DATA SHEET
The information in this document is subject to change without notice. Before using this document, please confirm that
this is the latest version.
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices
representative for availability and additional information.
PHOTOCOUPLER
PS2706-1
AC INPUT RESPONSE
DARLINGTON TRANSISTOR
SOP MULTI PHOTOCOUPLER SERIES NEPOC Series
The mark
shows major revised poi nts.
Document No. PN10244EJ01V0DS (1st edition)
(Previous No. P11310EJ5V0DS00)
Date Published February 2003 CP(K)
Printed in Japan
NEC Compound Semiconductor Devices 1988, 2003
DESCRIPTION
The PS2706-1 is an optically coupled isolator containing a GaAs light emitting diode and an NPN silicon
darlington-connected phototransistor.
This is mounted in a plastic SOP (Small Out-line Package) for high density applications.
This package has shield effect to cut off ambient light.
FEATURES
AC input response
High current transfer ratio (CTR = 2 000 % TYP.)
High isolation voltage (BV = 3 750 Vr.m.s.)
Small and thin (SOP) package
High-speed switching (tr, tf = 200
µ
s TYP.)
Ordering number of taping product: PS2706-1F3, F4
UL approved: File No. E72422 (S)
VDE0884 approved (Option)
APPLICATIONS
•Hybrid IC
Telephone, Exchange equipment
FA/OA equipment
Programmable logic controllers
ORDERING INFORMATION
Part Number Package Safety Standard A pproval
Standard specification produc tsPS2706-1 4-pin SOP
• UL approved
PS2706-1-V 4-pin SOP VDE0884 specification produc ts (Opti on)
Data Sheet PN10244EJ01V0DS
2
PS2706-1
PACKAGE DIMENSIONS (in millimeters)
PS2706-1
4.0±0.5
7.0±0.3
4.4
0.5±0.3
0.15
+0.10
–0.05
2.0
0.1±0.1
2.1±0.2
2.54
0.4
+0.10
–0.05
0.25 M
TOP VIEW
1. Anode,Cathode
2. Cathode,Anode
3. Emitter
4. Collector
43
12
Data Sheet PN10244EJ01V0DS 3
PS2706-1
ABSOLUTE MAXIMUM RATINGS (TA = 25 °
°°
°C, unless otherwise specified)
Parameter Symbol Ratings Unit
Diode Forward Current (DC) IF±50 mA
Power Dissipati on Derating
PD/°C0.8mW/
°C
Power Dissipati on PD80 mW
Peak Forward Current*1 IFP ±1A
Transistor Collector to Emitter Voltage VCEO 40 V
Emitter to Collector Voltage VECO 6V
Collector Current IC200 mA
Power Dissipati on Derating
PC/°C1.5mW/
°C
Power Dissipati on PC150 mW
Isolat i on Voltage*2 B V 3 750 Vr.m. s .
Operating Am bi ent Tem perature TA–55 to +100 °C
Storage Temperat ure Tstg –55 to +150 °C
*1 PW = 100
µ
s, Duty Cycle = 1 %
*2 AC voltage for 1 minute at TA = 25 °C, RH = 60 % between input and output
Data Sheet PN10244EJ01V0DS
4
PS2706-1
ELECTRICAL CHARACTERISTICS (TA = 25 °
°°
°C)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
Diode Forward Voltage VFIF = ±5 mA 1.1 1.4 V
Terminal Capaci tance CtV = 0 V, f = 1 MHz 60 pF
Transistor Collector to Emitter Dark
Current ICEO IF = 0 mA, VCE = 40 V 400 nA
Coupled Current Transf er Ratio
(IC/IF)CTR IF = ±1 mA, VCE = 2 V 200 2 000 %
CTR Ratio*1 CTR1/
CTR2 IF = ±1 mA, V CE = 2 V 0.3 1.0 3.0
Collecto r Sa tu r a tio n
Voltage VCE (sat) IF = ±1 mA, I C = 2 mA 1.0 V
Isolat i on Resist ance RI-O VI-O = 1 kVDC 1011
Isolat i on Capacitanc e CI-O V = 0 V, f = 1 M Hz 0.4 pF
Rise Time *2 trVCC = 5 V, I C = 2 mA, RL = 100 200
µ
s
Fall Time *2 tf200
*1 CTR1 = IC1/IF1, CTR2 = IC2/IF2
I
F1
I
F2
I
C1
I
C2
V
CE
*2 Test circuit for switching time
PW = 1 ms,
Duty cycle = 1/10
Pulse input V
CC
V
OUT
R
L
= 100 50
I
F
Input monitor
Data Sheet PN10244EJ01V0DS 5
PS2706-1
TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise specified)
100
50
25
0
75
25 50 75 100
Ambient Temperature T
A
(˚C)
Diode Power Dissipation P
D
(mW)
DIODE POWER DISSIPATION vs.
AMBIENT TEMPERATURE 200
150
100
50
025 50 75 100
Ambient Temperature T
A
(˚C)
Transistor Power Dissipation P
C
(mW)
TRANSISTOR POWER DISSIPATION vs.
