1. General description
The 74HC393; 7474HCT393 is a dual 4-stage binary ripple counter. Each counter
features a clock input (nCP), an overriding asynchronous master reset input (nMR) and 4
buffered parallel outputs (nQ0 to nQ3). The counter advances on the HIGH-to-LOW
transition of nCP. A HIGH on nMR clears the counter stages and forces the outputs LOW ,
independent of the state of nCP. Inputs include clamp diodes. This enables the use of
current limiting resistors to interface inputs to voltages in excess of VCC.
2. Features and benefits
Input levels:
For 74HC393: CMOS level
For 74HCT393: TTL level
Complies with JEDEC standard no. 7A
ESD protection:
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-A ex ce ed s 20 0 V.
Two 4-bit binary counters with individual clocks
Divide by any binary module up to 28 in one package
Two master resets to clear each 4-bit counter individually
3. Ordering information
74HC393; 74HCT393
Dual 4-bit binary ripple counter
Rev. 6 — 3 December 2015 Product data sheet
Table 1. Ordering information
Type number Package
Temperat ur e range Name Description Version
74HC393D 40 C to +125 C SO14 plastic small outline package; 14 leads; body width 3.9 mm SOT108-1
74HCT393D
74HC393DB 40 C to +125 C SSOP14 plastic shrink small outline package; 14 leads; body width
5.3 mm SOT337-1
74HCT393DB
74HC393PW 40 C to +125 C TSSOP14 plastic thin shrink small outline package; 14 leads; body
width 4.4 mm SOT402-1
74HCT393PW
74HC393BQ 40 C to +125 C DHVQFN14 plastic dual in-line compatible thermal enhanced very thin
quad flat package; no leads; 14 terminals;
body 2.5 30.85 mm
SOT762-1
74HCT393BQ
74HC_HCT393 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 6 — 3 December 2015 2 of 19
NXP Semiconductors 74HC393; 74HCT393
Dual 4-bit binary ripp le counter
4. Functional diagram
Fig 1. Logic symbol Fig 2. IEC logic symbol
DDG
&3

05
4
4
4
4
&3




05
4
4
4
4
DDG
&7 
&7




&7 
&7
&75
&75
Fig 3. Functional diagram Fig 4. State diag ra m
DDG
&3
%,7
%,1$5<
5,33/(
&2817(5
%,7
%,1$5<
5,33/(
&2817(5
05
4
4
4
4
&3




05
4
4
4
4
DDG




 
74HC_HCT393 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 6 — 3 December 2015 3 of 19
NXP Semiconductors 74HC393; 74HCT393
Dual 4-bit binary ripp le counter
5. Pinning information
5.1 Pinning
Fig 5. Logic diagram (one co un ter)
DDG
5'
))
7&3
4
05
5'
))
7
4
5'
))
7
4
5'
))
7
4
4 4 4 4
Fig 6. Pin configuration SO14
+&
+&7
&3 9
&&
05 &3
4 05
44
44
44
*1' 4
DDD





74HC_HCT393 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 6 — 3 December 2015 4 of 19
NXP Semiconductors 74HC393; 74HCT393
Dual 4-bit binary ripp le counter
5.2 Pin description
(1) This is not a supply pin. The substrate is attached to this
pad using conductive die attach material. There is no
electrical or mechanical requirement to solder this pad.
However, if it is soldered, the solder land should remain
floating or be connected to VCC.
Fig 7. Pin configuration SSOP14 and TSSOP14 Fig 8. Pin co nfiguration DHVQFN14
+&
+&7
&3 9&&
05 &3
4 05
4 4
4 4
4 4
*1' 4
DDD





