1
TABLE OF CONTENTS
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
General information
How to use this standard part catalog......................................................................................................................................................................................................................
Index by part number.....................................................................................................................................................................................................................................................
Index by device and thermal resistance.............................................................................................................................................................................................................
Index by style and thermal resistance.................................................................................................................................................................................................................
How to select a heat sink.......................................................................................................................................................................................................................................
How to read a thermal graph....................................................................................................................................................................................................................................
Board mounted heat sinks
Heat sinks for IC packages
BGA ........................................................................................................................................................................................................................................................
DIP...........................................................................................................................................................................................................................................................
Surface mount discrete semiconductor packages
D-PAK.....................................................................................................................................................................................................................................................
SO...................................................................................................................................................................................................................................................................
SMT Footprints..........................................................................................................................................................................................................................................
Thru-hole discrete semiconductor packages
TO-220..................................................................................................................................................................................................................................................
TO-220 and TO-262..........................................................................................................................................................................................................................
TO-220,TO-218, and TO-247.........................................................................................................................................................................................................
TO-220 and TO-202..................................................................................................................................................................................................................................
TO-220,TO-218,TO-247, and Multiwatt....................................................................................................................................................................................
TO-218..........................................................................................................................................................................................................................................................
TO-202..................................................................................................................................................................................................................................................
TO-126 .........................................................................................................................................................................................................................................................
SIP............................................................................................................................................................................................................................................................
TO-92............................................................................................................................................................................................................................................................
TO-3.......................................................................................................................................................................................................................................................
TO-66.............................................................................................................................................................................................................................................................
TO-5........................................................................................................................................................................................................................................................
Axial lead devices.....................................................................................................................................................................................................................................
Bridge rectifiers.........................................................................................................................................................................................................................................
Options
Table of contents.....................................................................................................................................................................................................................................................
How to decipher an Aavid 12 digit part number...............................................................................................................................................................................................
How to decipher a "Thermalloy" origin part number.......................................................................................................................................................................................
Index A, B, C = Aavid standard parts w/options..........................................................................................................................................................................................
Index D = "Thermalloy" origin parts w/options ................................................................................................................................................................................................
Interface materials
In-Sil™, Kondux™, Alignment Pads, Grafoil™ Pads....................................................................................................................................................................................
Double sided tape options (Factory applied)......................................................................................................................................................................................................
Labor savings heat sink to board and semiconductor mounts
Wave-On™ Mounts, Semiconductor Mounts, Shur-Lock™ Tabs, Solderable Tabs, Solderable Pins.........................................................................................
Solderable Nuts, Clinch Nuts, Solderable Studs, Device Mounting Studs.........................................................................................................................................
Clips
Kool-Klips™.......................................................................................................................................................................................................................................................................
Thermal Clips....................................................................................................................................................................................................................................................................
Accessories
Mounting Kits........................................................................................................................................................................................................................................................................................
Insulating Shoulder Washers.........................................................................................................................................................................................................................................................
Insulators–Thermalfilm™ and Thermalfilm™ MT.........................................................................................................................................................................................................
Insulators–Mica and Thermasil™III ............................................................................................................................................................................................................................................
Insulating Washers / Aluminum Oxide......................................................................................................................................................................................................................................
Insulating Stanchion Pads .............................................................................................................................................................................................................................................................
Insulating Covers...............................................................................................................................................................................................................................................................................
Mounting Pads..........................................................................................................................................................................................................................................................................
Finishes..................................................................................................................................................................................................................................................................................................
Card Ejectors & Guides....................................................................................................................................................................................................................................................................
Thermal Greases and Epoxies..............................................................................................................................................................................................................................................
2
3
4–5
6–8
9–10
11
12–20
21–24
25–26
25
27
28–50
51–53
53–58
59
60–61
62
63–64
65
66–67
68
69–73
74
75–76
77
77
78–79
80
81
82–84
85
86–87
88
89–94
94–96
97
98
99
100
101–102
103
104
105
106
107–109
110
111
112–115
Table of Contents
2
GENERAL INFORMATION
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
How to Use This Catalog
Style description
for heat sink
Base part
number
Ordering information will
specify the base heat sink with
available accessories.
Aavid has a large selection of popular
options to enhance your heat sink selection.
This section will indicate the most popular
options available.
Detailed indexes are available
to select additional options.
Icons indicate that
a mounting kit, grease
or epoxy can be used
with the heat sink
Detailed description
illustrates the heat sink’s
differentiating features.
Semiconductor devices
have been included in photos to
assist in determining mounting
position.
Thermal graphs show natural and forced
convection based on black anodize finish.
For information on how to use a thermal graph,
please refer to page 11.
7022 Channel style heat sink with folded back fins
Channel style heat sink with
folded back fins for increased
cooling surface area. Available
with tin plated solderable tabs
for easy attachment to the
printed circuit card.
9.52
(0.375)
50.44
(1.986)
23.01
(0.906)
49.99
(1.968)
3.81
(0.150)
21.03
(0.828)
2x 3.81
(0.150)
2.02
(0.080)
2.67
(0.105)
24.16
(0.951)
4.83
(0.190)
3.18
(0.125)
2.29
(0.090)
2x
4.44
(0.175)
ø
2x 2.03
(0.080)
"X"
14.48
(0.570)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
048121620
4
3
1
2
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Part Number Description Finish
7022B Channel heat sink with folded back fins Black anodize
7022PB Channel heat sink with folded back fins Pre-black anodize*
7022B-MT With solderable tabs Black anodize 2.90 ( 0.114)
7022PB-MT With solderable tabs Pre-black anodize* 2.90 ( 0.114)
ORDERING INFORMATION
Material: 1.27 (0.050) Thick Aluminum
Finish: See Table
* Edges cut during the manufacturing process will be unfinished.
See page XX for more information
Position Code Description Location Details
A TC11-MT Insulated device mounting clip for T0-220 and solderable tabs Hole X Page
POPULAR OPTIONS:
Dia of PCB
Plated Thru
Hole for Tabs
7022B-
For additional options see page xx
TO-220 Heat Sinks
Semiconductor
device
Mechanical Drawing
Dimensions as shown
are mm (inches)
Material and finish
information is shown
for each part
Base part no. A
RoHS Compliance
Aavid is committed to meeting all aspects of the European Union directive for removal of Hazardous
Substances (RoHS) on standard parts. As such, Aavid has denoted all RoHS compliant parts in red in the next
INDEX section. Updates on converted RoHS parts will be circulated separately when available.
Grease
Epoxy
&
page112
Mounting
Kits
page 99
3
INDEX
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
Part Number Page
10-5597-02 14
10-5597-22 14
10-5597-33 14
10-5607-04 14
10-5607-05 14
10-5634-01 12
10-6326-27 14
10-6326-28 14
10-6327-01 14
10-BRD1-01 12
10-BRD1-03 12
10-BRD1-04 12
10-BRD1-05 12
10-BRD1-07 12
10-BRD2-01 12
10-CLS1-01 12
10-CLS2-01 12
10-L4LB-03 14
10-L4LB-05 14
10-L4LB-11 14
10-THMA-01 12
10-TNT2-01 14
2317B-EP11-BGS1 18
2319B-TACH405 17
2321B-TACH 17
2327B-CP50 16
2327B-TACH 16
2332B-TACH 17
2338B-TACH 17
2342B-TACH 17
2518B-EP11-BGS2 18
2519B-EP11-BGS5 18
2520B-EP04-BGS5 18
2522B-EP04-BGS5 18
320105B00000 76
320205B00000 76
323005B00000 76
325705B00000 76
326005B00000 76
3319B 20
3320B 20
3321B 20
3325B 20
3330B 20
3331B 20
3332B 20
3334B 20
335114B00032 19
335211B00000 19
335211B00032 19
335214B00000 19
335214B00032 19
335214B00034 19
335224B00032 16
335224B00034 16
335314B00000 19
335314B00032 19
335314B00035 19
335324B00032 16
3354B 20
3356B 20
335714B00000 19
335714B00032 19
335724B00032 16
3357B 20
335814B00000 19
335814B00032 19
335824B00032 16
335824B00034 16
336314B00000 19
336624B00032 17
3613B 20
3624B 20
3625B 20
3634B 20
364424B00032 17
364424B00034 17
371824B00032 17
371824B00034 17
372024B00032 17
372024B00034 17