AMBIENT TEMPERATURE
1.5 mW/˚C
50 000
1
1 000
5 000
100
10
10 000
500
50
5
–60 0 40 80–40 –20 20 60 100
Ambient Temperature T
A
(˚C)
COLLECTOR TO EMITTER DARK
CURRENT vs. AMBIENT TEMPERATURE
Collector to Emitter Dark Current I
CEO
(nA)
V
CE
= 40 V
24 V
10 V
5 V
2 V
100
0.1
1
0.01
10
0.6 1.0 1.4 1.60.8 1.2
Forward Voltage V
F
(V)
Forward Current I
F
(mA)
FORWARD CURRENT vs.
FORWARD VOLTAGE
+25 ˚C
0 ˚C
–25 ˚C
–55 ˚C
T
A
= +100 ˚C
+75 ˚C
+50 ˚C
300
10
0.1
30
0.3
100
3
1
0.6 1.2 1.6
0.4 0.8 1.4
1.0
Collector Saturation Voltage V
CE (sat)
(V)
Collector Current I
C
(mA)
COLLECTOR CURRENT vs.
COLLECTOR SATURATION VOLTAGE
I
F
= 10 mA
1 mA
0.5 mA
5 mA
0.2 mA
0.1 mA
FORWARD CURRENT vs.
FORWARD VOLTAGE
Forward Voltage V
F
(V)
Forward Current I
F
(mA)
80
60
40
20
0
–40
–60
–80
–20
–1.2 0 0.4 1.2 1.6–1.6 –0.8 –0.4 0.8
Data Sheet PN10244EJ01V0DS
6
PS2706-1
1.2
0.6
0.0
0.8
1.0
0.4
0.2
025 50 100
–50 –25 75
Ambient Temperature TA (˚C)
NORMALIZED CURRENT TRANSFER
RATIO vs. AMBIENT TEMPERATURE
Normalized Current Transfer Ratio CTR
Normalized to 1.0
at TA = 25 ˚C,
IF = 1 mA, VCE = 2 V
,,,,,,,,,,,,,,,
,,,,,,,,,,,,,,,
,,,,,,,,,,,,,,,
,,,,,,,,,,,,,,,
,,,,,,,,,,,,,,,
,,,,,,,,,,,,,,,
Forward Current IF ( A)
Current Transfer Ratio CTR (%)
CURRENT TRANSFER RATIO vs.
FORWARD CURRENT
Forward Current IF (mA)
Current Transfer Ratio CTR (%)
CURRENT TRANSFER RATIO vs.
FORWARD CURRENT
1 000
5
1
500
100
50
10
50 500 5 k
100 1 k
Load Resistance RL ()
SWITCHING TIME vs.
LOAD RESISTANCE
Switching Time t ( s)
µ
VCC = 5 V, IC = 2 mA,
CTR = 2 200 %
tf
trtd
ts
5 000
1
500
1 000
50
5
100
10
50 500 5 k1 k 10 k 50 k100
Load Resistance RL ()
SWITCHING TIME vs.
LOAD RESISTANCE
Switching Time t ( s)
µ
IF = 1 mA, VCC = 5 V,
CTR = 2 200 % tf
ts
tr
td
µ
180
80
0
140
120
20
40
60
100
160
61024 8
Collector to Emitter Voltage VCE (V)
Collector Current IC (mA)
COLLECTOR CURRENT vs.
COLLECTOR TO EMITTER VOLTAGE
IF = 5 mA
0.5 mA
1 mA
2 mA
10
0
500
1 000
1 500
2 000
2 500
3 000
50 100 300
VCE = 2 V
0
1 000
2 000
3 000
4 000
5 000
6 000
7 000
8 000
9 000
10 000
10150.5
VCE = 2 V
Data Sheet PN10244EJ01V0DS 7
PS2706-1
1.2
1.0
0.0
0.4
0.2
0.8
0.6
10
2
10
3
110
4
10
5
10
6
Time (Hr)
LONG TERM CTR DEGRADATION
CTR (Relative Value)
I
F
= 1 mA, T
A
= 60 ˚C
I
F
= 1 mA, T
A
= 25 ˚C
–10
–20
0
–5
–15
5
100
0.5 10.1 5 10 50
Frequency f (kHz)
Normalized Gain G
V
FREQUENCY RESPONSE
I
F
= 1 mA,
V
CE
= 2 V
R
L
= 100
Remark The graphs indicate nominal characteristics.
