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December 2013
Rev. 1.0.0
Exar Corporation www.exar.com
48720 Kato Road, Fremont CA 94538, USA Tel. +1 510 668-7000Fax. +1 510 668-7001
GENERAL DESCRIPTION
The XRP779710EVB-DEMO-1 board is a
complete, two channel power system. The
default configuration provides 1.8V and 2.5V
at maximum loads of 6Amps per output. The
supplies can be dynamically adjusted in 5mV
increments. The order and ramp rates for each
supply can be programmed to accommodate
any sequencing requirement. All power supply
operations can be controlled over an I2C
interface. Faults, output voltages and currents
can also be monitored. Two GPIO and three
PSIO signals are available and can be
programmed to provide a variety of functions.
Unused GPIO/PSIO pins can be programmed
as I/O expansion for a microcontroller. The
board is supported by PowerArchitectTM 5.1 or
later, and plugs directly onto the interposer
board acting as an interface to Arduino
controller.
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XRP9710EVB-DEMO-1
FEATURES
XRP9710 Programmable Power Module
o Channel 3 and 4 internal converters
2 Channel Power System
Wide Input Voltage Range: 5.5V-22V
I2C Interface
Programming
Monitoring
Control
Arduino GPIO, PSIO and ENABLE
control
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December 2013
Rev. 1.0.0
Exar Corporation www.exar.com
48720 Kato Road, Fremont CA 94538, USA Tel. +1 510 668-7000Fax. +1 510 668-7001
EVALUATION BOARD SCHEMATICS
Figure 1 XRP9710 Evaluation Board Schematics
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© 2013 Exar Corporation 3/19 Rev. 1.0.0
PIN ASSIGNMENT
AGND
VOUT3+
VOUT3-
VOUT4-
GPIO0
GPIO1
NC
NC
NC
NC
NC
NC
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SCL
PSIO1
PSIO2
PSIO0
VCC
ENABLE
31
VOUT4+
SDA
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13 14
AGND
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25
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26
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40
44
39
3635
3332
2827
41
45
PVOUT3
PVOUT3 PGND3 PVINPVIN
LX3LX3 PVINPVIN
PGND4LX4AGNDAGND
LX4 PVOUT4
LX4 PVOUT4
LX3
AGND
LDO5
Figure 2 XRP9710 Pin Assignment
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© 2013 Exar Corporation 4/19 Rev. 1.0.0
PIN DESCRIPTION
Pin # Name Description
1-10 NC No Connect
11 ENABLE Enable.
If ENABLE is pulled high or allowed to float high, the chip is powered up. The
pin must be held low for the XRP9711 to be placed into shutdown.
12 VCC Controller Supply Voltage. Place a decoupling capacitor close to the controller IC.
This input is used in UVLO fault generation.
13
AGND Analog Ground. This is the small signal ground connection.
14
AGND Analog Ground. This is the small signal ground connection.
15 VOUT3+ Feedback Pin.
Positive input of remote sensing differential amplifier. Connect to the
remote voltage load, positive terminal.
16 VOUT3- Feedback Pin.
Negative input of remote sensing differential amplifier. Connect to the
remote voltage load, negative terminal.
17 VOUT4+ Feedback Pin.
Positive input of remote sensing differential amplifier. Connect to the
remote voltage load, positive terminal.
18 VOUT4- Feedback Pin.
Negative input of remote sensing differential amplifier. Connect to the
remote voltage load, negative terminal.
19
GPIO0 I/O Logic Signal. Can be configured as input or output.
20 GPIO1 I/O Logic Signal. Can be configured as input or output.
21 SDA I2C Data. SMBus/I2C serial interface communication.
22 SCL I2C Clock. SMBus/I2C serial interface communication.
23 PSIO0 I/O Logic Signal, HV. Open drain, high voltage
compliant. Can be configured as input
or output.
24
PVOUT3 Channel Output Power. Output voltage for the internal channel.
25
PVOUT3 Channel Output Power. Output voltage for the internal channel.
26 PGND3 Channel Output Ground. Output ground for the internal channel.
27 PVIN Channel Input Power. Internally connected to drain of upper switching MOSFET
28 PVIN Channel Input Power. Internally connected to drain of upper switching MOSFET
29
LX3 Switch Node. Switch node of the internal channel.
30 LX3 Switch Node. Switch node of the internal channel.
31 LX3 Switch Node. Switch node of the internal channel.
32 PVIN Channel Input Power. Internally connected to drain of upper switching MOSFET
33
PVIN Channel Input Power. Internally connected to drain of upper switching MOSFET
34 LDO5 5V LDO Output.
Used internally for power and may also be used for external power.