372924M02000 14
373024B00032 16
Part Number Page
373024B00034 16
373224M00032 16
373324M00032 17
374024B00032 16
374024B00035 16
374024B60023 12
374124B00032 16
374124B00035 16
374124B60023 12
374224B00032 16
374224B00035 16
374224B60023 12
374324B00032 16
374324B00035 16
374324B60023 12
374424B00032 16
374424B00035 16
374424B60023 12
374524B00032 16
374524B00035 16
374524B60023 12
374624B00032 17
374624B00035 17
374624B60024 12
374724B00032 17
374724B00035 17
374724B60024 12
374824B00032 17
374824B00035 17
374824B60024 12
374924B00032 17
374924B00035 17
374924B60024 12
375024B00032 17
375024B00035 17
375024B60024 12
375124B00032 17
375124B00035 17
375124B60024 12
375224B00032 16
375324B00035 16
375424B00034 16
500103B00000 72
500203B00000 72
500303B00000 72
500403B00000 72
501000B00000 21
501000J00000 21
501100B00000 24
501200B00000 24
501303B00000 70
501403B00000 70
501503B00000 70
501603B00000 70
501706B00000 74
501806B00000 74
501906B00000 74
502006B00000 74
504102B00000 39
504222B00000 39
505103B00000 72
505303B00000 72
505403B00000 72
506003B00000 69
506304B00000 63
506902B00000 42
507002B00000 42
507102B00000 42
507222B00000 42
507302B00000 39
507302J00000 39
508500B00000 24
508600B00000 24
508700B00000 24
513001B02500 58
513002B02500 58
513101B02500 58
513102B02500 58
513201B02500 58
513202B02500 58
513301B02500 58
513302B02500 58
519703B00000 71
Part Number Page
519803B00000 71
519903B00000 71
520103B00000 71
520327B00000 69
520328B00000 69
520329B00000 69
529701B02500 56
529702B02500 56
529801B02500 56
529802B02500 56
529901B02500 56
529902B02500 56
530001B02500 56
530002B02500 56
530101B00100 54
530101B00150 54
530102B00100 54
530102B00150 54
530161B00162 54
530162B00162 54
530401B00100 55
530401B00150 55
530402B00100 55
530402B00150 55
530510B00000 66
530510U00000 66
530613B00000 41
530614B00000 41
530714B00000 41
530801B05100 54
530801B05150 54
530802B05100 54
530802B05150 54
530861B05162 54
530862B05162 54
531002B02500 59
531002C02500 59
531102B02500 59
531102C02500 59
531202B02500 59
531202C02500 59
531302B02500 59
531302C02500 59
532602B02500 50
532702B02500 50
532802B02500 50
533001B02551 55
533002B02551 55
533101B02551 55
533102B02551 55
533201B02551 55
533202B02551 55
533301B02551 55
533302B02551 55
533401B02552 57
533402B02552 57
533421B02552 57
533422B02552 57
533501B02552 57
533502B02552 57
533521B02552 57
533522B02552 57
533601B02552 57
533602B02552 57
533621B02552 57
533622B02552 57
533701B02552 57
533702B02552 57
533721B02552 57
533722B02552 57
533802B02554 50
533902B02554 50
534002B02554 50
534202B02853 38
534202B03453 38
542502B00000 49
542502D00000 49
551002B00000 30
560200B00000 21
560200W00000 21
563002B00000 34
563002D00000 34
563002T00000 34
Part Number Page
566010B00000 66
566010B03100 66
566010B03400 66
566902B00000 53
566902B03100 53
566902B04000 53
569003B00000 71
569022B00000 43
573100D00000 25
573100D00010 25
573300D00000 25
573300D00010 25
573400D00000 26
573400D00010 26
574004B00000 63
574004U00000 63
574102B00000 45
574102B03300 45
574204B00000 63
574204B03300 63
574402B00000 45
574402B03200 45
574502B00000 45
574502B03300 45
574602B00000 45
574602B03300 45
574802B00000 44
574802B03300 44
574902B00000 45
574902B03300 45
575002B00000 34
575002D00000 34
575002T00000 34
575102B00000 46
575200B00000 68
575300B00000 68
575400B00000 68
575603B00000 70
575703B00000 70
575803B00000 70
575903B00000 70
576012B00000 41
576014B00000 41
576103B00000 73
576203B00000 73
576303B00000 73
576403B00000 73
576602B00000 34
576602D00000 34
576602T00000 34
576802B00000 52
576802B03100 52
576802B04000 52
576802C00000 52
576802C03100 52
576802C04000 52
576802U00000 52
576802U03100 52
576802U04000 52
576904B00000 64
577002B00000 35
577002B04000 35
577102B00000 35
577102B04000 35
577202B00000 35
577202B04000 35
577304B00000 64
577404B00000 64
577500B00000 65
577500U00000 65
577922B00000 41
578105B00000 75
578205B00000 75
578305B00000 75
578405B00000 75
578505B00000 75
578622B03200 41
579003B00000 71
579103B00000 69
579103C00000 69
579206B00000 74
579206C00000 74
579302B00000 46
Part Number Page
579402B00000 46
579604B00000 63
579604B03300 63
579704B00000 63
579704B03300 63
579802B00000 44
579802B03300 44
579902B00000 44
579902B03300 44
580100B00000 21
580100W00000 21
580200B00000 21
580200W00000 21
580300B00000 22
580400B00000 23
580500B00000 24
580600B00000 24
581001B02500 61
581002B02500 61
581101B02500 61
581102B02500 61
581201B02500 61
581202B02500 61
584000B00000 67
584000B03500 67
5900PB 33
590102B03600 35
590302B03600 35
591202B00000 51
591202B03100 51
591202B04000 51
591302B00000 51
591302B02800 51
591302B04000 51
592201B03400 62
592502B03400 49
592502U03400 49
592902B03400 34
593002B03400 34
593101B03600 62
593202B03500 48
5F 75
6000PD 77
6000U 77
6021B 31
6021PB 31
6022B 47
6022PB 47
6025B-TT 48
6025D 48
6032B-TT 47
6032D 47
6034B-TT 64
6038B 37
6038B-TT 37
6043PB 44
6046PB 64
6047PB 64
6049PB 44
6094PB 44
6109PB 36
6110PB 36
615653B00250 19
6201PB 75
6202PB 75
6203PB 75
6221PB 31
6222B 77
6223B 77
6224B 77
6225B-MT 47
6230B-TT 31
6230D 31
6232B-MT 48
6232PB-MT 48
6236B 40
6236PB 40
6237B 43
6237PB 43
6238B 38
6238B-MT 38
6239B-MT 38
6284B 24
Part Number Page
6374B 61
6380B 60
6381B 60
6382B 60
6396B 60
6396B-P2 60
6398B 60
6398B-P2 60
6399B 60
6399B-P2 60
6400B 60
6400B-P2 60
700353U01100 19
7019B 28
7019B-MT 28
7019PB 28
7020B 28
7020B-MT 28
7021B 29
7021B-MT 29
7022B 30
7022B-MT 30
7022PB 30
7022PB-MT 30
7023B 29
7023B-MT 29
7025B 28
7025B-MT 28
7038B 67
709203B00400 19
7106D 25
7106D/TR 25
7109D 26
7109D/TR 26
7128D 37
7130D 62
7136D 36
7137D 42
7139D 36
7140D 42
7141D 39
7142D 37
7148D 67
7173D 40
7178D 36
799403B01500 19
92F 68
BW38-2 58
BW38-4 58
BW50-2 58
BW50-4 58
BW63-2 58
BW63-4 58
ML26AA 50
PF432 52
PF433 52
PF434 52
PF435 52
PF436 52
SW25-2 56
SW25-4 56
SW25-6 59
SW38-2 56
SW38-4 56
SW38-6 59
SW50-2 56
SW50-4 56
SW63-2 56
SW63-4 56
TV1500 33
TV1505 33
TV265 33
TV35 32
TV4 65
TV40 40
TV47 32
TV58 32
TV96 53
TV97 53
YB32-4 61
Index by Part Number
NOTE: Red indicates RoHS compliance
4
INDEX
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
6000U 15.0 V 77
6000PD 15.0 V 77
6222B 9.4 V 77
6223B 9.4 V 77
6224B 9.4 V 77
501200B00000 68.0 H 24
501100B00000 67.0 H 24
501000J00000 60.0 H 21
501000B00000 60.0 H 21
580300B00000 39.0 H 22
580400B00000 39.0 H 23
508500B00000 34.0 H 24
508600B00000 32.0 H 24
580100B00000 30.0 H 21
580100W00000 30.0 H 21
508700B00000 27.2 H 24
6284B 25.0 H 24
560200B00000 20.0 H 21
560200W00000 20.0 H 21
580200B00000 20.0 H 21
580200W00000 20.0 H 21
580500B00000 20.0 H 23
580600B00000 20.0 H 22
Bi Directional Air Flow H 19
Fluted Fin H 20
Solder Anchor H 12
Push Pin H 14
Clip Attachment H 18
Tape Attachment H 16
YB32-4 8.4 V 61
6380B 6.8 V 60
6381B 5.8 V 60
6396B 5.6 V 60
6396B-P2 5.6 V 60
6374B 5.0 V 61
6398B 4.4 V 60
6398B-P2 4.4 V 60
6382B 4.2 V 60
6399B 3.3 V 60
6399B-P2 3.3 V 60
6400B 2.7 V 60
6400B-P2 2.7 V 60
530510U00000 20.6 V 66
530510B00000 20.6 V 66
7038B 16.0 V 67
7148D 16.0 V 67
566010B00000 11.5 H-V 66
566010B03400 11.5 V 66
566010B03100 11.5 H 66
584000B00000 10.0 V 67
584000B03500 10.0 V 67
6380B 6.8 V 60
6381B 5.8 V 60
6382B 4.2 V 60
D-PAK TO-252
573100D00010 15.0 H 25
573100D00000 15.0 H 25
D2PAK TO-263
573300D00010 18.0 H 25
573300D00000 18.0 H 25
7109D/TR 11.0 H 26
7109D 11.0 H 26
D2PAK TO-263 SO-10
7106D/TR 15.0 H 25
7106D 15.0 H 25
D3PAK TO-268
573400D00010 14.0 H 26
573400D00000 14.0 H 26
575603B00000 15.6 H 70
575703B00000 13.4 H 70
579103B00000 12.5 H 69
579103C00000 12.5 H 69
501303B00000 12.0 H 70
519803B00000 11.4 H 71
575803B00000 11.0 H 70
501403B00000 10.0 H 70
505103B00000 10.0 H 72
575903B00000 9.8 H 70
501503B00000 8.4 H 70
501603B00000 7.8 H 70
505303B00000 7.8 H 72
500103B00000 7.2 H 72
576103B00000 7.2 H 73
506003B00000 7.0 H 69
500203B00000 6.2 H 72
576203B00000 6.2 H 73
579003B00000 6.0 H 71
505403B00000 6.0 H 72
576303B00000 6.0 H 73
500303B00000 5.8 H 72
569003B00000 5.5 H 71
520103B00000 5.4 H 71
576403B00000 5.1 H 73
500403B00000 5.0 H 72
519703B00000 4.8 H 71
520329B00000 4.7 H 69
520328B00000 4.7 H 69
520327B00000 4.7 H 69
519903B00000 4.2 H 71
320105B00000 63.0 V 76
320205B00000 63.0 V 76
325705B00000 60.0 V 76
326005B00000 57.0 V 76
323005B00000 56.0 V 76
6201PB 54.0 V 75
5F 45.2 V 75
6202PB 43.0 V 75
578105B00000 40.0 V 75
578205B00000 38.0 V 75
6203PB 38.0 V 75
578305B00000 35.0 V 75
578405B00000 31.0 V 75
578505B00000 28.0 V 75
579206B00000 22.0 H 74
579206C00000 22.0 H 74
501706B00000 12.0 H 74
501806B00000 9.6 H 74
501906B00000 8.0 H 74
502006B00000 8.0 H 74
575200B00000 60.0 V 68
575300B00000 50.0 V 68
575400B00000 40.0 V 68
92F 36.1 V 68
577500B00000 26.0 V 65
577500U00000 26.0 V 65
TV4 21.6 H 65
576904B00000 32.0 H–V64
574004B00000 28.0 V 63
574004U00000 28.0 V 63
577304B00000 27.2 H–V64
6046PB 25.0 V 64
6047PB 25.0 V 64
579604B00000 24.0 V 63
579604B03300 24.0 V 63
579704B00000 24.0 V 63
579704B03300 24.0 V 63
577404B00000 24.0 H–V64
506304B00000 20.0 H–V63
574204B00000 16.8 V 63
574204B03300 16.8 V 63
531002B02500 13.4 V 59
531002C02500 13.4 V 59
SW25-6 13.0 V 59
531102B02500 10.4 V 59
531102C02500 10.4 V 59
SW38-6 10.0 V 59
6034B-TT 8.3 V 64
531302B02500 8.0 V 59
531302C02500 8.0 V 59
531202C02500 7.5 V 59
531202B02500 7.5 V 59
TV96 24.0 H 53
7130D 23.1 V 62
TV97 20.0 H 53
581001B02500 19.6 V 61
581101B02500 16.8 V 61
581201B02500 12.8 V 61
513001B02500 13.4 V 58
533001B02551 13.0 V 55
SW25-2 11.4 V 56
SW25-4 11.4 V 56
533101B02551 11.0 V 55
513101B02500 11.0 V 58
SW38-2 10.2 V 56
SW38-4 10.2 V 56
533201B02551 9.0 V 55
513201B02500 9.0 V 58
SW50-2 8.8 V 56
SW50-4 8.8 V 56
593101B03600 8.6 V 62
YB32-4 8.4 V 61
513301B02500 8.0 V 58
533301B02551 8.0 V 55
530001B02500 8.0 V 56
BW38-2 7.2 V 58
BW38-4 7.2 V 58
SW63-2 7.0 V 56
SW63-4 7.0 V 56
6380B 6.8 V 60
592201B03400 6.8 V 62
530101B00100 6.3 V 54
530101B00150 6.3 V 54
530801B05100 6.3 V 54
530801B05150 6.3 V 54
530401B00100 6.3 V 55
530401B00150 6.3 V 55
6381B 5.8 V 60
BW50-2 5.8 V 58
BW50-4 5.8 V 58
533701B02552 5.7 V 57
533721B02552 5.7 V 57
6396B 5.6 V 60
6396B-P2 5.6 V 60
529701B02500 5.5 V 56
6374B 5.0 V 61
533401B02552 5.0 V 57
533421B02552 5.0 V 57
BW63-2 4.7 V 58
BW63-4 7.4 V 58
529901B02500 4.5 V 56
533501B02552 4.5 V 57
533521B02552 4.5 V 57
530161B00162 4.4 V 54
530861B05162 4.4 V 54
6398B 4.4 V 60
6398B-P2 4.4 V 60
6382B 4.2 V 60
533601B02552 3.8 V 57
533621B02552 3.8 V 57
529801B02500 3.7 V 56
6399B 3.3 V 60
6399B-P2 3.3 V 60
6400B 2.7 V 60
6400B-P2 2.7 V 60
Index by Device Cooled and Thermal Resistance
Thermal Board
Part Number Resistance Mounting Page
AXIAL LEAD
BRIDGE RECTIFIERS
DIPS
IC PACKAGES, BGA, PGA, QFP, LCC
MULTI-WATT
SIPS
SMT
TO-3
TO-5
TO-66
TO-218
TO-92
TO-126
TO-202
Thermal Board
Part Number Resistance Mounting Page
Thermal Board
Part Number Resistance Mounting Page
Thermal Board
Part Number Resistance Mounting Page
H = Horizontal mount
V = Vertical mount
H–V = Both horizontal and vertical depending on device leads
5
INDEX
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
6094PB 40.5 H 44
7178D 35.7 V 36
6049PB 34.1 V 44
577002B00000 32.0 H–V35
577002B04000 32.0 V 35
TV58 29.9 H–V32
7139D 28.3 H 36
576802B00000 27.3 V 52
576802C00000 27.3 V 52
576802U00000 27.3 V 52
576802B03100 27.3 H 52
576802C03100 27.3 H 52
576802U03100 27.3 H 52
576802B04000 27.3 V 52
576802C04000 27.3 V 52
576802U04000 27.3 V 52
TV47 27.1 H–V32
591202B00000 26.8 H–V51
591202B03100 26.8 H 51
591202B04000 26.8 V 51
591302B00000 26.8 H–V51
591302B02800 26.8 V 51
591302B04000 26.8 H 51
579802B00000 26.4 V 44
579802B03300 26.4 V 44
579902B00000 26.4 V 44
579902B03300 26.4 V 44
577102B00000 25.9 H–V35
577102B04000 25.9 V 35
7173D 25.8 V 40
6236B 25.0 V 40
6236PB 25.0 V 40
6237B 25.0 H 43
6237PB 25.0 H 43
577202B00000 24.4 H–V35
577202B04000 24.4 V 35
507302B00000 24.0 H–V39
507302J00000 24.0 H–V39
542502B00000 24.0 H 49
542502D00000 24.0 H 49
TV96 24.0 H 53
576014B00000 23.2 H–V41
574402B00000 23.2 H–V45
574402B03200 23.2 H 45
574102B00000 23.2 H–V45
574102B03300 23.2 V 45
6043PB 23.0 V 44
592502B03400 22.0 V 49
592502U03400 22.0 V 49
574602B00000 21.6 H–V45
574602B03300 21.6 V 45
574502B00000 21.2 H–V45
574502B03300 21.2 V 45
6110PB 21.0 H–V36
576012B00000 20.8 H–V41
7137D 20.8 V 42
7140D 20.8 H 42
574802B00000 20.4 H–V44
574802B03300 20.4 V 44
7142D 20.3 H 37
7141D 20.3 V 39
530714B00000 20.3 H–V41
PF432 20.3 V 52
PF433 20.3 V 52
PF434 20.3 H 52
PF435 20.3 V 52
PF436 20.3 H 52
506902B00000 20.0 V 42
TV97 20.0 H–V53
7136D 19.7 V 36
7128D 19.2 V 37
566902B00000 18.8 H-V 53
566902B03100 18.8 H 53
566902B04000 18.8 V 53
6038B 18.0 V 37
6038B-TT 18.0 V 37
592902B03400 17.9 V 34
6025D 17.9 V 48
6025B-TT 17.9 V 48
ML26AA 17.9 H 50
581002B02500 17.4 V 61
TV1505 17.0 V 33
6109PB 17.0 H–V36
575102B00000 16.8 H–V46
579302B00000 16.8 V 46
579402B00000 16.8 V 46
581102B02500 16.8 V 61
530614B00000 16.7 H–V41
530613B00000 16.7 H–V41
6022PB 16.7 V 47
6022B 16.7 V 47
576602B00000 16.6 V 34
576602D00000 16.6 V 34
576602T00000 16.6 V 34
574902B00000 16.0 H–V45
574902B03300 16.0 V 45
504102B00000 15.6 H–V39
507002B00000 15.6 H–V42
507102B00000 15.6 H–V42
6225B-MT 15.0 V 47
TV1500 14.2 V 33
575002B00000 13.6 V 34
575002D00000 13.6 V 34
575002T00000 13.6 V 34
6238B 13.6 H–V38
6238B-MT 13.6 V 38
6239B-MT 13.6 V 38
593002B03400 13.4 V 34
534202B02853 13.4 V 38
534202B03453 13.4 V 38
513002B02500 13.4 V 58
531002B02500 13.4 V 59
531002C02500 13.4 V 59
577922B00000 13.2 V 41
578622B03200 13.2 V 41
TV265 13.0 V 33
5900PB 13.0 V 33
563002B00000 13.0 V 34
563002D00000 13.0 V 34
563002T00000 13.0 V 34
533802B02554 13.0 V 50
533002B02551 13.0 V 55
SW25-6 13.0 V 59
581202B02500 12.8 V 61
6021B 12.5 V 31
6021PB 12.5 V 31
6221PB 12.5 V 31
6230D 12.5 V 31
6230B-TT 12.5 V 31
551002B00000 12.4 H 30
SW25-2 11.4 V 56
SW25-4 11.4 V 56
590302B03600 11.2 V 35
7019B 11.0 V 28
7019PB 11.0 V 28
7019B-MT 11.0 V 28
533902B02554 11.0 V 50
513102B02500 11.0 V 58
533102B02551 11.0 V 55
593202B03500 10.4 V 48
531102B02500 10.4 V 59
531102C02500 10.4 V 59
SW38-2 10.2 V 56
SW38-4 10.2 V 56
590102B03600 10.0 V 35
6232B-MT 10.0 V 48
6232PB-MT 10.0 V 48
SW38-6 10.0 V 59
TV40 9.9 H 40
507222B00000 9.6 H 42
534002B02554 9.0 V 50
533202B02551 9.0 V 55
513202B02500 9.0 V 58
SW50-2 8.8 V 56
SW50-4 8.8 V 56
7020B 8.7 V 28
7020B-MT 8.7 V 28
YB32-4 8.4 V 61
Index by Device Cooled and Thermal Resistance
6032B-TT 8.3 V 47
6032D 8.3 V 47
533302B02551 8.0 V 55
530002B02500 8.0 V 56
513302B02500 8.0 V 58
531302B02500 8.0 V 59
531302C02500 8.0 V 59
531202C02500 7.5 V 59
531202B02500 7.5 V 59
TV35 7.2 H 32
BW38-2 7.2 V 58
BW38-4 7.2 V 58
SW63-2 7.0 V 56
SW63-4 7.0 V 56
7025B 6.8 V 28
7025B-MT 6.8 V 28
7021B 6.8 V 29
7021B-MT 6.8 V 29
6380B 6.8 V 60
7022B 6.5 V 30
7022PB 6.5 V 30
7022B-MT 6.5 V 30
7022PB-MT 6.5 V 30
504222B00000 6.4 H 39
530102B00100 6.3 V 54
530102B00150 6.3 V 54
530802B05100 6.3 V 54
530802B05150 6.3 V 54
530402B00100 6.3 V 55
530402B00150 6.3 V 55
6381B 5.8 V 60
BW50-2 5.8 V 58
BW50-4 5.8 V 58
533702B02552 5.7 V 57
533722B02552 5.7 V 57
6396B 5.6 V 60
6396B-P2 5.6 V 60
569022B00000 5.5 H 43
532602B02500 5.5 V 50
529702B02500 5.5 V 56
6374B 5.0 V 61
533402B02552 5.0 V 57
533422B02552 5.0 V 57
532702B02500 4.8 V 50
BW63-2 4.7 V 58
BW63-4 4.7 V 58
529902B02500 4.5 V 56
533502B02552 4.5 V 57
7023B 4.4 V 29
7023B-MT 4.4 V 29
530162B00162 4.4 V 54
530862B05162 4.4 V 54
6398B 4.4 V 60
6398B-P2 4.4 V 60
530162B00162 4.4 V 54
530862B05162 4.4 V 54
532802B02500 4.2 V 50
6382B 4.2 V 60
533602B02552 3.8 V 57
533622B02552 3.8 V 57
529802B02500 3.7 V 56
6399B 3.3 V 60
6399B-P2 3.3 V 60
6400B 2.7 V 60
6400B-P2 2.7 V 60
533522B02552 2.7 V 57
TV96 24.0 H 53
TV97 20.0 H–V53
513001B02500 13.4 V 58
533001B02551 13.0 V 55
SW25-2 11.4 V 56
SW25-4 11.4 V 56
533101B02551 11.0 V 55
513101B02500 11.0 V 58
SW38-2 10.2 V 56
SW38-4 10.2 V 56
533201B02551 9.0 V 55
513201B02500 9.0 V 58
SW50-2 8.8 V 56
SW50-4 8.8 V 56
YB32-4 8.4 V 61
533301B02551 8.0 V 55
530001B02500 8.0 V 56
513301B02500 8.0 V 58
BW38-2 7.2 V 58
BW38-4 7.2 V 58
SW63-2 7.0 V 56
SW63-4 7.0 V 56
6380B 6.8 V 60
530101B00100 6.3 V 54
530101B00150 6.3 V 54
530801B05100 6.3 V 54
530801B05150 6.3 V 54
530401B00100 6.3 V 55
530401B00150 6.3 V 55
6381B 5.8 V 60
BW50-2 5.8 V 58
BW50-4 5.8 V 58
533701B02552 5.7 V 57
533721B02552 5.7 V 57
6396B 5.6 V 60
6396B-P2 5.6 V 60
529701B02500 5.5 V 56
6374B 5.0 V 61
533401B02552 5.0 V 57
533421B02552 5.0 V 57
BW63-2 4.7 V 58
BW63-4 4.7 V 58
529901B02500 4.5 V 56
533501B02552 4.5 V 57
533521B02552 4.5 V 57
6398B 4.4 V 60
6398B-P2 4.4 V 60
530161B00162 4.4 V 54
530861B05162 4.4 V 54
6382B 4.2 V 60
533601B02552 3.8 V 57
533621B02552 3.8 V 57
529801B02500 3.7 V 56
6399B 3.3 V 60
6399B-P2 3.3 V 60
