SFH 3710
1Version 1.4 | 2018-11-26
Produktdatenblatt | Version 1.1
www.osram-os.com
Applications
SFH 3710
CHIPLED®
Silicon NPN Phototransistor with V
λ
Characteristics
Accent (BAR)
Area Lights
Backlighting (Smartphone, Tablet)
Electronic Equipment
Features:
Package: clear epoxy
ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
Spectral range of sensitivity: (typ) 350 ... 950 nm
Adapted to human eye sensitivity (V
λ
)
Very small SMT package
Ordering Information
Type Photocurrent Ordering Code
VCE = 5 V;
λ
= 560 nm; Ee = 0.01 mW/cm²
IPCE
SFH 3710-Z 2.5 ... 12.5 µA Q65110A3107
SFH 3710-3/4-Z 4.0 ... 12.5 µA Q65110A3511
SFH 3710-2/3-Z 2.5 ... 8.0 µA Q65110A3512
Single bins on request.
SFH 3710
2Version 1.4 | 2018-11-26
Maximum Ratings
TA = 25 °C
Parameter Symbol Values
Operating temperature Top min.
max.
-40 °C
85 °C
Storage temperature Tstg min.
max.
-40 °C
85 °C
Collector-emitter voltage VCE max. 5.5 V
Collector current ICmax. 20 mA
Emitter-collector voltage VEC max. 0.5 V
ESD withstand voltage
acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
VESD max. 2 kV
SFH 3710
3Version 1.4 | 2018-11-26
Characteristics
TA = 25 °C
Parameter Symbol Values
Wavelength of max sensitivity λS max typ. 570 nm
Spectral range of sensitivity λ10% typ. 350 ... 950 nm
Dimensions of chip area L x W typ. 0.75 x 0.75
mm x mm
Radiant sensitive area A typ. 0.29 mm²
Half angle φtyp. 60 °
Photocurrent
VCE = 5 V; Std. Light A; Ev = 1000 lx
IPCE typ. 350 µA
Dark current
VCE = 5 V; E = 0
ICE0 typ.
max.
3 nA
50 nA
Collector-emitter saturation voltage 1)
IC = IPCE,min X 0.3; Ee = 0.01 mW/cm²
VCEsat typ. 100 mV
Capacitance
VCE = 0 V; f = 1 MHz; E = 0
CCE typ. 4 pF
Temperature coe󰘲cient of sensitivity
λ = 550 nm
TCItyp. 0.78 % / K
Temperature coe󰘲cient of sensitivity
Std. Light A
TCItyp. 0.9 % / K
SFH 3710
4Version 1.4 | 2018-11-26
Grouping
TA = 25 °C
Group Photocurrent Photocurrent
VCE = 5 V;
λ
= 560 nm; Ee = 0.01 mW/cm² VCE = 5 V;
λ
= 560 nm; Ee = 0.01 mW/cm²
min. max.
IPCE IPCE
2 2.5 µA 5.0 µA
3 4.0 µA 8.0 µA
4 6.3 µA 12.5 µA
Relative Spectral Sensitivity 2), 3)
Srel = f (λ)
400
0nm
%
OHF04047
20
40
60
80
100
λ
rel
S
10
30
50
70
500 600 700 800 900 1100
SFH 3710
5Version 1.4 | 2018-11-26
Directional Characteristics 2), 3)
Srel = f (φ)
OHF01402
90
80
70
60
50
40 30 20 10
20 40 60 80 100 1200.40.60.81.0
ϕ
0.2
0.4
0.6
0.8
1.0
100 0
0
0
Photocurrent 2), 3)
IPCE = f (Ev);
mA
OHF04055
PCE
I
V
E
10
0
10
1
10
2
10
3
10
4
10
5
lx
-4
10
-3
10
10
-2
-1
10
10
0
1
10
10
2
Photocurrent 2), 3)
IPCE = f (Ev);
0
%
OHF04056
20
40
60
80
100
10
30
50
70
V
E
10
0
10
1
10
2
10
3
10
4
10
5
lx
PCE rel
I
SFH 3710
6Version 1.4 | 2018-11-26
Collector-Emitter Capacitance 2), 3)
CCE = f (VCE); f = 1 MHz; E = 0 ;
0
pF
OHF04052
CE
C
CE
V
10
-3
10
-2
10
-1
10
0
10
1
10
2
V
0.5
1.0
1.5
2.0
2.5
3.0
4.0
SFH 3710
7Version 1.4 | 2018-11-26
Dimensional Drawing 4)
GEOY7009
0.5 (0.020)
0.3 (0.012)
0.4 (0.016)
0.2 (0.008)
0.65 (0.026)
0.95 (0.037)
1.5 (0.059)
1.3 (0.051)
1.35 (0.053)
1.15 (0.045)
