
0.1µF +
D
R
12
11
10
9
13, 14
2
3
4
5
6, 7
VCC
GND
RO
RE
DE
DI
A
B
Y
Z
+5V
RT
RT
FIGURE 4. ISL32490E, ISL32493E, ISL32496E FULL DUPLEX EXAMPLE (SOIC PIN NUMBERS SHOWN)
Ordering Information
PART NUMBER
(Notes 2, 3)
PART
MARKING
TEMP. RANGE
(°C)
TAPE AND REEL
(Units) (Note 1)
PACKAGE
(RoHS COMPLIANT)
PKG.
DWG. #
ISL32490EIBZ ISL32490 EIBZ -40 to +85 - 14 Ld SOIC M14.15
ISL32490EIBZ-T ISL32490 EIBZ -40 to +85 2.5k 14 Ld SOIC M14.15
ISL32490EIBZ-T7A ISL32490 EIBZ -40 to +85 250 14 Ld SOIC M14.15
ISL32490EIUZ 2490E -40 to +85 - 10 Ld MSOP M10.118
ISL32490EIUZ-T 2490E -40 to +85 2.5k 10 Ld MSOP M10.118
ISL32490EIUZ-T7A 2490E -40 to +85 250 10 Ld MSOP M10.118
ISL32492EIBZ 32492 EIBZ -40 to +85 - 8 Ld SOIC M8.15
ISL32492EIBZ-T 32492 EIBZ -40 to +85 2.5k 8 Ld SOIC M8.15
ISL32492EIBZ-T7A 32492 EIBZ -40 to +85 250 8 Ld SOIC M8.15
ISL32492EIUZ 2492E -40 to +85 - 8 Ld MSOP M8.118
ISL32492EIUZ-T 2492E -40 to +85 2.5k 8 Ld MSOP M8.118
ISL32492EIUZ-T7A 2492E -40 to +85 250 8 Ld MSOP M8.118
ISL32493EIBZ ISL32493 EIBZ -40 to +85 - 14 Ld SOIC M14.15
ISL32493EIBZ-T ISL32493 EIBZ -40 to +85 2.5k 14 Ld SOIC M14.15
ISL32493EIBZ-T7A ISL32493 EIBZ -40 to +85 250 14 Ld SOIC M14.15
ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E
FN7786 Rev.6.00 Page 3 of 22
Feb 8, 2019
ISL32493EIUZ 2493E -40 to +85 - 10 Ld MSOP M10.118
ISL32493EIUZ-T 2493E -40 to +85 2.5k 10 Ld MSOP M10.118
ISL32493EIUZ-T7A 2493E -40 to +85 250 10 Ld MSOP M10.118
ISL32495EIBZ 32495 EIBZ -40 to +85 - 8 Ld SOIC M8.15
ISL32495EIBZ-T 32495 EIBZ -40 to +85 2.5k 8 Ld SOIC M8.15
ISL32495EIBZ-T7A 32495 EIBZ -40 to +85 250 8 Ld SOIC M8.15
ISL32495EIUZ 2495E -40 to +85 - 8 Ld MSOP M8.118
ISL32495EIUZ-T 2495E -40 to +85 2.5k 8 Ld MSOP M8.118
ISL32495EIUZ-T7A 2495E -40 to +85 250 8 Ld MSOP M8.118
ISL32496EIBZ ISL32496 EIBZ -40 to +85 - 14 Ld SOIC M14.15
ISL32496EIBZ-T ISL32496 EIBZ -40 to +85 2.5k 14 Ld SOIC M14.15
ISL32496EIBZ-T7A ISL32496 EIBZ -40 to +85 250 14 Ld SOIC M14.15
ISL32496EIUZ 2496E -40 to +85 - 10 Ld MSOP M10.118
ISL32496EIUZ-T 2496E -40 to +85 2.5k 10 Ld MSOP M10.118
ISL32496EIUZ-T7A 2496E -40 to +85 250 10 Ld MSOP M10.118
ISL32498EIBZ 32498 EIBZ -40 to +85 - 8 Ld SOIC M8.15
ISL32498EIBZ-T 32498 EIBZ -40 to +85 2.5k 8 Ld SOIC M8.15
ISL32498EIBZ-T7A 32498 EIBZ -40 to +85 250 8 Ld SOIC M8.15
ISL32498EIUZ 2498E -40 to +85 - 8 Ld MSOP M8.118
ISL32498EIUZ-T 2498E -40 to +85 2.5k 8 Ld MSOP M8.118
ISL32498EIUZ-T7A 2498E -40 to +85 250 8 Ld MSOP M8.118
NOTES:
1. See TB347 for details about reel specifications.
2. These Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate
plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Pb-free products are
MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
3. For Moisture Sensitivity Level (MSL), see the ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, and ISL32498E device information pages.
For more information about MSL, see TB363.
Ordering Information (Continued)
PART NUMBER
(Notes 2, 3)
PART
MARKING
TEMP. RANGE
(°C)
TAPE AND REEL
(Units) (Note 1)
PACKAGE
(RoHS COMPLIANT)
PKG.
DWG. #
TABLE 1. SUMMARY OF FEATURES
PART NUMBER
HALF/FULL
DUPLEX
DATA RATE
(Mbps)
SLEW-RATE
LIMITED? EN PINS?
HOT
PLUG?
QUIESCENT ICC
(mA)
LOW POWER
SHUTDOWN? PIN COUNT
ISL32490E Full 0.25 Yes Yes Yes 2.3 Yes 10, 14
ISL32492E Half 0.25 Yes Yes Yes 2.3 Yes 8
ISL32493E Full 1 Yes Yes Yes 2.3 Yes 10, 14
ISL32495E Half 1 Yes Yes Yes 2.3 Yes 8
ISL32496E Full 15 No Yes Yes 2.3 Yes 10, 14
ISL32498E Half 15 No Yes Yes 2.3 Yes 8
ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E
FN7786 Rev.6.00 Page 4 of 22
Feb 8, 2019
Pin Configurations
ISL32492E, ISL32495E, ISL32498E
(8 LD MSOP, 8 LD SOIC)
TOP VIEW
ISL32490E, ISL32493E, ISL32496E
(10 LD MSOP)
TOP VIEW
ISL32490E, ISL32493E, ISL32496E
(14 LD SOIC)
TOP VIEW
NOTE: Evaluate creepage and clearance requirements at your maximum fault voltage before using small pitch packages such as MSOP.
RO
RE
DE
DI
1
2
3
4
8
7
6
5
VCC
B/Z
A/Y
GND
D
R
RO
RE
DE
DI
GND
VCC
A
B
Z
Y
1
2
3
4
5
10
9
8
7
6
D
R
NC
RO
RE
DE
DI
GND
GND
VCC
VCC
A
B
Z
Y
NC
1
2
3
4
5
6
7
14
13
12
11
10
9
8
D
R
Pin Descriptions
PIN
NAME
8 LD
PIN #
10 LD
PIN #
14 LD
PIN # FUNCTION
RO 1 1 2 Receiver output. If A-B ≥ -10mV, RO is high; if A-B ≤ -200mV, RO is low; if A and B are unconnected (floating), shorted
together, or connected to an undriven, terminated bus, RO is high.
RE 2 2 3 Receiver output enable. RO is enabled when RE is low; RO is high impedance when RE is high. Internally pulled low.
DE 3 3 4 Driver output enable. The driver outputs, Y and Z, are enabled by bringing DE high. They are high impedance when DE is
low. Internally pulled high.
