NX25P16-VFI-G - Winbond Electronics Corporation America

W25P80 / W25P16 / W25P32

Publication Release Date: December 11, 2005

- 1 - Revision J

8M-BIT, 16M-BIT AND 32M-BIT

SERIAL FLASH MEMORY

Formally NexFlash NX25P80, NX25P16 and NX25P32

The Winbond W25P80/16/32 are fully compatible with the previous NexFlash

NX25P80/16/32 Serial Flash memories.

W25P80 / W25P16 / W25P32

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Table of Contents-

1. GENERAL DESCRIPTION ......................................................................................................... 4

2. FEATURES ................................................................................................................................. 4

3. PIN CONFIGURATION 208-MIL................................................................................................. 5

4. PIN DESCRIPTION 208-MIL ...................................................................................................... 5

5. PIN CONFIGURATION 300-MIL................................................................................................. 6

6. PIN DESCRIPTION 300-MIL ...................................................................................................... 6

6.1 Package Types ............................................................................................................... 7

6.2 Chip Select (/CS) ............................................................................................................ 7

6.3 Serial Data Output (DO) ................................................................................................. 7

6.4 Write Protect (/WP)......................................................................................................... 7

6.5 HOLD (/HOLD) ............................................................................................................... 7

6.6 Serial Clock (CLK) .......................................................................................................... 7

6.7 Serial Data Input (DI) ...................................................................................................... 7

7. BLOCK DIAGRAM ...................................................................................................................... 8

8. FUNCTIONAL DESCRIPTION ................................................................................................... 9

8.1 SPI OPERATIONS ......................................................................................................... 9

8.1.1 SPI Modes........................................................................................................................9

8.1.2 HOLD Function.................................................................................................................9

8.2 WRITE PROTECTION.................................................................................................... 9

8.2.1 Write Protect Features......................................................................................................9

9. CONTROL AND STATUS REGISTERS................................................................................... 10

9.1 STATUS REGISTER .................................................................................................... 10

9.1.1 BUSY..............................................................................................................................10

9.1.2 Write Enable Latch (WEL) ..............................................................................................10

9.1.3 Block Protect Bits (BP2, BP1, BP0)................................................................................11

9.1.4 Reserved Bits .................................................................................................................11

9.1.5 Status Register Protect (SRP)........................................................................................11

9.1.6 Status Register Memory Protection ................................................................................12

9.2 INSTRUCTIONS........................................................................................................... 13

9.2.1 Manufacturer and Device Identification...........................................................................13

9.2.2 Instruction Set (1).............................................................................................................14

9.2.3 Write Disable (04h).........................................................................................................15

9.2.4 Write Enable (06h)..........................................................................................................15

9.2.5 Read Status Register (05h) ............................................................................................16

9.2.6 Write Status Register (01h) ............................................................................................17

9.2.7 Read Data (03h) .............................................................................................................18

W25P80 / W25P16 / W25P32

Publication Release Date: December 11, 2005

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9.2.8 Fast Read (0Bh) .............................................................................................................19

9.2.9 Page Program (02h) .......................................................................................................20

9.2.10 Sector Erase (D8h).......................................................................................................21

9.2.11 Chip Erase (C7h)..........................................................................................................22

9.2.12 Power-down (B9h) ........................................................................................................23

9.2.13 Release Power-down / Device ID (ABh) .......................................................................23

9.2.14 Read Manufacturer / Device ID (90h) ...........................................................................25

9.2.15 JEDEC ID (9Fh)............................................................................................................26

9.2.16 Read Parameter Page (53h).........................................................................................27

9.2.17 Fast Read Parameter Page (5Bh) ................................................................................28

9.2.18 Program Parameter Page (52h) ...................................................................................29

9.2.19 Erase Parameter Page (D5h) .......................................................................................31

10. ELECTRICAL CHARACTERISTICS......................................................................................... 32

10.1 Absolute Maximum Ratings (1) .................................................................................... 32

10.2 Operating Ranges......................................................................................................... 32

10.3 Power-up Timing and Write Inhibit Threshold .............................................................. 33

10.4 DC Electrical Characteristics (Preliminary)(1) .............................................................. 34

10.5 AC Measurement Conditions........................................................................................ 35

10.6 AC Electrical Characteristics ........................................................................................ 36

10.7 Serial Output Timing ..................................................................................................... 38

10.8 Input Timing .................................................................................................................. 38

10.9 Hold Timing................................................................................................................... 38

11. PACKAGE SPECIFICATION .................................................................................................... 39

11.1 8-Pin SOIC 208-mil (Winbond Package Code SS) (NexFlash Package Code S)........ 39

11.2 16-Pin SOIC 300-mil (Winbond Package Code SF)(NexFlash Package Code F)....... 40

12. ORDERING INFORMATION .................................................................................................... 41

13. REVISION HISTORY ................................................................................................................42

W25P80 / W25P16 / W25P32

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1. GENERAL DESCRIPTION

The W25P80 (8M-bit), W25P16 (16M-bit) and W25P32 (32M-bit) Serial Flash memories provide a

storage solution for systems with limited space, pins and power. They are ideal for code download

applications as well as storing voice, text and data. The devices operate on a single 2.7V to 3.6V

power supply with current consumption as low as 4mA active and 1µA for power-down. Devices are

offered in space-saving SOIC packages. As part of a family of Serial Flash products, Winbond also

offers compatible devices in 1M/2M/4M-bit densities.

The W25P80/16/32 array is organized into 4,096/8,192/16,384 programmable pages of 256-bytes

each. Up to 256 bytes can be programmed at a time using the Page Program instruction. Pages are

grouped into 16/32/64 erasable sectors of 256 pages (64K-byte) each as shown in figure 2. Both

Sector Erase and Chip (full chip) Erase instructions are supported. Additionally, a 256-byte Parameter

Page is provided for user data that is typically stored in EEPROMs such as ID or revision numbers

and configuration parameters. The parameter page is separate from the main array allowing for much

faster erase times.

The Serial Peripheral Interface (SPI) consists of four pins (Serial Clock, Chip Select, Serial Data In

and Serial Data Out) that support high speed serial data transfers up to 50MHz. A Hold pin, Write

Protect pin and programmable write protect features provide further control flexibility. Additionally, the

device can be queried for manufacturer and device type.

The Winbond W25P80/16/32 are fully compatible with the previous NexFlash NX25P80/16/32 Serial

Flash memories.

