Order this document by MMSD301T1/D SEMICONDUCTOR TECHNICAL DATA The MMSD301T1, and MMSD701T1 devices are spin-offs of our popular MMBD301LT1, and MMBD701LT1 SOT-23 devices. They are designed for high-efficiency UHF and VHF detector applications. Readily available to many other fast switching RF and digital applications. Motorola Preferred Devices * Extremely Low Minority Carrier Lifetime * Very Low Capacitance * Low Reverse Leakage 2 1 Cathode 2 Anode 1 CASE 425-04, STYLE 1 SOD-123 MAXIMUM RATINGS Rating Symbol Value Unit VR 30 70 Vdc Forward Power Dissipation TA = 25C PF 225 mW Junction Temperature TJ - 55 to +125 C Tstg - 55 to +150 C Reverse Voltage MMSD301T1 MMSD701T1 Storage Temperature Range DEVICE MARKING MMSD301T1 = XT, MMSD701T1 = XH ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) Characteristic Reverse Breakdown Voltage (IR = 10 A) Diode Capacitance (VR = 0, f = 1.0 MHz, Note 1) Symbol Typ Max 30 70 -- -- -- -- -- -- 0.9 0.5 1.5 1.0 -- -- 0.9 0.5 1.5 1.0 -- -- 13 9.0 200 200 -- -- -- -- 0.38 0.52 0.42 0.7 0.45 0.6 0.5 1.0 V(BR)R MMSD301T1 MMSD701T1 MMSD301T1 MMSD701T1 Reverse Leakage (VR = 25 V) (VR = 35 V) MMSD301T1 MMSD701T1 Unit Volts CT MMSD301T1 MMSD701T1 Total Capacitance (VR = 15 Volts, f = 1.0 MHz) (VR = 20 Volts, f = 1.0 MHz) Forward Voltage (IF = 1.0 mAdc) (IF = 10 mA) (IF = 1.0 mAdc) (IF = 10 mA) Min pF CT pF IR VF MMSD301T1 MMSD701T1 nAdc nAdc Vdc Thermal Clad is a trademark of the Bergquist Company. Preferred devices are Motorola recommended choices for future use and best overall value. replaces MMSD101T1/D Small-Signal Transistors, FETs and Diodes Device Data Motorola Motorola, Inc. 1997 1 TYPICAL CHARACTERISTICS MMSD301T1 2.8 500 t , MINORITY CARRIER LIFETIME (ps) CT, TOTAL CAPACITANCE (pF) MMSD301T1 f = 1.0 MHz 2.4 2.0 1.6 1.2 0.8 0.4 0 MMSD301T1 400 KRAKAUER METHOD 300 200 100 0 0 3.0 6.0 9.0 12 15 18 21 VR, REVERSE VOLTAGE (VOLTS) 24 27 30 0 Figure 1. Total Capacitance 80 90 100 100 MMSD301T1 IF, FORWARD CURRENT (mA) MMSD301T1 IR, REVERSE LEAKAGE ( m A) 30 50 70 40 60 IF, FORWARD CURRENT (mA) 20 Figure 2. Minority Carrier Lifetime 10 TA = 100C 1.0 TA = 75C 0.1 TA = - 40C 10 TA = 85C 1.0 TA = 25C 0.01 TA = 25C 0.1 0.001 0 6.0 12 18 VR, REVERSE VOLTAGE (VOLTS) Figure 3. Reverse Leakage 2 10 24 30 0.2 0.4 0.6 0.8 VF, FORWARD VOLTAGE (VOLTS) 1.0 1.2 Figure 4. Forward Voltage Motorola Small-Signal Transistors, FETs and Diodes Device Data TYPICAL CHARACTERISTICS MMSD701T1 500 2.0 t , MINORITY CARRIER LIFETIME (ps) CT, TOTAL CAPACITANCE (pF) MMSD701T1 f = 1.0 MHz 1.6 1.2 0.8 0.4 0 MMSD701T1 400 KRAKAUER METHOD 300 200 100 0 0 5.0 10 15 20 25 30 35 VR, REVERSE VOLTAGE (VOLTS) 40 45 50 0 10 Figure 5. Total Capacitance 80 90 100 Figure 6. Minority Carrier Lifetime 10 100 MMSD701T1 MMSD701T1 IF, FORWARD CURRENT (mA) IR, REVERSE LEAKAGE ( m A) 30 50 70 40 60 IF, FORWARD CURRENT (mA) 20 TA = 100C 1.0 TA = 75C 0.1 10 TA = 85C TA = - 40C 1.0 0.01 TA = 25C TA = 25C 0.1 0.001 0 10 20 30 VR, REVERSE VOLTAGE (VOLTS) 40 50 Figure 7. Reverse Leakage Motorola Small-Signal Transistors, FETs and Diodes Device Data 0.2 0.4 0.8 1.2 