DI 4 4 5 Driver input. A low on DI forces output Y low and output Z high. A high on DI forces output Y high and output Z low.
GND 5 5 6, 7 Ground connection.
A/Y 6 - - ±60V fault and ±16.5kV HBM ESD protected RS-485/RS-422 level, non-inverting receiver input and non-inverting driver
output. Pin is an input if DE = 0; pin is an output if DE = 1.
B/Z 7 - - ±60V fault and ±16.5kV HBM ESD protected RS-485/RS-422 level, inverting receiver input and inverting driver output.
Pin is an input if DE = 0; pin is an output if DE = 1.
A - 9 12 ±60V fault and ±15kV HBM ESD protected RS-485/RS-422 level, non-inverting receiver input.
B - 8 11 ±60V fault and ±15kV HBM ESD protected RS-485/RS-422 level, inverting receiver input.
Y - 6 9 ±60V fault and ±15kV HBM ESD protected RS-485/RS-422 level, non-inverting driver output.
Z - 7 10 ±60V fault and ±15kV HBM ESD protected RS-485/RS-422 level, inverting driver output.
VCC 8 10 13, 14 System power supply input (4.5V to 5.5V).
NC - - 1, 8 No internal connection.
Truth Tables
TRANSMITTING
INPUTS OUTPUTS
RE DE DI Z Y
X11 0 1
X10 1 0
00X High-Z High-Z
1 0 X High-Z (see Note) High-Z (see Note)
NOTE: Low Power Shutdown Mode (see Note 11 on page 9).
RECEIVING
INPUTS OUTPUT
RE DE
Half Duplex
DE
Full Duplex
A-B RO
00 X V
AB ≥ -0.01V 1
0 0 X -0.01V > VAB > -0.2V Undetermined
00 X V
AB ≤ -0.2V 0
00 X Inputs
Open/Shorted
1
1 0 0 X High-Z (see
Note)
11 1 X High-Z
NOTE: Low Power Shutdown Mode (see Note 11 on page 9).
ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E
FN7786 Rev.6.00 Page 5 of 22
Feb 8, 2019
Absolute Maximum Ratings Thermal Information
VCC to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V
Input Voltages
DI, DE, RE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (VCC + 0.3V)
Input/Output Voltages
A/Y, B/Z, A, B, Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±60V
A/Y, B/Z, A, B, Y, Z (Transient Pulse Through 100Ω, (Note 15). . . . ±80V
RO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (VCC +0.3V)
Short-Circuit Duration
Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Indefinite
ESD Rating . . . . . . . . . . . . . . . . . . . . see “ESD PERFORMANCE” on page 6
Latch-Up (Tested per JESD78, Level 2, Class A) . . . . . . . . . . . . . . . +125°C
Thermal Resistance (Typical) θJA (°C/W) θJC (°C/W)
8 Ld MSOP Package (Notes 4, 5) . . . . . . . . 140 40
8 Ld SOIC Package (Notes 4, 5) . . . . . . . . . 108 47
10 Ld MSOP Package (Notes 4, 5) . . . . . . . 135 50
14 Ld SOIC Package (Notes 4, 5) . . . . . . . . 88 39
Maximum Junction Temperature (Plastic Package) . . . . . . . . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . . . . . . . -65°C to +150°C
Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See TB493
Recommended Operating Conditions
Supply Voltage (VCC). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5V
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
Bus Pin Common-Mode Voltage Range. . . . . . . . . . . . . . . . . . -25V to +25V
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions can adversely impact product
reliability and result in failures not covered by warranty.
NOTES:
4. θJA is measured with the component mounted on a high-effective thermal conductivity test board in free air. See TB379 for details.
5. For θJC, the “case temp” location is taken at the package top center.
Electrical Specifications VCC = 4.5V to 5.5V; unless otherwise specified. Typical values are at VCC = 5V, TA= +25°C (Note 6). Boldface
limits apply across the operating temperature range, -40°C to +85°C.
PARAMETER SYMBOL TEST CONDITIONS
TEMP
(°C)
MIN
(Note 14)TYP
MAX
(Note 14)UNIT
DC CHARACTERISTICS
Driver Differential VOUT (No load) VOD1 Full - - VCC V
Driver Differential VOUT (Loaded,
Figure 5A)
VOD2 RL = 100Ω (RS-422) Full 2.4 3.2 - V
RL = 54Ω (RS-485) Full 1.5 2.5 VCC V
RL = 54Ω (PROFIBUS, VCC ≥ 5V) Full 2.0 2.5
RL = 21Ω (Six 120Ω terminations for star
configurations, VCC ≥ 4.75V)
Full 0.8 1.3 - V
Change in Magnitude of Driver
Differential VOUT for Complementary
Output States
ΔVOD RL = 54Ω or 100Ω (Figure 5A)Full--0.2 V
Driver Differential VOUT with
Common-Mode Load (Figure 5B)
VOD3 RL = 60Ω, -7V ≤ VCM ≤ 12V Full 1.5 2.1 VCC V
RL = 60Ω, -25V ≤ VCM ≤ 25V (VCC ≥4.75V) Full 1.7 2.3
RL = 21Ω, -15V ≤ VCM ≤ 15V (VCC ≥4.75V) Full 0.8 1.1 - V
Driver Common-Mode VOUT
(Figure 5)
VOC RL = 54Ω or 100ΩFull -1 -3V
RL = 60Ω or 100Ω, -20V ≤ VCM ≤ 20V Full -2.5 -5V
Change in Magnitude of Driver
Common-Mode VOUT for
Complementary Output States
ΔVOC RL = 54Ω or 100Ω (Figure 5A)Full--0.2 V
Driver Short-Circuit Current IOSD DE = VCC, -25V ≤ VO ≤ 25V (Note 8)Full-250 -250 mA
IOSD1 At first foldback, 22V ≤ VO ≤ -22V Full -83 -83 mA
IOSD2 At second foldback,
35V ≤ VO ≤ -35V
Full -13 -13 mA
Logic Input High Voltage VIH DE, DI, RE Full 2.5 --V
Logic Input Low Voltage VIL DE, DI, RE Full - - 0.8 V
Logic Input Current IIN1 DI Full -1 -1µA