2. FEATUR ES

• 8M / 16M / 32M-bit Serial Flash Memories

• Family of Serial Flash Memories

– W25P80: 8M-bit/1M-byte (1,048,576)

– W25P16: 16M-bit/2M-byte (2,097,152)

– W25P32: 32M-bit/4M-byte (4,194,304)

– 256-bytes per programmable page

– Compatible 1M/2M/4M-bit devices

• 4-pin SPI Serial Interface

– Clock, Chip Select, Data In, Data Out

– Easily interfaces to popular microcontrollers

– Compatible with SPI Modes 0 and 3

– Optional Hold function for SPI flexibility

• Low Power Consumption, Wide

Temperature Range

– Single 2.7 to 3.6V supply

– 4mA active current, 1µA Power-down (typ)

– -40° to +85°C operating range

• Fast and Flexible Serial Data Access

– Clock operation to 50MHz

– Auto-increment Read capability

– Manufacturer and device type ID

• Programming Features

– Page program up to 256 bytes in 3.5ms

– Sector Erase (64K-byte) 0.6 seconds

– 100,000 erase/write cycles

– Twenty-year data retention

• Software and Hardware Write Protection

– Write-Protect all or portion of memory

– Enable/Disable protection with /WP pin

• Parameter Page

– 256 Byte page for ID# revision# or

configuration data

– Separate from array, erase time <200ms

• Space Saving Packaging

– 8-pin SOIC (W25P80 and W25P16)

– 16-pin SOIC (W25P16 and W25P32)

• Ideal for systems with limited pins, space,

and power

– Controller-based serial code-download

– µC systems storing data, text or voice

– Battery-operated and portable products

W25P80 / W25P16 / W25P32

Publication Release Date: December 11, 2005

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3. PIN CONFIGURATION 208-MIL

Figure 1a. W25P80/16 Pin Assignments, 8-pin SOIC 208-mi

4. PIN DESCRIPTION 208-MIL

PIN NO. PIN NAME I/O FUNCTION

1 /CS I Chip Select Input

2 DO O Data Output

3 /WP I Write Protect Input

4 GND Ground

5 DI I Data Input

6 CLK I Serial Clock Input

7 /HOLD I Hold Input

8 VCC Power Supply

W25P80 / W25P16 / W25P32

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5. PIN CONFIGURATION 300-MIL

Figure 1b. W25P16/32 Pin Assignments, 16-pin SOIC 300-mil

6. PIN DESCRIPTION 300-MIL

PAD NO. PAD NAME I/O FUNCTION

1 /HOLD I Hold Input

2 VCC Power Supply

3 N/C No Connect

4 N/C No Connect

5 N/C No Connect

6 N/C No Connect

7 /CS I Chip Select Input

8 DO O Data Output

9 /WP I Write Protect Input

10 GND Ground

11 N/C No Connect

12 N/C No Connect

13 N/C No Connect

14 N/C No Connect

15 DI I Data Input

16 CLK I Serial Clock Input

W25P80 / W25P16 / W25P32

Publication Release Date: December 11, 2005

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6.1 Package Types

The W25P80/16/32 are primarily offered in SOIC packages. The W25P80 and W25P16 use an 8-pin

plastic 208-mil width SOIC (Winbond package code SS) (NexFlash package code S) and the W25P16

and W25P32 use a 16-pin plastic 300-mil width SOIC (Winbond package code SF) (NexFlash

package code F) as shown in figures 1A and 1B respectively. Package diagrams and dimensions are

illustrated at the end of this data sheet. Optional 8-contact MLP packages may be available. Please

contact Winbond for further MLP package information.

6.2 Chip Select (/CS)

The SPI Chip Select (/CS) pin enables and disables device operation. When /CS is high the device is

deselected and the Serial Data Output (DO) pin is at high impedance. When deselected, the devices

power consumption will be at standby levels unless an internal erase, program or status register cycle

is in progress. When /CS is brought low the device will be selected, power consumption will increase

to active levels and instructions can be written to and data read from the device. After power-up, /CS

must transition from high to low before a new instruction will be accepted. The /CS input must track

the VCC supply level at power-up (see “Write Protection” and figure 16). If needed a pull-up resister

on /CS can be used to accomplish this.

6.3 Serial Data Output (DO)

The SPI Serial Data Output (DO) pin provides a means for data and status to be serially read from

(shifted out of) the device. Data is shifted out on the falling edge of the Serial Clock (CLK) input pin.

6.4 Write Protect (/WP)

The Write Protect (/WP) pin can be used to prevent the Status Register from being written. Used in

conjunction with the Status Register’s Block Protect (BP2, BP1, and BP0) bits and Status Register

Protect (SRP) bits, a portion or the entire memory array can be hardware protected. The /WP pin is

active low.

6.5 HOLD (/HOLD)

The /HOLD pin allows the device to be paused while it is actively selected. When /HOLD is brought

low, while /CS is low, the DO pin will be at high impedance and signals on the DI and CLK pins will be

ignored (don’t care). When /HOLD is brought high, device operation can resume. The /HOLD function

can be useful when multiple devices are sharing the same SPI signals. (“See Hold function”)

6.6 Serial Clock (CLK)

The SPI Serial Clock Input (CLK) pin provides the timing for serial input and output operations. ("See

SPI "Operations")

6.7 Serial Data Input (DI)

The SPI Serial Data Input (DI) pin provides a means for instructions, addresses and data to be serially

written to (shifted into) the device. Data is latched on the rising edge of the Serial Clock (CLK) input

pin.

W25P80 / W25P16 / W25P32

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7. BLOCK DIAGRAM

Figure 2. W25P80, W25P16 and W25P32 Block Diagram

W25P80 / W25P16 / W25P32

Publication Release Date: December 11, 2005

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8. FUNCTIONAL DESCRIPTION

8.1 SPI OPERATIONS

8.1.1 SPI Modes

The W25P80/16/32 is accessed through an SPI compatible bus consisting of four signals: Serial Clock

(CLK), Chip Select (/CS), Serial Data Input (DI) and Serial Data Output (DO). Both SPI bus operation

Modes 0 (0,0) and 3 (1,1) are supported. The primary difference between Mode 0 and Mode 3

concerns the normal state of the CLK signal when the SPI bus master is in standby and data is not

being transferred to the Serial Flash. For Mode 0 the CLK signal is normally low. For Mode 3 the CLK

signal is normally high. In either case data input on the DI pin is sampled on the rising edge of the

CLK. Data output on the DO pin is clocked out on the falling edge of CLK.

8.1.2 HOLD Function

The /HOLD signal allows the W25P80/16/32 operation to be paused while it is actively selected (when

/CS is low). The /HOLD function may be useful in cases where the SPI data and clock signals are

shared with other devices. For example, consider if the page buffer was only partially written when a

priority interrupt requires use of the SPI bus. In this case the /HOLD function can save the state of the

instruction and the data in the buffer so programming can resume where it left off once the bus is

available again.

To initiate a /HOLD condition, the device must be selected with /CS low. A /HOLD condition will

activate on the falling edge of the /HOLD signal if the CLK signal is already low. If the CLK is not

already low the /HOLD condition will activate after the next falling edge of CLK. The /HOLD condition

will terminate on the rising edge of the /HOLD signal if the CLK signal is already low. If the CLK is not

already low the /HOLD condition will terminate after the next falling edge of CLK.

During a /HOLD condition, the Serial Data Output (DO) is high impedance, and Serial Data Input (DI)

and Serial Clock (CLK) are ignored. The Chip Select (/CS) signal should be kept active (low) for the

full duration of the /HOLD operation to avoid resetting the internal logic state of the device.

8.2 WRITE PROTECTION

Applications that use non-volatile memory must take into consideration the possibility of noise and

other adverse system conditions that may compromise data integrity. To address this concern the

W25P80/16/32 provides several means to protect data from inadvertent writes.

8.2.1 Write Protect Features

• Device resets when VCC is below threshold.

• Time delay write disable after Power-up.

• Write enable/disable instructions.

• Automatic write disable after program and erase.

• Software write protection using Status Register.

• Hardware write protection using Status Register and /WP pin.

• Write Protection using Power-down instruction.

