PROTECTION PRODUCTS
1www.semtech.com
PROTECTION PRODUCTS - RailClamp®®
®®
®
RClamp0503F
RailClamp®®
®®
®
TVS Array for USB OTG Interfaces
Description Features
Schematic Schematic & PIN Configuration
Revision 4/25/2014
Applications
Mechanical Characteristics
RailClamp® TVS arrays are low capacitance ESD
protection devices designed to protect high speed data
interfaces.. This series has been specifically designed
to protect sensitive components which are connected
to data and transmission lines from overvoltage
caused by ESD (electrostatic discharge), CDE (Cable
Discharge Events), and EFT (electrical fast transients).
The unique design incorporates surge rated, low
capacitance steering diodes and a TVS diode in a
single package. During transient conditions, the
steering diodes direct the transient to either the
positive side of the power supply line or to ground. The
internal TVS diode prevents over-voltage on the power
line, protecting any downstream components.
The low capacitance array configuration allows the user
to protect three high-speed data or transmission lines.
The low inductance construction minimizes voltage
overshoot during high current surges. This device is
optimized for ESD protection of USB OTG and SIM
interfaces. They may be used to meet the ESD immu-
nity requirements of IEC 61000-4-2, Level 4 (±15kV
air, ±8kV contact discharge).
SC-70 5L (Top View)
5
134
2
EIAJ SC-70 5L package
Molding compound flammability rating: UL 94V-0
Lead Finish: Matte Tin
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Marking : F53
Packaging : Tape and Reel
Transient protection for high-speed data lines to
IEC 61000-4-2 (ESD) ±25kV (air), ±20kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
Array of surge rated diodes with internal TVS Diode
Small package saves board space
Protects three I/O lines & power line
Low capacitance (<3pF) for high-speed interfaces
Low clamping voltage
Low operating voltage: 5.0V
Solid-state silicon-avalanche technology
USB OTG interfaces
SIM Ports
Video Graphics Cards
Personal Digital Assistants (PDAs)
Monitors and Flat Panel Displays
Portable Electronics
Microcontroller Input Protection
2© 2014 Semtech Corporation www.semtech.com
PROTECTION PRODUCTS
RClamp0503F
Absolute Maximum Rating
Electrical Characteristics (T=25oC)
gnitaRlobmySeulaVstinU
)sμ02/8=pt(rewoPesluPkaePP
kp
051sttaW
(tnerruCesluPkaePmumixaM)sμ02/8=ptI
pp
6spmA
)riA(2-4-00016CEIrepDSE
1
)tcatnoC(2-4-00016CEIrepDSE
1
V
DSE
52-/+
02-/+
Vk
erutarepmeTgnitarepOT
J
521+ot55-C°
erutarepmeTegarotST
GTS
051+ot55-C°
Notes
1)ESD gun return path connected to ESD ground reference plane.
retemaraPlobmySsnoitidnoCmuminiMlacipyTmumixaMstinU
egatloVffO-dnatSesreveRV
MWR
2ot5niP5V
egatloVnwodkaerBesreveRV
RB
I
t
Am1=
2ot5niP
6V
tnerruCegakaeLesreveRI
R
V
MWR
C°52=T,V5=
2ot5niP
3Aμ
egatloVgnipmalCV
C
I
PP
sμ02/8=pt,A1=
2niPot4ro,3,1niP
51V
egatloVgnipmalCV
C
I
PP
sμ02/8=pt,A6=
2niPot4ro,3,1niP
52V
ecnaticapaCnoitcnuJC
j
V
R
zHM1=f,V0=
2niPot4ro,3,1niP
3Fp
V
R
zHM1=f,V0=
O/IowtynaneewteB
)4,3,1(snip
5.1Fp
3© 2014 Semtech Corporation www.semtech.com
PROTECTION PRODUCTS
RClamp0503F
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
TLP Characteristic
(Pin 1, 3, or 4 to GND)
Clamping Voltage vs. Peak Pulse Current (tp=8/20us)
ESD Clamping (+8kV Contact per IEC 61000-4-2)
(Pin 1, 3, or 4 to GND)
Junction Capacitance vs. Reverse Voltage
(Pin 1, 3, or 4 to GND - Normalized to 0V)
ESD Clamping (-8kV Contact per IEC 61000-4-2)
(Pin 1, 3, or 4 to GND)
0.01
0.1
1
10
0.1 1 10 100 1000
Peak Pulse Power - P
PP
(kW)
Pulse Duration - tp (µs)
DR040412-150
T
A
= 25
O
C
5
10
15
20
25
012345678
Peak Pulse Current - IPP (A)
Clamping Voltage - VC (V)
Waveform
Parameters:
tr = 8µs
td = 20µs Pin 1, 3, or
4,to pin 2
Pin 5 to pin 2
0
5
10
15
20
25
30
0 5 10 15 20 25 30 35 40
Voltage (V)
Current (A)
Transmission Line Pulse Test (TLP)
Settings:
tp = 100 ns, tr = 0.2ns,
ITLP and VTLP averagin g wind ow :
t1 = 70ns to t2 = 90ns
-50
0
50
100
150
200
-10 0 10 20 30 40 50 60 70 80
Time (ns)
Voltage (V)
Measuredwit h50Ohmscopeinput
impedance,2GHzbandwidth.Correctedfor
50Ohm,40dBattenuator.ESDgunreturn
pathconnectedtoESDgroundplane
-300
-250
-200
-150
-100
-50
0
50
-10 0 10 20 30 40 50 60 70 80
Time (ns)
Voltage (V)
Measuredwith50Ohmscopeinput
impedance,2GHzbandwidth.Corrected
for50Ohm,40dBattenuator.ESDgun
returnpathconnectedtoESDground
l
0
0.5
1
1.5
2
012345
Reverse Voltage - VR (V)
Normalized Capacitance
f = 1MHz
4© 2014 Semtech Corporation www.semtech.com
PROTECTION PRODUCTS
RClamp0503F
Typical Characteristics
Insertion Loss S21
(Pin 1, 3, or 4 to GND)
Insertion Loss S21
(Between any two I/O pins - 1, 3, 4)
-6
-5
-4
-3
-2
-1
0
1
1 10 100 1000 10000
Frequency (MHz )
S21 (dB)
-1.8
-1.6
-1.4
-1.2
-1
-0.8
-0.6
-0.4
-0.2
0
0.2
1 10 100 1000 10000
Frequency (MHz)
S21 (dB)
5© 2014 Semtech Corporation www.semtech.com
PROTECTION PRODUCTS
RClamp0503F
Applications Information
Device Connection Options for Protection of Three
High-Speed Data Lines
This device is designed to protect three data lines from
transient over-voltages by clamping them to a fixed
reference. When the voltage on the protected line
exceeds the reference voltage (plus diode VF) the
steering diodes are forward biased, conducting the
transient current away from the sensitive circuitry.