1.0 (0.039)
0.8 (0.031)
1.9 (0.075)
2.1 (0.083)
Collector mark
Approximate Weight: 3.8 mg
Package marking: Collector
SFH 3710
8Version 1.4 | 2018-11-26
Recommended Solder Pad 4)
OHFP2578
3.2
1.25
1
Component location on pad
Bauteil positioniert
Reflow Soldering Profile
Product complies to MSL Level 2 acc. to JEDEC J-STD-020E
0
0s
OHA04525
50
100
150
200
250
300
50 100 150 200 250 300
t
T
˚C
S
t
t
P
t
T
p
240 ˚C
217 ˚C
245 ˚C
25 ˚C
L
SFH 3710
9Version 1.4 | 2018-11-26
Pro󰘰le Feature Symbol Pb-Free (SnAgCu) Assembly Unit
Minimum Recommendation Maximum
Ramp-up rate to preheat*)
25 °C to 150 °C
2 3 K/s
Time tS
TSmin to TSmax
tS60 100 120 s
Ramp-up rate to peak*)
TSmax to TP
2 3 K/s
Liquidus temperature TL217 °C
Time above liquidus temperature tL80 100 s
Peak temperature TP245 260 °C
Time within 5 °C of the speci󰘰ed peak
temperature TP - 5 K
tP10 20 30 s
Ramp-down rate*
TP to 100 °C
3 6 K/s
Time
25 °C to TP
480 s
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; ful󰘰llment for the whole T-range
Taping 4)
SFH 3710
10 Version 1.4 | 2018-11-26
Tape and Reel 5)
D
0
2
P
P
0
1
P
W
FE
Direction of unreeling
N
W
1
2
W
A
OHAY0324
Label
Leader:
Trailer:
13.0
Direction of unreeling
±0.25
min. 160 mm *
min. 400 mm *
*) Dimensions acc. to IEC 60286-3; EIA 481-D
Reel dimensions [mm]
A W Nmin W1W2 max Pieces per PU
180 mm 8 + 0.3 / - 0.1 60 8.4 + 2 14.4 3000
SFH 3710
11 Version 1.4 | 2018-11-26
Barcode-Product-Label (BPL)
Dry Packing Process and Materials 4)
OHA00539
OSRAM
Moisture-sensitive label or print
Barcode label
Desiccant
Humidity indicator
Barcode label
OSRAM
Please check the HIC immidiately after
bag opening.
Discard if circles overrun.
Avoid metal contact.
WET
Do not eat.
Comparator
check dot
parts still adequately dry.
examine units, if necessary
examine units, if necessary
5%
15%
10%
bake units
bake units
If wet,
change desiccant
If wet,
Humidity Indicator
MIL-I-8835
If wet,
Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours
a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or
reflow, vapor-phase reflow, or equivalent processing (peak package
2. After this bag is opened, devices that will be subjected to infrared
1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH).
Moisture Level 5a
at factory conditions of
(if blank, seal date is identical with date code).
a) Mounted within
b) Stored at
body temp.
3. Devices require baking, before mounting, if:
Bag seal date
Moisture Level 1
Moisture Level 2
Moisture Level 2a
4. If baking is required,
b) 2a or 2b is not met.
Date and time opened:
reference IPC/JEDEC J-STD-033 for bake procedure.
Floor time see below
If blank, see bar code label
Floor time > 1 Year
Floor time 1 Year
Floor time 4 Weeks
10% RH.
_
<
Moisture Level 4
Moisture Level 5
˚C).
OPTO SEMICONDUCTORS
MOISTURE SENSITIVE
This bag contains
CAUTION
Floor time 72 Hours
Floor time 48 Hours
Floor time 24 Hours
30 ˚C/60% RH.
_
<
LEVEL
If blank, see
bar code label
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.