DDD
+&
7UDQVSDUHQWWRSYLHZ
WHUPLQDO
LQGH[DUHD
Table 2. Pin description
Symbol Pin Description
1CP 1 clock input (HIGH-to -LOW, edge-triggered)
1MR 2 asynchronous master reset input (active HIGH)
1Q0 3 flip-flop output
1Q1 4 flip-flop output
1Q2 5 flip-flop output
1Q3 6 flip-flop output
GND 7 ground (0 V)
2Q3 8 flip-flop output
2Q2 9 flip-flop output
2Q1 10 flip-flop output
2Q0 11 flip-flop output
2MR 12 asynchronous master reset input (active HIGH)
2CP 13 clock input (HIGH-to -LOW, edge-triggered)
VCC 14 supply voltage
74HC_HCT393 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 6 — 3 December 2015 5 of 19
NXP Semiconductors 74HC393; 74HCT393
Dual 4-bit binary ripp le counter
6. Functional description
[1] H = HIGH voltage level; L = LOW voltage level.
7. Limiting values
[1] For SO14 package: Ptot derates linearly with 8 mW/K above 70 C.
For (T)SSOP14 packages: Ptot derates linearly with 5.5 mW/K above 60 C.
For DHVQFN14 packages: Ptot derates linearly with 4.5 mW/K above 60 C.
Table 3. Count sequence for one counter [1]
Count Output
nQ0 nQ1 nQ2 nQ3
0 LLLL
1 HLLL
2LHLL
3 HHLL
4 LLHL
5HLHL
6 LHHL
7 HHHL
8 LLLH
9 HLLH
10LHLH
11HHLH
12LLHH
13HLHH
14LHHH
15HHHH
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions Min Max Unit
VCC supply voltage 0.5 +7 V
IIK input clamping current V I < 0.5 V or VI>V
CC +0.5 V - 20 mA
IOK output clamping current VO<0.5 V or VO>V
CC +0.5V - 20 mA
IOoutput curren t VO = 0.5 V to VCC +0.5V - 25 mA
ICC supply current - ±50 mA
IGND ground current - 50 mA
Tstg storage temperature 65 +150 C
Ptot total power dissipation SO14, (T)SSOP14 and DHVQFN14
package [1] -500mW
74HC_HCT393 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 6 — 3 December 2015 6 of 19
NXP Semiconductors 74HC393; 74HCT393
Dual 4-bit binary ripp le counter
8. Recommended operating conditions
9. Static characteristics
Table 5. Recommended operating con ditions
Voltages are referenced to GND (ground = 0 V)
Symbol Parameter Conditions 74HC393 74HCT393 Unit
Min Typ Max Min Typ Max
VCC supply voltage 2.0 5.0 6.0 4.5 5.0 5.5 V
VIinput voltage 0 - VCC 0-V
CC V
VOoutput voltage 0 - VCC 0-V
CC V
Tamb ambient temperature 40 +25 +125 40 +25 +125 C
t/V input transition rise and fall rate VCC = 2.0 V - - 625 - - - ns/V
VCC = 4.5 V - 1.67 139 - 1.67 139 ns/V
VCC = 6.0 V - - 83 - - - ns/V
Table 6. Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions 25 C40 C to +85 C40 C to +125 CUnit
Min Typ Max Min Max Min Max
74HC393
VIH HIGH-level
input voltage VCC = 2.0 V 1.5 1.2 - 1.5 - 1.5 - V
VCC = 4.5 V 3.15 2.4 - 3.15 - 3.15 - V
VCC = 6.0 V 4.2 3.2 - 4.2 - 4.2 - V
VIL LOW-level
input voltage VCC = 2.0 V - 0.8 0.5 - 0.5 - 0.5 V
VCC = 4.5 V - 2.1 1.35 - 1.35 - 1.35 V
VCC = 6.0 V - 2.8 1.8 - 1.8 - 1.8 V
VOH HIGH-level
output voltage VI=V
IH or VIL
IO=20 A; VCC = 2.0 V 1.9 2.0 - 1.9 - 1.9 - V
IO=20 A; VCC = 4.5 V 4.4 4.5 - 4.4 - 4.4 - V
IO=20 A; VCC = 6.0 V 5.9 6.0 - 5.9 - 5.9 - V
IO=4.0 mA; VCC = 4.5 V 3.98 4.32 - 3.84 - 3.7 - V
IO=5.2 mA; VCC = 6.0 V 5.48 5.81 - 5.34 - 5.2 - V
VOL LOW-level
output voltage VI=V
IH or VIL
IO=20A; VCC = 2.0 V - 0 0.1 - 0.1 - 0.1 V
IO=20A; VCC = 4.5 V - 0 0.1 - 0.1 - 0.1 V