W25P80 / W25P16 / W25P32

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Upon power-up or at power-down the W25P80/16/32 will maintain a reset condition while VCC is

below the threshold value of VWI, (See Power-up Timing and Voltage Levels and Figure 17). While

reset, all operations are disabled and no instructions are recognized. During power-up and after the

VCC voltage exceeds VWI, all program and erase related instructions are further disabled for a time

delay of tPUW. This includes the Write Enable, Page Program, Sector Erase, Chip Erase and the Write

Status Register instructions. Note that the chip select pin (/CS) must track the VCC supply level at

power-up until the VCC-min level and tVSL time delay is reached. If needed a pull-up resister on /CS

can be used to accomplish this.

After power-up the device is automatically placed in a write-disabled state with the Status Register

Write Enable Latch (WEL) set to a 0. A Write Enable instruction must be issued before a Page

Program, Sector Erase, Chip Erase or Write Status Register instruction will be accepted. After

completing a program, erase or write instruction the Write Enable Latch (WEL) is automatically

cleared to a write-disabled state of 0.

Software controlled write protection is facilitated using the Write Status Register instruction and setting

the Status Register Protect (SRP) and Block Protect (BP2, BP1, and BP0) bits. These Status Register

bits allow a portion or all of the memory to be configured as read only. Used in conjunction with the

Write Protect (/WP) pin, changes to the Status Register can be enabled or disabled under hardware

control. See Status Register for further information.

Additionally, the Power-down instruction offers an extra level of write protection as all instructions are

ignored except for the Release Power-down instruction.

9. CONTROL AND STATUS REGISTERS

The Read Status Register instruction can be used to provide status on the availability of the Flash

memory array, if the device is write enabled or disabled, and the state of write protection. The Write

Status Register instruction can be used to configure the devices write protection features. See Figure

9.1 STATUS REGISTER

9.1.1 BUSY

BUSY is a read only bit in the status register (S0) that is set to a 1 state when the device is executing

a Page Program, Sector Erase, Chip Erase or Write Status Register instruction. During this time the

device will ignore further instructions except for the Read Status Register instruction (see tW, tPP, tSE

and tCE in AC Characteristics). When the program, erase or write status register instruction has

completed, the BUSY bit will be cleared to a 0 state indicating the device is ready for further

instructions.

9.1.2 Write Enable Latch (WEL)

Write Enable Latch (WEL) is a read only bit in the status register (S1) that is set to a 1 after executing

a Write Enable Instruction. The WEL status bit is cleared to a 0 when the device is write disabled. A

write disable state occurs upon power-up or after any of the following instructions: Write Disable, Page

Program, Sector Erase, Chip Erase and Write Status Register.

W25P80 / W25P16 / W25P32

Publication Release Date: December 11, 2005

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9.1.3 Block Protect Bits (BP2, BP1, BP0)

The Block Protect Bits (BP2, BP1, BP0) are non-volatile read/write bits in the status register (S4, S3,

S2) that provide Write Protection control and status. Block Protect bits can be set using the Write

Status Register Instruction (see tW in AC characteristics). All, none or a portion of the memory array

can be protected from Program and Erase instructions (see Status Register Memory Protection table).

The factory default setting for the Block Protection Bits is 0, none of the array protected. The Block

Protect bits can not be written to if the Status Register Protect (SRP) bit is set to 1 and the Write

Protect (/WP) pin is low.

9.1.4 Reserved Bits

Status register bit locations 5 and 6 are reserved for future use. Current devices will read 0 for these

bit locations. It is recommended to mask out the reserved bit when testing the Status Register. Doing

this will ensure compatibility with future devices.

9.1.5 Status Register Protect (SRP)

The Status Register Protect (SRP) bit is a non-volatile

read/write bit in the status register (S7) that can be used in conjunction with the Write Protect (/WP)

pin to disable writes to the status register. When the SRP bit is set to a 0 state (factory default) the

/WP pin has no control over the status register. When the SRP pin is set to a 1, the Write Status

Figure 3. Status Register Bit Locations

W25P80 / W25P16 / W25P32

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9.1.6 Status Register Memory Protection

STATUS

BP2 BP1 BP0 SECTOR(S) ADDRESSES DENSITY (KB) PORTION

0 0 0 NONE NONE NONE NONE

0 0 1 63 3F0000h - 3FFFFFh 512K-bit Upper 1/64

0 1 0 62 and 63 3E0000h - 3FFFFFh 1M-bit Upper 1/32

0 1 1 60 thru 63 3C0000h - 3FFFFFh 2M-bit Upper 1/16

1 0 0 56 thru 63 380000h - 3FFFFFh 4M-bit Upper 1/8

1 0 1 48 thru 63 300000h - 3FFFFFh 8M-bit Upper 1/4

1 1 0 32 thru 63 200000h - 3FFFFFh 16M-bit Upper 1/2

1 1 1 ALL 000000h - 3FFFFFh All memory plus Parameter Page

STATUS

BP2 BP1 BP0 SECTOR(S) ADDRESSES DENSITY (KB) PORTION

0 0 0 NONE NONE NONE NONE

0 0 1 31 1F0000h - 1FFFFFh 512K-bit Upper 1/32

0 1 0 30 and 31 1E0000h - 1FFFFFh 1M-bit Upper 1/16

0 1 1 28 thru 31 1C0000h - 1FFFFFh 2M-bit Upper 1/8

1 0 0 24 thru 31 180000h - 1FFFFFh 4M-bit Upper 1/4

1 0 1 16 thru 31 100000h - 1FFFFFh 8M-bit Upper 1/2

1 1 x ALL 000000h - 1FFFFFh All memory plus Parameter Page

STATUS

BP2 BP1 BP0 SECTOR(S) ADDRESSES DENSITY (KB) PORTION

0 0 0 NONE NONE NONE NONE

0 0 1 15 0F0000h - 0FFFFFh 512K-bit Upper 1/16

0 1 0 14 and 15 0E0000h - 0FFFFFh 1M-bit Upper 1/8

0 1 1 12 thru 15 0C0000h - 0FFFFFh 2M-bit Upper 1/4

1 0 0 8 thru 15 080000h - 0FFFFFh 4M-bit Upper 1/2

1 0 1 ALL 000000h - 0FFFFFh

1 1 x ALL 000000h - 0FFFFFh All memory plus Parameter Page

Note:

1. x = don’t care

W25P80 / W25P16 / W25P32

Publication Release Date: December 11, 2005

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9.2 INSTRUCTIONS

The instruction set of the W25P80/16/32 consists of thirteen basic instructions that are fully controlled

through the SPI bus (see Instruction Set table). Instructions are initiated with the falling edge of Chip

Select (/CS). The first byte of data clocked into the DI input provides the instruction code. Data on the

DI input is sampled on the rising edge of clock with most significant bit (MSB) first.

Instructions vary in length from a single byte to several bytes and may be followed by address bytes,

data bytes, dummy bytes (don’t care), and in some cases, a combination. Instructions are completed

with the rising edge of edge /CS. Clock relative timing diagrams for each instruction are included in

figures 4 through 21. All read instructions can be completed after any clocked bit. However, all

instructions that Write, Program or Erase must complete on a byte boundary (/CS driven high after a

full 8-bits have been clocked) otherwise the instruction will be terminated. This feature further protects

the device from inadvertent writes. Additionally, while the memory is being programmed or erased, or

when the Status Register is being written, all instructions except for Read Status Register will be

ignored until the program or erase cycle has completed.