SFH 3710
12 Version 1.4 | 2018-11-26
Transportation Packing and Materials 4)
OHA02044
PACKVAR:
R077
Additional TEXT
P-1+Q-1
Multi TOPLED
Muster
OSRAM Opto
Semiconductors
(6P) BATCH NO:
(X) PROD NO:
1
0
(9D) D/C:
11
(1T) LOT NO:
210021998
123GH1234
02
4 5
(Q)QTY:
2000
0144
(G) GROUP:
260 C RT
240 C R
3
220 C R
ML
Bin3:
Bin2: Q-1-20
Bin1: P-1-20
LSY T676
2
2a
Temp ST
R18
DEMY
PACKVAR:
R077
Additional TEXT
P-1+Q-1
Multi TOPLED
Muster
OSRAM Opto
Semiconductors
(6P) BATCH NO:
(X) PROD NO:
1
0
(9D) D/C:
11
(1T) LOT NO:
210021998
123GH1234
024 5
(Q)QTY:
2000
0144
(G) GROUP:
260 C RT
240 C R
3
220 C R
ML
Bin3:
Bin2: Q-1-20
Bin1: P-1-20
LSY T676
2
2a
Temp ST
R18
DEMY
OSRAM
Packing
Sealing label
Barcode label
Moisture Level 3 Floor time 168 Hours Moisture Level 6Floor time 6 Hours
a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or
reflow, vapor-phase reflow, or equivalent processing (peak package
2. After this bag is opened, devices that will be subjected to infrared
1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH).
Moisture Level 5a
at factory conditions of
(if blank, seal date is identical with date code).
a) Mounted within
b) Stored at
body temp.
3. Devices require baking, before mounting, if:
Bag seal date
Moisture Level 1
Moisture Level 2
Moisture Level 2a
4. If baking is required,
b) 2a or 2b is not met.
Date and time opened:
reference IPC/JEDEC J-STD-033 for bake procedure.
Floor time see below
If blank, see bar code label
Floor time > 1 Year
Floor time 1 Year
Floor time 4 Weeks
10% RH.
_
<
Moisture Level 4
Moisture Level 5
˚C).
OPTO SEMICONDUCTORS
MOISTURE SENSITIVE
This bag contains
CAUTION
Floor time 72 Hours
Floor time 48 Hours
Floor time 24 Hours
30 ˚C/60% RH.
_
<
LEVEL
If blank, see
bar code label
Barcode label
Dimensions of transportation box in mm
Width Length Height
200 ± 5 mm 195 ± 5 mm 30 ± 5 mm
SFH 3710
13 Version 1.4 | 2018-11-26
Notes
The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of
lamps and lamp systems). Within the risk grouping system of this IEC standard, the device speci󰘰ed in this
data sheet falls into the class exempt group (exposure time 10000 s). Under real circumstances (for expo-
sure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the
eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light
sources have a high secondary exposure potential due to their blinding e󰘯ect. When looking at bright light
sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irrita-
tion, annoyance, visual impairment, and even accidents, depending on the situation.
Subcomponents of this device contain, in addition to other substances, metal 󰘰lled materials including silver.
Metal 󰘰lled materials can be a󰘯ected by environments that contain traces of aggressive substances. There-
fore, we recommend that customers minimize device exposure to aggressive substances during storage,
production, and use. Devices that showed visible discoloration when tested using the described tests above
did show no performance deviations within failure limits during the stated test duration. Respective failure
limits are described in the IEC60810.
For further application related informations please visit www.osram-os.com/appnotes
SFH 3710
14 Version 1.4 | 2018-11-26
Disclaimer
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may
contain dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please 󰘰nd the latest version on the OSRAM OS webside.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest
sales o󰘲ce.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For
packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to
invoice you for any costs incurred.
Product safety devices/applications or medical devices/applications
OSRAM OS components are not developed, constructed or tested for the application as safety relevant
component or for the application in medical devices.
In case Buyer – or Customer supplied by Buyer– considers using OSRAM OS components in product safety
devices/applications or medical devices/applications, Buyer and/or Customer has to inform the local sales
partner of OSRAM OS immediately and OSRAM OS and Buyer and /or Customer will analyze and coordi-
nate the customer-speci󰘰c request between OSRAM OS and Buyer and/or Customer.
SFH 3710
15 Version 1.4 | 2018-11-26
Glossary
1) IPCEmin: IPCEmin is the min. photocurrent of the speci󰘰ed group.
2) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devic-
es, the typical data or calculated correlations of technical parameters can only re󰘱ect statistical 󰘰gures.
These do not necessarily correspond to the actual parameters of each single product, which could dif-
fer from the typical data and calculated correlations or the typical characteristic line. If requested, e.g.
because of technical improvements, these typ. data will be changed without any further notice.
3) Testing temperature: TA = 25°C
4) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are speci󰘰ed with ±0.1 and
dimensions are speci󰘰ed in mm.
5) Tape and Reel: All dimensions and tolerances are speci󰘰ed acc. IEC 60286-3 and speci󰘰ed in mm.
SFH 3710
16 Version 1.4 | 2018-11-26
Published by OSRAM Opto Semiconductors GmbH
Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com © All Rights Reserved.