LDO that can remain active while the rest of the IC is in standby mode.
35
AGND Analog Ground. This is the small signal ground connection.
36 AGND Analog Ground. This is the small signal ground connection.
37 LX4 Switch Node. Switch node of the internal channel.
38 PGND4 Channel Output Ground. Output ground for the internal channel.
39
AGND Analog Ground. This is the small signal ground connection.
40 LX4 Switch Node. Switch node of the internal channel.
41 PVOUT4 Channel Output Power. Output voltage for the internal channel.
42 PSIO1 I/O Logic Signal, HV. Open drain, high voltage
compliant. Can be configured as input
or output.
43 PSIO2 I/O Logic Signal, HV. Open drain, high voltage
compliant. Can be configured as input
or output.
44 LX4 Switch Node. Switch node of the internal channel.
45 PVOUT4 Channel Output Power. Output voltage for the internal channel.
ORDERING INFORMATION
Refer to XRP9710’s datasheet and/or www.exar.com for exact and up to date ordering information.
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© 2013 Exar Corporation 5/19 Rev. 1.0.0
USING THE EVALUATION BOARD
INPUT VOLTAGE RANGE
The input voltage range of XRP9710EVB-
DEMO-1 board is from 5.5V to 22V. The
default configuration has been optimized for a
12V input rail. When running the board at an
input voltage other than 12V, use
PowerArchitectTM 5.1 (PA5.1) to evaluate the
system performance.
I2C INTERFACE
The XRP9710 programmable power module
employs a standard I2C interface. Although the
I2C signals can be pulled up to LDO5 on board
by means of installing jumpers at the locations
JP1, JP2 and JP4, the I2C bus signals are
pulled up on the controller interface board by
default (refer to Appendix jumpers installed
shorting pins 2 and 3 together at the locations
JP6 and JP7).
OPERATING THE EVALUATION BOARD
The XRP9710EVB-DEMO-1 is designed to be
powered from either an AC/DC wall wart (the
output voltage must be in the range of 5.5V to
22V) connected to the barrel connector or a
test bench DC power supply (the voltage must
be in the range of 5.5V to 22V) connected to
the VIN connectors.
BRING UP PROCEDURE
Plug the XRP9710EVB-DEMO-1 evaluation
board to the controller interface board as
shown below.
Load the PowerArchitectTM 5.1 software and
run it.
After selecting the proper family (Modules)
and the device (XRP9710), select the “Get
Started with the EVB-DEMO-1” option when
prompted as shown below.
When done, click “Create”. PA 5.1 will load the
default XRP9710EVB-DEMO-1 configuration
automatically.
Apply power to the board. Please refer to the
sections above on how to properly supply
power to the board and what voltage range to
use.
Turn on the Power supply.
Use USB cable to connect the computer (type
A) and the Arduino controller board (type B).
Go to the Tools tab in PA 5.1 and select
Boards. The software will identify
communication ports where it found the
Arduino controller board. Select the port.
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© 2013 Exar Corporation 6/19 Rev. 1.0.0
PA 5.1 is now communicating with the Arduino
controller board which is indicated in the lower
left corner.
Programming the Configuration onto
XRP9710
To program a configuration go to the Tools tab
in PA 5.1 and select Program Flash.
The program Flash window will appear.
Click the Flash button.
PA 5.1 will go through the process of loading
configuration in the flash. Once it has
successfully completed the task, it will report
the outcome as seen above and reset the
device if “Automatically Reset After Flashing”
box checked (default option).
Close the window.
Note that XRP9710EVB-DEMO-1 boards will be
pre-loaded with the default configuration.
Regulation
To enable channel regulation go to the Tools
tab in PA 5.1 and select Dashboard.
In Dashboard turn Group 1 on. The
configuration groups the channels 3 and 4 into
Group 1. The channels are now in regulation
as indicated by VOUT readings as well as the in-
regulation indicators.
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© 2013 Exar Corporation 7/19 Rev. 1.0.0
Channels can be turned on individually if
desired.
GPIO and PISO interface
The GPIOs, PSIOs and ENABLE can be
controlled from the Arduino controller
dynamically in the dashboard.
ENABLE signal is connected to the Arduino
controller board by default (JP3 header is
shorted). Arduino drives the ENABLE pin low
to place XRP9710 into the shutdown mode. It
releases the ENABLE pin to enable the device.
If leaving the ENABLE pin floating is desired,
the jumper at JP3 shall be removed.