6400B 2.7 V 60
6400B-P2 2.7 V 60
576802B00000 27.3 H–V52
576802C00000 27.3 H–V52
576802U00000 27.3 H–V52
576802B03100 27.3 H 52
576802C03100 27.3 H 52
576802U03100 27.3 H 52
576802B04000 27.3 V 52
576802C04000 27.3 V 52
576802U04000 27.3 V 52
591202B00000 26.8 H-V 51
591202B03100 26.8 H 51
591202B04000 26.8 V 51
591302B00000 26.8 H-V 51
591302B02800 26.8 V 51
591302B04000 26.8 H 51
PF432 20.3 V 52
PF433 20.3 V 52
PF434 20.3 H 52
PF435 20.3 V 52
PF436 20.3 H 52
566902B00000 18.8 H-V 53
566902B03100 18.8 H 53
566902B04000 18.8 V 53
TO-220
TO-247
TO-262
Thermal Board
Part Number Resistance Mounting Page
Thermal Board
Part Number Resistance Mounting Page
Thermal Board
Part Number Resistance Mounting Page
Thermal Board
Part Number Resistance Mounting Page
6
INDEX
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
6000U 15.0 V 77
6000PD 15.0 V 77
6222B 9.4 V 77
6223B 9.4 V 77
6224B 9.4 V 77
Extruded Heat Sinks
501200B00000 68.0 H 24
501100B00000 67.0 H 24
508700B00000 27.2 H 24
6284B 25.0 H 24
580500B00000 20.0 H 23
580600B00000 20.0 H 22
Slide On Heat Sinks
501000J00000 60.0 H 21
501000B00000 60.0 H 21
580300B00000 39.0 H 22
580400B00000 39.0 H 23
508500B00000 34.0 H 24
508600B00000 32.0 H 24
580100B00000 30.0 H 21
580100W00000 30.0 H 21
560200B00000 20.0 H 21
560200W00000 20.0 H 21
580200B00000 20.0 H 21
580200W00000 20.0 H 21
Bi Directional Air Flow H 19
Fluted Fin H 20
Solder Anchor H 12
Push Pin H 14
Clip Attachment H 18
Tape Attachment H 16
Extruded Heat Sinks
YB32-4 8.4 V 61
6380B 6.8 V 60
6381B 5.8 V 60
6396B 5.6 V 60
6396B-P2 5.6 V 60
6374B 5.0 V 61
6398B 4.4 V 60
6398B-P2 4.4 V 60
6382B 4.2 V 60
6399B 3.3 V 60
6399B-P2 3.3 V 60
6400B 2.7 V 60
6400B-P2 2.7 V 60
Channel Style Heat Sinks
530510U00000 20.6 V 66
530510B00000 20.6 V 66
Clip On Style Heat Sinks
584000B00000 10.0 V 67
584000B03500 10.0 V 67
Extruded Heat Sinks
6380B 6.8 v 60
6381B 5.8 V 60
6382B 4.2 v 60
Plug In Style Heat Sinks
566010B00000 11.5 H–V66
566010B03400 11.5 V 66
566010B03100 11.5 H 66
Slide On Style Heat Sinks
7038B 16.0 V 67
7148D 16.0 V 67
D-Pak TO-252
573100D00010 15.0 H 25
573100D00000 15.0 H 25
D2Pak TO-263
573300D00010 18.0 H 25
573300D00000 18.0 H 25
7109D/TR 11.0 H 26
7109D 11.0 H 26
D2Pak TO-263 SO10 (MO-184)
7106D/TR 15.0 H 25
7106D 15.0 H 25
D3Pak TO-268
573400D00010 14.0 H 26
573400D00000 14.0 H 26
Diamond Shaped Basket Heat Sinks
575603B00000 15.6 H 70
575703B00000 13.4 H 70
501303B00000 12.0 H 70
575803B00000 11.0 H 70
501403B00000 10.0 H 70
575903B00000 9.8 H 70
501503B00000 8.4 H 70
501603B00000 7.8 H 70
Hat Section Heat Sink
506003B00000 7.0 H 69
Space Saving Collar Heat Sinks
579103B00000 12.5 H 69
579103C00000 12.5 H 69
Square Basket Heat Sinks
519803B00000 11.4 H 71
505103B00000 10.0 H 72
505303B00000 7.8 H 72
500103B00000 7.2 H 72
576103B00000 7.2 H 73
500203B00000 6.2 H 72
576203B00000 6.2 H 73
579003B00000 6.0 H 71
505403B00000 6.0 H 72
576303B00000 6.0 H 73
500303B00000 5.8 H 72
569003B00000 5.5 H 71
520103B00000 5.4 H 71
576403B00000 5.1 H 73
500403B00000 5.0 H 72
519703B00000 4.8 H 71
519903B00000 4.2 H 71
Two Piece Heat Sinks
520329B00000 4.7 H 69
520328B00000 4.7 H 69
520327B00000 4.7 H 69
Extruded Collar Heat Sinks
320105B00000 63.0 V 76
320205B00000 63.0 V 76
325705B00000 60.0 V 76
326005B00000 57.0 V 76
323005B00000 56.0 V 76
Low Cost Push On Heat Sink
5f 45.2 V 75
Snap On Cooler Heat Sinks
578105B00000 40.0 V 75
578205B00000 38.0 V 75
578305B00000 35.0 V 75
578405B00000 31.0 V 75
578505B00000 28.0 V 75
Space Saving Collar Heat Sinks
6201PB 54.0 V 75
6202PB 43.0 V 75
6203PB 38.0 V 75
Diamond Shaped Basket Heat Sinks
501706B00000 12.0 H 74
501806B00000 9.6 H 74
501906B00000 8.0 H 74
502006B00000 8.0 H 74
Space Saving Collar Heat Sinks
579206B00000 22.0 H 74
579206C00000 22.0 H 74
Clip On Style Heat Sink
92F 36.1 V 68
Slip On Style Heat Sinks
575200B00000 60.0 V 68
575300B00000 50.0 V 68
575400B00000 40.0 V 68
Channel Style Heat Sink
TV4 21.6 H 65
Slip On Style Heat Sinks
577500B00000 26.0 V 65
577500U00000 26.0 V 65
Channel Style Heat Sinks
576904B00000 32.0 H–V64
577304B00000 27.2 H–V64
577404B00000 24.0 H–V64
Compact Slide On Heat Sinks
6046PB 25.0 V 64
6047PB 25.0 V 64
Extruded Heat Sinks
531002B02500 13.4 V 59
531002C02500 13.4 V 59
SW25-6 13.0 V 59
531102B02500 10.4 V 59
531102C02500 10.4 V 59
SW38-6 10.0 V 59
531302B02500 8.0 V 59
531302C02500 8.0 V 59
531202C02500 7.5 V 59
531202B02500 7.5 V 59
Thermal Board
Part Number Resistance Mounting Page
Index by Device Cooled, Heat Sink Style, and Thermal Resistance
AXIAL LEAD
BRIDGE RECTIFIERS
DIPS
IC PACKAGES, BGA, PGA, QFP, LCC
MULTI-WATT
SIPS
SMT
TO-3
TO-5
TO-92
TO-126
TO-202
TO-66
Thermal Board
Part Number Resistance Mounting Page
Thermal Board
Part Number Resistance Mounting Page
7
INDEX
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
6399B-P2 3.3 V 60
6400B 2.7 V 60
6400B-P2 2.7 V 60
6374B 5.0 V 61
Hat Section Heat Sinks
TV96 24.0 H 53
TV97 20.0 H–V53
High Rise Style Heat Sinks
530101B00100 6.3 V 54
530101B00150 6.3 V 54
530801B05100 6.3 V 54
530801B05150 6.3 V 54
530401B00100 6.3 V 55
530401B00150 6.3 V 55
Plug In Style Heat Sink
592201B03400 6.8 V 62
Slide On Heat Sink
7130D 23.1 V 62
Channel Style Heat Sinks
7178D 35.7 V 36
577002B04000 32.0 V 35
577002B00000 32.0 H-V 35
TV58 29.9 H–V32
7139D 28.3 H 36
TV47 27.1 H–V32
577102B00000 25.9 H-V 35
577102B04000 25.9 V 35
7173D 25.8 V 40
6236B 25.0 V 40
6236PB 25.0 V 40
577202B00000 24.4 H-V 35
577202B04000 24.4 V 35
507302B00000 24.0 H-V 39
507302J00000 24.0 H-V 39
576014B00000 23.2 H-V 41
6110PB 21.0 H-V 36
576012B00000 20.8 H-V 41
7142D 20.3 H 37
7141D 20.3 V 39
530714B00000 20.3 H-V 41
7136D 19.7 V 36
7128D 19.2 V 37
6038B 18.0 V 37
6038B-TT 18.0 V 37
592902B03400 17.9 V 34
6109PB 17.0 H-V 36
TV1505 17.0 V 33
530614B00000 16.7 H-V 41
530613B00000 16.7 H-V 41
576602B00000 16.6 V 34
576602D00000 16.6 V 34
576602T00000 16.6 V 34
504102B00000 15.6 H–V39
TV1500 14.2 V 33
575002B00000 13.6 V 34
575002D00000 13.6 V 34
575002T00000 13.6 V 34
6238B 13.6 H–V38
6238B-MT 13.6 V 38
6239B-MT 13.6 V 38
593002B03400 13.4 V 34
534202B02853 13.4 V 38
534202B03453 13.4 V 38
577922B00000 13.2 V 41
578622B03200 13.2 V 41
563002B00000 13.0 V 34
563002D00000 13.0 V 34
563002T00000 13.0 V 34
TV265 13.0 V 33
5900PB 13.0 V 33
6021B 12.5 V 31
6021PB 12.5 V 31
6221PB 12.5 V 31
6230D 12.5 V 31
6230B-TT 12.5 V 31
551002B00000 12.4 H 30
590302B03600 11.2 V 35
7019B 11.0 V 28
7019PB 11.0 V 28
7019B-MT 11.0 V 28
590102B03600 10.0 V 35
TV40 9.9 H 40
7020B 8.7 V 28
7020B-MT 8.7 V 28
TV35 7.2 H 32
7025B 6.8 V 28
7025B-MT 6.8 V 28
7021B 6.8 V 29
7021B-MT 6.8 V 29
7022B 6.5 V 30
7022PB 6.5 V 30
7022B-MT 6.5 V 30
7022PB-MT 6.5 V 30
504222B00000 6.4 H 39
7023B 4.4 V 29
7023B-MT 4.4 V 29
Clip On Style Heat Sinks
6094PB 40.5 H 44
6049PB 34.1 V 44
579802B00000 26.4 V 44
579802B03300 26.4 V 44
579902B00000 26.4 V 44
579902B03300 26.4 V 44
6043PB 23.0 V 44
574802B00000 20.4 H–V44
574802B03300 20.4 V 44
Dual Extruded Heat Sinks
6380B 6.8 V 60
6381B 5.8 V 60
533722B02552 5.7 V 57
533422B02552 5.0 V 57
6374B 5.0 V 61
6382B 4.2 V 60
533622B02552 3.8 V 57
533522B02552 2.7 V 57
Dual High Rise Style Heat Sinks
530162B00162 4.4 V 54
530862B05162 4.4 V 54
Extruded Heat Sinks
ML26AA 17.9 H 50
581002B02500 17.4 V 61
581102B02500 16.8 V 61
513002B02500 13.4 V 58
531002B02500 13.4 V 59
531002C02500 13.4 V 59
533802B02554 13.0 V 50
533002B02551 13.0 V 55
SW25-6 13.0 V 59
581202B02500 12.8 V 61
SW25-2 11.4 V 56
SW25-4 11.4 V 56
533902B02554 11.0 V 50
533102B02551 11.0 V 55
513102B02500 11.0 V 58
531102B02500 10.4 V 59
531102C02500 10.4 V 59
SW38-2 10.2 V 56
SW38-4 10.2 V 56
SW38-6 10.0 V 59
Index by Device Cooled, Heat Sink Style, and Thermal Resistance
Thermal Board
Part Number Resistance Mounting Page
Thermal Board
Part Number Resistance Mounting Page
Low Cost Slide On Heat Sinks
574004B00000 28.0 V 63
574004U00000 28.0 V 63
Low Cost Slide On Cooler Heat Sinks
579604B00000 24.0 V 63
579604B03300 24.0 V 63
579704B00000 24.0 V 63
579704B03300 24.0 V 63
574204B00000 16.8 V 63
574204B03300 16.8 V 63
Low Profile Hat Section Heat Sink
506304B00000 20.0 H–V63
Space Saving Staggered Heat Sink
6034B-TT 8.3 V 64
Channel Style Heat Sinks
593101B03600 8.6 V 62
Dual Extruded Heat Sinks
533721B02552 5.7 V 57
533421B02552 5.0 V 57
533521B02552 4.5 V 57
533621B02552 3.8 V 57
Dual High Rise Style Heat Sinks
530161B00162 4.4 V 54
530861B05162 4.4 V 54
Extruded Heat Sinks
581001B02500 19.6 V 61
581101B02500 16.8 V 61
513001B02500 13.4 V 58
533001B02551 13.0 V 55
581201B02500 12.8 V 61
SW25-2 11.4 V 56
SW25-4 11.4 V 56
533101B02551 11.0 V 55
513101B02500 11.0 V 58
SW38-2 10.2 V 56
SW38-4 10.2 V 56
533201B02551 9.0 V 55
513201B02500 9.0 V 58
SW50-2 8.8 V 56
SW50-4 8.8 V 56
YB32-4 8.4 V 61
533301B02551 8.0 V 55
530001B02500 8.0 V 56
513301B02500 8.0 V 58
BW63-4 7.4 V 58
BW38-2 7.2 V 58
BW38-4 7.2 V 58
SW63-2 7.0 V 56
SW63-4 7.0 V 56
6380B 6.8 V 60
BW50-2 5.8 V 58
BW50-4 5.8 V 58
6381B 5.8 V 60
533701B02552 5.7 V 57
6396B 5.6 V 60
6396B-P2 5.6 V 60
529701B02500 5.5 V 56
533401B02552 5.0 V 57
BW63-2 4.7 V 58
529901B02500 4.5 V 56
533501B02552 4.5 V 57
6398B 4.4 V 60
6398B-P2 4.4 V 60
6382B 4.2 V 60
533601B02552 3.8 V 57
529801B02500 3.7 V 56
6399B 3.3 V 60
TO-218
TO-220
Thermal Board
Part Number Resistance Mounting Page
TO-202 CONTINUED
8
INDEX
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
534002B02554 9.0 V 50
533202B02551 9.0 V 55
513202B02500 9.0 V 58
SW50-2 8.8 V 56
SW50-4 8.8 V 56
YB32-4 8.4 V 61
533302B02551 8.0 V 55
530002B02500 8.0 V 56
513302B02500 8.0 V 58
531302B02500 8.0 V 59
531302C02500 8.0 V 59
531202C02500 7.5 V 59
531202B02500 7.5 V 59
BW38-2 7.2 V 58
BW38-4 7.2 V 58
SW63-2 7.0 V 56
SW63-4 7.0 V 56
BW50-2 5.8 V 58
BW50-4 5.8 V 58
533702B02552 5.7 V 57
6396B 5.6 V 60
6396B-P2 5.6 V 60
532602B02500 5.5 V 50
529702B02500 5.5 V 56
533402B02552 5.0 V 57
532702B02500 4.8 V 50
BW63-2 4.7 V 58
BW63-4 4.7 V 58
529902B02500 4.5 V 56
533502B02552 4.5 V 57
6398B 4.4 V 60
6398B-P2 4.4 V 60
532802B02500 4.2 V 50
533602B02552 3.8 V 57
529802B02500 3.7 V 56
6399B 3.3 V 60
6399B-P2 3.3 V 60
6400B 2.7 V 60
6400B-P2 2.7 V 60
Hat Section Heat Sinks
6237B 25.0 H 43
6237PB 25.0 H 43
TV96 24.0 H 53
7137D 20.8 V 42
7140D 20.8 H 42
506902B00000 20.0 V 42
TV97 20.0 H–V53
507002B00000 15.6 H–V42
507102B00000 15.6 H–V42
507222B00000 9.6 H 42
High Rise Style Heat Sinks
530102B00100 6.3 V 54
530102B00150 6.3 V 54
530802B05100 6.3 V 54
530802B05150 6.3 V 54
530402B00100 6.3 V 55
530402B00150 6.3 V 55
Plug In Style Heat Sinks
576802B00000 27.3 V 52
576802C00000 27.3 V 52
576802U00000 27.3 V 52
576802B03100 27.3 H 52
576802C03100 27.3 H 52
576802U03100 27.3 H 52
576802B04000 27.3 V 52
576802C04000 27.3 V 52
576802U04000 27.3 V 52
591202B00000 26.8 H-V 51
591202B03100 26.8 H 51
591202B04000 26.8 V 51
Thermal Board
Part Number Resistance Mounting Page
591302B00000 26.8 H-V 51
591302B02800 26.8 V 51
591302B04000 26.8 H 51
PF432 20.3 V 52
PF433 20.3 V 52
PF434 20.3 H 52
PF435 20.3 V 52
PF436 20.3 H 52
566902B00000 18.8 H-V 53
566902B03100 18.8 H 53
566902B04000 18.8 V 53
Slide On Heat Sinks
574402B00000 23.2 H-V 45
574402B03200 23.2 H 45
574102B00000 23.2 H–V45
574102B03300 23.2 V 45
574602B00000 21.6 H-V 45
574602B03300 21.6 V 45
574502B00000 21.2 H-V 45
574502B03300 21.2 V 45
574902B00000 16.0 H-V 45
574902B03300 16.0 V 45
Snap Down Style Heat Sinks
575102B00000 16.8 H–V46
579302B00000 16.8 V 46
579402B00000 16.8 V 46
Space Saving Heat Sinks
542502B00000 24.0 H 49
542502D00000 24.0 H 49
592502B03400 22.0 V 49
592502U03400 22.0 V 49
6025D 17.9 V 48
6025B-TT 17.9 V 48
6022PB 16.7 V 47
6022B 16.7 V 47
6225B-MT 15.0 V 47
593202B03500 10.4 V 48
6232B-MT 10.0 V 48
6232PB-MT 10.0 V 48
6032B-TT 8.3 V 47
6032D 8.3 V 47
Square Basket Heat Sink
569022B00000 5.5 H 43
Dual Extruded Heat Sinks
533721B02552 5.7 V 57
533421B02552 5.0 V 57
533521B02552 4.5 V 57
533621B02552 3.8 V 57
Dual High Rise Style Heat Sinks
530161B00162 4.4 V 54
530861B05162 4.4 V 54
Extruded Heat Sinks
513001B02500 13.4 V 58
533001B02551 13.0 V 55
SW25-2 11.4 V 56
SW25-4 11.4 V 56
533101B02551 11.0 V 55
513101B02500 11.0 V 58
SW38-2 10.2 V 56
SW38-4 10.2 V 56
533201B02551 9.0 V 55
513201B02500 9.0 V 58
SW50-2 8.8 V 56
SW50-4 8.8 V 56
YB32-4 8.4 V 61
533301B02551 8.0 V 55
530001B02500 8.0 V 56
513301B02500 8.0 V 58
BW38-2 7.2 V 58
BW38-4 7.2 V 58
SW63-2 7.0 V 56
SW63-4 7.0 V 56
6380B 6.8 V 60
BW50-2 5.8 V 58
BW50-4 5.8 V 58
6381B 5.8 V 60
533701B02552 5.7 V 57
6396B 5.6 V 60
6396B-P2 5.6 V 60
529701B02500 5.5 V 56
533401B02552 5.0 V 57
6374B 5.0 V 61
BW63-2 4.7 V 58
BW63-4 4.7 V 58
529901B02500 4.5 V 56
533501B02552 4.5 V 57
6398B 4.4 V 60
6398B-P2 4.4 V 60
6382B 4.2 V 60
533601B02552 3.8 V 57
529801B02500 3.7 V 56
6399B 3.3 V 60
6399B-P2 3.3 V 60
6400B 2.7 V 60
6400B-P2 2.7 V 60
Hat Section Heat Sinks
TV96 24.0 H 53
TV97 20.0 H–V53
High Rise Style Heat Sinks
530101B00100 6.3 V 54
530101B00150 6.3 V 54
530801B05100 6.3 V 54
530801B05150 6.3 V 54
530401B00100 6.3 V 55
530401B00150 6.3 V 55
Plug In Style Heat Sinks
576802B00000 27.3 H–V52
576802C00000 27.3 H–V52
576802U00000 27.3 H–V52
576802B03100 27.3 H 52
576802C03100 27.3 H 52
576802U03100 27.3 H 52
576802B04000 27.3 V 52
576802C04000 27.3 V 52
576802U04000 27.3 V 52
591202B00000 26.8 H-V 51
591202B03100 26.8 H 51
591202B04000 26.8 V 51
591302B00000 26.8 H-V 51
591302B02800 26.8 V 51
591302B04000 26.8 H 51
566902B00000 18.8 H-V 53
566902B03100 18.8 H 53
566902B04000 18.8 V 53
PF432 20.3 V 52
PF433 20.3 V 52
PF434 20.3 H 52
PF435 20.3 V 52
PF436 20.3 H 52
Index by Device Cooled, Heat Sink Style, and Thermal Resistance
Thermal Board
Part Number Resistance Mounting Page
Thermal Board
Part Number Resistance Mounting Page
TO-247
TO-262
TO-220 CONTINUED
9
HOW TO SELECT A HEAT SINK
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United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
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www.aavidthermalloy.com
Heat sinks reduce and maintain device
temperature below the maximum allowable
temperature of the device in its normal oper-
ating environment. In selecting a heat sink to
achieve this goal, four fundamental parame-
ters must be known about the application:
• The amount of heat, Q, being generated by
the semiconductor device in watts (W).
•The maximum allowable junction temper-
ature,Tj, of the device in degrees celsius
(°C): this information is available from the
semiconductor manufacturer’s data book
or fact sheet.
•The maximum temperature of the
ambient cooling air,Ta, in °C.
•The type of convection cooling in the
area of the device: is it natural or forced?
If it is forced convection, the air flow
velocity, in linear feet per minute (LFM),
must be known.
BASIC FORMULAS:
Heat is a form of energy that flows from a
higher temperature location (i.e. the semi-
conductor junction at Tj) to a lower tempera-
ture location (i.e. the surrounding ambient
air at Ta). In semiconductor devices, heat will
flow from the device to the ambient air
through many paths, each of which repre-
sents resistance to the heat flow.This resist-
ance is called thermal resistance, denoted
as θin °C/W, and is defined as the ratio
between the amount of total heat being
transferred and the temperature difference
that drives the heat flow.The total thermal
resistance of a system for a given device
can therefore be expressed as:
where θis the thermal resistance in degrees
C per watt, and where ja represents junction-
to-ambient.Thermal resistance is a measure
of relative performance. A low thermal resist-
ance represents better performance than a
high thermal resistance.
A system that has a lower thermal resistance
can either dissipate more heat for a given
temperature difference, or dissipate a given
amount of heat with a smaller temperature
difference.
In cooling electronic devices, heat sinks
lower the overall junction to ambient ther-
mal resistance.The actual thermal path runs
through the heat sink when it is mounted
on the device by means of an attachment
mechanism. In this case, the total thermal
resistance, θja, is the sum of all the individ-
ual resistances which represent the physical
aspect of the thermal path. There are three
thermal resistances that are commonly
used to express the total resistance:
1) the junction-to-case resistance, θjc, to
account for the thermal path across the
internal structure of the device,
2) the case-to-sink resistance, θcs, which is
also called the interface resistance, to
account for the path across the interface
between the device and the heat sink,
3) the sink-to-ambient resistance, θsa, to
account for the thermal path between the
base of the heat sink to the ambient air.