DE, RE Full -15 615 µA
ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E
FN7786 Rev.6.00 Page 6 of 22
Feb 8, 2019
Input/Output Current (A/Y, B/Z) IIN2 DE = 0V, VCC =0V
or 5.5V
VIN = 12V Full - 110 250 µA
VIN = -7V Full -200 -75 - µA
VIN = ±25V Full -800 ±240 800 µA
VIN = ±60V (Note 16)Full-6 ±0.5 6mA
Input Current (A, B)
(Full Duplex Versions Only)
IIN3 VCC = 0V or 5.5V VIN = 12V Full - 90 125 µA
VIN = -7V Full -100 -70 - µA
VIN = ±25V Full -500 ±200 500 µA
VIN = ±60V (Note 16)Full-3 ±0.4 3mA
Output Leakage Current (Y, Z)
(Full Duplex Versions Only)
IOZD RE = 0V, DE = 0V,
VCC = 0V or 5.5V
VIN = 12V Full - 20 200 µA
VIN = -7V Full -100 -5 - µA
VIN = ±25V Full -500 ±40 500 µA
VIN = ±60V (Note 16)Full-3 ±0.1 3mA
Receiver Differential Threshold
Voltage
VTH -25V ≤ VCM ≤ 25V Full -200 -100 -10 mV
Receiver Input Hysteresis ΔVTH -25V ≤ VCM ≤ 25V 25 - 25 - mV
Receiver Output High Voltage VOH IO = -2mA, VID = -10mV Full VCC - 0.5 4.75 - V
IO = -8mA, VID = -10mV Full 2.8 4.2 - V
Receiver Output Low Voltage VOL IO = 6mA, VID = -200mV Full - 0.27 0.4 V
Receiver Output Low Current IOL VO = 1V, VID = -200mV Full 15 22 - mA
Three-state (High Impedance)
Receiver Output Current
IOZR 0V ≤ VO ≤ VCC Full -1 0.01 1µA
Receiver Short-Circuit Current IOSR 0V ≤ VO ≤ VCC Full ±12 -±110 mA
SUPPLY CURRENT
No Load Supply Current (Note 7)I
CC DE = VCC, RE =0V or V
CC, DI = 0V or VCC Full - 2.3 4.5 mA
Shutdown Supply Current ISHDN DE = 0V, RE = VCC, DI = 0V or VCC Full - 10 50 µA
ESD PERFORMANCE
RS-485 Pins (A, Y, B, Z, A/Y, B/Z) Human Body
Model, from bus
pins to GND
Half duplex 25 - ±16.5 - kV
Full duplex 25 - ±15 - kV
All Pins Human Body Model, per JEDEC 25 - ±8 - kV
Machine Model 25 - ±700 - V
DRIVER SWITCHING CHARACTERISTICS (250kbps Versions - ISL32490E, ISL32492E)
Driver Differential Output Delay tPLH, tPHL RD = 54Ω,
CD= 50pF
(Figure 6)
No CM load Full - 320 450 ns
-25V ≤ VCM ≤ 25V Full - - 1000 ns
Driver Differential Output Skew tSKEW RD = 54Ω,
CD= 50pF
(Figure 6)
No CM load Full - 6 30 ns
-25V ≤ VCM ≤ 25V Full - - 50 ns
Driver Differential Rise or Fall Time tR, tFRD = 54Ω,
CD= 50pF
(Figure 6)
No CM load Full 400 650 1200 ns
-25V ≤ VCM ≤ 25V Full 300 -1350 ns
Maximum Data Rate fMAX CD = 820pF (Figure 8)Full0.25 1.5 - Mbps
Electrical Specifications VCC = 4.5V to 5.5V; unless otherwise specified. Typical values are at VCC = 5V, TA= +25°C (Note 6). Boldface
limits apply across the operating temperature range, -40°C to +85°C. (Continued)
PARAMETER SYMBOL TEST CONDITIONS
TEMP
(°C)
MIN
(Note 14)TYP
MAX
(Note 14)UNIT
ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E
FN7786 Rev.6.00 Page 7 of 22
Feb 8, 2019
Driver Enable to Output High tZH SW = GND (Figure 7), (Note 9)Full--1200 ns
Driver Enable to Output Low tZL SW = VCC (Figure 7), (Note 9)Full--1200 ns
Driver Disable from Output Low tLZ SW = VCC (Figure 7)Full--120 ns
Driver Disable from Output High tHZ SW = GND (Figure 7)Full--120 ns
Time to Shutdown tSHDN (Note 11)Full60 160 600 ns
Driver Enable from Shutdown to
Output High
tZH(SHDN) SW = GND (Figure 7), (Notes 11, 12)Full--2500 ns
Driver Enable from Shutdown to
Output Low
tZL(SHDN) SW = VCC (Figure 7), (Notes 11, 12)Full--2500 ns
DRIVER SWITCHING CHARACTERISTICS (1Mbps Versions - ISL32493E, ISL32495E)
Driver Differential Output Delay tPLH, tPHL RD = 54Ω,
CD= 50pF
(Figure 6)
No CM load Full - 70 125 ns
-25V ≤ VCM ≤ 25V Full - - 350 ns
Driver Differential Output Skew tSKEW RD = 54Ω,
CD= 50pF
(Figure 6)
No CM load Full - 4.5 15 ns
-25V ≤ VCM ≤ 25V (Note 17)Full - - 25 ns
Driver Differential Rise or Fall Time tR, tFRD = 54Ω,
CD= 50pF
(Figure 6)
No CM load Full 70 170 300 ns
-25V ≤ VCM ≤ 25V Full 70 -550 ns
Maximum Data Rate fMAX CD = 820pF (Figure 8)Full14 - Mbps
Driver Enable to Output High tZH SW = GND (Figure 7), (Note 9)Full--350 ns
Driver Enable to Output Low tZL SW = VCC (Figure 7), (Note 9)Full--300 ns
Driver Disable from Output Low tLZ SW = VCC (Figure 7)Full--120 ns
Driver Disable from Output High tHZ SW = GND (Figure 7)Full--120 ns
Time to Shutdown tSHDN (Note 11)Full60 160 600 ns
Driver Enable from Shutdown to
Output High
tZH(SHDN) SW = GND (Figure 7), (Notes 11, 12)Full--2000 ns
Driver Enable from Shutdown to
Output Low
tZL(SHDN) SW = VCC (Figure 7), (Notes 11, 12)Full--2000 ns
DRIVER SWITCHING CHARACTERISTICS (15Mbps Versions - ISL32496E, ISL32498E)
Driver Differential Output Delay tPLH, tPHL RD = 54Ω,
CD= 50pF
(Figure 6)
No CM load Full - 21 45 ns
-25V ≤ VCM ≤ 25V Full - - 80 ns
Driver Differential Output Skew tSKEW RD = 54Ω,
CD= 50pF
(Figure 6)
No CM load Full - 3 6ns
-25V ≤ VCM ≤ 25V Full - - 7ns
Driver Differential Rise or Fall Time tR, tFRD = 54Ω,
CD= 50pF
(Figure 6)
No CM Load Full 517 30 ns
-25V ≤ VCM ≤ 25V Full 5-30 ns
Maximum Data Rate fMAX CD = 470pF (Figure 8)Full15 25 - Mbps
Driver Enable to Output High tZH SW = GND (Figure 7), (Note 9)Full--100 ns