9.2.1 Manufacturer and Device Identification

MANUFACTURER ID (M7-M0)

Winbond Serial Flash EFh

Device ID (ID7-ID0) (ID15-ID0)

Instruction ABH, 90h 9Fh

W25P80 13h 2014h

W25P16 14h 2015h

W25P32 15h 2016h

W25P80 / W25P16 / W25P32

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9.2.2 Instruction Set

(1)

INSTRUCTION

NAME

BYTE 1

CODE BYTE 2 (5) BYTE 3 BYTE 4 BYTE 5 BYTE 6 N-BYTES

Write Enable 06h

Write Disable 04h

Read Status

Write Status

Read Data 03h A23–A16 A15–A8 A7–A0 (D7–D0) (Next byte) continuous

Fast Read 0Bh A23–A16 A15–A8 A7–A0 dummy (D7–D0) (Next Byte)

continuous

Page Program 02h A23–A16 A15–A8 A7–A0(3) (D7–D0) (Next byte)

Up to 256

bytes

(128 Words)

(3)

Sector Erase D8h A23–A16 A15–A8 A7–A0

Chip Erase C7h

Power-down B9h

Read Parameter

Page 53h Don’t care Don’t care A7–A0 D7-D0 Next Byte Next Byte

Fast Read

Parameter Page 5Bh Don’t care Don’t care A7–A0 dummy D7-D0 Next Byte

Program

Parameter Page 52h Don’t care Don’t care A7–A0(3) D7-D0 D15-D8

Up to 256

bytes

(128 Words)

Erase Parameter

Page D5h

Release Power-

down / Device ID (4) ABh dummy dummy dummy (ID7-ID0) (5)

Manufacturer/

Device ID (4) 90h dummy dummy 00h (M7-M0) (ID7-ID0)

JEDEC ID 9Fh (M7-M0)

Manufacturer

(ID15-ID8)

Memory

Type

(ID7-ID0)

Capacity

Notes:

1. Data bytes are shifted with Most Significant Bit first. Byte fields with data in parenthesis “( )” indicate data being

read from the device on the DO pin.

2. The Status Register contents will repeat continuously until //CS terminates the instruction.

3. The Page Program instruction programs in increments of one word (two bytes) at a time. The Program

address A23-A16 must be an “Even” Address (A0 must equal 0).

4. See Manufacturer and Device Identification table for Device ID information

5. The Device ID will repeat continuously until //CS terminates the instruction.

W25P80 / W25P16 / W25P32

Publication Release Date: December 11, 2005

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Write Disable (04h)

The Write Enable instruction (Figure 4) sets the Write Enable Latch (WEL) bit in the Status Register to

a 1. The WEL bit must be set prior to every Page Program, Sector Erase, Chip Erase and Write Status

code “06h” into the Data Input (DI) pin on the rising edge of CLK, and then driving /CS high.

Figure 4. Write Disable Instruction Sequence Diagram

9.2.3 Write Enable (06h)

The Write Disable instruction (Figure 5) resets the Write Enable Latch (WEL) bit in the Status Register

to a 0. The Write Disable instruction is entered by driving /CS low, shifting the instruction code “04h”

into the DI pin and then driving /CS high. Note that the WEL bit is automatically reset after Power-up

and upon completion of the Write Status Register, Page Program, Sector Erase, and Chip Erase

instructions.

Figure 5. Write Enable Instruction Sequence Diagram

W25P80 / W25P16 / W25P32

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9.2.4 Read Status Register (05h)

The Read Status Register instruction allows the 8-bit Status Register to be read. The instruction is

entered by driving /CS low and shifting the instruction code “05h” into the DI pin on the rising edge of

CLK. The status register bits are then shifted out on the DO pin at the falling edge of CLK with most

significant bit (MSB) first as shown in figure 6. The Status Register bits are shown in figure 3 and

include the BUSY, WEL, BP2-BP0, and SRP bits (see description of the Status Register earlier in this

data sheet).

The Status Register instruction may be used at any time, even while a Program, Erase or Write Status

cycle is complete and if the device can accept another instruction. The Status Register can be read

continuously, as shown in figure 6. The instruction is completed by driving /CS high.

Figure 6. Read Status Register Instruction Sequence Diagram

W25P80 / W25P16 / W25P32

Publication Release Date: December 11, 2005

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9.2.5 Write Status Register (01h)

The Write Status Register instruction allows the Status Register to be written. A Write Enable

instruction must previously have been executed for the device to accept the Write Status Register

Instruction (Status Register bit WEL must equal 1). Once write enabled, the instruction is entered by

driving /CS low, sending the instruction code “01h”, and then writing the status register data byte as

illustrated in figure 7. The Status Register bits are shown in figure 3 and described earlier in this data

sheet.

Only non-volatile Status Register bits SRP, BP2, BP1 and BP0 (bits 7, 4, 3 and 2) can be written to.

All other Status Register bit locations are read-only and will not be affected by the Write Status

The /CS pin must be driven high after the eighth bit of the last byte has been latched. If this is not

done the Write Status Register instruction will not be executed. After /CS is driven high, the self-timed

Write Status Register cycle will commence for a time duration of tW (See AC Characteristics). While

the Write Status Register cycle is in progress, the Read Status Register instruction may still accessed

to check the status of the BUSY bit. The BUSY bit is a 1 during the Write Status Register cycle and a

0 when the cycle is finished and ready to accept other instructions again. After the Write Register

cycle has finished the Write Enable Latch (WEL) bit in the Status Register will be cleared to 0.

The Write Status Register instruction allows the Block Protect bits (BP2, BP1 and BP0) to be set for

protecting all, a portion, or none of the memory from erase and program instructions. Protected areas

become read-only (see Status Register Memory Protection table). The Write Status Register

instruction also allows the Status Register Protect bit (SRP) to be set. This bit is used in conjunction

with the Write Protect (/WP) pin to disable writes to the status register. When the SRP bit is set to a 0

state (factory default) the /WP pin has no control over the status register. When the SRP pin is set to a

1, the Write Status Register instruction is locked out while the /WP pin is low. When the /WP pin is

high the Write Status Register instruction is allowed.

Figure 7. Write Status Register Instruction Sequence Diagram

W25P80 / W25P16 / W25P32

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9.2.6 Read Data (03h)

The Read Data instruction allows one more data bytes to be sequentially read from the memory. The

instruction is initiated by driving the /CS pin low and then shifting the instruction code “03h” followed

by a 24-bit address (A23-A0) into the DI pin. The code and address bits are latched on the rising edge

of the CLK pin. After the address is received, the data byte of the addressed memory location will be

shifted out on the DO pin at the falling edge of CLK with most significant bit (MSB) first. The address is

automatically incremented to the next higher address after each byte of data is shifted out allowing for

a continuous stream of data. This means that the entire memory can be accessed with a single

instruction as long as the clock continues. The instruction is completed by driving /CS high. The Read

Data instruction sequence is shown in figure 8. If a Read Data instruction is issued while an Erase,

Program or Write cycle is in process (BUSY=1) the instruction is ignored and will not have any effects

on the current cycle. The Read Data instruction allows clock rates from D.C. to a maximum of fR ( see

AC Electrical Characteristics).

