TD62001~004P/AP/F/AF TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TD62001P,TD62001AP,TD62001F,TD62001AF,TD62002P TD62002AP,TD62002F,TD62002AF,TD62003P,TD62003AP,TD62003F TD62003AF,TD62004P,TD62004AP,TD62004F,TD62004AF 7CH DARLINGTON SINK DRIVER The TD62001P / AP / F / AF Series are high-voltage, high-current darlington drivers comprised of seven NPN darlington pairs. All units feature integral clamp diodes for switching inductive loads. Applications include relay, hammer, lamp and display (LED) drivers. FEATURES Output current (single output) 500 mA MAX. High sustaining voltage output 35 V MIN. (TD62001P / F Series) 50 V MIN. (TD62001AP / AF Series) Output clamp diodes Inputs compatible with various types of logic Package Type-P, AP : DIP-16 pin Package Type-F, AF : SOP-16 pin TYPE INPUT BASE RESISTOR TD62001P / AP / F / AF External General Purpose TD62002P / AP / F / AF 10.5-k + 7 V Zenner diode 14~25 V PMOS TD62003P / AP / F / AF 2.7 k TTL, 5 V CMOS TD62004P / AP / F / AF 10.5 k 6~15 V PMOS, CMOS DESIGNATION Weight DIP16-P-300-2.54A : 1.11 g (Typ.) SOP16-P-225-1.27 : 0.16 g (Typ.) PIN CONNECTION (TOP VIEW) 1 2001-06-27 TD62001~004P/AP/F/AF SCHEMATICS (EACH DRIVER) TD62001P / AP / F / AF TD62002P / AP / F / AF TD62003P / AP / F / AF TD62004P / AP / F / AF Note: The input and output parasitic diodes cannot be used as clamp diodes. MAXIMUM RATINGS (Ta = 25C) CHARACTERISTIC Output Sustaining Voltage SYMBOL P, F AP, AF Output Current -0.5~35 -0.5~50 IOUT Input Voltage VIN (Note 1) Input Current Clamp Diode Reverse Voltage VCE (SUS) RATING AP, AF Clamp Diode Forward Current mA / ch -0.5~30 V 25 mA 35 VR 50 IF 500 P Power Dissipation AP Storage Temperature P AP, F, AF V mA 1.0 PD 1.47 W 0.54 / 0.625 (Note 3) F, AF Operating Temperature V 500 IIN (Note 2) P, F UNIT Topr Tstg -30~75 -40~85 -55~150 C C Note 1: Except TD62001P / AP / F / AF Note 2: Only TD62001P / AP / F / AF Note 3: On glass epoxy PCB (30 x 30 x 1.6 mm Cu 50%) 2 2001-06-27 TD62001~004P/AP/F/AF RECOMMENDED OPERATING CONDITIONS (Ta = -40~85C and Ta = -30~75C for only Type-P) CHARACTERISTIC SYMBOL P, F Output Sustaining Voltage AP, AF CONDITION VCE (SUS) Duty = 10% AP 0 50 0 370 130 295 Duty = 50% 0 95 Duty = 10% 0 233 Duty = 50% 0 70 0 24 14.5 24 2.8 24 TD62004 6.2 24 TD62001 0 0.6 0 7.4 0 0.7 0 1.0 0 10 35 50 350 0.6 0.76 0.325 P Except TD62001P / AP / F / AF TD62003 TD62002 TD62003 Only TD62001 Voltage P, F AP, AF Clamp Diode Forward Current IOUT VIN VIN (ON) IOUT = 400 mA hFE = 800 VIN (OFF) IIN VR IF P AP AF, F Note: 35 Clamp Diode Reverse Power Dissipation 0 TD62004 Input Current 0 0 TD62002 Input Voltage (Output Off) MAX Duty = 50% Tpw = 25 ms 7 Circuits Ta = 85C Tj = 120C F, AF Input Voltage (Output On) TYP. Duty = 10% Output Current Input Voltage MIN PD Ta = 85C Ta = 85C (Note) UNIT V mA / ch V V V mA V mA W On glass epoxy PCB (30 x 30 x 1.6 mm Cu 50%) 3 2001-06-27 TD62001~004P/AP/F/AF ELECTRICAL CHARACTERISTICS (Ta = 25C unless otherwise noted) CHARACTERISTIC SYMBOL TEST CIR- CUIT MIN TYP. MAX VCE = 50 V, Ta = 25C 50 VCE = 50 V, Ta = 85C 100 VCE = 35 V, Ta = 25C 50 VCE = 35 V, Ta = 85C 100 VCE = 35 V, Ta = 25C 50 VCE = 35 V, Ta = 75C 100 IOUT = 350 mA, IIN = 500 A 1.3 1.6 IOUT = 200 mA, IIN = 350 A 1.1 1.3 IOUT = 100 mA, IIN = 250 A 0.9 1.1 VCE = 2 V, IOUT = 350 mA 1000 VIN = 20 V, IOUT = 350 mA 1.1 1.7 VIN = 2.4 V, IOUT = 350 mA 0.4 0.7 VIN = 9.5 V, IOUT = 350 mA 0.8 1.2 IOUT = 500 A, Ta = 75C 50 65 IOUT = 500 A, Ta = 85C 50 65 IOUT = 350 mA 13.7 IOUT = 200 mA 11.4 IOUT = 350 mA 2.6 IOUT = 200 mA 2.0 IOUT = 350 mA 4.7 IOUT = 200 mA 4.4 VR = 50 V, Ta = 25C 50 VR = 50 V, Ta = 85C 100 VR = 35 V, Ta = 25C 50 VR = 35 V, Ta = 85C 100 VR = 35 V, Ta = 25C 50 VR = 35 V, Ta = 75C 100 IF = 350 mA 2.0 V 15 pF VOUT = 35 V, RL = 87.5 CL = 15 pF 0.1 AP, AF VOUT = 50 V, RL = 125 CL = 15 pF 0.1 P, F VOUT = 35 V, RL = 87.5 CL = 15 pF 0.2 VOUT = 50 V, RL = 125 CL = 15 pF 0.2 AP, AF Output Leakage Current F ICEX 1 P Collector-Emitter Saturation Voltage DC Current Transfer Ratio VCE (sat) hFE 2 2 TD62002 Input Current (Output On) TD62003 IIN (ON) 3 TD62004 Input Current (Output Off) P AP, F, AF IIN (OFF) 4 TEST CONDITION TD62002 Input Voltage (Output On) TD62003 VIN (ON) 5 VCE = 2 V hFE = 800 TD62004 AP, AF Clamp Diode Reverse Current F IR 6 P Clamp Diode Forward Voltage VF 7 Input Capacitance CIN P, F Turn-On Delay tON Turn-Off Delay tOFF AP, AF 8 8 4 UNIT A V mA A V A s 2001-06-27 TD62001~004P/AP/F/AF TEST CIRCUIT 1. ICEX 2. VCE (sat), hFE 3. IIN (ON) 4. IIN (OFF) 5. VIN (ON) 6. IR 7. VF 5 2001-06-27 TD62001~004P/AP/F/AF 8. tON, tOFF Note 1: Pulse width 50 s, duty cycle 10% Output impedance 50 , tr 5 ns, tf 10 ns Note 2: See below INPUT CONDITION TYPE NUMBER R1 VIH TD62001P / AP / F / AF 2.7 k 3V TD62002P / AP / F / AF 0 13 V TD62003P / AP / F / AF 0 3V TD62004P / AP / F / AF 0 8V Note 3: CL includes probe and jig capacitance. PRECAUTIONS for USING This IC does not include built-in protection circuits for excess current or overvoltage. If this IC is subjected to excess current or overvoltage, it may be destroyed. Hence, the utmost care must be taken when systems which incorporate this IC are designed. Utmost care is necessary in the design of the output line, COMMON and GND line since IC may be destroyed due to short-circuit between outputs, air contamination fault, or fault by improper grounding. 6 2001-06-27 TD62001~004P/AP/F/AF 7 2001-06-27 TD62001~004P/AP/F/AF 8 2001-06-27 TD62001~004P/AP/F/AF 9 2001-06-27 TD62001~004P/AP/F/AF 10 2001-06-27 TD62001~004P/AP/F/AF PACKAGE DIMENSIONS DIP16-P-300-2.54A Unit : mm Weight: 1.11 g (Typ.) 11 2001-06-27 TD62001~004P/AP/F/AF PACKAGE DIMENSIONS SOP16-P-225-1.27 Unit : mm Weight: 0.16 g (Typ.) 12 2001-06-27 TD62001~004P/AP/F/AF RESTRICTIONS ON PRODUCT USE 000707EBA * TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc.. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. * The products described in this document are subject to the foreign exchange and foreign trade laws. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. * The information contained herein is subject to change without notice. 13 2001-06-27