Driver Enable to Output Low tZL SW = VCC (Figure 7), (Note 9)Full--100 ns
Driver Disable from Output Low tLZ SW = VCC (Figure 7)Full--120 ns
Driver Disable from Output High tHZ SW = GND (Figure 7)Full--120 ns
Time to Shutdown tSHDN (Note 11)Full60 160 600 ns
Electrical Specifications VCC = 4.5V to 5.5V; unless otherwise specified. Typical values are at VCC = 5V, TA= +25°C (Note 6). Boldface
limits apply across the operating temperature range, -40°C to +85°C. (Continued)
PARAMETER SYMBOL TEST CONDITIONS
TEMP
(°C)
MIN
(Note 14)TYP
MAX
(Note 14)UNIT
ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E
FN7786 Rev.6.00 Page 8 of 22
Feb 8, 2019
Driver Enable from Shutdown to
Output High
tZH(SHDN) SW = GND (Figure 7), (Notes 11, 12)Full--2000 ns
Driver Enable from Shutdown to
Output Low
tZL(SHDN) SW = VCC (Figure 7), (Notes 11, 12)Full--2000 ns
RECEIVER SWITCHING CHARACTERISTICS (250kbps Versions - ISL32490E, ISL32492E)
Maximum Data Rate fMAX -25V ≤ VCM ≤ 25V (Figure 9)Full0.25 5 - Mbps
Receiver Input to Output Delay tPLH, tPHL -25V ≤ VCM ≤ 25V (Figure 9)Full-200280 ns
Receiver Skew |tPLH - tPHL |t
SKD (Figure 9)Full-410 ns
Receiver Enable to Output Low tZL RL = 1kΩ, CL = 15pF, SW = VCC (Figure 10), (Note 10)Full - - 50 ns
Receiver Enable to Output High tZH RL = 1kΩ, CL = 15pF, SW = GND (Figure 10),
(Note 10)
Full - - 50 ns
Receiver Disable from Output Low tLZ RL = 1kΩ, CL = 15pF, SW = VCC (Figure 10)Full--50 ns
Receiver Disable from Output High tHZ RL = 1kΩ, CL = 15pF, SW = GND (Figure 10)Full--50 ns
Time to Shutdown tSHDN (Note 11)Full60 160 600 ns
Receiver Enable from Shutdown to
Output High
tZH(SHDN) RL = 1kΩ, CL = 15pF, SW = GND (Figure 10),
(Notes 11, 13)
Full - - 2000 ns
Receiver Enable from Shutdown to
Output Low
tZL(SHDN) RL = 1kΩ, CL = 15pF, SW = VCC (Figure 10),
(Notes 11, 13)
Full - - 2000 ns
RECEIVER SWITCHING CHARACTERISTICS (1Mbps Versions - ISL32493E, ISL32495E)
Maximum Data Rate fMAX -25V ≤ VCM ≤ 25V (Figure 9)Full115 - Mbps
Receiver Input to Output Delay tPLH, tPHL -25V ≤ VCM ≤ 25V (Figure 9)Full-90150 ns
Receiver Skew |tPLH -t
PHL|t
SKD (Figure 9)Full-410 ns
Receiver Enable to Output Low tZL RL = 1kΩ, CL = 15pF, SW = VCC (Figure 10), (Note 10)Full - - 50 ns
Receiver Enable to Output High tZH RL = 1kΩ, CL = 15pF, SW = GND (Figure 10),
(Note 10)
Full - - 50 ns
Receiver Disable from Output Low tLZ RL = 1kΩ, CL = 15pF, SW = VCC (Figure 10)Full--50 ns
Receiver Disable from Output High tHZ RL = 1kΩ, CL = 15pF, SW = GND (Figure 10)Full--50 ns
Time to Shutdown tSHDN (Note 11)Full60 160 600 ns
Receiver Enable from Shutdown to
Output High
tZH(SHDN) RL = 1kΩ, CL = 15pF, SW = GND (Figure 10),
(Notes 11, 13)
Full - - 2000 ns
Receiver Enable from Shutdown to
Output Low
tZL(SHDN) RL = 1kΩ, CL = 15pF, SW = VCC (Figure 10), (Notes
11, 13)
Full - - 2000 ns
RECEIVER SWITCHING CHARACTERISTICS (15Mbps Versions - ISL32496E, ISL32498E)
Maximum Data Rate fMAX -25V ≤ VCM ≤ 25V (Figure 9)Full15 25 - Mbps
Receiver Input to Output Delay tPLH, tPHL -25V ≤ VCM ≤ 25V (Figure 9)Full-3570 ns
Receiver Skew |tPLH -t
PHL|t
SKD (Figure 9)Full-410 ns
Receiver Enable to Output Low tZL RL = 1kΩ, CL = 15pF, SW = VCC (Figure 10), (Note 10)Full - - 50 ns
Receiver Enable to Output High tZH RL = 1kΩ, CL = 15pF, SW = GND (Figure 10),
(Note 10)
Full - - 50 ns
Receiver Disable from Output Low tLZ RL = 1kΩ, CL = 15pF, SW = VCC (Figure 10)Full--50 ns
Receiver Disable from Output High tHZ RL = 1kΩ, CL = 15pF, SW = GND (Figure 10)Full--50 ns
Time to Shutdown tSHDN (Note 11)Full60 160 600 ns
Electrical Specifications VCC = 4.5V to 5.5V; unless otherwise specified. Typical values are at VCC = 5V, TA= +25°C (Note 6). Boldface
limits apply across the operating temperature range, -40°C to +85°C. (Continued)
PARAMETER SYMBOL TEST CONDITIONS
TEMP
(°C)
MIN
(Note 14)TYP
MAX
(Note 14)UNIT
ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E
FN7786 Rev.6.00 Page 9 of 22
Feb 8, 2019
Receiver Enable from Shutdown to
Output High
tZH(SHDN) RL = 1kΩ, CL = 15pF, SW = GND (Figure 10),
(Notes 11, 13)
Full - - 2000 ns
Receiver Enable from Shutdown to
Output Low
tZL(SHDN) RL = 1kΩ, CL = 15pF, SW = VCC (Figure 10),
(Notes 11, 13)
Full - - 2000 ns
NOTES:
6. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise
specified.
7. Supply current specification is valid for loaded drivers when DE = 0V.
8. Applies to peak current. See “Typical Performance Curves” beginning on page 11 for more information.
9. Keep RE = 0 to prevent the device from entering shutdown.
10. The RE signal high time must be short enough (typically <100ns) to prevent the device from entering shutdown.
11. Transceivers are put into shutdown by bringing RE high and DE low. If the inputs are in this state for fewer than 60ns, the parts are ensured not to
enter shutdown. If the inputs are in this state for at least 600ns, the parts are ensured to enter shutdown. See “Low Power Shutdown Mode” on
page 16.