It follows that θja = θjc+θcs + θsa.
Realistically, a typical thermal designer has
no access to the internal structure of the
device, and can only control two resistances
outside of the device, θcs and θsa.
Therefore, for a device with a known θjc
obtained from the device manufacturer’s
data book, θcs and θsa become the main
design variables in selecting a heat sink.
Thermal interface between the case and
the heat sink is controlled in a variety of
manners with different heat conducting
materials.The interface resistance between
the case and the heat sink is dependent on
four variables: the thermal resistivity of the
interface material (ρ°C,W–inch), the aver-
age material thickness (t, inches), the area
of the thermal contact footprint (A, inch2),
and the ability to replace voids due to fin-
ish or flatness (sink or chip) with a better
conductor than air.The interface thermal
resistance is then expressed as:
NOTE: The thermal resistivity (ρ), of any
material, is the reciprocal of its thermal
conductivity (k). Therefore, if the conductivi-
ty is known, its resistivity can be calculated.
The expression is:
when k is in units of
Tj–Ta
θja = Q
ρ•t
θcs = A
TYPICAL VALUES FOR THERMAL
RESISTIVITY ρρ(°C/W-INCH):
copper (pure) 0.10
aluminum (1100 series) 0.19
aluminum (5000 series) 0.28
aluminum (6000 series) 0.17
beryllium oxide 0.32
carbon steel 0.84
alumina 1.15
anodized finish 5.60
silicon rubber 81.00
mica 66.00
mylar 236.00
silicone grease 204.00
dead air 1200.00
Note: These values do not take into account
the contact resistance that will depend on the
filling of voids with the interface material. i.e.
copper is much more conductive than grease,
but grease is used since copper will not flow
to fill in the voids that may be present.
Once the θcs is calculated, the required ther-
mal resistance from the sink to ambient (θsa)
is easily calculated by the following equation:
The above information will allow you to use
the catalog’s performance graphs in choosing
a standard, ready-to-use, heat sink to meet
your requirements.
Tj–Ta
θsa = (θjc + θcs)
Q
Btu•inch
hr•ft2 •°F
273.2
ρ=
k
How To Select a Heat Sink
10
HOW TO SELECT A HEAT SINK
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
Technical Capabilities
There are 4 primary cooling mechanisms that Aavid Thermalloy
takes pride in having expertise and technical capabilities in.
The cooling mechanisms include: Natural Convection, Forced
Convection, Fluid Phase Change, and Liquid Cooled.This
Standard Product Catalog focuses on displaying products that
dissipate heat at the board level and various options that can
assist in overall performance.The above graph illustrates where
the board level products fall in terms of power dissipation and
can assist as a starting point to gauge what type of products
can be used for your system configuration. For further informa-
tion realated to our other cooling mechanisms, please contact
Aavid Thermalloy at www.aavidthermalloy.com.
T0-220 to dissipate 13 watts:
Tj Max= 150°C
Ta max= 50°C
θjc=3.0°C/W
Air Velocity = 400ft/min
Find a suitable heat sink
Assume the use of a Kon-DuxTM2pad with a torque of 2 in-lb.
From Aavid’s data for this type of semiconductor, we know
that θcs= 0.5°C/W.
Using the formula above, you will find that Aavid 504222 (see
page 39) has a thermal resistance of 4.0°C/Watt at an air velocity
of 400 ft/min and therefore will comply with the requirements.
Given:TO-220 case style to dissipate 5 watts:
RθJC = 3.0°C/watt
Tj max = 150°C
Ta max = 50°C
Find: The proper heat sink to keep the semiconductor junction
from exceeding 150ºC in natural convection.
Equation:
PD=
Assume the device is mounted with ThermalcoteTM1without an
insulator. The thermal resistance from case to mounting surface
can be obtained from this figure below:
RθCS = 0.5 C/Watt at 0.678 Nm (Newton meter) or 6in. – lbs mount-
ing screw torque, therefore:
Part number 6022 on page 47 at 5 watts power dissipation has a
mounting surface temperture of 80°C above ambient, therefore:
which meets this requirement of natural convection.
Example B
Example A
5.0
012 345
4.0
3.0
1.0
2.0
0
Thermal Resistance From
Case To Mounting Surface
RθCS (ºC/watt)
6
(in-lbs)
0 .113 .399 .217 .452 .565 .678
(N-m)
*Bare joint
Mounting Screw Torque
*Bare joint – no finish (with grease)
Tj-Ta
RθJC+ RθCS +RθSA
RθSA = 150°C - 50°C
5 Watts
RθSA= 16.5°C/Watt
RθSA = 80°C
5 watts
=16°C/Watt
How To Select a Heat Sink
1. See page 113 for information on ThermalcoteTM
2. See page 86 for information on Kon-DuxTMPads
- 3.5
11
READING A THERMAL PERFORMANCE GRAPH
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www.aavidthermalloy.com
The performance graphs you will see in this
catalog (See graph 579802) are actually a
composite of two separate graphs which
have been combined to save space. The small
arrows on each curve indicate to which axis
the curve corresponds.Thermal graphs are
published assuming the device to be cooled
is properly mounted and the heat sink is in
its recommended mounting position.
GRAPH A is used to show heat sink perform-
ance when used in a natural convection envi-
ronment (i.e. without forced air).This graph
starts in the lower left hand corner with the
horizontal axis representing the heat dissipa-
tion (watts) and the vertical left hand axis
representing the rise in heat sink mounting
surface temperature above ambient (°C). By
knowing the power to be dissipated, the
temperature rise of the mounting surface
can be predicted.Thermal resistance in natu-
ral convection is determined by dividing this
temperature rise by the power input (°C/W).
EXAMPLE A: Aavid Thermalloy part number
579802 is to be used to dissipate 3 watts of
power in natural convection. Because we are
dealing with natural convection, we refer to
graph “A”. Knowing that 3 watts are to be dis-
sipated, follow the grid line to the curve and
find that at 3 watts there is a temperature
rise of 75°C.To get the thermal resistance,
divide the temperature rise by the power
dissipated, which yields 25°C/W.
GRAPH B is used to show heat sink per-
formance when used in a forced convec-
tion environment (i.e. with forced air flow
through the heat sink).This graph has its
origin in the top right hand corner with the
horizontal axis representing air velocity
over the heat sink LFM1and the vertical axis
representing the thermal resistance of the
heat sink (°C/W). Air velocity is calculated
by dividing the output volumetric flow rate
of the fan by the cross-sectional area
of the outflow air passage.
EXAMPLE B: For the same application
we add a fan which blows air over the heat
sink at a velocity of 400 LFM.
The addition of a fan indicates the use of
forced convection and therefore we refer
to graph “B”. This resistance of 9.50°C/W is
then multiplied by the power to be dissi-
pated, 3 watts. This yields a temperature
rise of 28.5°C.
CONVERTING VOLUME
TO VELOCITY
Velocity (LFM)
area (ft2)0
Although most fans are normally rated and
compared at their free air delivery at zero
back pressure, this is rarely the case in most
applications. For accuracy, the volume of
output must be derated 60% - 80% for
the anticipation of back pressure.
EXAMPLE: The output air volume
of a fan is given as 80 CFM. The output area
is 6 inches by 6 inches or 36 in2or 25 ft2.
To find velocity:
80
0.25
Velocity is 320 LFM, which at 80%,
derates to 256 LFM.
DESIGN ASSISTANCE
Aavid Thermalloy can assist in the design
of heat sinks for both forced and natural
convection applications. Contact us for help
with your next thermal challenge. For more
information, visit our web site at:
www.aavidthermalloy.com
Heat Dissipated—Watts
0
20
40
60
80
100
012 34 5
Mounting Surface Temp
Rise Above Ambient—°C
Air Velocity—Feet Per Minute
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
16
12
4
8
0
0400
200 600 800 1000
GRAPH B
= Volume (CFM)2
Velocity = = 320
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
012 34 5
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
GRAPH A
579802
Reading a Thermal Performance Graph
Volume (LFM) = Velocity (CFM)
area (ft2)
1. Linear feet per minute
2. Cubic feet per minute
12
HEAT SINKS FOR IC PACKAGES
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www.aavidthermalloy.com
ORDERING INFORMATION
Solder anchor attachment
Aavid's unique Solder Anchor attachment
method uses two or four small Solder Anchors
attached to the circuit card and a wire spring
clip to securely fasten the heat sink to the
device.This method is rugged, compact and
allows for easy removal in case of rework.
All products include a phase change pad to
optimize thermal performance. Suitable for
most IC package styles. Models are available
with a single or dual spring clips for additional
thermal interface pressure. Solder Anchors
are ordered separately.
IC Pkg Size (mm) IC Pkg Style Part Number “W” (mm) “L” (mm) “H” (mm) “A” (mm) θθn1θθf2Finish Fig. 4PCB Fig.4#Anchors3
23 x 23 All 374024B60023 23.00 23.00 10.00 49.70 40.00 11.69 Black anodize 1 A 2
23 x 23 All 374124B60023 23.00 23.00 18.00 49.70 23.40 7.39 Black anodize 1 A 2
23 x 23 All 374224B60023 23.00 23.00 25.00 49.70 19.70 6.37 Black anodize 1 A 2
27 x 27 All 374324B60023 27.00 27.00 10.00 49.70 30.60 9.35 Black anodize 1 A 2
27 x 27 All 374424B60023 27.00 27.00 18.00 49.70 20.30 6.46 Black anodize 1 A 2
27 x 27 All 374524B60023 27.00 27.00 25.00 49.70 16.50 5.47 Black anodize 1 A 2
35 x 35 Flip Chip 10-5634-01 31.00 34.90 23.00 11.50 4.20 Black anodize 2 C 2
35 x 35 Flip Chip 10-THMA-01 31.00 34.90 35.00 10.70 3.95 Black anodize 2 C 2
35 x 35 All 374624B60024 35.00 35.00 10.00 62.30 23.40 7.55 Black anodize 1 B 2
35 x 35 All 374724B60024 35.00 35.00 18.00 62.30 15.30 5.15 Black anodize 1 B 2
35 x 35 All 374824B60024 35.00 35.00 25.00 62.30 12.00 4.27 Black anodize 1 B 2
37.5 x 37.5 Flip Chip 10-BRD2-01 35.70 37.30 23.00 11.50 4.20 Clear anodize 2 B 2
37.5 x 37.5 Flip Chip 10-BRD1-01 37.50 37.50 23.00 10.10 3.83 Black anodize 2 B 2
37.5 x 37.5 Flip Chip 10-BRD1-03 37.50 37.50 23.00 10.10 3.83 Black anodize 3 D 4
37.5 x 37.5 Flip Chip 10-BRD1-04 37.50 37.50 23.00 10.10 3.83 Black anodize 2 B 2
37.5 x 37.5 Flip Chip 10-BRD1-05 37.50 37.50 23.00 10.10 3.83 Clear anodize 3 D 4
37.5 x 37.5 Flip Chip 10-BRD1-07 37.50 37.50 23.00 10.10 3.83 Clear anodize 2 B 2
40 x 40 All 374924B60024 40.00 40.00 10.00 62.30 20.30 6.46 Black anodize 1 B 2
40 x 40 All 375024B60024 40.00 40.00 18.00 62.30 12.20 4.34 Black anodize 1 B 2
42 x 40 All 375124B60024 40.00 40.00 25.00 62.30 10.30 3.83 Black anodize 1 B 2
42.5 x 42.5 Flip Chip 10-CLS1-01 42.30 42.30 23.00 8.80 3.51 Black anodize 2 E 2
42.5 x 42.5 Flip Chip 10-CLS2-01 42.30 42.30 35.00 8.30 3.44 Black anodize 2 E 2
BGA–Solder Anchor
1. Natural convection thermal resistance based on a 75º C heat sink temperature rise.
2. Force convection thermal resistance based on an entering 1.0 m/s (200LFM) airflow.
3. Solder Anchors are sold separately refer to Figure 4 on page 13
4. Solder Anchor mechanical drawings and board mounting drawings see page 13
13
HEAT SINKS FOR IC PACKAGES
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www.aavidthermalloy.com
"L"
"W"
"H"
"A"
"L" "H"
"W" 12.70
(0.500)
54.74
(2.155)
12.70
(0.500)
2.46
(0.097)
5.30
(0.209)
PLASTIC
2.47
(0.097)
3.00
(0.118)
7.62
(0.299)
5.08
(0.200)
0.64
(0.025)
FIGURE 4
BGA–Solder Anchor
FIGURE 3
FIGURE 2
FIGURE 1
2X
35.56
(1.400)
17.78
(0.700) 5.08
(0.200)
53.34
(2.100)
26.67
(1.050)
0.97 ± 0.03
(0.038 ± 0.001)
ø
PLATED THROUGH
HOLES 4 X
55.88
(2.200)
PLATED THROUGH
HOLES 4X
0.97 ± 0.03
(Ø 0.038 ± 0.001)
66.04
(2.600)
33.02
(1.300)
5.08
(0.200 2X)
27.94
(1.100)
24.13
(0.950)
5.08
(0.200) 4X
66.04
(2.600) 2X
33.02
(1.300)
Ø
0.97 ± 0.03
(0.038 ± 0.001)
PLATED THROUGH
HOLES 2X
48.26
(1.900) 2X
Ø 0.97 ± 0.03
(Ø 0.038 ± 0.001)
45.72
(1.800)
22.86
(0.900)
5.08
(0.200)2X
58.42
(2.300)
29.21
(1.150)
PLATED THROUGH
HOLES 4X
2x
24.13
(0.950)
48.26
(1.900)
66.04
(2.600)
33.02
(1.300)
5.08
(0.200)
0.97 ± 0.03
(0.038 ± 0.001)
ø
PLATED THROUGH
HOLES 4X
FIGURE A FIGURE B
FIGURE C FIGURE D FIGURE E
45.88
(1.806)
"H"
"L"
"W"
15.00
(0.591)
15.00
(0.591)
Solder Anchor heat sinks mechanical drawings
Board mounting pattern information for solder anchor heat sinks
Solder anchor
part number DO57
14
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www.aavidthermalloy.com
ORDERING INFORMATION
Push pin attachment
Push pin heat sinks require two 3.10mm holes in the circuit card
to quickly attach the heat sink over the device. The one piece
design makes assembly a snap. Pressure is maintained by the
tension of the push pin coil springs to ensure even pressure
across the device. Push pins provide a greater margin of reliabil-
ity in applications where gravity or vibration may cause tapes or
adhesives to fail.The addition of a phase change pad optimizes
thermal performance.
IC Pkg. Size (mm) Part Number “W” (mm) “L” (mm) “H” (mm) “S” (mm) “T” (mm) θn2θf3Finish Fig. PCB Fig.1Pin Style Pad
28 x 28 10-6326-27 28.00 28.00 6.00 46.60 6.50 44.10 13.13 Black anodize 1 A Plastic Yes
28 x 28 10-6326-28 28.00 28.00 6.00 46.60 6.50 44.10 13.13 Black anodize 1 A Brass Yes
28 x 28 10-6327-01 28.50 28.50 10.00 46.60 7.00 30.60 9.26 Black anodize 2 A Plastic No
35 x 35 10-TNT2-01 36.10 48.00 11.60 6.50 18.80 6.13 Black anodize 3 D Plastic No
37.5 x 37.5 10-5597-02 37.40 37.40 6.00 59.00 6.50 33.30 9.91 Green anodize 5 B Plastic No
37.5 x 37.5 10-5597-22 37.40 37.40 6.00 59.00 6.50 33.30 9.91 Gold anodize 5 B Plastic Yes
37.5 x 37.5 10-5597-33 37.40 37.40 6.00 59.00 6.50 33.30 9.91 Gold anodize 5 B Brass Yes
37.5 x 37.5 10-5607-04 37.40 37.40 10.00 59.00 7.00 22.10 6.99 Black anodize 5 B Plastic Yes
37.5 x 37.5 10-5607-05 37.40 37.40 10.00 59.00 7.00 22.10 6.99 Black anodize 5 B Brass Yes
37.5 x 37.5 372924M02000 37.40 37.40 6.00 59.00 6.50 32.60 9.91 Green anodize 5 B Plastic No
45 x 45 10-L4LB-03 45.20 41.40 11.89 58.80 8.00 16.70 5.60 Black anodize 4 C Plastic Yes
45 x 45 10-L4LB-05 45.20 41.40 11.89 58.80 8.00 16.70 5.60 Black anodize 4 C Brass Yes
45 x 45 10-L4LB-11 45.20 41.40 11.70 58.80 8.00 14.20 4.91 Black anodize 4 C Plastic No