The PSIOs are not pulled up on XRP9710EVB-
DEMO-1 by default. There is a loading option
to pull PSIOs up to LDO5 if desired. To do this,
one will need to short JP4, JP5, JP6 and JP7
headers by means of installing jumpers.
EVALUATION BOARD CONNECTIONS
The following picture illustrates how VIN
supplied from a test bench DC power supply
and instruments attached to the outputs would
be connected to the XRP9710EVB-DEMO-1
board.
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© 2013 Exar Corporation 9/19 Rev. 1.0.0
BILL OF MATERIAL
Ref. Qty
Manufacturer Part Number Size Component
1 Exar Corporation
146-6709-01 2.25x2.80in PCB
U1 1 Exar Corporation
XRP9710 12x12mm
LGA
Dual 6A Programmable
Power Module
DS1 1 Wurth Elektronik
150120AS75000 1206 SMD Amber Chip LED
C2 1 Murata
Corporation GRM21BR71H105KA12L 0805 Ceramic Capacitor 1µF,
50V, X7R
C3, C4, C6, C8 4 Murata
Corporation GRM32ER71A476KE15L 1210 Ceramic Capacitor
47µF, 10V, X7R
C5, C7 2 Murata
Corporation GRM32ER71H106KA12L 1210 Ceramic Capacitor
10µF, 50V, X7R
C9 1 Panasonic/Sanyo
35SVPF120M F12 OSCON Capacitor
120µF, 35V
C12, C19 2 Murata
Corporation GRM188R71H104KA93D
0603 Ceramic Capacitor
0.1µF, 50V, X7R
C13, C15 2 Murata
Corporation GRM155R71H103KA88D
0402 Ceramic Capacitor
0.01µF, 50V, X7R
C14, C16, C17, C18 4 Murata
Corporation GRM155R71C104KA88D
0402 Ceramic Capacitor
0.1µF, 16V, X7R
R1 1 Vishay Dale CRCW12060000Z0EAHP 1206 RES 0 Ω, 1/2W, SMD
R2, R3, R5, R6, R7 5 Panasonic ERJ-3EKF4701V 0603 RES 4.7kΩ, 1/10W,
5%, SMD
R8 1 Panasonic ERJ-6GEYJ122V 0805 RES 1.2k
Ω, 1/8W, 5%,
SMD
JP1, JP2, JP3, JP4, JP5, JP6, JP7 7 Wurth Elektronik
61300211121 0.20x0.10in
Connector, Male
Header, 2 Positions,
100mil Spacing,
Vertical, TH
P1 1
Sullins
Connector
Solutions
SFH11-PBPC-D10-RA-
BK 1.20x0.55in
Connector, Female
Header, 20 Positions,
100mil Spacing, RA, TH
P2 1 Switchcraft RAPC722X 0.60x0.40in Connector, Power Jack
Mini R/A, T/H
T1, T2, T5 3 Wurth Elektronik
61300111121 0.10x0.10in Square Test Posts, TH
TP1, TP2, TP3, TP4, TP5, TP6 6 Wurth Elektronik
7471287 0.32x0.10in Mounting Tabs
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© 2013 Exar Corporation 10/19 Rev. 1.0.0
EVALUATION BOARD LAYOUT
Figure 3 Component Placement Top Side
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© 2013 Exar Corporation 11/19 Rev. 1.0.0
Figure 4 Layout Top Side
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© 2013 Exar Corporation 12/19 Rev. 1.0.0
Figure 5 Layout - Bottom
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© 2013 Exar Corporation 13/19 Rev. 1.0.0
Figure 6 Layout Middle Layer 1
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© 2013 Exar Corporation 14/19 Rev. 1.0.0
Figure 7 Layout Middle Layer 2
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© 2013 Exar Corporation 15/19 Rev. 1.0.0
Figure 8 Layout Signal Ground Plane
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P
PW
WM
M/
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PF
FM
M
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P
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© 2013 Exar Corporation 16/19 Rev. 1.0.0
Figure 9 Layout Internal Plane
X
XR
RP
P9
97
71
10
0E
EV
VB
B-
-D
DE
EM
MO
O-
-
1
1
D
Du
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l
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Ou
ut
tp
pu
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D
Di
ig
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it
ta
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P
PW
WM
M/
/P
PF
FM
M
D
De
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mo
o
B
Bo
oa
ar
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d
d
P
Pr
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og
gr
ra
am
mm
ma
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P
Po
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M
Ma
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me
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© 2013 Exar Corporation 17/19 Rev. 1.0.0