12. Keep RE = VCC, and set the DE signal low time >600ns to ensure that the device enters shutdown.
13. Set the RE signal high time >600ns to ensure that the device enters shutdown.
14. Compliance to datasheet limits is assured by one or more methods: production test, characterization, and/or design.
15. Tested according to TIA/EIA-485-A, Section 4.2.6 (±80V for 15µs at a 1% duty cycle).
16. See “Caution” statement following “Absolute Maximum Ratings” on page 5.
17. This parameter is not production tested.
Electrical Specifications VCC = 4.5V to 5.5V; unless otherwise specified. Typical values are at VCC = 5V, TA= +25°C (Note 6). Boldface
limits apply across the operating temperature range, -40°C to +85°C. (Continued)
PARAMETER SYMBOL TEST CONDITIONS
TEMP
(°C)
MIN
(Note 14)TYP
MAX
(Note 14)UNIT
Test Circuits and Waveforms
FIGURE 5A. VOD AND VOC FIGURE 5B. VOD AND VOC WITH COMMON-MODE LOAD
FIGURE 5. DC DRIVER TEST CIRCUITS
D
DE
DI
VCC
VOD
VOC
RL/2
RL/2
Z
Y
D
DE
DI VOD
375Ω
375Ω
Z
Y
VCM
VCC
RL/2
RL/2
VOC
ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E
FN7786 Rev.6.00 Page 10 of 22
Feb 8, 2019
FIGURE 6A. TEST CIRCUIT FIGURE 6B. MEASUREMENT POINTS
FIGURE 6. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES
FIGURE 7A. TEST CIRCUIT FIGURE 7B. MEASUREMENT POINTS
FIGURE 7. DRIVER ENABLE AND DISABLE TIMES
FIGURE 8A. TEST CIRCUIT FIGURE 8B. MEASUREMENT POINTS
FIGURE 8. DRIVER DATA RATE
Test Circuits and Waveforms (Continued)
D
DE
DI
VCC
SIGNAL
GENERATOR
RD
Z
Y
375Ω*
375Ω*
CD
VCM
*USED ONLY FOR COMMON
MODE LOAD TESTS
OUT (Z)
3V
0V
1.5V1.5V
VOH
VOL
OUT (Y)
tPLH tPHL
DIFF OUT (Y - Z)
tR
+VOD
-VOD
90% 90%
tF
10% 10%
DI
SKEW = |tPLH - tPHL|
D
DE
DI Z
Y
VCC
GND
SW
PARAMETER OUTPUT RE DI SW CL (pF)
tHZ Y/Z X 1/0 GND 50
tLZ Y/Z X 0/1 VCC 50
tZH Y/Z 0 (Note 9)1/0GND100
tZL Y/Z 0 (Note 9)0/1V
CC 100
tZH(SHDN) Y/Z 1 (Note 12)1/0GND 100
tZL(SHDN) Y/Z 1 (Note 12)0/1V
CC 100
SIGNAL
GENERATOR
110Ω
CL
OUT (Y, Z)
3V
0V
1.5V1.5V
VOH
0V
VOH - 0.5V
tHZ
OUT (Y, Z)
VCC
VOL
VOL + 0.5V
tLZ
DE
OUTPUT LOW
tZL, tZL(SHDN)
tZH, tZH(SHDN)
2.3V
2.3V
(Note 11)
(Note 11)
(Note 11)
OUTPUT HIGH
D
DE
DI
VCC
SIGNAL
GENERATOR
Z
Y
CDVOD
+
-
54Ω
3V
0V
DIFF OUT (Y - Z) +VOD
-VOD
DI
0V
ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E
FN7786 Rev.6.00 Page 11 of 22
Feb 8, 2019
FIGURE 9A. TEST CIRCUIT FIGURE 9B. MEASUREMENT POINTS
FIGURE 9. RECEIVER PROPAGATION DELAY AND DATA RATE
FIGURE 10A. TEST CIRCUIT FIGURE 10B. MEASUREMENT POINTS
FIGURE 10. RECEIVER ENABLE AND DISABLE TIMES
Test Circuits and Waveforms (Continued)
SIGNAL
GENERATOR
RRO
RE
A
B15pF
SIGNAL
GENERATOR
VCM
RO
VCM + 750mV
VCM - 750mV
tPLH
VCM
VCM
VCC
0V
50% 50%
tPHL
A
B
1kΩ VCC
GND
SW
PARAMETER DE A SW
tHZ 0 +1.5V GND
tLZ 0 -1.5V VCC
tZH (Note 10)0+1.5VGND
tZL (Note 10) 0 -1.5V VCC
tZH(SHDN) (Note 13)0 +1.5V GND
tZL(SHDN) (Note 13) 0 -1.5V VCC
SIGNAL
GENERATOR
RRO
RE
A
B
15pF
RO
3V
0V
1.5V1.5V
VOH
0V
1.5V
VOH - 0.5V
tHZ
RO
VCC
VOL
1.5V
VOL + 0.5V
tLZ
RE
OUTPUT LOW
tZL, tZL(SHDN)
tZH, tZH(SHDN)
(Note 11)
(Note 11)
(Note 11)
OUTPUT HIGH
Typical Performance Curves VCC = 5V, TA = +25°C; unless otherwise specified.
FIGURE 11. DRIVER OUTPUT CURRENT vs DIFFERENTIAL
OUTPUT VOLTAGE
FIGURE 12. DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs
TEMPERATURE
DIFFERENTIAL OUTPUT VOLTAGE (V)
DRIVER OUTPUT CURRENT (mA)
012345
0
10
20
30
40
50
60
70
80
90
+25°C
RD = 54Ω
RD = 100Ω
RD = 30Ω
RD = 20Ω
+85°C
-40 0 50 85
TEMPERATURE (°C)
DIFFERENTIAL OUTPUT VOLTAGE (V)
-25 25 75
RD = 54Ω
RD = 100Ω
2.2
2.4
2.6
2.8
3.0
3.2
3.4
3.6
ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E
FN7786 Rev.6.00 Page 12 of 22
Feb 8, 2019
FIGURE 13. SUPPLY CURRENT vs TEMPERATURE FIGURE 14. RECEIVER OUTPUT CURRENT vs RECEIVER OUTPUT
VOLTAGE
FIGURE 15. DRIVER OUTPUT CURRENT vs SHORT-CIRCUIT VOLTAGE FIGURE 16. BUS PIN CURRENT vs BUS PIN VOLTAGE
FIGURE 17. DRIVER DIFFERENTIAL PROPAGATION DELAY vs
TEMPERATURE (ISL32490E, ISL32492E)
FIGURE 18. DRIVER DIFFERENTIAL SKEW vs TEMPERATURE
(ISL32490E, ISL32492E)
Typical Performance Curves VCC = 5V, TA = +25°C; unless otherwise specified. (Continued)
-40 0 50 85
TEMPERATURE (°C)
ICC (mA)
-25 25 75
2.00
2.05
2.10
2.15
2.20
2.25
2.30
2.35
2.40
2.45
DE = VCC, RE = X
DE = GND, RE = GND
RECEIVER OUTPUT VOLTAGE (V)
RECEIVER OUTPUT CURRENT (mA)
-30
-20
-10
0
10
20
30
40
50
60
70
VOH, +25°C
VOH, +85°C
VOL, +25°C VOL, +85°C
012345
OUTPUT VOLTAGE (V)
OUTPUT CURRENT (mA)
-150
-100
-50
0
50
100
150
-60-50-40-30-20-10 0 102030405060
Y OR Z = HIGH
Y OR Z = LOW
+85°C
+85°C
+25°C
+25°C
-600
-400
-200
0
200
400
600
800
1000
-70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70
BUS PIN VOLTAGE (V)
BUS PIN CURRENT (µA)
A/Y or B/Z
Y or Z
VCC = 0V TO 5.5V
-40 0 50 85
TEMPERATURE (°C)
-25 25 75
PROPAGATION DELAY (ns)
tPLH
tPHL
300
305
310
315
320
325
330
335
340
RD = 54Ω, CD = 50pF
-40 0 50 85
TEMPERATURE (°C)
SKEW (ns)
-25 25 75
|tPLH - tPHL|
0
1
2
3
4
5
6
7
8
RD = 54Ω, CD = 50pF
ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E
FN7786 Rev.6.00 Page 13 of 22
Feb 8, 2019
FIGURE 19. DRIVER DIFFERENTIAL PROPAGATION DELAY vs
TEMPERATURE (ISL32493E, ISL32495E)
FIGURE 20. DRIVER DIFFERENTIAL SKEW vs TEMPERATURE
(ISL32493E, ISL32495E)
FIGURE 21. DRIVER DIFFERENTIAL PROPAGATION DELAY vs
TEMPERATURE (ISL32496E, ISL32498E)
FIGURE 22. DRIVER DIFFERENTIAL SKEW vs TEMPERATURE
(ISL32496E, ISL32498E)
FIGURE 23. RECEIVER PERFORMANCE WITH ±25V CMV
(ISL32490E, ISL32492E)
FIGURE 24. RECEIVER PERFORMANCE WITH ±25V CMV
(ISL32493E, ISL32495E)
Typical Performance Curves VCC = 5V, TA = +25°C; unless otherwise specified. (Continued)
-40 0 50 85
TEMPERATURE (°C)
-25 25 75
PROPAGATION DELAY (ns)
50
55
60
65
70
75
80
85
tPLH
tPHL
RD = 54Ω, CD = 50pF
-40 0 50 85
TEMPERATURE (°C)
SKEW (ns)
-25 25 75
2.0
2.5
3.0
3.5
4.0
|tPLH - tPHL|
RD = 54Ω, CD = 50pF
-40 0 50 85
TEMPERATURE (°C)
-25 25 75
PROPAGATION DELAY (ns)
15
17
19
21
23
25
27
tPLH
tPHL
RD = 54Ω, CD = 50pF
-40 0 50 85
TEMPERATURE (°C)
SKEW (ns)
-25 25 75
2.0
2.2
2.4
2.6
2.8
3.0
3.2
3.4
|tPLH - tPHL|
RD = 54Ω, CD = 50pF
TIME (1µs/DIV)
VOLTAGE (V)
-25
-20
-15
-10
-5
0
5RO
A
B
0
5
10
15
20
25
RO
A
BVID = ±1V
TIME (400ns/DIV)
VOLTAGE (V)
-25
-20
-15
-10
-5
0
5RO
A
B
0
5
10
15
20
25
RO
A
BVID = ±1V
ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E
FN7786 Rev.6.00 Page 14 of 22
Feb 8, 2019
Application Information
RS-485 and RS-422 are differential (balanced) data
transmission standards used for long haul or noisy environments.