Data Sheet PN10244EJ01V0DS
8
PS2706-1
TAPING SPECIFICATIONS (in millimeters)
Tape Direciton
Outline and Dimensions (Reel)
Packing: 3 500 pcs/reel
2.0±0.5
R 1.0
13.0±0.2
φ
21.0±0.8
φ
330±2.0
φ
100±1.0
φ
2.0±0.5
11.9 to 15.4
Outer edge of
flange
17.5±1.0
13.5±1.0
13.0±0.2
φ
PS2706-1-F3 PS2706-1-F4
1.55±0.1
2.0±0.05
4.0±0.1
1.75±0.1
4.6±0.1
2.9 MAX.
0.3
8.0±0.1
Outine and Dimensions (Tape)
2.4±0.1
1.5+0.1
–0
7.4±0.1
5.5±0.05
12.0±0.2
Data Sheet PN10244EJ01V0DS 9
PS2706-1
NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
Peak reflow temperature 260°C or below (package surface temperature)
Time of peak reflow temperature 10 seconds or less
Time of temperature higher than 220°C 60 seconds or less
Time to preheat temperature from 120 to 180°C 120±30 s
Number of reflows Three
Flux Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
120±30 s
(preheating)
220˚C
180˚C
Package Surface Temperature T (˚C)
Time (s)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
to 60 s
260˚C MAX.
120˚C
(2) Wave soldering
Temperature 260°C or below (molten solder temperature)
Time 10 seconds or less
Preheating conditions 120°C or below (package surface temperature)
Number of times One (Allowed to be dipped in solder including plastic mold portion.)
Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
(3) Cautions
•Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
2. Cautions regarding noise
Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between
collector-emitters at startup, the output side may enter the on state, even if the voltage is within the absolute
maximum ratings.
Data Sheet PN10244EJ01V0DS
10
PS2706-1
USAGE CAUTIONS
1. Protect against static electricity when handling.
2. Avoid storage at a high temperature and high humidity.
Data Sheet PN10244EJ01V0DS 11
PS2706-1
SPECIFICATION OF VDE MARKS LICENSE DOCUMENT (VDE0884)
Parameter Symbol Speck Unit
Applic at i on class i ficat i on (DIN VDE 0109)
for rated li ne v ol tages 300 Vr. m.s.
for rated li ne v ol tages 600 Vr. m.s. IV
III
Climati c test clas s (DIN IE C 68 Tei l 1/09.80) 55/100/21
Dielect ri c strength
maximum operating isolation voltage
Test v ol t age (partial dis charge test, procedure a for type test and random test)
Upr = 1.2 × UIORM, Pd < 5 pC
UIORM
Upr
710
850 Vpeak
Vpeak
Test v ol t age (partial dis charge test, procedure b for all devi ces test)
Upr = 1.6 × UIORM, Pd < 5 pC Upr 1 140 Vpeak
Highest perm i ssible overvolt age UTR 6 000 Vpeak
Degree of pollut i on (DI N V DE 0109) 2
Clearance dis tance > 5mm
Creepage distance > 5mm
Comparativ e tracki ng i ndex (DIN IE C 112/ VDE 0303 part 1) CTI 175
Material group (DIN VDE 0109) III a
Storage tem perature range Tstg 55 to +150 °C
Operating tem perat ure range TA–55 to +100 °C
Isolat i on resist ance, mi ni m um value
VIO = 500 V dc at T A = 25 °C
VIO = 500 V dc at T A M AX. at l east 100 °CRis MIN.
Ris MIN. 1012
1011
Safety maxi m um ratings (maximum perm i ssibl e i n c ase of faul t, see thermal
derating curve)
Package temperature
Current (input c urrent IF, Psi = 0)
Power (output or total power dissipat i on)
Isolat i on resist ance
VIO = 500 V dc at T A = 175 °C (T si)
Tsi
Isi
Psi
Ris MIN.
150
200
300
109
°C
mA
mW
Data Sheet PN10244EJ01V0DS
12
PS2706-1
M8E 00. 4 - 0110
The information in this document is current as of February, 2003. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or
data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all
products and/or types are available in every country. Please check with an NEC sales representative
for availability and additional information.
No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness
to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd.
and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
NEC Compound Semiconductor Devices Hong Kong Limited
Hong Kong Head Office
Taipei Branch Office
Korea Branch Office
TEL: +852-3107-7303
TEL: +886-2-8712-0478
TEL: +82-2-558-2120
FAX: +852-3107-7309
FAX: +886-2-2545-3859
FAX: +82-2-558-5209
NEC Electronics (Europe) GmbH http://www.ee.nec.de/
TEL: +49-211-6503-01 FAX: +49-211-6503-487
California Eastern Laboratories, Inc. http://www.cel.com/
TEL: +1-408-988-3500 FAX: +1-408-988-0279
0302
NEC Compound Semiconductor Devices, Ltd.
5th Sales Group, Sales Division TEL: +81-44-435-1588 FAX: +81-44-435-1579 E-mail: salesinfo@csd-nec.com
For further information, please contact
PS2706-1
SAFETY INFORMATION ON THIS PRODUCT
Caution GaAs Products The product cont ains gallium arsenide, GaA s.
GaAs vapor and powder are hazardous to human health if inhaled or inges ted.
Do not destroy or burn the product.
Do not cut or cleave of f any part of the product .
Do not crush or chemic al l y di ssolve the product .
Do not put the product in t he m outh.
Follow related l aws and ordinances for dispos al . The product should be exc l uded from general
industri al was te or household garbage.