Features
l For surface mount applications in in order to optimize
board space
l Low profile package
l Fast response time: typical less than 1.0ps from 0 volts to
VBR minimum
l Low inductance
Mechanical Data
l CASE: JEDEC DO-214AA
l Terminals: solderable per MIL-STD-750, Method 2026
l Polarity: Color band denotes positive end (cathode)
except Bidirectional
l Maximum soldering temperature: 250oC for 10 seconds
Maximum Ratings @ 25oC Unless Otherwise Specified
Peak Pulse Current on
10/1000us waveform IPP See Table 1 Note: 1
Peak Pulse Power
Dissipation PPP 600W Note: 1,
Peak Forward Surge
Current IFSM) 100A Note: 3
Operation And Storage
Temperature Range TJ, TSTG-55oC to
+150oC
NOTES:
1. Non-repetitive current pulse, per Fig.3 and derated above
TA=25oC per Fig.2.
2. Mounted on 5.0mm2 copper pads to each terminal.
3. 8.3ms, single half sine wave duty cycle=4 pulses per. Minute
maximum.
SMB
JP6KE6.8(C)A
THRU
SMBJP6KE550(C)A
Transient
Voltage Suppressor
6.8 to 550 Volts
600 Watt
www.mccsemi.com
l Excellent clamping capability
DO-214AA
(SMBJ) (LEAD FRAME)
0.050”
0.106"
0.082”
SUGGESTED SOLDER
PAD LAYOUT
omponents
20736 Marilla Street Chatsworth
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MCC
Revision: 2 2005/05/19
DIMENSIONS
INCHES MM
DIM MIN MAX MIN MAX NOTE
A .160 .185 4.06 4.70
B .130 .155 3.30 3.94
C .006 .012 0.15 0.31
D ..030 . 06 0 0. 76 1..52
E .200 .220 5.08 5.59
F .079 .096 2.00 2.44
G .075 .087 1.91 2.21
H .002 .008 0.05 0.203
A
B
D
C
E
F
G
H
l UL Recognized File # E222849