RS-422 is a subset of RS-485, so RS-485 transceivers are also
RS-422 compliant. RS-422 is a point-to-multipoint (multidrop)
standard that allows only one driver and up to 10 receivers on
each bus, assuming one-unit load devices. RS-485 is a true
multipoint standard that allows up to 32 one-unit load devices
(any combination of drivers and receivers) on each bus. To allow
for multipoint operation, the RS-485 specification requires that
drivers must handle bus contention without sustaining any
damage.
Another important advantage of RS-485 is the extended
Common-Mode Range (CMR), which specifies that the driver
outputs and receiver inputs withstand signals that range from
+12V to -7V. RS-422 and RS-485 are intended for runs as long as
4000ft; thus, the wide CMR is necessary to handle ground
potential differences and voltages induced in the cable by
external fields.
The ISL3249xE is a family of ruggedized RS-485 transceivers
that improves on the RS-485 basic requirements and increases
system reliability. The CMR increases to ±25V, while the RS-485
bus pins (receiver inputs and driver outputs) include fault
protection against voltages and transients up to ±60V.
Additionally, larger than required differential output voltages
(VOD) increase noise immunity, while the ±16.5kV built-in ESD
protection complements the fault protection.
Receiver (Rx) Features
These devices use a differential input receiver for maximum
noise immunity and CMR. Input sensitivity is greater than
±200mV as required by the RS-422 and RS-485 specifications.
The receiver input (load) current surpasses the RS-422
specification of 3mA and is four times lower than the RS-485
Unit Load (UL) requirement of 1mA maximum. Therefore, these
products are known as one-quarter UL transceivers, and there
can be up to 128 of these devices on a network while still
complying with the RS-485 loading specification.
FIGURE 25. RECEIVER PERFORMANCE WITH ±25V CMV
(ISL32496E, ISL32498E)
FIGURE 26. DRIVER AND RECEIVER WAVEFORMS (ISL32490E,
ISL32492E)
FIGURE 27. DRIVER AND RECEIVER WAVEFORMS (ISL32493E,
ISL32495E)
FIGURE 28. DRIVER AND RECEIVER WAVEFORMS (ISL32496E,
ISL32498E)
Typical Performance Curves VCC = 5V, TA = +25°C; unless otherwise specified. (Continued)
TIME (20ns/DIV)
VOLTAGE (V)
-25
-20
-15
-10
-5
0
5RO
A
B
0
5
10
15
20
25
RO
A
BVID = ±1V
TIME (1µs/DIV)
RECEIVER OUTPUT (V)
RD = 54Ω, CD = 50pF
0
5
DRIVER OUTPUT (V)
0
5
DRIVER INPUT (V)
DI
RO
A/Y - B/Z
-3
-2
-1
0
1
2
3
TIME (400ns/DIV)
RECEIVER OUTPUT (V)
RD = 54Ω, CD = 50pF
0
5
DRIVER OUTPUT (V)
0
5
DRIVER INPUT (V)
DI
RO
A/Y - B/Z
-3
-2
-1
0
1
2
3
TIME (20ns/DIV)
RECEIVER OUTPUT (V)
RD = 54Ω, CD = 50pF
0
5
DRIVER OUTPUT (V)
0
5
DRIVER INPUT (V)
DI
RO
A/Y - B/Z
-3
-2
-1
0
1
2
3
ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E
FN7786 Rev.6.00 Page 15 of 22
Feb 8, 2019
The receiver (Rx) functions with common-mode voltages as great
as ±25V, making them ideal for industrial or long networks
where induced voltages are a realistic concern.
All the receivers include a full fail-safe function that ensures a
high-level receiver output if the receiver inputs are unconnected
(floating), shorted together, or connected to a terminated bus
with all the transmitters disabled (that is, an idle bus).
Rx outputs feature high drive levels (typically 22mA at VOL =1V) to
ease the design of optically coupled isolated interfaces.
Receivers easily meet the data rates supported by the
corresponding driver, and all receiver outputs are three-statable
using the active low RE input.
The Rx in the 250kbps and 1Mbps versions includes noise
filtering circuitry to reject high-frequency signals. The 1Mbps
version typically rejects pulses narrower than 50ns (equivalent to
20Mbps), while the 250kbps Rx rejects pulses below 150ns
(6.7Mbps).
Driver (Tx) Features
The RS-485/RS-422 driver is a differential output device that
delivers at least 1.5V across a 54Ω load (RS-485) and at least
2.4V across a 100Ω load (RS-422). The drivers feature low
propagation delay skew to maximize bit width and minimize EMI,
and all drivers are three-statable using the active high DE input.
The 250kbps and 1Mbps driver outputs are slew rate limited to
minimize EMI and reflections in unterminated or improperly
terminated networks. The ISL32496E and ISL32498E driver
outputs are not limited; thus, faster output transition times allow
data rates of at least 15Mbps.
High Overvoltage (Fault) Protection
Increases Ruggedness
Note: The available smaller pitch package (MSOP) may not meet
the Creepage and Clearance (C&C) requirements for ±60V levels.
Determine C&C requirements before selecting a package type.
The ±60V fault protection (referenced to the IC GND) on the
RS-485 pins makes these transceivers some of the most rugged
on the market. This level of protection makes the ISL3249xE
perfect for applications where power (such as 24V and 48V
supplies) must be routed in the conduit with the data lines, or for
outdoor applications where large transients are likely to occur.
When power is routed with the data lines, even a momentary
short between the supply and data lines destroys an unprotected
device. The ±60V fault levels of this family are at least five times
higher than the levels specified for standard RS-485 ICs. The
ISL3249xE protection is active whether the Tx is enabled or
disabled, and even if the IC is powered down, or VCC and Ground
are floating.
If transients or voltages (including overshoots and ringing)
greater than ±60V are possible, additional external protection is
required.
Widest Common-Mode Voltage (CMV)
Tolerance Improves Operating Range
RS-485 networks operating in industrial complexes or over long
distances are susceptible to large CMV variations. Either of these
operating environments can suffer from large node-to-node
ground potential differences or CMV pickup from external
electromagnetic sources, and devices with only the minimum
required +12V to -7V CMR can malfunction. The ISL3249xE’s
extended ±25V CMR is the widest available, allowing operation in
environments that would overwhelm lesser transceivers.
Additionally, the Rx does not phase invert (erroneously change
state), even with CMVs of ±40V or differential voltages as large
as 40V.
