CREAT BY ART
- Glass passivated junction chip
- Ideal for automated placement
- Low profile package
- Low power loss, high efficiency
- Moisture sensitivity level: level 1, per J-STD-020
- Halogen-free according to IEC 61249-2-21 definition
Molding compound, UL flammability classification rating 94V-0
Base P/N with suffix "G" on packing code - green compound (halogen-free)
Base P/N with prefix "H" on packing code - AEC-Q101 qualified
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 1A whisker test
with prefix "H" on packing code meet JESD 201 class 2 whisker test
EAL EBL ECL EDL EFL EGL EHL EJL
V
RRM
50 100 150 200 300 400 500 600 V
V
RMS
35 70 105 140 210 280 350 420 V
V
DC
50 100 150 200 300 400 500 600 V
I
F(AV)
A
Cj pF
Trr ns
T
JO
C
T
STG O
C
Document Number: DS_D1405035 Version: I14
Note 3: Reverse Recovery Test Conditions: I
F
=0.5A, I
R
=1.0A, I
RR
=0.25A
Taiwan Semiconductor
ES
1HL
0.95 1.3 1.7
10 8
35
Operating junction temperature range - 55 to +150
Storage temperature range - 55 to +150
Note 1: Pulse test with PW=300μs, 1% duty cycle
Note 2: Measured at 1 MHz and Applied VR=4.0 Volts.
A
Maximum instantaneous forward voltage (Note 1)
@ 1 A V
F
V
Maximum reverse current @ rated VR T
J
=25 ℃
T
J
=125 ℃
O
C/W
1
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load I
FSM
Typical junction capacitance (Note 2)
Maximum reverse recovery time (Note 3)
Typical thermal resistance R
θJL
R
θJA
35
85
PARAMETER SYMBOL ES
1AL
I
R
5μA
100
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
Polarity: Indicated by cathode band
Weight: 0.019 g (approximately)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (T
A
=25℃ unless otherwise noted)
30
ES
1FL
ES
1GL
ES
1JL UNIT
Marking code
Maximum repetitive peak reverse voltage
ES1AL thru ES1JL
Surface Mount Su
er Fast Rectifiers
FEATURES
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
ES
1BL
ES
1CL
ES
1DL
MECHANICAL DATA
Case: Sub SMA Sub SMA