VF, FORWARD VOLTAGE (VOLTS) 1.6 2.0 Figure 8. Forward Voltage 3 INFORMATION FOR USING THE SOD-123 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. SOD-123 EEEE EEEE EEEE EEEE 0.91 0.036 EEEE EEEE EEEE EEEE 2.36 0.093 4.19 0.165 1.22 0.048 mm inches SOD-123 POWER DISSIPATION The power dissipation of the SOD-123 is a function of the pad size. This can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature of the die, RJA, the thermal resistance from the device junction to ambient, and the operating temperature, TA . Using the values provided on the data sheet for the SOD-123 package, PD can be calculated as follows: PD = TJ(max) - TA RJA The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values into the equation for an ambient temperature TA of 25C, one can calculate the power dissipation of the device which in this case is 225 milliwatts. PD = 125C - 25C 444C/W = 225 milliwatts The 444C/W for the SOD-123 package assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 225 milliwatts. There are other alternatives to achieving higher power dissipation from the SOD-123 package. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal Clad. Using a board material such as Thermal Clad, an aluminum core board, the power dissipation can be doubled using the same footprint. SOLDERING PRECAUTIONS The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. * Always preheat the device. * The delta temperature between the preheat and soldering should be 100C or less.* * When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference shall be a maximum of 10C. 4 * The soldering temperature and time shall not exceed 260C for more than 10 seconds. * When shifting from preheating to soldering, the maximum temperature gradient shall be 5C or less. * After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling. * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. Motorola Small-Signal Transistors, FETs and Diodes Device Data PACKAGE DIMENSIONS A AAAA AAAA C NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. H 1 K DIM A B C D E H J K B MILLIMETERS MIN MAX 1.40 1.80 2.55 2.85 0.95 1.35 0.50 0.70 0.25 --- 0.00 0.10 --- 0.15 3.55 3.85 E 2 D INCHES MIN MAX 0.055 0.071 0.100 0.112 0.037 0.053 0.020 0.028 0.004 --- 0.000 0.004 --- 0.006 0.140 0.152 STYLE 1: PIN 1. CATHODE 2. ANODE J CASE 425-04 ISSUE C Motorola Small-Signal Transistors, FETs and Diodes Device Data 5 Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. Mfax is a trademark of Motorola, Inc. How to reach us: USA / EUROPE / Locations Not Listed: Motorola Literature Distribution; P.O. Box 5405, Denver, Colorado 80217. 303-675-2140 or 1-800-441-2447 JAPAN: Nippon Motorola Ltd.: SPD, Strategic Planning Office, 4-32-1, Nishi-Gotanda, Shinagawa-ku, Tokyo 141, Japan. 81-3-5487-8488 Mfax: RMFAX0@email.sps.mot.com - TOUCHTONE 602-244-6609 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, - US & Canada ONLY 1-800-774-1848 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852-26629298 INTERNET: http://motorola.com/sps 6 Motorola Small-Signal Transistors, FETs and DiodesMMSD301T1/D Device Data