High VOD Improves Noise Immunity and
Flexibility
The ISL3249xE driver design delivers larger differential output
voltages (VOD) than the RS-485 standard requires or than most
RS-485 transmitters can deliver. The typical ±2.5V VOD provides
more noise immunity than networks built using many other
transceivers.
Another advantage of the large VOD is the ability to drive more
than two bus terminations, which allows for using the ISL3249xE
in star and other multi-terminated, nonstandard network
topologies. Figure 11 on page 11 details the transmitter’s VOD vs
IOUT characteristic and includes load lines for four (30Ω) and six
(20Ω) 120Ω terminations. Figure 11 shows that the driver
typically delivers ±1.3V into six terminations, and the “Electrical
Specifications” on page 5 ensures a VOD of ±0.8V at 21Ω across
the full temperature range. The RS-485 standard requires a
minimum 1.5V VOD into two terminations, but the ISL3249xE
devices deliver RS-485 voltage levels with two to three times the
number of terminations.
Hot Plug Function
When a piece of equipment powers up, there is a period of time
when the processor or ASIC driving the RS-485 control lines (DE,
RE) is unable to ensure that the RS-485 Tx and Rx outputs are
kept disabled. If the equipment is connected to the bus, a driver
activating prematurely during power-up may crash the bus. To
avoid this scenario, the ISL3249xE devices incorporate a hot plug
function. Circuitry monitoring VCC ensures that the Tx and Rx
outputs remain disabled during power-up and power-down if VCC
is less than ≈3.5V, regardless of the state of DE and RE. The
disabled Tx and Rx outputs allow the processor/ASIC to stabilize
and drive the RS-485 control lines to the proper states. Figure 29
illustrates the power-up and power-down performance of the
ISL3249xE compared to an RS-485 IC without the hot plug
feature.
ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E
FN7786 Rev.6.00 Page 16 of 22
Feb 8, 2019
ESD Protection
All pins on these devices include Class 3 (>8kV) Human Body
Model (HBM) ESD protection structures that can survive ESD
events commonly seen during manufacturing. Even so, the
RS-485 pins (driver outputs and receiver inputs) incorporate
more advanced structures, allowing them to survive ESD events
in excess of ±16.5kV HBM (±15kV for the full-duplex versions).
The RS-485 pins are particularly vulnerable to ESD strikes
because they typically connect to an exposed port on the exterior
of the finished product. Touching the port pins or connecting a
cable can cause an ESD event that can destroy unprotected ICs.
The new ESD structures protect the device whether or not it is
powered up, and without interfering with the exceptional ±25V
CMR. The built-in ESD protection minimizes the need for
board-level protection structures (for example, transient
suppression diodes) and the associated undesirable capacitive
load they present.
Data Rate, Cables, and Terminations
RS-485 and RS-422 are intended for network lengths up to
4000ft, but the maximum system data rate decreases as the
transmission length increases. Devices operating at 15Mbps can
be used at lengths up to 150ft (46m), but the distance can be
increased to 328ft (100m) by operating at 10Mbps. The
ISL32493E and ISL32495E can operate at the full data rate of
1Mbps with lengths up to 800ft (244m). Jitter is the limiting
parameter at these faster data rates, so employing encoded data
streams (for example, Manchester coded or Return-to-Zero) can
allow increased transmission distances. The ISL32490E and
ISL32492E can operate at 115kbps or less at the full 4000ft
(1220m) distance, or at 250kbps for lengths up to 3000ft (915m).
DC cable attenuation is the limiting parameter, so using better
quality cables (such as 22 AWG) may allow increased transmission
distance.
Use a twisted pair cable for RS-485/RS-422 networks. Twisted
pair cables tend to pick up noise and other electromagnetically
induced voltages as common-mode signals that are effectively
rejected by the differential receivers in these ICs.
Note: Proper termination is imperative to minimize reflections
when using the 15Mbps ISL32496E and ISL32498E devices.
Short networks using the 250kbps ISL32490E and ISL32492E
versions do not need to be terminated; however, terminations are
recommended unless power dissipation is an overriding concern.
In point-to-point or point-to-multipoint networks (single driver on
bus, such as RS-422), terminate the main cable in its
characteristic impedance (typically 120Ω) at the end farthest from
the driver. In multireceiver applications, keep stubs connecting
receivers to the main cable as short as possible. Multipoint
(multidriver) systems require that the main cable be terminated in
its characteristic impedance at both ends. Keep stubs connecting
a transceiver to the main cable as short as possible.
Built-in Driver Overload Protection
The RS-485 specification requires that drivers survive worst-case
bus contentions undamaged. These transceivers meet this
requirement using driver output short-circuit current limits and
on-chip thermal shutdown circuitry.
The driver output stages incorporate a double foldback,
short-circuit current limiting scheme, which ensures that the
output current never exceeds the RS-485 specification, even at
the common-mode and fault condition voltage range extremes.
The first foldback current level (≈70mA) is set to ensure that the
driver never folds back when driving loads with CMVs up to ±25V.
The very low second foldback current setting (≈9mA) minimizes
power dissipation if the Tx is enabled when a fault occurs.
In the event of a major short-circuit condition, the ISL3249xE’s
thermal shutdown feature disables the drivers whenever the die
temperature becomes excessive. Thermal shutdown eliminates
the power dissipation, allowing the die to cool. The drivers
automatically re-enable after the die temperature drops about
+15°C. If the contention persists, the thermal shutdown/re-enable
cycle repeats until the fault is cleared. Receivers stay operational
during thermal shutdown.
Low Power Shutdown Mode
These BiCMOS transceivers all use a fraction of the power
required by competitive devices, but they also include a
shutdown feature that reduces the already low quiescent ICC to a
10µA trickle. These devices enter shutdown whenever the
receiver and driver are simultaneously disabled (RE =V
CC and
DE = GND) for a period of at least 600ns. Disabling both the
driver and the receiver for fewer than 60ns ensures that the
transceiver does not enter shutdown.
Receiver and driver enable times increase when the transceiver
enables from shutdown. See Notes 9 through 13 on page 9 for
more information.
Die Characteristics
SUBSTRATE POTENTIAL (POWERED UP):
GND
PROCESS:
Si Gate BiCMOS
TIME (40µs/DIV)
VCC
RECEIVER OUTPUT (V)
DRIVER Y OUTPUT (V)
2.5
5.0
2.5
5.0
VCC (V)
RL = 1kΩ
RO
0
2.5
5.0
0
0
A/Y
RL = 1kΩ
2.8V
3.5V
ISL3249xE
ISL3249xE
RE = GND
DE, DI = VCC
ISL83088E
FIGURE 29. HOT PLUG PERFORMANCE (ISL3249xE) vs ISL83088E
WITHOUT HOT PLUG CIRCUITRY
ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E
FN7786 Rev.6.00 Page 17 of 22
Feb 8, 2019
Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted.
Please visit our website to make sure you have the latest revision.
DATE REVISION CHANGE
Feb 8, 2019 FN7765.6 Updated links throughout document.
Updated ordering information table by adding all tape and reel information and updating notes.
Updated last sentence in the “High Overvoltage (Fault) Protection Increases Ruggedness” section.
Removed About Intersil section.
Updated disclaimer.
Sep 18, 2017 FN7765.5 Added Related Literature section.
Updated Receiving Truth Table on page 3.
Applied Intersil A Renesas Company template.
Apr 20, 2015 FN7786.4 DRIVER SWITCHING CHARACTERISTICS (250kbps Versions; ISL32490E, ISL32492E) Changed MAX limit
from “1200” to “1350” in “Driver Differential Rise or Fall Time” on page 6 that has -25V ≤ VCM ≤ 25V for
test condition.