BGA–Push Pin Attachment
1. Push pin mechanical drawings and board mounting drawings see page 15
2. Natural convection thermal resistance based on a 75º C heat sink temperature rise.
3. Force convection thermal resistance based on an entering 1.0 m/s (200LFM) airflow.
15
HEAT SINKS FOR IC PACKAGES
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AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
Mechanical drawings
"W"
"S"
"L"
"T" "H"
"H"
"W"
"L"
"T" 46.60
(1.835)
"S"
"L"
"W"
"H"
"T"
10.69
(0.421)
20.02
(0.788)
FIGURE 4
BGA–Push Pin Attachment
41.50
(1.634)
41.70
(1.642)
"L"
"W" "H"
"T"
FIGURE 3FIGURE 2
FIGURE 1
Ø
3.10 ±0.03
(0.122 ±0.001)
THROUGH HOLES
(UNPLATED) 2X
32.53
(1.281)
33.38
(1.314)
16.69
(0.657) 16.46
(0.640)
46.60
(1.830) REF
20.85
(0.821)
41.70
(1.642)
41.50
(1.634)
20.75
(0.817)
Ø
3.10 ±0.03
(
Ø
0.122 ±0.001)
THROUGH HOLES
(UNPLATED) 2X
25.40
(1.000)
50.80
(2.000)
20.02
(0.788)
10.01
(0.394)
Ø
3.10 ±0.03
(
Ø
0.122 ±0.001)
THROUGH HOLES
(UNPLATED) 2X
41.74
(1.643)
20.87
(0.822)
20.87
(0.822)
41.74
(1.643)
59.00
(2.320)
3.10 ±0.030
(0.122 ±0.001)
THROUGH HOLES
REF
ø
(UNPLATED) 2X
FIGURE A FIGURE B
FIGURE C FIGURE D
Board mounting pattern information
"W"
"S"
"L"
"T"
"H"
FIGURE 5
16
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www.aavidthermalloy.com
Tape attachment
IC Pkg. Size (mm) IC Pkg. Style Part Number “W”(mm) “L”(mm) “H”(mm) θθn2θθf3Finish Tape code1
10 x 10 Plastic 375324B00035 10.20 10.20 10.20 71.40 21.20 Black anodize 35
10 x 10 Metal / Ceramic 375224B00032 10.20 11.10 10.20 71.40 21.20 Black anodize 32
15 x 15 Plastic 375424B00034 15.20 15.20 6.40 62.50 17.60 Black anodize 34
23 x 23 Metal / Ceramic 374024B00032 23.00 23.00 10.00 40.00 11.69 Black anodize 32
23 x 23 Plastic 374024B00035 23.00 23.00 10.00 40.00 11.69 Black anodize 35
23 x 23 Metal / Ceramic 374124B00032 23.00 23.00 18.00 23.40 7.39 Black anodize 32
23 x 23 Plastic 374124B00035 23.00 23.00 18.00 23.40 7.39 Black anodize 35
23 x 23 Metal / Ceramic 374224B00032 23.00 23.00 25.00 19.70 6.370 Black anodize 32
23 x 23 Plastic 374224B00035 23.00 23.00 25.00 19.70 6.370 Black anodize 35
25 x 25 Metal / Ceramic 335224B00032 25.00 25.00 9.90 34.00 10.39 Black anodize 32
25 x 25 Plastic 335224B00034 25.00 25.00 9.90 34.00 10.39 Black anodize 34
27 x 27 Metal / Ceramic 335324B00032 26.90 26.90 11.40 27.70 8.71 Black anodize 32
27 x 27 Metal / Ceramic 374324B00032 27.00 27.00 10.00 30.60 9.35 Black anodize 32
27 x 27 Plastic 374324B00035 27.00 27.00 10.00 30.60 9.35 Black anodize 35
27 x 27 Metal / Ceramic 374424B00032 27.00 27.00 18.00 20.30 6.46 Black anodize 32
27 x 27 Plastic 374424B00035 27.00 27.00 18.00 20.30 6.46 Black anodize 35
27 x 27 Metal / Ceramic 374524B00032 27.00 27.00 25.00 16.50 5.47 Black anodize 32
27 x 27 Plastic 374524B00035 27.00 27.00 25.00 16.50 5.47 Black anodize 35
28 x 28 Metal / Ceramic 373024B00032 27.90 27.90 8.89 33.30 10.00 Black anodize 32
28 x 28 Plastic 373024B00034 27.90 27.90 8.90 33.30 10.00 Black anodize 34
28 x 28 Metal / Ceramic 373224M00032 28.00 28.00 6.00 44.10 13.13 Green anodize 32
28 x 28 Plastic 2327B-CP50 27.90 28.10 15.20 23.40 7.43 Black anodize 34
28 x 28 Metal / Ceramic 2327B-TACH 27.90 28.10 15.20 23.40 7.43 Black anodize 32
31 x 31 Metal / Ceramic 335724B00032 30.10 30.10 6.60 35.70 10.84 Black anodize 32
31 x 31 Metal / Ceramic 335824B00032 30.00 30.00 9.40 29.40 9.11 Black anodize 32
31 x 31 Plastic 335824B00034 30.00 30.00 9.40 29.40 9.11 Black anodize 34
BGA–Tape Attachment
Pressure sensitive, thermally conductive adhesive tape
easily and reliably bonds a heat sink to an integrated circuit
package. Tapes provide high thermal conductivity and
exceptional bonding properties. Adhesives are formulated
for plastic and metal/ceramic packages.
"L" "H"
"W"
Material: Aluminum
ORDERING INFORMATION
1. For tape specifications see page 88
2. Natural convection thermal resistance based on a 75º C heat sink temperature rise.
3. Force convection thermal resistance based on an entering 1.0 m/s (200LFM) airflow.
17
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AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
ORDERING INFORMATION
IC Pkg. Size (mm) IC Pkg. Style Part Number “W”(mm) “L”(mm) “H”(mm) θθn2θθf3Finish Tape Code1
32.5 x 32.5 Metal / Ceramic 2338B-TACH 33.00 31.40 12.50 23.10 7.23 Black anodize 32
35 x 35 Metal / Ceramic 371824B00032 35.00 35.00 7.00 31.90 9.67 Black anodize 32
35 x 35 Plastic 371824B00034 35.00 35.00 7.00 31.90 9.67 Black anodize 34
35 x 35 Metal / Ceramic 374624B00032 35.00 35.00 10.00 23.40 7.55 Black anodize 32
35 x 35 Plastic 374624B00035 35.00 35.00 10.00 23.40 7.55 Black anodize 35
35 x 35 Metal / Ceramic 374724B00032 35.00 35.00 18.00 15.30 5.15 Black anodize 32
35 x 35 Plastic 374724B00035 35.00 35.00 18.00 15.30 5.15 Black anodize 35
35 x 35 Metal / Ceramic 374824B00032 35.00 35.00 25.00 12.00 4.27 Black anodize 32
35 x 35 Plastic 374824B00035 35.00 35.00 25.00 12.00 4.27 Black anodize 35
35 x 35 Metal / Ceramic 372024B00032 35.00 35.00 27.90 11.90 4.28 Black anodize 32
35 x 35 Plastic 372024B00034 35.00 35.00 27.90 11.90 4.28 Black anodize 34
37.5 x 37.5 Metal / Ceramic 373324M00032 37.40 37.40 6.00 32.60 9.91 Green anodize 32
37.5 x 37.5 Metal / Ceramic 2319B-TACH405 38.10 38.10 10.16 12.50 3.50 Black anodize 32
37.5 x 37.5 Metal / Ceramic 336624B00032 38.10 38.10 16.00 15.30 5.15 Black anodize 32
40 x 40 Metal / Ceramic 374924B00032 40.00 40.00 10.00 20.30 6.46 Black anodize 32
40 x 40 Plastic 374924B00035 40.00 40.00 10.00 20.30 6.46 Black anodize 35
40 x 40 Metal / Ceramic 364424B00032 40.10 40.00 11.40 18.40 6.02 Black anodize 32
40 x 40 Plastic 364424B00034 40.10 40.00 11.40 18.40 6.02 Black anodize 34
40 x 40 Metal / Ceramic 375024B00032 40.00 40.00 18.00 12.20 4.34 Black anodize 32
40 x 40 Plastic 375024B00035 40.00 40.00 18.00 12.20 4.34 Black anodize 35
40 x 40 Metal / Ceramic 375124B00032 40.00 40.00 25.00 10.30 3.83 Black anodize 32
40 x 40 Plastic 375124B00035 40.00 40.00 25.00 10.30 3.83 Black anodize 35
42.5 x 42.5 Metal / Ceramic 2321B-TACH 43.20 41.30 8.90 22.10 6.93 Black anodize 32
42.5 x 42.5 Metal / Ceramic 2332B-TACH 43.20 41.30 16.50 12.90 4.53 Black anodize 32
45 x 45 Metal / Ceramic 2342B-TACH 45.70 44.60 7.00 23.10 7.26 Black anodize 32
Tape attachment
BGA–Tape Attachment
1. For tape specifications see page 88
2. Natural convection thermal resistance based on a 75º C heat sink temperature rise.
3. Force convection thermal resistance based on an entering 1.0 m/s (200LFM) airflow.
18
HEAT SINKS FOR IC PACKAGES
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Italy Tel: +39 051 764011 email: sales.it@aavid.com
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Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
ORDERING INFORMATION
Clip attachment
Aavid's BGS Clip heat sinks provide a mechanical
attachment alternative to tape applications
where it is desirable to attach the heat sink
directly to the device.The unique clip uses spring
pressure to ensure even contact across the
device while the end plates firmly engage the
edge of the package, locking the heat sink in
place. Each heat sink uses pre-applied thermal
grease for optimum thermal performance.
IC Pkg. Size (mm) Part Number “W”(mm) “L”(mm) “H”(mm) IC Pkg. Style θn1θf2Interface Clip3
27 x 27 2317B-EP11-BGS1 26.14 20.47 15.24 All 32.60 9.94 EP11 BGS1
35 x 35 2518B-EP11-BGS2 30.50 28.10 15.60 All 22.70 7.05 EP11 BGS2
42.5 X 42.5 2519B-EP11-BGS5 34.50 31.40 15.60 All 19.70 6.30 EP11 BGS5
42.5 X 42.5 2520B-EP04-BGS5 38.10 38.00 15.60 All 15.60 5.17 EP04 BGS5
42.5 X 42.5 2522B-EP04-BGS5 38.10 38.00 10.16 All 22.10 6.94 EP04 BGS5
BGA–Clip Attachment
"H"
"W"
"L"
Material Description Adhesive Thermal Resistance Color Carrier “D”Dim “E”Dim
EP11 ThermalcoteTM grease with release liner None 0.18 White None 13.34 (0.525) 13.34 (0.525)
EP04 ThermalcoteTM grease with release liner None 0.03 White None 31.75 (1.250) 31.75 (1.250)
TAPE TYPE AND INTERFACE MATERIAL INFORMATION
NOTE: For BGS features, see page 20.
For more information on ThermalcoteTM see page 113.
Material: Aluminum
Finish: Black Anodize
"D"
"E"
THERMALCOTETM
GREASE
PULL TAB
1. Natural convection thermal resistance based on a 75º C heat sink temperature rise.
2. Force convection thermal resistance based on an entering 1.0 m/s (200LFM) airflow.
3. For BGS features, see page 20.
19
HEAT SINKS FOR IC PACKAGES
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Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
ORDERING INFORMATION
Bi Directional
Designed for application with airflow traveling
in a single direction, these heat sinks are suitable
for a variety of standard square IC packages.
Models are available with pre applied thermal
tape for easy attachment to the IC. Epoxy attach
models are also available.
IC Pkg Size IC Pkg Style Part Number “W”(mm) “L”(mm) “H”(mm) θn3Finish Attachment Tape Code 2
10 X 10 ALL 615653B00250 6.00 6.00 5.00 142.58 Black anodize Epoxy1N/A
10 X 10 ALL 709203B00400 10.00 10.00 10.00 55.98 Black anodize Epoxy1N/A
24 X 24 Metal 335114B00032 24.00 24.00 24.00 13.60 Black anodize Tape 32
25 X 25 Metal 335214B00032 25.00 25.00 10.00 10.00 Black anodize Tape 32
25 X 25 Metal 335211B00032 25.00 25.00 10.00 10.00 Black anodize Tape 32
25 X 25 ALL 335214B00000 25.00 25.00 10.00 10.00 Black anodize Epoxy1N/A
25 X 25 ALL 335211B00000 25.00 25.00 10.00 10.00 Black anodize Epoxy1N/A
25 X 25 Plastic 335214B00034 25.00 25.00 10.00 10.00 Black anodize Tape 34
27 X 27 Plastic 335314B00035 27.00 27.00 11.00 10.00 Black anodize Tape 35
27 X 27 Metal 335314B00032 27.00 27.00 11.00 10.00 Black anodize Tape 32
27 X 27 ALL 335314B00000 27.00 27.00 11.00 10.00 Black anodize Epoxy1N/A
28 X 28 ALL 700353U01100 28.00 28.00 9.00 18.49 Unfinished Epoxy1N/A
30 X 30 ALL 335814B00000 30.00 30.00 9.00 10.50 Black anodize Epoxy1N/A
30 X 30 ALL 335714B00000 30.00 30.00 7.00 15.20 Black anodize Epoxy1N/A
30 X 30 Metal 335814B00032 30.00 30.00 9.00 9.20 Black anodize Tape 32
30 X 30 Metal 335714B00032 30.00 30.00 7.00 15.20 Black anodize Tape 32
37.5 X 37.5 ALL 799403B01500 38.00 38.00 10.00 12.21 Black anodize Epoxy1N/A
37.5 X 37.5 ALL 336314B00000 36.00 36.00 17.00 11.00 Black anodize Epoxy1N/A
BGA – Bi Directional
"W"
"H"
"L"
1. Epoxy ordered separately for information on Epoxy see page 114,115.
2. For tape specifications see page 88.
3. Natural convection thermal resistance based on a 75º C heat sink temperature rise.
Material: Aluminum
20
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AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
ORDERING INFORMATION
Fluted FinsTM
Fluted Fin™ technology was developed to produce a
low cost BGA cooling solution with enhanced thermal
performance versus conventional cross cut methods.
Instead of straight edged rectangular pin fins, Fluted
Fin™ are rippled and slightly staggered. Under many
circumstances, this design may contribute to increase
turbulent airflow conditions within the pin fin field
array, resulting in improved performance.
IC Pkg. Size (mm) Part Number “W”(mm) “L”(mm) “H”(mm) θn1θf2
27 X 27 3319B 25.90 23.90 10.00 20.90 11.50
35 X 35 3613B 30.80 30.60 10.00 16.00 8.80
40 X 40 3624B 40.60 30.60 10.00 13.60 7.50
40 X 40 3625B 40.60 37.30 10.00 11.30 6.20
42.5 X 42.5 3330B 40.60 37.30 16.50 8.70 4.80
42.5 X 42.5 3332B 45.50 44.00 16.50 6.90 3.80
45 X 45 3320B 40.60 44.00 10.00 10.40 5.70
45 X 45 3321B 45.50 44.00 10.00 9.80 5.40
45 X 45 3331B 40.60 44.00 16.50 7.60 4.20
50 MM or larger 3634B 50.40 44.00 10.00 9.30 5.10
50 MM or larger 3325B 50.40 50.70 10.00 8.60 4.70
50 MM or larger 3334B 50.40 50.70 16.50 6.00 3.30
50 MM or larger 3354B 50.40 50.70 25.00 4.80 2.60
50 MM or larger 3356B 50.40 64.10 25.00 4.10 2.30
50 MM or larger 3357B 50.40 70.80 25.00 3.80 2.10
BGA–Fluted FinsTM
1. Natural convection thermal resistance based on a 75º C heat sink temperature rise.
2. Force convection thermal resistance based on an entering 1.0 m/s (200LFM) airflow.
"W"
"L"
"H"
Position Code Max. BGA Size (mm)
A BGS1 27.00
A BGS2 35.00
A BGS3 40.00
A BGS4 45.00
A BGS5 42.50
Base part no.
(from table above)
3_ _ _ B -
A
POPULAR OPTIONS:
Aavid BGS Clip provides a mechanical attachment
alternative to tape in applications where it is desir-
able to attach the heat sink directly to the device.
This unique clip uses spring pressure to ensure
even contact across the device while the end
plates firmly engage the edge of the package
locking the heat sink in place.
BGS Clip for Fluted FinsTM
Material: Aluminum
Finish: Black Anodize
21
HEAT SINKS FOR IC PACKAGES
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www.aavidthermalloy.com
ORDERING INFORMATION
5801 Slide on heat sink with staggered fins
Slide on heat sink with staggered fins
attaches to 8 pin DIP packages quickly and
easily.The heat sink features double spring
action and locking catch to firmly attach
the device creating a thermal conduction
path on both the top and bottom surfaces.
Available in two finishes.
10.54
(0.415)
14.27
(0.562)
5.33
(0.210)
6.35
(0.250)
LOCKING
CATCH
15.24
(0.600)
11.43
(0.450)
Part Number Finish
580100B00000 Black anodize
580100W00000 Black anodize with black paint on bottom side
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
0 0.4 0.8 1.2 1.6 2.0
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
6.35
(0.250)
15.34
(0.604)
REF
19.05
(0.750)
5.39
(0.212)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
100
0
20
40
60
80
100
0 0.4 0.8 1.2 1.6 2.0
80
60
20
40
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Angle fin heat sink is a simple low
cost solution for cooling DIP devices.
Suitable for 14 and 16 pin packages
and available in two finish options.
Easily attaches using thermal epoxy.
5010 Angle fin heat sink
5602, 5802 Slide on heat sink with angled fins
Slide on heat sink with angled fins
attaches to 14 and 16 pin DIP packages
quickly and easily.The heat sink features
double spring action and locking catch
to firmly attach the device creating a
thermal conduction path on both the
top and bottom surfaces. Available in
two finishes.
15.24
(0.600)
22.61
(0.890)
10.42
(0.410)
LOCKING
CATCH
21.34
(0.840)
5.08
(0.200)
"A"
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
0 0.4 0.8 1.2 1.6 2.0
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Part Number Device Pkg Style Finish “A”Dim
560200B00000 Ceramic Black anodize 7.87 (0.310)
560200W00000 Ceramic Black anodize with black paint on bottom side 7.87 (0.310)
580200B00000 Plastic Black anodize 6.35 (0.250)
580200W00000 Plastic Black anodize with black paint on bottom side 6.35 (0.250)
ORDERING INFORMATION
Material: 0.63 (0.025) Thick Aluminum
Finish: See Table
Material: 1.27 (0.050) Thick Aluminum
Finish: See Table
Material: 0.63 (0.025) Thick Aluminum
Finish: See Table
ORDERING INFORMATION
Part Number Finish
501000J00000 Pre black anodize*
501000B00000 Black anodize
DIPS
* Edges cut during the manufacturing process will be unfinished.
See page 110 for more information.
Grease
Epoxy
&
page112
22
HEAT SINKS FOR IC PACKAGES
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AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
ORDERING INFORMATION
5803 Slide on Heat Sink with Staggered Fins
Slide on heat sink with staggered fins
attaches to 18 pin DIP packages quickly
and easily.The heat sink features double
spring action and locking catch to firmly
attach the device creating a thermal
conduction path on both the top and
bottom surfaces.
28.58
(1.125)
17.78
(0.700)
5.33
(0.210)
6.35
(0.250)
14.12
(0.556)
23.62
(0.930)
LOCKING CATCH
Part Number Description
580300B00000 Slide on heat sink with staggered fins
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
0 0.4 0.8 1.2 1.6 2.0
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Material: 0.63 (0.025) Thick Aluminum
Finish: Black Anodize
DIPS
5806 Slide on Heat Sink with Staggered Fins
Slide on heat sink with staggered fins
attaches to 28 pin DIP packages quickly
and easily.The heat sink features double
spring action and locking catch to firmly
attach the device creating a thermal
conduction path on both the top and
bottom surfaces.
42.67
(1.680)
37.47
(1.475)
25.40
(1.000)
14.86
(0.585)
12.70
(0.500)
13.72
(0.540)
LOCKING
CATCH
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
0 0.4 0.8 1.2 1.6 2.0
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
ORDERING INFORMATION
Part Number Description
580600B00000 Slide on heat sink with staggered fins
Material: 0.81 (0.032) Thick Aluminum
Finish: Black Anodize
23
HEAT SINKS FOR IC PACKAGES
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AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
ORDERING INFORMATION
28.58
(1.125)
17.78
(0.700)
5.33
(0.210)
6.35
(0.250)
14.12
(0.556)
26.80
(1.055)
LOCKING CATCH
Part Number Description
580400B00000 Slide on heat sink with staggered fins
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
0 0.4 0.8 1.2 1.6 2.0
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Slide on heat sink with staggered fins
attaches to 20 pin DIP packages quickly
and easily.The heat sink features double
spring action and locking catch to firmly
attach the device creating a thermal
conduction path on both the top and
bottom surfaces.
5804 Slide on heat sink with staggered fins
Material: 0.63 (0.025) Thick Aluminum
Finish: Black Anodize
5805 Slide on heat sink with staggered fins
Slide on heat sink with staggered fins
attaches to 24 pin DIP packages quickly
and easily.The heat sink features double
spring action and locking catch to firmly
attach the device creating a thermal con-
duction path on both the top and bot-
tom surfaces.