Figure 8. Read Data Instruction Sequence Diagram

W25P80 / W25P16 / W25P32

Publication Release Date: December 11, 2005

- 19 - Revision J

9.2.7 Fast Read (0Bh)

The Fast Read instruction is similar to the Read Data instruction except that it can operate at the

highest possible frequency of FR (see AC Electrical Characteristics). This is accomplished by adding a

“dummy” byte after the 24-bit address as shown in figure 9. The dummy byte allows the devices

internal circuits additional time for setting up the initial address. The dummy byte data value on the DI

pin is a “don’t care”.

Figure 9. Fast Read Instruction Sequence Diagram

W25P80 / W25P16 / W25P32

- 20 -

9.2.8 Page Program (02h)

The Page Program instruction allows up to 256 bytes of data to be programmed at previously erased

to all 1s (FFh) memory locations. A Write Enable instruction must be executed before the device will

accept the Page Program Instruction (Status Register bit WEL must equal 1). The instruction is

initiated by driving the /CS pin low then shifting the instruction code “02h” followed by a 24-bit address

(A23-A0) and at least two data bytes, into the DI pin. Because the W25P80/16/32 programs in

increments of one word (two bytes) at a time the 24-bit address (A23-A0) must be an even address

(A0 must equal 0). The /CS pin must be held low for the entire length of the instruction while data is

being sent to the device. The Page Program instruction sequence is shown in figure 10.

If an entire 256 byte page is to be programmed, the last address byte (the 8 least significant address

bits) should be set to 0. If the last address byte is not zero, and the number of clocks exceed the

remaining page length, the addressing will wrap to the beginning of the page. Less than 256 bytes can

be programmed without having any effect on other bytes within the same page. If more than 256 bytes

are sent to the device the addressing will wrap to the beginning of the page and overwrite previously

sent data.

As with the write and erase instructions, the /CS pin must be driven high after the eighth bit of the last

byte has been latched. If this is not done the Page Program instruction will not be executed. After /CS

is driven high, the self-timed Page Program instruction will commence for a time duration of tpp (See

AC Characteristics). While the Page Program cycle is in progress, the Read Status Register

instruction may still be accessed for checking the status of the BUSY bit. The BUSY bit is a 1 during

the Page Program cycle and becomes a 0 when the cycle is finished and the device is ready to accept

other instructions again. After the Page Program cycle has finished the Write Enable Latch (WEL) bit

in the Status Register is cleared to 0. The Page Program instruction will not be executed if the

addressed page is protected by the Block Protect (BP2, BP1, BP0) bits (see Status Register Memory

Protection table).

Figure 10. Page Program Instruction Sequence Diagram

W25P80 / W25P16 / W25P32

Publication Release Date: December 11, 2005

- 21 - Revision J

9.2.9 Sector Erase (D8h)

The Sector Erase instruction sets all memory within a specified sector to the erased state of all 1s

(FFh). A Write Enable instruction must be executed before the device will accept the Erase Sector

Instruction (Status Register bit WEL must equal 1). The instruction is initiated by driving the /CS pin

low and shifting the instruction code “D8h” followed a 24-bit sector address (A23-A0) (see Figure 2).

The Sector Erase instruction sequence is shown in figure 11.

The /CS pin must be driven high after the eighth bit of the last byte has been latched. If this is not

done the Sector Erase instruction will not be executed. After /CS is driven high, the self-timed Sector

Erase instruction will commence for a time duration of tSE (See AC Characteristics). While the Sector

Erase cycle is in progress, the Read Status Register instruction may still be accessed for checking the

status of the BUSY bit. The BUSY bit is a 1 during the Sector Erase cycle and becomes a 0 when the

cycle is finished and the device is ready to accept other instructions again. After the Sector Erase

cycle has finished the Write Enable Latch (WEL) bit in the Status Register is cleared to 0. The Sector

Erase instruction will not be executed if the addressed page is protected by the Block Protect (BP2,

BP1, BP0) bits (see Status Register Memory Protection table).

Figure 11. Sector Erase Instruction Sequence Diagram

W25P80 / W25P16 / W25P32

- 22 -

9.2.10 Chip Erase (C7h)

The Chip Erase instruction sets all memory within the device to the erased state of all 1s (FFh). A

Write Enable instruction must be executed before the device will accept the Chip Erase Instruction

(Status Register bit WEL must equal 1). The instruction is initiated by driving the /CS pin low and

shifting the instruction code “C7h”. The Chip Erase instruction sequence is shown in figure 12.

The /CS pin must be driven high after the eighth bit has been latched. If this is not done the Chip

Erase instruction will not be executed. After /CS is driven high, the self-timed Chip Erase instruction

will commence for a time duration of tCE (See AC Characteristics). While the Chip Erase cycle is in

progress, the Read Status Register instruction may still be accessed to check the status of the BUSY

bit. The BUSY bit is a 1 during the Chip Erase cycle and becomes a 0 when finished and the device is

ready to accept other instructions again. After the Chip Erase cycle has finished the Write Enable

Latch (WEL) bit in the Status Register is cleared to 0. The Chip Erase instruction will not be executed

if any page is protected by the Block Protect (BP2, BP1, BP0) bits (see Status Register Memory

Protection table).

Figure 12. Chip Erase Instruction Sequence Diagram

W25P80 / W25P16 / W25P32

Publication Release Date: December 11, 2005

- 23 - Revision J

9.2.11 Power-down (B9h)

Although the standby current during normal operation is relatively low, standby current can be further

reduced with the Power-down instruction. The lower power consumption makes the Power-down

instruction especially useful for battery powered applications (See ICC1 and ICC2 in AC

Characteristics). The instruction is initiated by driving the /CS pin low and shifting the instruction code

“B9h” as shown in figure 13.

The /CS pin must be driven high after the eighth bit has been latched. If this is not done the Power-

down instruction will not be executed. After /CS is driven high, the power-down state will entered

within the time duration of tDP (See AC Characteristics). While in the power-down state only the

Release from Power-down / Device ID instruction, which restores the device to normal operation, will

be recognized. All other instructions are ignored. This includes the Read Status Register instruction,

which is always available during normal operation. Ignoring all but one instruction makes the Power

Down state a useful condition for securing maximum write protection. The device always powers-up in

the normal operation with the standby current of ICC1.

Figure 13. Deep Power-down Instruction Sequence Diagram

9.2.12 Release Power-down / Device ID (ABh)

The Release from Power-down / Device ID instruction is a multi-purpose instruction. It can be used to

release the device from the power-down state, obtain the devices electronic identification (ID) number

or do both.

When used only to release the device from the power-down state, the instruction is issued by driving

the /CS pin low, shifting the instruction code “ABh” and driving /CS high as shown in figure 14. After

the time duration of tRES1 (See AC Characteristics) the device will resume normal operation and other

instructions will be accepted. The /CS pin must remain high during the tRES1 time duration.

When used only to obtain the Device ID while not in the power-down state, the instruction is initiated

by driving the /CS pin low and shifting the instruction code “ABh” followed by 3-dummy bytes. The

Device ID bits are then shifted out on the falling edge of CLK with most significant bit (MSB) first as

shown in figure 15. The Device ID values for the W25P80, W25P16 and W25P32 are listed in

Manufacturer and Device Identification table. The Device ID can be read continuously. The instruction

is completed by driving /CS high.