IO=20A; VCC = 6.0 V - 0 0.1 - 0.1 - 0.1 V
IO= 4.0 mA ; VCC = 4.5 V - 0.15 0.26 - 0.33 - 0.4 V
IO= 5.2 mA ; VCC = 6.0 V - 0.16 0.26 - 0.33 - 0.4 V
IIinput leakage
current VI=V
CC or GND;
VCC =6.0V --0.1 - 0.1 - 0.1 A
ICC supply current VI=V
CC or GND; IO=0A;
VCC =6.0V - - 8.0 - 80 - 160 A
74HC_HCT393 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 6 — 3 December 2015 7 of 19
NXP Semiconductors 74HC393; 74HCT393
Dual 4-bit binary ripp le counter
CIinput
capacitance -3.5- - - - -pF
74HCT393
VIH HIGH-level
input voltage VCC = 4.5 V to 5.5 V 2.0 1.6 - 2.0 - 2.0 - V
VIL LOW-level
input voltage VCC = 4.5 V to 5.5 V - 1.2 0.8 - 0.8 - 0.8 V
VOH HIGH-level
output voltage VI=V
IH or VIL; VCC =4.5V
IO=20 A 4.4 4.5 - 4.4 - 4.4 - V
IO=6 mA 3.98 4.32 - 3.84 - 3.7 - V
VOL LOW-level
output voltage VI=V
IH or VIL; VCC =4.5V
IO=20A - 0 0.1 - 0.1 - 0.1 V
IO= 6.0 mA - 0.15 0.26 - 0.33 - 0.4 V
IIinput leakage
current VI=V
CC or GND;
VCC =5.5V --0.1 - 1.0 - 1.0 A
ICC supply current VI=V
CC or GND; IO=0A;
VCC =5.5V - - 8.0 - 80 - 160 A
ICC additional
supply current VI=V
CC 2.1 V;
other inputs at VCC or GND;
VCC = 4.5 V to 5.5 V; IO=0A
per input pi n; nCP - 40 144 - 180 - 196 A
per input pin; nMR - 100 360 - 450 - 490 A
CIinput
capacitance -3.5- - - - -pF
Table 6. Static characteristics …continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions 25 C40 C to +85 C40 C to +125 CUnit
Min Typ Max Min Max Min Max
74HC_HCT393 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 6 — 3 December 2015 8 of 19
NXP Semiconductors 74HC393; 74HCT393
Dual 4-bit binary ripp le counter
10. Dynamic characteristics
Table 7. Dynamic characteristics
Voltages are referenced to GND (ground = 0 V); CL = 50 pF unless otherwise specified; for test circuit see Figure 11.
Symbol Parameter Conditions 25 C40 C to +85 C40 C to +125 CUnit
Min Typ Max Min Max Min Max
74HC393
tpd propagation
delay nCP to nQ0; see Figure 9 [1]
VCC = 2.0 V - 41 125 - 155 - 190 ns
VCC = 4.5 V - 15 25 - 31 - 38 ns
VCC = 5 V; CL = 15 pF - 12 - - - - - ns
VCC = 6.0 V - 12 21 - 26 - 32 ns
nQx to nQ(x1);
see Figure 9 [1]
VCC = 2.0 V - 14 45 - 55 - 70 ns
VCC = 4.5 V - 5 9 - 11 - 14 ns
VCC = 5 V; CL = 15 pF - 5 - - - - - ns
VCC = 6.0 V - 4 8 - 9 - 12 ns
tPHL HIGH to
LOW
propagation
delay
nMR to nQx; see Figure 10
VCC = 2.0 V - 39 140 - 175 - 210 ns
VCC = 4.5 V - 14 28 - 35 - 42 ns
VCC = 5 V; CL = 15 pF - 11 - - - - - ns
VCC = 6.0 V - 11 24 - 30 - 36 ns
tttransition
time Qn; see Figure 9 [2]
VCC = 2.0 V - 19 75 - 95 - 110 ns
VCC = 4.5 V - 7 15 - 19 - 22 ns
VCC = 6.0 V - 6 13 - 16 - 19 ns
tWpulse width nCP HIGH or LOW;
see Figure 9
VCC = 2.0 V 80 17 - 100 - 120 - ns
VCC = 4.5 V 16 6 - 20 - 24 - ns
VCC = 6.0 V 14 5 - 17 - 20 - ns
nMR HIGH; see Figure 10
VCC = 2.0 V 80 19 - 100 - 120 - ns
VCC = 4.5 V 16 7 - 20 - 24 - ns
VCC = 6.0 V 14 6 - 17 - 20 - ns
trec recovery
time nMR to nC P; see Figure 10
VCC = 2.0 V 5 3 - 5 - 5 - ns
VCC = 4.5 V 5 1 - 5 - 5 - ns
VCC = 6.0 V 5 1 - 5 - 5 - ns
74HC_HCT393 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 6 — 3 December 2015 9 of 19
NXP Semiconductors 74HC393; 74HCT393
Dual 4-bit binary ripp le counter
fclk(max) maximum
clock
frequency
see Figure 9