Data lines are connected at pins 1, 3, and 4. The
negative reference is connected at pin 2. This pin
should be connected directly to a ground plane on the
board for best results. The path length is kept as short
as possible to minimize parasitic inductance.
Connect pin 5 directly to the positive supply rail (VCC).
In this configuration the data lines are referenced to
the supply voltage. The internal TVS diode prevents
over-voltage on the supply rail.
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free
replacement for SnPb lead finishes. A matte tin finish
is composed of 100% tin solder with large grains.
Since the solder volume on the leads is small com-
pared to the solder paste volume that is placed on the
land pattern of the PCB, the reflow profile will be
determined by the requirements of the solder paste.
Therefore, these devices are compatible with both
lead-free and SnPb assembly techniques. In addition,
unlike other lead-free compositions, matte tin does not
have any added alloys that can cause degradation of
the solder joint.
Data Line and Power Supply Protection Using Vcc as
reference
6© 2014 Semtech Corporation www.semtech.com
PROTECTION PRODUCTS
RClamp0503F
Outline Drawing - SC-70 5L
Land Pattern - SC-70 5L
DIMENSIONS
INCHES
Y
Z
DIM
G
P
X
CMILLIMETERS
Z
.033
.106
.039
(.073)
.026
.016
1.00
(1.85)
0.65
0.40
0.85
2.70
XDIMENSIONS
INCHES
Y
Z
DIM
G
P
X
CMILLIMETERS
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
NOTES:
1.
C
P
G
Y
.083 BSC
.026 BSC
DETAIL
5
SEE DETAIL A
.004
1 2
N
.045 .079
.049 .087
.006 -
5
0.10
1.25 2.20
2.10 BSC
0.65 BSC
.053 1.15 2.00
.012 0.15
1.35
0.30
-
PLANE
GAGE
1.80.071
0°
.012
-
.004
.010
.003
(.017)
.014
-
.028
.000
--
-
.035
0.10
0.30
8° 0° -8°
0.90
(0.42)
0.36.018
.009
0.26
0.08
.043
.039
.004 0.00
0.70
-
0.22
0.46
-
0.10
1.10
1.00
-
-
1.30 BSC.051
A
3. DIMENSIONS " E1" AN D " D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS
O R GATE BURRS.
-B-
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
DATUMS AND TO BE DETERMINED AT DATUM PLANE
NOTES:
1.
2. -A- -H-
SIDE VIEW
bxN bbb CA-B D
L
(L1) 01
c
DIM
bbb
ccc
e
L1
aaa
01
N
e1
L
c
E1
E
D
A2
A1
b
A
MILLIMETERS
NOM
INCHES
DIMENSIONS
MIN NOM MAX MIN MAX
H
0.15
Ae1
E1 E
D
E/2
e
B
ccc C
2X N/2 TIPS
D
SEATING
aaa C
PLANE
CA1
A2 A
REFERENCE JEDEC STD MO-203, VARI ATION AA.4.
7© 2014 Semtech Corporation www.semtech.com
PROTECTION PRODUCTS
RClamp0503F
Marking Code Ordering Information
Carrier Tape Specification
RailClamp and RClamp are trademarks of Semtech Corporation.
rebmuNtraPhsiniFdaeL repytQ leeR eziSleeR
TCT.F3050pmalCRniTettaM000,3hcnI7
Device Orientation in Tape
epaT
htdiW )xaM(,BD
1D
)NIM( EF
K
)XAM( P0P2P)XAM(TW
mm8 mm2.4
)561.(
mm1.0+5.1
mm0.0-
500.+95.0(
)000.-
mm0.1
)930.(
01.±057
.1
mm
)400.±960.(
50.0±5.3
mm
)200.±831.(
mm4.2
)490.(
1.0±0.4
mm
-00.±751.(
)4
1.0±0.4
mm
-00.±751.(
)4
-m50.0±0.2
m
)200.±970.(
mm4.0
)610.(
mm3.8
)210.±213.(
F53
1
F53 F53 F53 F53 F53 F53 F53 F53
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Rd., Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