W25P80 / W25P16 / W25P32

- 24 -

When used to release the device from the power-down state and obtain the Device ID, the instruction

is the same as previously described, and shown in figure 13, except that after /CS is driven high it

must remain high for a time duration of tRES2 (See AC Characteristics). After this time duration the

device will resume normal operation and other instructions will be accepted.

If the Release from Power-down / Device ID instruction is issued while an Erase, Program or Write

cycle is in process (when BUSY equals 1) the instruction is ignored and will not have any effects on

the current cycle.

Figure 14. Release Power-down Instruction Sequence

Figure 15. Release Power-down / Device ID Instruction Sequence Diagram

W25P80 / W25P16 / W25P32

Publication Release Date: December 11, 2005

- 25 - Revision J

9.2.13 Read Manufacturer / Device ID (90h)

The Read Manufacturer/Device ID instruction is an alternative to the Release from Power-down /

Device ID instruction that provides both the JEDEC assigned manufacturer ID and the specific device

ID.

The Read Manufacturer/Device ID instruction is very similar to the Release from Power-down / Device

ID instruction. The instruction is initiated by driving the /CS pin low and shifting the instruction code

“90h” followed by a 24-bit address (A23-A0) of 000000h. After which, the Manufacturer ID for Winbond

(EFh) and the Device ID are shifted out on the falling edge of CLK with most significant bit (MSB) first

as shown in figure 16. The Device ID values for the W25P80, W25P16 and W25P32 are listed in

Manufacturer and Device Identification table. If the 24-bit address is initially set to 000001h the Device

ID will be read first and then followed by the Manufacturer ID. The Manufacturer and Device IDs can

be read continuously, alternating from one to the other. The instruction is completed by driving /CS

high.

Figure 16. Read Manufacturer / Device ID Diagram

W25P80 / W25P16 / W25P32

- 26 -

9.2.14 JEDEC ID (9Fh)

For compatibility reasons, the W25P80/16/32 provides several instructions to electronically determine

the identity of the device. The Read JEDEC ID instruction is compatible with the JEDEC standard for

SPI compatible serial memories that was adopted in 2003.

The instruction is initiated by driving the /CS pin low and shifting the instruction code “9Fh”. The

JEDEC assigned Manufacturer ID byte for Winbond (EFh) and two Device ID bytes, Memory Type

(ID15-ID8) and Capacity (ID7-ID0) are then shifted out on the falling edge of CLK with most significant

bit (MSB) first as shown in figure 17. For the W25P80, the Memory Type is 20h and the Capacity is

14h. For the W25P16, the Memory type is also 20h and the Capacity is 15h. For the W25P32, the

Memory type is also 20h and the Capacity is 16h.

Figure 17. Read JEDEC ID

W25P80 / W25P16 / W25P32

Publication Release Date: December 11, 2005

- 27 - Revision J

9.2.15 Read Parameter Page (53h)

The Parameter Page is a 256-byte page of Flash memory that can be used for storing serial numbers,

revision information and configuration data that might typically be stored in an additional Serial

EEPROM memory. Because the Parameter Page is relatively small and separate from the array, the

erase time is significantly shorter than that of a sector erase (see tPE in AC Electrical Characteristics).

This makes it convenient for more frequent updates.

The Read Parameter Page instruction allows one or more bytes of the Parameter page to be read.

The instruction is initiated by driving the /CS pin low and then shifting the instruction code “53h”

followed by a 24-bit address (A23-A0) into the DI pin. Only the lower 8 address bits (A7-A0) are used,

the 16 upper most address bits (A23-A8) are ignored (don’t care). The code and address bits are

latched on the rising edge of the CLK pin. After the address is received, the data byte of the

addressed memory location will be shifted out on the DO pin at the falling edge of CLK with most

significant bit (MSB) first. The address is automatically incremented to the next higher address after

each byte of data is shifted out allowing for a continuous stream of data. When the end of the

Parameter page is reached the address will wrap to the beginning. The Read Parameter Page

instruction is shown in figure 18. If the Read Parameter Page instruction is issued while an Erase,

Program or Write cycle is in process (BUSY=1) the instruction is ignored and will not have any effects

on the current cycle. The Read Parameter Page instruction allows clock rates from D.C. to a

maximum of fR (see AC Electrical Characteristics).

Figure 18. Read Parameter Page Instruction Sequence Diagram

W25P80 / W25P16 / W25P32

- 28 -

9.2.16 Fast Read Parameter Page (5Bh)

The Fast Read Parameter Page instruction is basically the same as the Read Parameter Page

instruction except that it allows for a faster clock rate to be used. The Fast Read Parameter Page

instruction can opperate at clock rates from D.C. to a maximum of FR (see AC Electrical

Characteristics). This is accomplished by adding a “dummy” byte after the 24-bit address, as shown in

figure 19. The dummy byte allows the devices internal circuits additional time for setting up the initial

address. The dummy byte data value on the DI pin is a “don’t care”.

Figure 19. Fast Read Parameter Page Instruction Sequence Diagram

W25P80 / W25P16 / W25P32

Publication Release Date: December 11, 2005

- 29 - Revision J

9.2.17 Program Parameter Page (52h)

The Program Parameter Page instruction allows up to 256 bytes (128 words) to be programmed at

memory word locations that have been previously erased to all 1s “FFFFh” (see Erase Parameter

Page instruction). A Write Enable instruction must be executed before the device will accept the

Program Parameter Page instruction (Status Register bit WEL must equal 1). The instruction is

initiated by driving the /CS pin low then shifting the instruction code “52h” followed by a 24-bit address

(A23-A0) and the full 256 data bytes, into the DI pin. Only the lower 8 address bits (A7-A0) are used,

the 16 upper most address bit (A23-A8) are ignored (don’t care). Because the W25P80/16/32

programs in increments of one word (two bytes) at a time, the address must be an even address (A0

must equal 0). The /CS pin must be held low for the entire length of the instruction while data is being

sent to the device. The Program Parameter Page instruction sequence is shown in figure 20.

The start address of the needs to be set to 00h on the Parameter Page. If more than 256 bytes are

sent to the device the addressing will wrap to the beginning of the page. If previously written data

bytes are over-written the data will not be valid.

In most applications it is best to read the full 256-byte contents of the page into a temporary RAM.

Data can then be modified as needed and the entire 256 bytes can then be reprogrammed into the

Parameter Page at one time.

As with the write and erase instructions, the /CS pin must be driven high after the eighth bit of the last

byte has been latched. If this is not done the Parameter Page Program instruction will not be

executed. After /CS is driven high, the self-timed Page Program instruction will commence for a time

duration of tPP (See AC Characteristics). While the Page Program cycle is in progress, the Read

Status Register instruction may still be accessed for checking the status of the BUSY bit. The BUSY

bit is a 1 during the program cycle and becomes a 0 when the cycle is finished and the device is ready

to accept other instructions again. After the program cycle has finished the Write Enable Latch (WEL)

bit in the Status Register is cleared to 0. The Program Parameter Page instruction will not be executed

if the addressed page is protected by the Block Protect (BP2, BP1, BP0) bits (see Status Register

Memory Protection table).