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
0 0.4 0.8 1.2 1.6 2.0
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
25.60
(1.008)
14.73
(0.580)
37.08
(1.460)
32.51
(1.280)
12.19
(0.480)
13.72
(0.540)
LOCKING
CATCH
ORDERING INFORMATION
Part Number Description
580500B00000 Slide on heat sink with staggered fins
Material: 0.81 (0.032) Thick Aluminum
Finish: Black Anodize
DIPS
24
HEAT SINKS FOR IC PACKAGES
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AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
5085, 5086, 5087 Extruded epoxy attach on heat sink with straight fins
Extruded epoxy attach on heat sink
with straight fins attaches to 24, 28,
and 40 pin DIP packages quickly and
easily. May be added before or after
final board assembly, no additional
board space is required.
13.46
(0.530)
4.83
(0.190)
"A"
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
01 2 34 5
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
508600
508500
508700
ORDERING INFORMATION
Part Number Pins “A”Dim
508500B00000 24 31.75 (1.250)
508600B00000 28 36.83 (1.450)
508700B00000 40 50.80 (2.000)
Material: Aluminum
Finish: Black anodize
6284 Extruded epoxy attach heat sink
Extruded epoxy attach heat sink
which requires no additional board
space is suitable for narrow DIP
packages. May be added before
or after final board assembly, no
additional board space is required.
Attaches to 28 pin DIP.
13.46
(0.530)
12.06
(0.475)
36.83
(1.450)
REF
REF
Air Velocity – Feet Per Minute
Heat Dissipated – Watts
Thermal Resistance From MTG
Surface to Ambient – °C/Watt
25
0
20
40
60
80
100
012 345
20
15
5
10
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient – °C
ORDERING INFORMATION
Part Number Description
6284B Extruded epoxy attach heat sink for 28 Pin DIP
Material: Aluminum
Finish: Black anodize
DIPS
5011, 5012 Extruded epoxy attach heat sink with straight fins
Extruded epoxy attach heat sink with
straight fins attaches to 14 and 16 pin
DIP packages quickly and easily. May be
added before or after final board assem-
bly, no additional board space is required.
Available in two fin directions.
Air Velocity – Feet Per Minute
Heat Dissipated – Watts
Thermal Resistance From MTG
Surface to Ambient – °C/Watt
100
0
20
40
60
80
100
0.0 0.4 0.8 1.2 1.6 2.0
80
60
20
40
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient – °C
501200
501100
5
0
11–501
2
19.05
(0.750)
REF
6.35
(0.250)
REF
4.82
(0.190)
ORDERING INFORMATION
Part Number Description Figure
501100B00000 Extruded epoxy attach heat sink with straight fins A
501200B00000 Extruded epoxy attach heat sink with straight fins B
Material: Aluminum
Finish: Black Anodize
4.83
(0.190)
18.57
(0.730)
6.35
(0.250)
FIGURE A FIGURE B
For epoxy information see pages 114-115.
For epoxy information see pages 114-115.
For epoxy information see pages 114-115.
Grease
Epoxy
&
page112
Grease
Epoxy
&
page112
Grease
Epoxy
&
page112
25
SURFACE MOUNT DISCRETE SEMICONDUCTOR PACKAGES
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AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
ORDERING INFORMATION
5731 Surface mount heat sink for D-PAK (TO-252) package semiconductors
Surface mount heat sink for D-PAK
(TO-252) package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks.The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
1.30
(0.050)
8.00
(0.315)
22.86
(0.900)
10.16
(0.400)
10.41
(0.410)
8.13
(0.320)
Part Number Packaging
573100D00010 13" Reel, 250 per reel
573100D00000 Bulk, 500 per bag
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
25
0
10
20
30
40
50
0.0 0.5 1.0 1.5 2.0 2.5
20
15
5
10
0
0400
200 600 800 1000
Case Temp Rise
Rise Above Ambient—°C
ORDERING INFORMATION
1.32
(0.052)
12.70
(0.500)
26.16
(1.030)
10.16
(0.400)
12.70
(0.500)
7.36
(0.290)
Part Number Packaging
573300D00010 13" Reel, 250 per reel
573300D00000 Bulk, 500 per bag
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
10
20
30
40
50
0.0 0.5 1.0 1.5 2.0 2.5
16
12
4
8
0
0400
200 600 800 1000
Case Temp Rise
Rise Above Ambient—°C
Surface mount heat sink for D2PAK
(TO-263) package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks.The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
5733 Surface mount heat sink for D2PAK (TO-263) package semiconductors
7106 Surface mount heat sink for D2PAK (TO-263), power SO-10 (MO-184) and SO-10 package semiconductors
Surface mount heat sink for D2PAK
(TO-263), power SO-10 (MO-184)
and SO-10 package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks.The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
012 345
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Part Number Packaging
7106D/TR 13" Reel, 200 per reel
7106D Bulk, 500 per bag
ORDERING INFORMATION
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
SMT
See page 26 for tape and reel information
Refer to Figure A and B on page 27 for board footprint information
See page 26 for tape and reel information
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
Refer to Figure A and B on page 27 for board footprint information
See page 26 for tape and reel information
Refer to Figure C on page 27 for board footprint information
25.91
(1.020)
10.16
(0.400)
7.62
(0.300)
9.52
(0.375)
14.99
(0.590)
10.92
(0.430)
14.99
(0.590)
5.33
(0.210)
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
26
SURFACE MOUNT DISCRETE SEMICONDUCTOR PACKAGES
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www.aavidthermalloy.com
7109 Surface mount heat sink for D2PAK (TO-263) package semiconductors
Surface mount heat sink for D2PAK
(TO-263) package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks.The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
25.40
(1.000)
19.38
(0.763)
15.24
(0.600)
11.43
(0.450)
11.43
(0.450)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
012 345
4
3
1
2
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
12.70
(0.500)
30.99
(1.220)
10.16
(0.400)
17.53
(0.690)
7.37
(0.290)
1.30
(0.050)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
10
20
30
40
50
0.0 0.5 1.0 1.5 2.0 2.5
16
12
4
8
0
0400
200 600 800 1000
Case Temp Rise
Rise Above Ambient—°C
Surface mount heat sink for D3PAK
(TO-268) package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks.The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
5734 Surface mount heat sink for D3PAK (TO-268) package semiconductors
Tape and Reel information
Part Number “A”Dim “B”Dim “C”Dim “D”Dim
7106D/TR 44.00 (1.730) 40.40 (1.590) 24.00 (0.940) 4.06 (0.160)
7109D/TR 44.00 (1.730) 40.40 (1.590) 36.00 (1.420) 4.06 (0.160)
573100D00010 44.00 (1.730) 40.40 (1.590) 16.00 (0.630) 4.06 (0.160)
573300D00010 44.00 (1.730) 40.40 (1.590) 24.00 (0.940) 4.06 (0.160)
573400D00010 44.00 (1.730) 40.40 (1.590) 24.00 (0.940) 4.06 (0.160)
ORDERING INFORMATION
SMT
ORDERING INFORMATION
Part Number Packaging
7109D/TR 13" Reel, 125 per reel
7109D Bulk, 500 per bag
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
See below for tape and reel information
Refer to Figure D on page 27 for board footprint information
ORDERING INFORMATION
Part Number Packaging
573400D00010 13" Reel, 250 per reel
573400D00000 Bulk, 500 per bag
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
See below for tape and reel information
Refer to Figure A and B on page 27 for board footprint information
"A"
"B" "C"
"D"
27
SURFACE MOUNT DISCRETE SEMICONDUCTOR PACKAGES
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www.aavidthermalloy.com
FIGURE A
SMT Footprints
10.67
(0.420)
15.49
(0.610)
10.41
(0.410)
2.29
(0.090)
7.62
(0.300)
15.49
(0.610)
1.40
(0.060)
0.80
(0.030)
"W1"
"W2"
"L"
FIGURE B
FIGURE D
FIGURE C
"L"
"W"
16.76
(0.660)
2.54
(0.100)
10.67
(0.420)
20.32
(0.800)
2.54
(0.100)
Recommended copper heat speader drain pad footprint Recommended heat sink solder mask opening
Note: The thickness of
the drain pad is variable
depending on the amount
of heat generated by the
SMT device, design, limita-
tions and process
Part Number “L”“W”
573100 9.53 (0.375) 13.97 (0.550)
573300 14.22 (0.560) 16.26 (0.640)
573400 14.22 (0.560) 21.08 (0.830)
Part Number “L”“W1”“W2”
573100 9.02 (0.355) 13.46 (0.530) 8.89 (0.350)
573300 13.72 (0.540) 15.75 (0.620) 11.18 (0.440)
573400 13.72 (0.540) 20.57 (0.810) 16.00 (0.630)
Recommended copper pad size for heat sink
and device mounting footprint
For D Pak (TO-263) For MO-184 and SO-10
Recommended copper pad size for heat sink
and device mounting footprint
28
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ORDERING INFORMATION
7025 Channel style heat sink with folded back fins
Channel style heat sink with folded
back fins for increased cooling surface
area. Available with tin plated solder-
able tabs for easy attachment to the
printed circuit card.
24.13
(0.950)
26.67
(1.050)
48.26
(1.900)
28.04
(1.100)
2.02
(0.080)
28.70
(1.130)
23.62
(0.930)
3.81
(0.150)
THRU
14.48
(0.570) 5.08
(0.200)
2.54
(0.100)
4.45
(0.175)
19.05
(0.750)
3.18
(0.125)
2.29
(0.090)
ø
Part Number Description
7025B Channel heat sink with folded back fins
7025B-MT With solderable mounting tabs 2.90 ( 0.114)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
024 6810
4
3
1
2
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
ORDERING INFORMATION
25.40
(1.000) 14.48
(0.570)
3.81
(0.150)
THRU
38.23
(1.505)
39.37
(1.550)
2.28
(0.090)
5.08
(0.200)
2.03
(0.080)
9.52
(0.375)
4.83
(0.190)
3.18
(0.125)
11.94
(0.470)
ø
Part Number Description Finish
7019B Channel heat sink with folded back fins Black anodize
7019PB Channel heat sink with folded back fins Pre black anodize*
7019B-MT With solderable tabs Black anodize 2.90 ( 0.114)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
024 6810
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Narrow channel style heat sink with
folded back fins for increased cooling
surface area. Available with tin plated
solderable tabs for easy attachment to
the printed circuit card.
7019 Narrow channel style heat sink with folded back fins
7020 Narrow channel style heat sink with folded back fins
Narrow channel style heat sink with
folded back fins for increased cooling
surface area. Available with tin plated
solderable tabs for easy attachment to
the printed circuit card.
(0.700)
17.78
(0.470)
11.94
(1.450)
36.83
(1.300)
33.02
(0.570)
14.48
(0.310)
7.87
(1.255)
31.88 (0.240)
6.10
2x
(0.150)
3.81
(0.190)
4.83
(0.125)
3.18
(0.080)
2.02
C
L
ø
"x"
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
024 6810
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Part Number Description
7020B Narrow channel heat sink with folded back fins
7020B-MT With solderable tabs 2.90 (0.114)
ORDERING INFORMATION
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
Material: 1.02 (0.040) Thick Aluminum
Finish: See Table
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
Dia of PCB
Plated Thru
Hole for Tabs
TO-220 Heat Sinks
Position Code Description Location Details
A TC10-MT Insulating device mounting clip Hole X Page 93, 98
and solderable tabs
Dia of PCB
Plated Thru
Hole for Tabs
Dia of PCB
Plated Thru
Hole for Tabs
*Edges cut during the manufacturing process will be unfinished.
See page 110 for more information
POPULAR OPTIONS:
Base part no. A
7020B-
For additional options see page 85
For additional options see page 85
For additional options see page 85
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AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
ORDERING INFORMATION
7021 Channel style heat sink with folded back fins
Channel style heat sink with
folded back fins for increased
cooling surface area. Available
with tin plated solderable tabs
for easy attachment to the
printed circuit card.
44.45
(1.750)
36.83
(1.450)
43.05
(1.695)
14.48
(0.570)
7.87
(0.310)
9.65
(0.380)
17.78
(0.700)
3.81
(0.150)
4.83
(0.190)
3.18
(0.125)
5.58
(0.220)
2x ø
2.02
(0.080)
2.67
(0.105)
2.28
(0.090)
"X"
Part Number Description
7021B Channel heat sink with folded back fins
7021B-MT With solderable tabs 2.90 ( 0.114)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
024 6810
4
3
1
2
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
26.67
(1.050)
48.26
(1.900)
24.13
(0.950)
28.03
(1.104)
49.53
(1.950)
15.49
(0.610)
14.48
(0.570)
3.81
(0.150)
THRU
4.83
(0.190)
2.29
(0.090)
3.18
(0.125)
5.08
(0.200)
2.54
(0.100) 19.05
(0.750)
4.45
(0.175)
2x
SECTION A-A
A
A
ø
"X"
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
024 6810
4
3
1
2
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Channel style heat sink with
folded back fins for increased
cooling surface area. Available
with tin plated solderable tabs
for easy attachment to the
printed circuit card.
7023 Channel style heat sink with folded back fins
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number Description
7023B Channel heat sink with folded back fins
7023B-MT With solderable tabs 2.90 ( 0.114)
Dia of PCB
Plated Thru
Hole for Tabs
TO-220 Heat Sinks
Position Code Description Location Details
A TC10-MT Locking device mounting clip and solderable tabs Hole X Page 93,98
A MT5 Bifurcated tabs with 0.205 stand off Page 93
A MT6 Bifurcated tabs with 0.115 stand off Page 93
A TC10-MT5 Locking device mounting clip and bifurcated tabs Hole X Page 93,98
Position Code Description Location Details
A TC6-MT Locking device mounting clip and solderable tabs Hole X Page 93,98
A TC7-MT Insulating device mounting clip and solderable tabs Hole X Page93,98
POPULAR OPTIONS:
Dia of PCB
Plated Thru
Hole for Tabs
POPULAR OPTIONS:
Base part no. A
7021B-
Base part no. A
7023B-
For additional options see page 85
For additional options see page 85
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AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
7022 Channel style heat sink with folded back fins
5510 High performance channel style heat sink
High performance channel style
heat sink with folded back fins
for greater cooling capacity in a
minimum of space when mounted
horizontally. Folded back fin design
maximizes surface area without
increasing the vertical space
required by the heat sink.
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
01 2 3 4 5
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Part Number Description
551002B00000 High performance channel style heat sink with folded back fins
ORDERING INFORMATION
25.55
(1.006)
13.21
(0.520)
19.99
(0.787)
ø 3.68
(0.145)
THRU
36.83
(1.450)
13.46
(0.530)
9.91
(0.390)
12.78
(0.503)
C
L
13.46
(0.530)
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
TO-220 Heat Sinks
Position Code Description Details
A 01 6-32 Wave On threaded insert Page 89
0.100 stand off
POPULAR OPTIONS:
Channel style heat sink with
folded back fins for increased
cooling surface area. Available
with tin plated solderable tabs
for easy attachment to the
printed circuit card.
9.52
(0.375)
50.44
(1.986)
23.01
(0.906)
49.99
(1.968)
3.81
(0.150)
21.03
(0.828)
2x 3.81
(0.150)
2.02
(0.080)
2.67
(0.105)
24.16
(0.951)
4.83
(0.190)
3.18
(0.125)
2.29
(0.090)
2x
4.44
(0.175)
ø
2x 2.03
(0.080)
"X"
14.48
(0.570)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
048121620
4
3
1
2
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Part Number Description Finish
7022B Channel heat sink with folded back fins Black anodize
7022PB Channel heat sink with folded back fins Pre black anodize*
7022B-MT With solderable tabs Black anodize 2.90 ( 0.114)
7022PB-MT With solderable tabs Pre black anodize* 2.90 ( 0.114)
ORDERING INFORMATION Material: 1.27 (0.050) Thick Aluminum
Finish: See Table
* Edges cut during the manufacturing process will be unfinished.
See page 110 for more information
Position Code Description Location Details
A TC11-MT Insulated device mounting clip for T0-220 and solderable tabs Hole X Page 93, 98
POPULAR OPTIONS:
Dia of PCB
Plated Thru
Hole for Tabs
Base part no. A
7022B-
Base part no. A
551002B0 00 00
For additional options see page 85
For additional options see page 82
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Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
ORDERING INFORMATION
6021, 6221 Channel style heat sink with straight fins
Channel style heat sink with
straight fins features integrated
solderable tabs for easy mounting
to the printed circuit card. Available
with a single device mounting hole
or slotted hole to accomodate
varying device lead lengths.
1.02
(0.040)
25.40
(1.000)
29.97
(1.180)
0.80
(0.032)
24.38
(0.960)
17.78
(0.700)
12.70
(0.500)
3.81
(0.150)
ø 3.38
(0.133)
"A"
"B"
"X"
Part Number Description Finish Figure “A”Dim “B”Dim
6021B Channel heat sink with straight fins and integrated tabs Black anodize A 2.21 (0.087) 10.16 (0.400) 1.78 (0.070)
6021PB Channel heat sink with straight fins and integrated tabs Pre-black anodize* A 2.21 (0.087) 10.16 (0.400) 1.78 (0.070)
6221PB With slotted device mounting hole Pre-black anodize* B 3.18 (0.125) 6.99 (0.275) 2.54(0.100)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
024 6810
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
29.97
(1.180) 17.78
(0.700)
25.40
(1.000)
12.70
(0.500)
2.54
(0.100)
6.98
(0.275)
3.81
(0.150)
9.53
(0.375)
3.81
(0.150)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
024 6810
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Copper channel style heat sink
with straight fins features integrated
tabs which can be twisted to attach
the heat sink to the board prior to
wave solder. Available in two finishes.
6230 Copper channel style heat sink with straight fins
Material: 1.02 (0.040) Thick Aluminum
Finish: See Table
Material: 0.63 (0.02)5 Thick Copper
Finish: See Table
ORDERING INFORMATION
Part Number Finish
6230D Tin plated 3.00 (0.118)
6230B-TT Black paint and tinned tabs 3.00 (0.118)
Dia of PCB
Plated Thru
Hole for Tabs
TO-220 Heat Sinks
Position Code Description Location Details
A B Black anodize
A PB Pre-black anodize*
B SF1 4-40 UNC-2A device mounting stud Hole X Page 96
POPULAR OPTIONS:
* Edges cut during the manufacturing process will be unfinished.
See page 110 for more information
Dia of PCB
Plated Thru
Hole for Tabs
Base part no. A
6021- -
Available on the 6021 only
For additional options for part 6021 see page 85
25.40
(1.000)
3.81
(0.150)
9.52
(0.375)
29.97
(1.180)
17.78
(0.700)
3.80
(0.150) 24.59
(0.968)
1.02
(0.040)
0.80
(0.032)
12.70
(0.500)
wide x
long slot
"A"
"B"
FIGURE A FIGURE B
B
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AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
TV35 Narrow channel style heat sink features twisted fins
TV47, TV58 Narrow channel style heat sink features twisted fins
Narrow channel style heat sink
features twisted fins for
increased air turbulence
and better cooling. Can
be mounted vertically
or horizontally.