VCC = 2.0 V 6 30 - 5 - 4 - MHz
VCC = 4.5 V 30 90 - 24 - 20 - MHz
VCC = 5 V; CL = 15 pF - 99 - - - - - MHz
VCC = 6.0 V 35 107 - 28 24 - MHz
CPD power
dissipation
capacitance
CL=50pF;f=1 MHz;
VI=GNDtoV
CC
[3] -23- - - - - pF
74HCT393
tpd propagation
delay nCP to nQ0; see Figure 9 [1]
VCC = 4.5 V - 15 25 - 31 - 38 ns
VCC =5V; C
L=15pF - 20 - - - - - ns
nQx to nQ(x1);
see Figure 9 [1]
VCC = 4.5 V - 6 10 - 13 - 15 ns
VCC =5V; C
L=15pF - 6 - - - - - ns
tPHL HIGH to
LOW
propagation
delay
nMR to nQx; see Figure 10
VCC = 4.5 V - 18 32 - 40 - 48 ns
VCC =5V; C
L=15pF - 15 - - - - - ns
tttransition
time Qn; see Figure 9 [2]
VCC = 4.5 V - 7 15 - 19 - 22 ns
tWpulse width nCP HIGH or LOW;
see Figure 9
VCC = 4.5 V 19 11 - 24 - 29 - ns
nMR HIGH; see Figure 10
VCC = 4.5 V 16 6 - 20 - 24 - ns
trec recovery
time nMR to nCP;
see Figure 10
VCC = 4.5 V 5 0 - 5 - 5 - ns
fclk(max) maximum
clock
frequency
see Figure 9
VCC = 4.5 V 27 48 - 22 - 18 - MHz
VCC =5V; C
L=15pF - 53 - - - - - MHz
Table 7. Dynamic characteristics …continued
Voltages are referenced to GND (ground = 0 V); CL = 50 pF unless otherwise specified; for test circuit see Figure 11.
Symbol Parameter Conditions 25 C40 C to +85 C40 C to +125 CUnit
Min Typ Max Min Max Min Max
74HC_HCT393 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 6 — 3 December 2015 10 of 19
NXP Semiconductors 74HC393; 74HCT393
Dual 4-bit binary ripp le counter
[1] tpd is the same as tPLH and tPHL.
[2] tt is the same as tTHL and tTLH.
[3] CPD is used to determine the dynamic power dissipation (PD in W).
PD=C
PD VCC2fiN+(CLVCC2fo) where:
fi = input frequency in MHz;
fo= output frequency in MHz;
CL= output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
(CLVCC2fo) = sum of outputs.
10.1 Waveforms
CPD power
dissipation
capacitance
CL=50pF;f=1 MHz;
VI=GNDtoV
CC 1.5 V [3] -25- - - - - pF
Table 7. Dynamic characteristics …continued
Voltages are referenced to GND (ground = 0 V); CL = 50 pF unless otherwise specified; for test circuit see Figure 11.
Symbol Parameter Conditions 25 C40 C to +85 C40 C to +125 CUnit
Min Typ Max Min Max Min Max
Measurement points are given in Table 8.
Fig 9. Propa ga tion delays clock (nCP ) to output (nQx), the output transition times and the maximum clock
frequency
DDG
9
0
9
0
W
3/+
W
7/+
W
7+/
W
3+/
LQSXWQ&3
9
,
*1'
9
2+
9
2/
I
PD[
RXWSXWQ4[
Table 8. Measurement points
Type Input Output
VMVM
74HC393 0.5VCC 0.5VCC
74HCT393 1.3 V 1.3 V
74HC_HCT393 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 6 — 3 December 2015 11 of 19
NXP Semiconductors 74HC393; 74HCT393
Dual 4-bit binary ripp le counter
Measurement points are given in Table 8.
Fig 10. Propagation delays cl oc k (nCP) to output (nQx), pulse width master reset (nMR), and recovery time
master reset (nMR) to clock (nCP)
DDG
RXWSXWQ4[
92/
92+
*1'
9,
*1'
9,
90
W3+/
90
LQSXWQ05 90
W:
WUHF
LQSXWQ&3
Test data is given in Table 9.
Definitions test circuit:
RT = termination resistance should be equal to output impedance Zo of the pulse generator.
CL = load capacitance including jig and probe capacitance.
Fig 11. Test circuit for measuring switching times
DDK
W:
W:
WU
WU
WI
90
9,
QHJDWLYH
SXOVH
*1'
9,
SRVLWLYH
SXOVH
*1'