DRIVER SWITCHING CHARACTERISTICS (1Mbps Versions; ISL32493E, ISL32495E) Changed MAX limit from
“400” to “550” in “Driver Differential Rise or Fall Time” on page 7 that has -25V ≤ VCM ≤ 25V for test
condition.
Oct 14, 2014 FN7786.3 On page 7, added “Note 17” reference to the Driver Differential Output Test condition.
On page 9, added Note 17, “This parameter is not production tested.”
On page 19 replaced M10.118 POD with latest revision.
Mar 7, 2012 FN7786.2 Updated Figure 16 on page 12 to show Pos breakdown between 60V and 70V.
Updated Theta JA in “Thermal Information” on page 5 for 8 Ld SOIC from 116 to 108.
Updated Package Outline Drawing on page 21. Changed Note 1 "1982" to "1994".
Nov 11, 2011 FN7786.1 Added 10 to “Pin Count” for ISL32490E, ISL32493E, ISL32496E in the Summary of Features table.
Added 10 Ld MSOP option for ISL32490E, ISL32493E, ISL32496E in the “Ordering Information” table.
Added 10 Ld MSOP pinout to “Pin Configurations” for ISL32490E, ISL32493E, ISL32496E.
Added 10 Ld Pin # column in the “Pin Description” table.
Added “(SOIC pin numbers shown)” in the “Typical Operating Circuits”.
Added 10 Ld MSOP information in the “Thermal Resistance” section.
Added 10 Ld MSOP package outline drawing.
M8.118 on page 18- Corrected lead width dimension in side view 1 from "0.25 - 0.036" to "0.25 - 0.36"
M8.15 on page 21- In Typical Recommended Land Pattern, changed the following:
2.41(0.095) to 2.20(0.087)
0.76 (0.030) to 0.60(0.023)
0.200 to 5.20(0.205)
Jan 18, 2011 FN7786.0 Initial release
ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E
FN7786 Rev.6.00 Page 18 of 22
Feb 8, 2019
Package Outline Drawings
M8.118
8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE
Rev 4, 7/11
DETAIL "X"
SIDE VIEW 2
TYPICAL RECOMMENDED LAND PATTERN
TOP VIEW
PIN# 1 ID
0.25 - 0.36
DETAIL "X"
0.10 ± 0.05
(4.40)
(3.00)
(5.80)
H
C
1.10 MAX
0.09 - 0.20
3°±3°
GAUGE
PLANE 0.25
0.95 REF
0.55 ± 0.15
B
0.08 C A-B D
3.0±0.05
12
8
0.85±010
SEATING PLANE
A
0.65 BSC
3.0±0.05 4.9±0.15
(0.40)
(1.40)
(0.65)
D
5
5
SIDE VIEW 1
Dimensioning and tolerancing conform to JEDEC MO-187-AA
Plastic interlead protrusions of 0.15mm max per side are not
Dimensions in ( ) are for reference only.
Dimensions are measured at Datum Plane "H".
Plastic or metal protrusions of 0.15mm max per side are not
Dimensions are in millimeters.
3.
4.
5.
6.
NOTES:
1.
2.
and AMSEY14.5m-1994.
included.
included.
0.10 C
M
For the most recent package outline drawing, see M8.118.
ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E
FN7786 Rev.6.00 Page 19 of 22
Feb 8, 2019
M10.118
10 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE
Rev 1, 4/12
DETAIL "X"
SIDE VIEW 2
TYPICAL RECOMMENDED LAND PATTERN
TOP VIEW
PIN# 1 ID
0.18 - 0.27
DETAIL "X"
0.10 ± 0.05
(4.40)
(3.00)
(5.80)
H
C
1.10 MAX
0.09 - 0.20
3°±3°
GAUGE
PLANE 0.25
0.95 REF
0.55 ± 0.15
B
0.08 C A-B D
3.0±0.05
12
10
0.85±010
SEATING PLANE
A
0.50 BSC
3.0±0.05 4.9±0.15
(0.29)
(1.40)
(0.50)
D
5
5
SIDE VIEW 1
Dimensioning and tolerancing conform to JEDEC MO-187-BA
Plastic interlead protrusions of 0.15mm max per side are not
Dimensions in ( ) are for reference only.
Dimensions are measured at Datum Plane "H".
Plastic or metal protrusions of 0.15mm max per side are not
Dimensions are in millimeters.
3.
4.
5.
6.
NOTES:
1.
2.
and AMSEY14.5m-1994.
included.
included.
0.10 C
M
For the most recent package outline drawing, see M10.118.
ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E
FN7786 Rev.6.00 Page 20 of 22
Feb 8, 2019
M14.15
14 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
Rev 1, 10/09
A
D
4
0.25 A-BMC
C
0.10 C
5B
D
3
0.10 A-BC
4
0.20 C 2X
2X
0.10 DC 2X
H
0.10 C
6
36
ID MARK
PIN NO.1 (0.35) x 45°
SEATING PLANE
GAUGE PLANE
0.25
(5.40)
(1.50)
1.27
0.31-0.51
4° ± 4°
DETAIL"A" 0.22±0.03
0.10-0.25
1.25 MIN
1.75 MAX
(1.27) (0.6)
6.0
8.65
3.9
7
14 8
Dimensioning and tolerancing conform to AMSEY14.5m-1994.
Dimension does not include interlead flash or protrusions.
Dimensions in ( ) for Reference Only.
Interlead flash or protrusions shall not exceed 0.25mm per side.
Datums A and B to be determined at Datum H.
4.
5.
3.
2.
Dimensions are in millimeters.
NOTES:
1.
The pin #1 indentifier may be either a mold or mark feature.
6. Does not include dambar protrusion. Allowable dambar protrusion
7. Reference to JEDEC MS-012-AB.
shall be 0.10mm total in excess of lead width at maximum condition.
DETAIL "A"
SIDE VIEW
TYPICAL RECOMMENDED LAND PATTERN
TOP VIEW
For the most recent package outline drawing, see M14.15.
ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E
FN7786 Rev.6.00 Page 21 of 22
Feb 8, 2019
M8.15
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
Rev 4, 1/12
DETAIL "A"
TOP VIEW
INDEX
AREA
123
-C-
SEATING PLANE
x 45°
NOTES:
1. Dimensioning and tolerancing per ANSI Y14.5M-1994.
2. Package length does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
3. Package width does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
4. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
5. Terminal numbers are shown for reference only.
6. The lead width as measured 0.36mm (0.014 inch) or greater above the
seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch).
7. Controlling dimension: MILLIMETER. Converted inch dimensions are not
necessarily exact.
8. This outline conforms to JEDEC publication MS-012-AA ISSUE C.
SIDE VIEW “A
SIDE VIEW “B”
1.27 (0.050)
6.20 (0.244)
5.80 (0.228)
4.00 (0.157)
3.80 (0.150)
0.50 (0.20)
0.25 (0.01)
5.00 (0.197)
4.80 (0.189)
1.75 (0.069)
1.35 (0.053)
0.25(0.010)
0.10(0.004)
0.51(0.020)
0.33(0.013)
8°
0°
0.25 (0.010)
0.19 (0.008)
1.27 (0.050)
0.40 (0.016)
1.27 (0.050)
5.20(0.205)
1
2
3
45
6
7
8
TYPICAL RECOMMENDED LAND PATTERN
2.20 (0.087)
0.60 (0.023)
For the most recent package outline drawing, see M8.15.
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