APPENDIXINTERFACE BOARD
SCHEMATICS
X
XR
RP
P9
97
71
10
0E
EV
VB
B-
-D
DE
EM
MO
O-
-
1
1
D
Du
ua
al
l
O
Ou
ut
tp
pu
ut
t
D
Di
ig
gi
it
ta
al
l
P
PW
WM
M/
/P
PF
FM
M
D
De
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mo
o
B
Bo
oa
ar
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d
d
P
Pr
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gr
ra
am
mm
ma
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P
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M
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me
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© 2013 Exar Corporation 18/19 Rev. 1.0.0
BILL OF MATERIAL
Ref. Qty Manufacturer Part Number Size Component
1 Exar Corporation 146-6703-01 4.40x2.10in PCB
DS1 1 Wurth Elektronik 150120RS75000 1206 SMD Red Chip LED
DS2 1 Wurth Elektronik 150120VS75000 1206 SMD Green Chip LED
C1, C2, C3, C4 4 Vishay Sprague 293D226X9010B2TE3 B Tantalum Capacitor 22µF,
10V, 10%
R1, R5, R6, R9 4 Panasonic ERJ-6GEY0R00V 0805 RES 0 Ω, 1/8W, 5% SMD
R2, R3 2 Panasonic ERJ-6GEYJ122V 0805 RES 1.2kΩ, 1/8W, 5%, SMD
R4, R7, R8 3 Panasonic ERJ-6GEYJ472V 0805 RES 4.7kΩ, 1/8W, 5%, SMD
SW1 1 Wurth Elektronik 430182050816 6x6mm Tact Switch, SMD
CON5 1 Wurth Elektronik 61301021121 0.50x0.20in
Connector, Male Header, 10
Positions, Dual Row, 100mil
Spacing, Vertical, TH
JP1, JP2, JP3, JP4,
JP5 5 Wurth Elektronik 61300211121 0.20x0.10in
Connector, Male Header, 2
Positions, 100mil Spacing,
Vertical, TH
JP6, JP7 2 Wurth Elektronik 61300311121 0.30x0.10in
Connector, Male Header, 3
Positions, 100mil Spacing,
Vertical, TH
P1 1 Wurth Elektronik 612020235221 1.30x0.55in
Connector, Male Header, 20
Positions, Dual Row, 100mil
Spacing, Shrouded, RA, TH
P2 1 Wurth Elektronik 653104124022 11x6mm
Wire-to-Board Connector,
Male, 4 Positions, 1.25mm
Spacing, Shrouded, SMT
P_IOH1 1 Wurth Elektronik 61301011121 1.00x0.10in
Connector, Male Header, 10
Positions, 100mil Spacing,
Vertical, TH
P_POWER1,
P_IOL1 2 Wurth Elektronik 61300811121 0.80x0.10in
Connector, Male Header, 8
Positions, 100mil Spacing,
Vertical, TH
P_AD1 1 Wurth Elektronik 61300611121 0.60x0.10in
Connector, Male Header, 6
Positions, 100mil Spacing,
Vertical, TH
T23, T24, T25 3 Wurth Elektronik 61300111121 0.10x0.10in Square Test Posts, TH
X
XR
RP
P9
97
71
10
0E
EV
VB
B-
-D
DE
EM
MO
O-
-
1
1
D
Du
ua
al
l
O
Ou
ut
tp
pu
ut
t
D
Di
ig
gi
it
ta
al
l
P
PW
WM
M/
/P
PF
FM
M
D
De
em
mo
o
B
Bo
oa
ar
r
d
d
P
Pr
ro
og
gr
ra
am
mm
ma
ab
bl
le
e
P
Po
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we
er
r
M
Ma
an
na
ag
ge
em
me
en
nt
t
S
Sy
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st
te
e
m
m
© 2013 Exar Corporation 19/19 Rev. 1.0.0
DOCUMENT REVISION HISTORY
Revision Date Description
1.0.0 01/06/2014 Initial release of document
BOARD REVISION HISTORY
Board Revision
Date Description
XRP9710EVB-
DEMO-1-01 12/20/13 Initial release of evaluation board
FOR FURTHER ASSISTANCE
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Exar Technical Documentation: http://www.exar.com/TechDoc/default.aspx?
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NOTICE
EXAR Corporation reserves the right to make changes to the products contained in this publication in order to improve
design, performance or reliability. EXAR Corporation assumes no responsibility for the use of any circuits described herein,
conveys no license under any patent or other right, and makes no representation that the circuits are free of patent
infringement. Charts and schedules contained here in are only for illustration purposes and may vary depending upon a
user’s specific application. While the information in this publication has been carefully checked; no responsibility, however,
is assumed for inaccuracies.
EXAR Corporation does not recommend the use of any of its products in life support applications where the failure or
malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its
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