Air Velocity – Feet Per Minute
Heat Dissipated – Watts
Thermal Resistance From MTG
Surface to Ambient – °C/Watt
20
0
20
40
60
80
100
012 3 4 5
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient – °C
TV47
TV58
Part Number “A”Dim
TV47 13.00 (0.512)
TV58 11.00 (0.433)
ORDERING INFORMATION
19.00
(0.749)
C
L
6.30
(0.248)
4.00
(0.157)
"A"
22.00
(0.887)
MAX
11.00
(0.433)
MIN
Thru
ø
TO-220 Heat Sinks
Narrow channel style heat sink
features twisted fins for increased
air turbulence and better cooling.
Mounts horizontally to accommo-
date two TO-220 devices.
38.00
(1.497)
42.00
(1.655)
35.00
(1.380)
25.00
(0.985)
C
L
10.00
(0.394)
14.00
(0.552)
4.00
(0.158)
THRU
2X ø
Air Velocity – Feet Per Minute
Heat Dissipated – Watts
Thermal Resistance From MTG
Surface to Ambient – °C/Watt
10
0
20
40
60
80
100
024 6 810
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient – °C
Part Number Description
TV35 Channel style heat sink with twisted fins
ORDERING INFORMATION
Material: 0.81 (0.032) Thick Aluminum
Finish: Black Anodize
Material: 0.81 (0.032) Thick Aluminum
Finish: Black Anodize
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AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
ORDERING INFORMATION
TV265, TV1500, TV1505 Channel style heat sink features twisted fins
Channel style heat sink features
twisted fins for increased air turbu-
lence and better cooling. Can be
mounted vertically or horizontally.
Models are available with integrated
twist tabs or mounting solderable tabs.
Air Velocity – Feet Per Minute
Heat Dissipated – Watts
Thermal Resistance From MTG
Surface to Ambient – °C/Watt
20
0
20
40
60
80
100
024 6 810
16
12
4
8
0
0400
200 600 800 1000
TV1505
TV1500
Mounting Surface Temp
Rise Above Ambient – °C
Part Number Description Figure
TV265 Channel style heat sink with twisted fins and solderable tabs A 2.39 (0.094)
TV1500 Channel style heat sink with twisted fins B
TV1505 With integrated twist tabs B 3.30 (0.130)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
024 6810
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
30.40
(1.197)
31.20
(1.228)
25.00
(0.984)
5.10
(0.201)
15.20
(0.598)
12.50
(0.492)
C
L
Slots for
clip attach
3.81
(0.150)
0.80
(0.031)
24.20
(0.953)
11.10
(0.437) 1.90
(0.075)
5.00
(0.197)
Channel style heat sink features
solderable tabs and twisted fins
for increased air turbulence for bet-
ter cooling. For ease of assembly use
with clip 7701 (sold separately) to
attach device. See page 97 for clip
information.
5900 Channel style heat sink features solderable tabs and twisted fins
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
Material: 1.19 (0.047) Thick Aluminum
Finish: Pre Black Anodize*
ORDERING INFORMATION
Part Number Description
5900PB Channel style heat sink with twisted fins and solderable tabs 2.40 (0.094)
Dia of PCB
Plated Thru
Hole for Tabs
TO-220 Heat Sinks
Dia of PCB
Plated Thru
Hole for Tabs
Air Velocity – Feet Per Minute
Heat Dissipated – Watts
Thermal Resistance From MTG
Surface to Ambient – °C/Watt
20
0
20
40
60
80
100
0123 4 5
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient – °C
TV 265
12.70
(0.500)
2.54
(0.100)
5.80
(0.228)
30.00
(1.181)
5.08
(0.200)
1.20
(0.047) 24.13
(0.950)
30.20
(1.187)
3.80
(0.150)
1.90
(0.075)
15.24
(0.600)
TAB
TV1505
ONLY
C
L
R
45.00
(1.772)
4.50
(0.177) 1.90
(0.075) 10.15
(0.400)
12.70
(0.500)
1.90
(0.075)
R
30.00
(1.181)
22.10
(0.870)
25.40
(1.000)
15.24
(0.600)
5.08
(0.200)
0.75
(0.030)
C
L
* Edges cut during the manufacturing process will be unfinished.
See page 110 for more information.
FIGURE A
FIGURE B
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Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
ORDERING INFORMATION
5929, 5930 Channel style heat sink featuring twisted fins
Channel style heat sink features
twisted fins for increased air turbulence
for better cooling. Two heights are avail-
able and include wave solderable tin
plated tabs for easy attachment
to the PC board.
17.78
(0.700)
3.18
(0.125)
THRU
0.81
(0.032) 10.16
(0.400)
1.90
(0.075)
12.70
(0.500)
4.32
(0.170)
ø
"A"
23.93
(0.942)
"X"
Part Number “A”Dim
592902B03400 24.89 (0.980) 2.36 (0.093)
593002B03400 29.97 (1.180) 2.36 (0.093)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
024 6810
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
593002
592902
17.78
(0.700)
25.40
(1.000)
5.08
(0.200)
"A"
12.70
(0.500)
8.89
(0.350)
2.54
(0.100)
9.52
(0.375)
3.81
(0.150)
TYP
C
L
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
024 6810
8
6
2
4
0
0400
200 600 800 1000
576602
563002
Mounting Surface Temp
Rise Above Ambient—°C
Channel style heat sink features three
integrated tabs for greater stability and
slotted mounting hole to accommodate a
variety of device lead lengths. Available in
two heights. Mounting tabs are designed
for either soldering (tin finish) or twisted.
5630, 5766 Channel style heat sink featuring three integrated tabs
5750 Channel style heat sink with two integrated tabs
Channel style heat sink features two
integrated tabs and slotted mounting
hole to accommodate a variety of device
lead lengths. Mounting tabs are designed
for either soldering (tin finish) or twisted.
25.40
(1.000)
9.52
(0.375)
3.81
(0.150) 5.08
(0.200)
17.78
(0.700)
29.97
(1.180)
12.70
(0.500)
10.16
(0.400)
2.54
(0.100)
C
L
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
024 6810
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Part Number Finish
575002B00000 Black anodize 3.10 (0.122)
575002D00000 Tin plated 3.10 (0.122)
575002T00000 Black paint and tinned tabs 3.10 (0.122)
ORDERING INFORMATION
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
Material: 1.27 (0.050) Thick Aluminum
Finish: See Table
Material: 1.27 (0.050) Thick Aluminum
Finish: See Table
Dia of PCB
Plated Thru
Hole for Tabs
TO-220 Heat Sinks
Position Code Description Location Details
A 05 4-40 male semiconductor mount 0.380 LG Hole X Page 90
ORDERING INFORMATION
Part Number “A”Dim Finish
563002B00000 29.97 (1.180) Black anodize 3.10 (0.122)
563002D00000 29.97 (1.180) Tin plated 3.10 (0.122)
563002T00000 29.97 (1.180) Black paint and tinned tabs 3.10 (0.122)
576602B00000 24.13 (0.950) Black anodize 3.10 (0.122)
576602D00000 24.13 (0.950) Tin plated 3.10 (0.122)
576602T00000 24.13 (0.950) Black paint and tinned tabs 3.10 (0.122)
Dia of PCB
Plated Thru
Hole for Tabs
Dia of PCB
Plated Thru
Hole for Tabs
POPULAR OPTIONS:
Base part no. A
59 _ _ 02B034 00
For additional options see page 82
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
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Epoxy
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page112
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Kits
page 99
35
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
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Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
5901 Channel style heat sink featuring recessed lower fins
Channel style heat sink features
recessed lower fins to allow closer com-
ponent spacing and longer upper fins for
maximum cooling. Includes two solderable
tabs for easy attachment to the PC card.
25.40
(1.000)
17.78
(0.700)
23.50
(0.925) 3.96
(0.156)
25.40
(1.000)
2.54
(0.100)
12.70
(0.500)
42.54
(1.675)
5.08
(0.200)
9.53
(0.375)
x
øSLOT
23.98
(0.944)
1.27
(0.050)
C
L
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
01 2 3 4 5
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
17.78
(0.700)
42.54
(1.675)
3.96
(0.156)
0.81
(0.032)
11.43
(0.450)
5.08
(0.200)
12.70
(0.500)
24.89
(0.980)
2.54
(0.100)
9.52
(0.375)
ø
C
L
x
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
01 2 3 4 5
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Channel style heat sink features slotted
mounting hole to accommodate a variety of
devices and lead lengths. Includes two solder-
able tabs for easy attachment to the PC card.
5903 Channel style heat sink featuring slotted mounting hole
5770, 5771, 5772 Slim low cost channel style heat sink
Slim low cost channel style heat sink
is ideal where space and cost are limited.
Available in 3 fin heights with or without
solderable mounting tab.
19.05
(0.750)
6.35
(0.250) 1.27
(0.050)
ø 3.81
(0.150) THRU
0.81
(0.032)
13.21
(0.520)
"A"
10.67
(0.420)
13.33
(0.525)
C
L
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
01 2 3 4 5
16
12
4
8
0
0400
200 600 800 1000
577102
577202
577002
Mounting Surface Temp
Rise Above Ambient—°C
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number Description
590302B03600 High performance heat sink with solderable tabs 2.92 (0.115)
Dia of PCB
Plated Thru
Hole for Tabs
TO-220 Heat Sinks
ORDERING INFORMATION
Part Number Description
590102B03600 High performance heat sink with recessed lower fins 2.92 (0.115)
Dia of PCB
Plated Thru
Hole for Tabs
ORDERING INFORMATION
Part Number Description “A”Dim
577002B00000 Slim, low cost channel style heat sink 6.35 (0.250)
577002B04000 With solderable tab 6.35 (0.250) 1.73 (0.068)
577102B00000 Slim, low cost channel style heat sink 9.52 (0.375)
577102B04000 With solderable tab 9.52 (0.375) 1.73 (0.068)
577202B00000 Slim, low cost channel style heat sink 12.70 (0.500)
577202B04000 With solderable tab 12.70 (0.500) 1.73 (0.068)
Dia of PCB
Plated Thru
Hole for Tabs
Position Code Description Details
A 3 In-Sil-8TM pad Page 86
POPULAR OPTIONS:
Base part no. A
57_ _02B 0 4000
For additional options see page 82
For additional options see page 82
For additional options see page 82
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
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Epoxy
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THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
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AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
ORDERING INFORMATION
6109, 6110 Low cost channel style heat sink featuring integrated alignment tabs
Low cost channel style heat sink features
integrated alignment tabs to prevent the
device from rotating while applying torque
to the mounting hardware. Available in two
lengths with a pre-black anodized finish.
10.92
(0.430)
11.68
(0.460)
8.89
(0.350)
29.97
(1.180)
12.70
(0.500)
AT BASE
25.40
(1.000)
3.81
(0.150)
ø
Part Number Description Figure
6109PB Low cost channel heat sink with device locating tabs A
6110PB Low cost channel heat sink with device locating tabs B
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
0 1 2 3 4 5
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
6110
6109
ORDERING INFORMATION
19.05
(0.750) 13.34
(0.525)
6.35
(0.250)
3.81
(0.150) 6.60
(0.260)
3.81
(0.150)
3.81
(0.150)
1.27
(0.050)
9.52
(0.375)
øC
L
13.21
(0.520)
AT BASE
Part Number Description
7178D Narrow channel copper heat sink 2.54 (0.100)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
0.0 0.4 0.8 1.2 1.6 2.0
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Copper narrow channel style heat sink
includes a single integrated tab to allow
easy attachment to the PC board.Tin plated
finish ensures easy solderability.
7178 Copper narrow channel style heat sink with a single integrated tab
7136, 7139 Copper channel style slide on heat sink featuring integrated mounting clip
Copper channel style slide on heat
sink features integrated mounting
clip for easy no hardware attach-
ment to the device. Also includes
solderable mounting tabs for easy
attachment to the PC board.
21.54
(0.848)
1.27
(0.050)
13.08
(0.515)
13.21
(0.520)
2.79
(0.110)
4.19
(0.165)
2x 1.27
(0.050)
2x
2x
17.78
(0.700)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
0 1 2 3 4 5
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
7139
7136
Part Number Description Figure
7136D Vertical mount A 2.54 (0.100)
7139D Horizontal mount B 2.54 (0.100)
ORDERING INFORMATION
19.81
(0.780) 14.86
(0.580)
13.08
(0.515) 2.79
(0.110)
13.21
(0.520)
2.03
(0.080)
Top is cut away
to show detail
16.51
(0.650)
Material: 1.27 (0.050) Thick Aluminum
Finish: Pre-Black Anodize*
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
Dia of PCB
Plated Thru
Hole for Tabs
TO-220 Heat Sinks
Position Code Description Details
A MT Solderable mounting tabs Page 93
Dia of PCB
Plated Thru
Hole for Tabs
* Edges cut during the manufacturing process will be unfinished.
See page 110 for more information
10.92
(0.430)
AT BASE
25.40
(1.000)
5.72
(0.225)
8.89
(0.350)
3.81
(0.150)
18.03
(0.710)
12.70
(0.500)
ø
C
L
POPULAR OPTIONS:
Base part no. A
61_ _PB -
For additional options see page 85
FIGURE A FIGURE B
FIGURE A FIGURE B
Grease
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page112
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Kits
page 99
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&
page112
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THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
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Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
ORDERING INFORMATION
7128 Copper channel style heat sink with integrated clip
Copper channel style heat sink with
integrated clip and locking tab for
secure attachment to the device. Narrow
profile uses less board space. Includes
tin plated solderable tabs for easy
attachment to the printed circuit card.
27.94
(1.100)20.32
(0.800)
9.52
(0.375)
22.00
(0.866)
Top is cut
away to
show detail
1.27
(0.050)
1.27
(0.050)
2.79–3.43
(0.110–0.135)
5.31
(0.209)
4.47
(0.176)
6.12
(0.241)
1.68
(0.066)
1.07
(0.042)
10.80
(0.425)
Part Number Description
7128D Slide on channel heat sink with integrated tabs 2.92 (0.115)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From
Case to Ambient—°C/Watt
10
0
20
40
60
80
100
0 1 2 3 4 5
8
6
2
4
0
0400
200 600 800 1000
Case Temp Rise
Rise Above Ambient—°C
29.97
(1.180)
12.70
(0.500)
25.40
(1.000)
2.54
(0.100)
6.35
(0.250)
2.54
(0.100)
10.16
(0.400)
AT BASE
16.51
(0.650)
8.26
(0.325)
11.43
(0.450)
31.24
(1.230)
18.29
(0.720)
5.89
(0.232)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
0 1 2 3 4 5
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Channel style heat sink with integrated
clip and locking tab for secure attach-
ment to the device.Tabs can be bent for
mounting or tinned tab version can be
soldered directly to the board.
6038 Channel style heat sink with integrated clip
7142 Narrow channel style heat sink with integrated clip
Narrow channel style heat sink with
integrated clip and locking tab for
secure attachment to the device.
Device can be mounted horizontally
using a single center tab that can be
soldered directly to the PC board.
19.81
(0.780)
13.08
(0.515)
13.21
(0.520)
2.79
(0.110)
Top is cut
away to
show detail
2.54
(0.100)
0.64
(0.025)
14.86
(0.585)
C
L
16.51
(0.650)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From
Case to Ambient—°C/Watt
10
0
20
40
60
80
100
0 1 2 3 4 5
8
6
2
4
0
0400
200 600 800 1000
Case Temp Rise
Above Ambient—°C
Part Number Description
7142D Slide on narrow channel heat sink with integrated clip 3.18 (0.125)
ORDERING INFORMATION
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
ORDERING INFORMATION
Part Number Finish Material
6038B Black anodize 3.81 (0.150) 0.81(0.032) Thick Aluminum
6038B-TT Black paint and tinned tabs 3.81 (0.150) 0.81(0.032) Thick Copper
Dia of PCB
Plated Thru
Hole for Tabs
TO-220 Heat Sinks
Dia of PCB
Plated Thru
Hole for Tabs
Dia of PCB
Plated Thru
Hole for Tabs
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AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
ORDERING INFORMATION
6238, 6239 Channel style heat sink with integrated clip
Channel style heat sink with
integrated clip features strong
spring tension and device lock-
ing tab to attach device securely
to the heat sink. Available with
solderable tabs for vertical
mount or without tabs for
mounting horizontally.
10.80
(0.425)
24.38
(0.960)
2.67
(0.105)
15.49
(0.610)
25.53
(1.005)
5.08
(0.200)
8.00
(0.315)
"A"
2.02
(0.080)
B
B
3.17
(0.125)
19.05
(0.750)
1.90
(0.075)
16.51
(0.650)
SECTION B-B
AT BASE
Part Number Description “A”Dim
6238B Slip on channel heat sink with integral clip
6238B-MT With solderable mounting tabs 10.16 (0.400) 2.90 (0.114)
6239B-MT With solderable mounting tabs 6.99 (0.275) 2.90 (0.114)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
0 1 2 3 4 5
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
5342 Channel style heat sink with convenient clip
Material: 1.02 (0.040) Thick Aluminum
Finish: Black Anodize
TO-220 Heat Sinks
Dia of PCB
Plated Thru
Hole for Tabs
ORDERING INFORMATION
Channel style heat sink features
a dittin to locate the device and
a convenient clip to eliminate the
need for mounting hardware. The
twisted fins increase cooling effi-
ciency. Available in two solderable
mounting tab styles.
25.40
(1.000)
17.80
(0.700)
3.12
(0.123)
22.35
(0.880)
3.05
(0.120)
12.70
(0.500)
9.27
(0.365)
1.60
(0.063)
29.97
(1.180)
0.762
(0.030)
9.78
(0.385)
x
ø 0.64
(0.025)
HIGH DITTIN
C
L
14.12
(0.556)
Part Number Description Figure
534202B02853 With Shur-LockTM tabs and clip A 2.39 (0.094)
534202B03453 With solderable mounting tabs and clip B 2.39 (0.094)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
024 6810
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
17.80
(0.701)
4.27
(0.170) 23.67
(0.932)
3.05 0.64
(0.120) (0.025)
12.70
(0.500)
10.16
(0.400)
1.90
(0.075)
29.97
(1.180)
0.81
(0.032)
9.78
(0.385)
HIGH
DITTIN
ø
x
C
L
25.40
(1.000)
14.12
(0.556)
FIGURE A FIGURE B
12.06
(0.475)
3.96
(0.156)
3.17
(0.125)
13.84
(0.545)
CLIP 53
For additional options see page 85
Dia of PCB
Plated Thru
Hole for Tabs
For additional options see page 82
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Kits
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THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
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AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
ORDERING INFORMATION
5041, 5042 Economy, narrow base, low profile channel style heat sink
Economy, narrow base, low profile
channel style heat sink is perfect for
use on printed circuit boards with tight
component spacing. Models are available
for single and dual device mounting.