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

9090
90
WI
9&&
'87
57
9,92
&/
*
Table 9. Test data
Type Input Load Test
VItr, tfCL
74HC393 VCC 6.0 ns 15 pF, 50 pF tPLH, tPHL
74HCT393 3.0 V 6.0 ns 15 pF, 50 pF tPLH, tPHL
74HC_HCT393 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 6 — 3 December 2015 12 of 19
NXP Semiconductors 74HC393; 74HCT393
Dual 4-bit binary ripp le counter
11. Package outline
Fig 12. Package outline SOT108-1 (SO14)
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Product data sheet Rev. 6 — 3 December 2015 13 of 19
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Product data sheet Rev. 6 — 3 December 2015 14 of 19
NXP Semiconductors 74HC393; 74HCT393
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74HC_HCT393 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 6 — 3 December 2015 15 of 19
NXP Semiconductors 74HC393; 74HCT393
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74HC_HCT393 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 6 — 3 December 2015 16 of 19
NXP Semiconductors 74HC393; 74HCT393
Dual 4-bit binary ripp le counter
12. Abbreviations
13. Revision history
Table 10. Abbreviations
Acronym Description
CMOS Complementary Metal-Oxide Semiconductor
DUT Device Under Test
ESD ElectroStatic Discharge
HBM Human Body Model
MM Machine Model
Table 11. Revision history
Document ID Release date Data sheet status Change notice Supersedes
74HC_HCT393 v.6 20151203 Product data sheet - 74HC_HCT393 v.5
Modifications: •Type numbers 74HC393N and 74HCT393N (SOT27-1) remo ved.
74HC_HCT393 v.5 20140401 Product data sheet - 74HC_HCT393 v.4
Modifications: •The conditions for CPD have been corrected (errata).
74HC_HCT393 v.4 20130516 Product data sheet - 74HC_HCT393 v.3
Modifications: •The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
•Legal texts have been adapted to the new company name where appropriate.
74HC_HCT393 v.3 20050906 Product data sheet - 74HC_HCT393_CNV v.2
74HC_HCT393_CNV v.2 19901201 Product specification - -
74HC_HCT393 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 6 — 3 December 2015 17 of 19
NXP Semiconductors 74HC393; 74HCT393
Dual 4-bit binary ripp le counter
14. Legal information
14.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of de vice(s) descr ibed in th is document m ay have cha nged since thi s document w as publish ed and may di ffe r in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
14.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liab ility for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and tit le. A short data sh eet is intended
for quick reference only and shou ld not b e relied u pon to cont ain det ailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semicond uctors sales
office. In case of any inconsistency or conflict wit h the short data sheet, the
full data sheet shall pre va il.
Product specificat ion — The information and data provided in a Product
data sheet shall define the specification of the product as agr eed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to off er functions and qualities beyond those described in the
Product data sheet.
14.3 Disclaimers
Limited warr a nty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warrant ies, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Se miconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequ ential damages (including - wit hout limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liabil ity towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all informa tion supplied prior
to the publication hereof .
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, lif e-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in perso nal injury, death or severe property or environme ntal
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconducto rs products in such equipment or
applications and ther efore such inclu sion and/or use is at the cu stomer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and ope ration of their applications
and products using NXP Semiconductors product s, and NXP Semiconductors
accepts no liability for any assistance with applicati ons or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suit able and fit for t he customer’s applications and
products planned, as well as fo r the planned application and use of
customer’s third party customer(s). Custo mers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party custo mer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms an d conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individua l agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing i n this document may be interpreted or
construed as an of fer t o sell product s that is open for accept ance or the gr ant,
conveyance or implication of any license under any copyrights, patents or
other industrial or inte llectual property rights.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contain s data from the objective specification for product development .
Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
74HC_HCT393 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 6 — 3 December 2015 18 of 19
NXP Semiconductors 74HC393; 74HCT393
Dual 4-bit binary ripp le counter
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for aut omotive use. It i s neit her qua lified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in au tomotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automot ive specifications and standards, custome r
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such au tomotive applications, use and specificatio ns, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconduct ors for an y
liability, damages or failed product claims result ing from customer design an d
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specificat ions.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
14.4 Trademarks
Notice: All referenced b rands, produc t names, service names and trademarks
are the property of their respective ow ners.
15. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to : salesaddresses@nxp.com
NXP Semiconductors 74HC393; 74HCT393
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© NXP Semiconductors N.V. 2015. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 3 December 2015
Document identifier: 74HC_HCT393
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
16. Contents
1 General description. . . . . . . . . . . . . . . . . . . . . . 1
2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 1
4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
5 Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
6 Functional description . . . . . . . . . . . . . . . . . . . 5
7 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . . . 5
8 Recommended operating conditions. . . . . . . . 6
9 Static characteristics. . . . . . . . . . . . . . . . . . . . . 6
10 Dynamic characteristics . . . . . . . . . . . . . . . . . . 8
10.1 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
11 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12
12 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 16
13 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 16
14 Legal information. . . . . . . . . . . . . . . . . . . . . . . 17
14.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17
14.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
14.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 17
14.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 18
15 Contact information. . . . . . . . . . . . . . . . . . . . . 18
16 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19