W25P80 / W25P16 / W25P32

- 30 -

Figure 20. Parameter Page Program Instruction Sequence Diagram

W25P80 / W25P16 / W25P32

Publication Release Date: December 11, 2005

- 31 - Revision J

9.2.18 Erase Parameter Page (D5h)

The Erase Parameter Page instruction sets all 256 bytes of memory in the Parameter Page to the

erased state of all 1s (FFh). A Write Enable instruction must be executed before the device will accept

the Erase Parameter Page instruction (Status Register bit WEL must equal 1). The instruction is

initiated by driving the /CS pin low and shifting the instruction code “D5h”. The Erase Parameter Page

instruction sequence is shown in figure 21.

The /CS pin must be driven high after the eighth bit has been latched. If this is not done the Erase

Parameter Page instruction will not be executed. After /CS is driven high, the self-timed Erase

Parameter Page instruction will commence for a time duration of tPE (See AC Characteristics). While

the Erase Parameter Page cycle is in progress, the Read Status Register instruction may still be

accessed to check the status of the BUSY bit. The BUSY bit is a 1 during the Erase Parameter Page

cycle and becomes a 0 when finished and the device is ready to accept other instructions again. After

the Erase Parameter Page cycle has finished the Write Enable Latch (WEL) bit in the Status Register

is cleared to 0. The Erase Parameter Page instruction will not be executed if any page is protected by

the Block Protect (BP2, BP1, BP0) bits (see Status Register Memory Protection table).

Figure 21. Parameter Page Erase Instruction Sequence Diagram

W25P80 / W25P16 / W25P32

- 32 -

10. ELECTRICAL CHARACTERISTICS

10.1 Absolute Maximum Ratings (1)

PARAMETERS SYMBOL CONDITIONS RANGE UNIT

Supply Voltage VCC –0.6 to +4.0 V

Voltage Applied to Any Pin VIO Relative to Ground –0.6 to VCC +0.4 V

Storage Temperature TSTG –65 to +150 °C

Lead Temperature TLEAD See Note 2 °C

Electrostatic Discharge Voltage VESD Human Body Model(3) –2000 to +2000 V

Notes:

1. This device has been designed and tested for the specified operation ranges. Proper operation outside of these levels is not

guaranteed. Exposure beyond absolute maximum ratings (listed above) may cause permanent damage.

2. Compliant with JEDEC Standard J-STD-20C for small body Sn-Pb or Pb-free (Green) assembly and the European directive

on restrictions on hazardous substances (RoHS) 2002/95/EU.

3. JEDEC Std JESD22-A114A (C1=100 pF, R1=1500 ohms, R2=500 ohms).

10.2 Operating Ranges

SPEC

PARAMETER SYMBOL CONDITIONS

MIN MAX

UNIT

Supply Voltage(1) VCC

FR = 33MHz, fR = 25MHz

FR = 50MHz, fR = 25MHz

2.7

3.0

3.6

Ambient Temperature,

Operating TA Industrial –40 +85 °C

Note:

1. VCC voltage during Read can operate across the min and max range but should not exceed ±10% of the programming

(erase/write) voltage.

W25P80 / W25P16 / W25P32

Publication Release Date: December 11, 2005

- 33 - Revision J

10.3 Power-up Timing and Write Inhibit Threshold

SPEC

PARAMETER SYMBOL

MIN MAX

UNIT

VCC (min) to /CS Low tVSL(1) 10 µs

Time Delay Before Write Instruction tPUW(1) 1 10 ms

Write Inhibit Threshold Voltage VWI(1) 1 2 V

Note:

1. These parameters are characterized only.

Figure 22. Power-up Timing and Voltage Levels

W25P80 / W25P16 / W25P32

- 34 -

10.4 DC Electrical Characteristics (Preliminary)(1)

SPEC

PARAMETER SYMBOL CONDITIONS

MIN TYP MAX

UNIT

Input Capacitance CIN(2) VIN = 0V(2) 6 pf

Output Capacitance Cout(2) VOUT = 0V(2) 8 pf

Input Leakage ILI ±2 µA

I/O Leakage ILO ±2 µA

Standby Current ICC1 /CS = VCC,

VIN = GND or VCC 25 75 µA

Power-down Current ICC2 /CS = VCC,

VIN = GND or VCC <1 5 µA

Current Read Data

1MHz(3) ICC3 C = 0.1 VCC / 0.9 VCC

DO = Open 4 8 mA

Current Read Data

20MHz(3) C = 0.1 VCC / 0.9 VCC

DO = Open 8 15 mA

Current Read Data

33MHz(3) C = 0.1 VCC / 0.9 VCC

DO = Open 9 20 mA

Current Page

Program ICC4 /CS = VCC 16 25 mA

Current Write Status

Current Sector Erase ICC6 /CS = VCC 20 25 mA

Current Chip Erase ICC7 /CS = VCC 20 25 mA

Input Low Voltage VIL –0.5 VCC x0.3 V

Input High Voltage VIH VCC x0.7 VCC +0.4 V

Output Low Voltage VOL IOL = 1.6 mA 0.4 V

Output High Voltage VOH IOH = –100 µA VCC –0.2 V

Notes:

1 .See Preliminary Designation.

2. Tested on sample basis and specified through design and characterization data. TA=25° C, VCC 3V

3. Checker Board Pattern.

W25P80 / W25P16 / W25P32

Publication Release Date: December 11, 2005

- 35 - Revision J

10.5 AC Measurement Conditions

SPEC

PARAMETER SYMBOL

MIN MAX

UNIT

Load Capacitance CL 30 30 pF

Input Rise and Fall Times TR, TF 5 ns

Input Pulse Voltages VIN 0.2 VCC to 0.8 VCC V

Output Timing Reference Voltages OUT 0.3 VCC to 0.7 VCC V

Note:

1. Output Hi-Z is defined as the point where data out is no longer driven.

Figure 23. AC Measurement I/O Waveform

W25P80 / W25P16 / W25P32

- 36 -

10.6 AC Electrical Characteristics

SPEC

DESCRIPTION SYMBOL ALT

MIN TYP MAX

UNIT

Clock frequency, for Fast Read (0Bh) and all

other instructions except Read Data (03h)

2.7V-3.6V VCC

3.0V-3.6V VCC

FR fC

D.C.

MHz

Clock freq. Read Data instruction 03h fR D.C. 25 MHz

Clock High, Low Time, for Fast Read (0Bh) and

all other instructions except Read Data (03h)

tCLH,

tCLL(1) 9 ns

Clock High, Low Time for Read Data instruction tCRLH,

tCRLL(1) 9 ns

Clock Rise Time peak to peak tCLCH(2) 0.1 V/ns

Clock Fall Time peak to peak tCHCL(2) 0.1 V/ns

/CS Active Setup Time relative to CLK tSLCH tCSS 5 ns

/CS Not Active Hold Time relative to CLK tCHSL 5 ns

Data In Setup Time tDVCH tDSU 2 ns

Data In Hold Time tCHDX tDH 5 ns

/CS Active Hold Time relative to CLK

(2.7V-3.6V / 3.0V-3.6V)

tCHSH 10/8 ns

/CS Not Active Setup Time relative to CLK tSHCH 5 ns

/CS Deselect Time tSHSL tCSH 100 ns

Output Disable Time tSHQZ(2) tDIS 12/10 ns

Clock Low to Output Valid

(2.7V-3.6V / 3.0V-3.6V)

tCLQV tV 12/8 ns

Output Hold Time tCLQX tHO 0 ns

/HOLD Active Setup Time relative to CLK

(2.7V-3.6V / 3.0V-3.6V)

tHLCH 5 ns

/HOLD Active Hold Time relative to CLK tchhh 5 ns

W25P80 / W25P16 / W25P32

Publication Release Date: December 11, 2005

- 37 - Revision J

AC Electrical Characteristics, continued

SPEC

DESCRIPTION SYMBOL ALT

MIN TYP MAX

UNIT

/HOLD Not Active Setup Time relative to CLK tHHCH 5 ns

/HOLD Not Active Hold Time relative to CLK tCHHL 5 ns

/HOLD to Output Low-Z tHHQX(2) tLZ 9 ns

/HOLD to Output High-Z tHLQZ(2) tHZ 9 ns

Write Protect Setup Time Before /CS Low tWHSL(4) 20 ns

Write Protect Hold Time After /CS High tSHWL(4) 100 ns

/CS High to Power-down Mode tDP(2) 3 µs

/CS High to Standby Mode without Electronic

Signature Read tRES1(2) 30 µs

/CS High to Standby Mode with Electronic

Signature Read tRES2(2) 30 µs

Write Status Register Cycle Time tW 17 30 ms

Page Program Cycle Time (5)

3.0V-3.6V VCC

2.7V-3.6V VCC

tPP

3.5

Sector Erase Cycle Time tSE 0.6 1.5 s

Chip Erase Cycle Time W25P80

Chip Erase Cycle Time W25P16

Chip Erase Cycle Time W25P32

tCE

Parameter Page Erase Cycle Time tPE 100 200 ms

Notes:

1. Clock high + Clock low must be less than or equal to 1/fC.

2. Value guaranteed by design and/or characterization, not 100% tested in production.

3. Expressed as a slew-rate.

4. Only applicable as a constraint for a Write Status Register instruction when Sector Protect Bit is set at 1.

5. Maximum Tpp uses worse-case user pattern at 85°C.

W25P80 / W25P16 / W25P32

- 38 -

10.7 Serial Output Timing

10.8 Input Timing

10.9 Hold Timing

W25P80 / W25P16 / W25P32

Publication Release Date: December 11, 2005

- 39 - Revision J

11. PACKAGE SPECIFICATION

11.1 8-Pin SOIC 208-mil (Winbond Package Code SS)

MILLIMETERS INCHES

SYMBOL

MIN MAX MIN MAX

A 1.75 2.16 0.069 0.085

A1 0.05 0.25 0.002 0.010

A2 1.70 1.91 0.067 0.075

b 0.35 0.48 0.014 0.019

C 0.19 0.25 0.007 0.010

D 5.18 5.38 0.204 0.212

E 7.70 8.10 0.303 0.319

E1 5.18 5.38 0.204 0.212

e 1.27 BSC 0.050 BSC

L 0.50 0.80 0.020 0.031

θ 0o 8

o 0

o 8

y --- 0.10 --- 0.004

Notes:

1. Controlling dimensions: inches, unless otherwise specified.

2. BSC = Basic lead spacing between centers.

3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package.

W25P80 / W25P16 / W25P32

- 40 -

11.2 16-Pin SOIC 300-mil (Winbond Package Code SF)

MILLIMETERS INCHES

SYMBOL MIN MAX MIN MAX

A 2.36 2.64 0.093 0.104

A1 0.10 0.30 0.004 0.012

b 0.33 0.51 0.013 0.020

C 0.18 0.28 0.007 0.011

D(3) 10.08 10.49 0.397 0.413

E 10.01 10.64 0.394 0.419

E1(3) 7.39 7.59 0.291 0.299

e(2) 1.27 BSC 0.050 BSC

L 0.39 1.27 0.015 0.050

θ 0o 8

o 0

o 8

y --- 0.076 --- 0.003

Notes:

1. Controlling dimensions: inches, unless otherwise specified.

2. BSC = Basic lead spacing between centers.

3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package.

W25P80 / W25P16 / W25P32

Publication Release Date: December 11, 2005

- 41 - Revision J

12. ORDERING INFORMATION

W25P80 / W25P16 / W25P32

- 42 -

13. REVISION HISTORY

VERSION DATE PAGE DESCRIPTION

A 03/05/04 New Create

B 03/24/04

MLP metal die pad notification; Under "Package

Types," figure 1 and packaging information.

C 04/19/04

Corrected timing diagrams for figure 16 (Read

Manufacturer / Device ID Diagram) and figure 17

(Read JEDEC ID). Added 8x6mm MLP Package for

W25P16/32.

D 05/06/04

Corrected dimensions in Packaging Information

section for 6x5mm and 8x6mm MLP.

E 06/28/04

Changed 200-mil SOIC reference to 208-mil SOIC.

Updated dimensional table for the 208milSOIC in the

packaging information. Added 208milSOIC and

removed 5x6mm MLP for W25P16.

F 10/07/04

Added Parameter Page data to Features, Block

Diagram (Figure 2), Status Register Memory

Protection, Instruction Set and Manufacturer and

Device Identification. Added Parameter Page timing

diagrams (Figures 20, 21, 22 and 23). Updated FR,

tCH AND tPE data in AC Electrical Characteristics

G 04/22/05

Updated AC and DC parameters and package type

descriptions. Removed 8-contact 6x5 and 8x6 MLP

packages from document. Corrected data in

Instruction Set. Updated package dimension symbols

for compliance.

H 06/14/05 Updated Important Notice

I 06/28/05

Changed NexFlash part numbers to Winbond part

numbers and updated ordering and contact

information

J 12/11/05 ALL

Updated data sheet to comply with Winbond

standard.

Updated FR and fR values in Operating Ranges

Table and AC Characteristics Table. Updated Read

Data (fR) values in Operating Range and AC

Characteristics Tables from 33MHz to 25MHz.

Corrected the pin assignment on table of pin

description of page 5.

W25P80 / W25P16 / W25P32

Publication Release Date: December 11, 2005

- 43 - Revision J

Preliminary Designation

The “Preliminary” designation on a Winbond data sheet indicates that the product is not fully

characterized. The specifications are subject to change and are not guaranteed. Winbond or an

authorized sales representative should be consulted for current information before using this product.

Trademarks

Winbond and spiFlash are trademarks of Winbond

Electronics Corporation All other marks are the property of their respective owner.

Important Notice

Winbond products are not designed, intended, authorized or warranted for use as components

in systems or equipment intended for surgical implantation, atomic energy control

instruments, airplane or spaceship instruments, transportation instruments, traffic signal

instruments, combustion control instruments, or for other applications intended to support or

sustain life. Further more, Winbond products are not intended for applications wherein failure

of Winbond products could result or lead to a situation wherein personal injury, death or

severe property or environmental damage could occur.

Winbond customers using or selling these products for use in such applications do so at their

own risk and agree to fully indemnify Winbond for any damages resulting from such improper

use or sales.

The Winbond W25P80/16/32 are fully compatible with the previous NexFlash NX25P80/16/32 Serial

Flash memories.