17.80
(0.700)
3.66
(0.144)
THRU
13.46
(0.530)
21.60
(0.850)
19.80
(0.780)
ø
"X"
Part Number Description Figure
504102B00000 Economy, narrow base channel style heat sink A
504222B00000 For dual devices B
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
024 6810
8
6
2
4
0
0400
200 600 800 1000
504222
504102
Mounting Surface Temp
Rise Above Ambient—°C
Material: 1.02 (0.040) Thick Aluminum
Finish: Black Anodize
TO-220 Heat Sinks
Position Code Description Location Details
A 01 6-32 Wave On threaded insert 0.100 stand off Hole X Page 89
21.59
(0.850)
13.47
(0.530)
36.83
(1.450)
9.91
(0.390)
3.66
(0.144)
THRU TYP 2
19.81
(0.780)
9.91
(0.390)
ø
"X" "X"
Economy, narrow base, low profile
channel style heat sink is perfect for
use on printed circuit boards with
0.500 inch centering.When mounted
horizontally, the total height of the
heat sink is just 0.375.
9.65
(0.380)
9.52
(0.375)
13.34
(0.525)
ø 3.81
(0.150)
THRU
19.05
(0.750)
19.05
(0.750)
L
C
"X"
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
012 34 5
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Part Number Finish
507302B00000 Black anodize
507302J00000 Pre-black anodize*
ORDERING INFORMATION Material: 1.27 (0.050) Thick Aluminum
Finish: See Table
Position Code Description Location Details
A 09 Stud 4–40 x 0.350 LG Hole X Page 96
* Edges cut during the manufacturing process will be unfinished. See page 110 for more information
5073 Economy, narrow base, low profile channel style heat sink
7141 Copper narrow channel style heat sink with integrated clip
Copper narrow channel style heat
sink with integrated clip and locking
tab for secure attachment to the device.
Single center tab can be soldered
directly to the PC board.
19.81
(0.780)
5.72
(0.225) 1.27
(0.050)
3.81
(0.150)
3.05
(0.120)
13.08
(0.515)
13.21
(0.520)
Top is cut
away to
show detail
2.54
(0.100)
MAX
16.51
(0.650)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From
Case to Ambient—°C/Watt
10
0
20
40
60
80
100
0 1 2 3 4 5
8
6
2
4
0
0400
200 600 800 1000
Case Temp Rise
Above Ambient—°C
Part Number Description
7141D Slide on narrow channel heat sink with integrated clip 2.77 (0.109)
ORDERING INFORMATION
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
Dia of PCB
Plated Thru
Hole for Tabs
FIGURE A FIGURE B
POPULAR OPTIONS:
Base part no. A
507302 _ 000 00
POPULAR OPTIONS:
Base part no. A
504_ _2B00000
For additional options see page 82
For additional options see page 82
Grease
Epoxy
&
page112
Mounting
Kits
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THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
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ASIA
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United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
7173 Copper channel style heat sink featuring two integrated tabs
6236 Channel style heat sink featuring an integrated device retaining clip
TO-220 Heat Sinks
19.05
(0.750)13.34
(0.525)
ø
3.81
(0.150)
THRU
9.52
(0.375)
19.05
(0.750)
3.81
(0.150)
6.35
(0.250)
3.81
(0.150) 1.27
(0.050)
4.11
(0.162)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
012 345
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Copper channel style heat sink
features two integrated tabs.
The heat sink is tin plated and can
be soldered to the PC board.
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
ORDERING INFORMATION
Part Number Description
7173D Copper channel style heat sink 2.54 (0.100)
Dia of PCB
Plated Thru
Hole for Tabs
Channel style heat sink features an
integrated device retaining clip that
eliminates the need for attachment
hardware. Available in two finish options.
17.78
(0.700)
12.95
(0.510)
13.21
(0.520)
Top is cut away
to show detail
2.54
(0.100)
Locking Catch
14.22
(0.560)
C
L
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
024 6 8 10
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Part Number Finish
6236B Black anodize
6236PB Pre-black anodize*
ORDERING INFORMATION Material: 1.02 (0.040) Thick Aluminum
Finish: See table
* Edges cut during the manufacturing process will be unfinished.
See page 110 for more information.
TV40 Narrow channel style heat sink features twisted fins
38.00
(1.497)
22.00
(0.866)
28.00
(1.103)
C
L
13.00
(0.512) 6.00
(0.236)
4.00
(0.158)
THRU
2X
Air Velocity – Feet Per Minute
Heat Dissipated – Watts
Thermal Resistance From MTG
Surface to Ambient – °C/Watt
10
0
20
40
60
80
100
024 6 810
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient – °C
Narrow channel style heat
sink features twisted fins
for increased air turbulence
and better cooling. Mounts
horizontally to accommodate
two TO-220 devices. Material: 0.81 (0.032) Thick Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number Description
TV40 Narrow channel style heat sink with twisted fins
Grease
Epoxy
&
page112
Mounting
Kits
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Grease
Epoxy
&
page112
Mounting
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page 99
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5306, 5307, 5760 Channel style heat sink with wide mounting surface
Lightweight, low cost channel style
heat sink with wide mounting surface
and selection of lengths to accept a
variety of packages. Models accomodate
one or two devices.
"C"
AT BASE
25.40
(1.000)
THRU
3.81
(0.150)
ø
"B"
"A"
C
L
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
01 2 3 4 5
8
6
2
4
0
0400
200 600 800 1000
530613 or 530614
576012, 530714 or 576014
Mounting Surface Temp
Rise Above Ambient—°C
Part Number Figure “A”Dim “B”Dim “C”Dim
530613B00000 B 12.19 (0.480) 10.16 (0.400)
530614B00000 A 29.97 (1.180) 11.68 (0.460) 12.70 (0.500)
530714B00000 A 18.03 (0.710) 12.32 (0.485) 12.70 (0.500)
576012B00000 A 22.86 (0.900) 11.43 (0.450) 9.65 (0.380)
576014B00000 A 22.86 (0.900) 8.13 (0.320) 9.65 (0.380)
ORDERING INFORMATION
12.70
(0.500)
29.97
(1.180)
AT BASE
25.40
(1.000)
THRU 2X
3.81
(0.150)
ø
"A"
"B"
C
L
FIGURE A FIGURE B
For additional options see page 82
5779, 5786 Twin channel style heat sink
Twin channel style heat sink
vertically mounts two TO-220 devices
to a single heat sink. Center fins
increase cooling capacity. Available
with integrated twist tabs or staked
on solder tabs for easy attachment
to the PC board.
37.59
(1.480)
12.70
(0.500)
2.54
(0.100)
5.08
(0.200)
26.16
(1.030)
19.30
(0.760)
30.15
(1.187)
3.81
(0.150)
THRU
TYP 2
ø
9.65
(0.380)
TYP 2
15.49
(0.610)
TYP 2
3.81
(0.150)
THRU
TYP 2
ø
37.59
(1.480)
12.70
(0.500)
14.99
(0.590)
35.56
(1.400)
9.65
(0.380)
TYP 2
19.30
(0.760)
5.59
(0.220)
1.57
(0.062)
3.43
(0.135)
12.70
(0.500)
25.40
(1.000)
ORDERING INFORMATION
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
0 1 2 3 4 5
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
Part Number Description Figure
577922B00000 Twin channel style heat sink with integrated tabs A 3.10 (0.122)
578622B03200 With staked on solderable tabs B 1.91 (0.075)
Dia of PCB
Plated Thru
Hole for Tabs
FIGURE A FIGURE B
For additional options see page 43
TO-220 Heat Sinks
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
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&
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Mounting
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AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
ORDERING INFORMATION
5069, 5070, 5071, 5072 Hat section style heat sink
Hat section style heat sinks are low
profile and perfect for use on printed
circuit cards with 0.500 inch centering
between boards. For higher power
applications the 5071 hat can be added
to the 5070 or 5072 for double sided
cooling of a TO-220 device.
17.78
(0.700)
9.52
(0.375)
13.46
(0.530)
17.78
(0.700) C
L
3.66
(0.144)
THRU
ø
"A"
Part Number Description Figure “A”Dim
506902B00000 Hat section heat sink A 31.75 (1.250)
507002B00000 Wide hat section heat sink A 44.45 (1.750)
507102B00000 Hat section heat sink with cut out C
507222B00000 Dual device hat section heat sink B
44.45
(1.750)
12.70
(0.500)
12.70
(0.500)
17.78
(0.700)
3.66
(0.144)
10.67
(0.420)
10.29
(0.405)
13.46
(0.530)
ø
7137, 7140 Copper, hat section, slide on heat sink
Copper, hat section, slide on heat sink
features integrated mounting clip
for easy no hardware attachment to
the device. Also included are solderable
mounting tabs for easy attachment
to the PC card.
21.54
(0.848)
22.86
(0.900)
9.52
(0.375)
13.21
(0.520)
2.54
(0.100)
Top is cut away
to show detail
19.05
(0.750)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
01 2 3 4 5
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Part Number Description Figure
7137D Vertical mount A 2.54 (0.100)
7140D Horizontal mount B 2.54 (0.100)
ORDERING INFORMATION
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
TO-220 Heat Sinks
Position Code Description Details
A 1 Kon DuxTM pad Page 86
37.34
(1.470)
44.45
(1.750)
17.78
(0.700)
9.52
(0.375)
13.59
(0.535)
10.16
(0.400)
C
L
3.66
(0.144)
THRU TYP 2
ø
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
01 2 3 4 5
8
6
2
4
0
0400
200 600 800 1000
507002
506902
Mounting Surface Temp
Rise Above Ambient—°C
Dia of PCB
Plated Thru
Hole for Tabs
FIGURE C
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
0 2 4 6 8 10
8
6
2
4
0
0400
200 600 800 1000
507222 with 507102 attached
507222
Mounting Surface Temp
Rise Above Ambient—°C
17.78
(0.700)
22.86
(0.900)
9.52
(0.375)
13.21
(0.520)
1.57
(0.062) 3.05
(0.120)
11.05
(0.435)
For additional options see page 82
FIGURE A FIGURE B
FIGURE A FIGURE B
POPULAR OPTIONS:
Base part no. A
50_ _ _2B 0 0000
Grease
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&
page112
Mounting
Kits
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Material: 1.02 (0.040) Thick Aluminum
Finish: Black Anodize
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ORDERING INFORMATION
6237 Hat section style heat sink featuring an integrated clip
Hat section style heat sink
features an integrated clip
for secure attachment to the
device without added hard-
ware. Available in two finishes.
17.78
(0.700)
22.86
(0.900)
9.52
(0.375)
13.21
(0.520)
2.54
(0.100)
Top is cut away
to show detail
14.22
(0.560)
Part Number Finish
6237B Black anodize
6237PB Pre-black anodize*
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
024 6 8 10
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
ORDERING INFORMATION
TYP 2
4.19
(0.165)
14.73
(0.580) 1.78
(0.070)
11.18
(0.440)
2.41
(0.095)
4.83
(0.190)
TYP 6
1.98
(0.078)
R
DETAIL-A
TYP 2
3.56
(0.140)
2
1
REF
15.49
(0.61)
REF
33.27
(1.31)
REF
27.69
(1.09)
@ BASE
33.27
(1.310)
SQ.
REF
46.48
(1.83)
REF
6.35
(0.25)
THRU
TYP 8
3.66
(0.144)
SEE DETAIL "A"
1
2
C
L
ø
ø
C
L
C
L
TYP 2
C
L
TYP 2
"X"
"X"
Part Number Description
569022B00000 High power, square basket, folded back fin heat sink
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
0 4 8 12 16 20
4
3
1
2
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
High power, square basket heat sink
accommodates two TO-220 devices.
Features folded back fins for increased
surface area for maximum cooling.
5690 High power, square basket heat sink with folded back fins
Material: 1.02 (0.040) Thick Aluminum
Finish: See Table
Material: 1.60 (0.063) Thick Aluminum
Finish: Black Anodize
TO-220 Heat Sinks
* Edges cut during the manufacturing process will be unfinished.
See page 110 for more information
Position Code Description Location Details
A016–32 Wave On threaded insert, 0.100 stand off 0.062 Bd Hole X Page 89
For additional options see page 82
POPULAR OPTIONS:
Base part no. A
569022B0 00 00
Grease
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&
page112
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Kits
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5748, 5798, 5799 Clip on style heat sink featuring an integrated clip
Clip on style heat sink features
an integrated clip to retain the
device meaning no mounting
hardware is required. Models
have fins on the both sides, left
or right side and are available
with solderable tabs for easy
attachment to the PC board.
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
012 34 5
16
12
4
8
0
0400
200 600 800 1000
579902
574802
Mounting Surface Temp
Rise Above Ambient—°C
579802
6043, 6049, 6094 Low cost, clip on style heat sink featuring a locking tab
Low cost, clip on style heat sink
features a locking tab
to prevent the device from dis-
lodging from the heat sink. Also
includes slide runners to ensure
proper device alignment. Available
in a pre-black anodize finish.
"D" "C"
"A"
"E"
"B"
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
01 2 3 4 5
16
12
4
8
0
0400
200 600 800 1000
6049
6043
6094
Mounting Surface Temp
Rise Above Ambient—°C
Part Number “A”Dim “B”Dim “C”Dim “D”Dim “E”Dim
6043PB 25.40 (1.000) 16.51 (0.650) 10.16 (0.400) 20.32 (0.800) 6.81 (0.268)
6049PB 25.40 (1.000) 16.51 (0.650) 10.16 (0.400) 13.97 (0.550) 6.81 (0.268)
6094PB 20.32 (0.800) 14.73 (0.580) 10.92 (0.430) 20.32 (0.800) 6.45 (0.254)
ORDERING INFORMATION
Material: 0.63 (0.025) Thick Aluminum
Finish: Pre-Black Anodize*
TO-220 Heat Sinks
Part Number Description Figure
574802B00000 Clip on heat sink, left & right side fins A
574802B03300 Left & right side fins with solderable tabs A 1.91 (0.075)
579802B00000 Left side fin B
579802B03300 Left side fin with solderable tab B 1.91 (0.075)
579902B00000 Right side fin B
579902B03300 Right side fin with solderable tab B 1.91 (0.075)
ORDERING INFORMATION Dia of PCB
Plated Thru
Hole for Tabs
25.15
(0.990)
25.91
(1.020)
10.67
(0.420)
6.09
(0.240)
22.86
(0.900)
3.18
(0.125)
LOCKING CATCH
9.52
(0.380)
0.50
(0.020)
1.60
(0.063)
5.08
(0.200)
ø
19.05
(0.750)
22.86
(0.900)
10.67
(0.420)
13.56
(0.530)
3.18
(0.125)
0.51
(0.020)
1.60
(0.063)
9.52
(0.375)
10.67
(0.420)
5.08
(0.200)
LOCKING CATCH
ø
Material: 0.63 (0.025) Thick Aluminum
Finish: Black Anodize
*Edges cut during the manufacturing process will be unfinished.
See page 110 for more information
FIGURE A FIGURE B
Note: Fins on left or right. Right hand side model shown
For additional options see page 82
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ORDERING INFORMATION
5744, 5745, 5746, 5749 Low cost, labor saving, slide on heat sink featuring spring action
Low cost, labor saving, slide on
heat sink features spring action
to firmly hold the device tab to the
heat sink providing maximum
metal to metal contact and good
thermal conduction. Available with
solderable tabs for horizontal or
vertical mounting to the PC board.
9.52
(0.375)
21.08
(0.830)
HOLDING TABS
DITTIN
11.81
(0.465)
10.03
(0.395)
21.84
(0.860)
14.99
(0.590)
"A"
3.18
(0.125)
9.02
(0.355)
ø3.81
(0.150)
1.57
(0.062)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
01 2 3 4 5
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
574402
574502
5741 Low cost, labor saving, slide on heat sink featuring spring action
Low cost, labor saving, slide on heat sink
features spring action to firmly hold the
device tab to the heat sink providing maxi-
mum metal to metal contact and good thermal
conduction. Includes a clearance hole in the
top side to allow the use of optional hardware
to attach device and heat sink to circuit board
or other surface. Also available with solderable
tabs for vertical mounting to the PC board.
21.84
(0.860)
9.02
(0.355)
19.05
(0.750)
3.81
(0.150)
10.03
(0.395)
11.81
(0.465)
14.99
(0.590)
20.57
(0.810)
ø
7.62
(0.300)
CLEARANCE
DITTIN
9.52
(0.375)
5.33
(0.210)
1.57
(0.062)
THRU
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
0 1 2 3 4 5
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Part Number Description
574102B00000 Low cost slide on heat sink
574102B03300 With solderable tabs 1.91 (0.075)
ORDERING INFORMATION
10.03
(0.395)
1.57
(0.062)
5.33
(0.210)
9.52
(0.375)
9.02
(0.355)
HOLDING TABS
20.57
(0.810)
21.84
(0.860)
"A"
4.19
(0.165)
11.81
(0.465)
14.99
(0.590)
DITTIN
Material: 0.63 (0.025) Thick Aluminum
Finish: Black Anodize
Material: 0.63 (0.025) Thick Aluminum
Finish: Black Anodize
TO-220 Heat Sinks
Part Number Description Figure “A”Dim
574402B00000 Low cost slide on heat sink A 19.05 (0.750)
574402B03200 With solderable tabs for horizontal mounting A 19.05 (0.750) 1.91 (0.075)
574502B00000 Low cost slide on heat sink B 19.05 (0.750)
574502B03300 With solderable tabs for vertical mounting B 19.05 (0.750) 1.91 (0.075)
574602B00000 Low cost slide on heat sink B 17.53 (0.690)
574602B03300 With solderable tabs for vertical mounting B 17.53 (0.690) 1.91 (0.075)
574902B00000 Low cost slide on heat sink B 34.92 (1.375)
574902B03300 With solderable tabs for vertical mounting B 34.92 (1.375) 1.91 (0.075)
Position Code Description Details
A 37 Solderable tab with step to limit insertion depth Page 92
Dia of PCB
Plated Thru
Hole for Tabs
Dia of PCB
Plated Thru
Hole for Tabs
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
0 1 2 3 4 5
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
574902
574602
POPULAR OPTIONS:
Base part no. A
574102B0 00 00
For additional options see page 82
FIGURE A FIGURE B
For additional options see page 82
Mounting
Kits
page 99
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www.aavidthermalloy.com
ORDERING INFORMATION
5751, 5793, 5794 Snap down style heat sink featuring two side fins
Snap down style heat sink feature
two side fins that act as springs
to hold the semiconductor firmly
to the heat sink. Models include an
integrated clip and device locking
catch for more robust applications.
Available for both standard and
bevel edged TO-220 packages.
Part Number Description Figure
575102B00000 Snap down heat sink A
579302B00000 With integrated clip and locking catch B
579402B00000 With integrated clip and locking catch B
for T0-220 with beveled edge
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
01 2 3 4 5
8
6
2
4
0
0400
200 600 800 1000
579302
Mounting Surface Temp
Rise Above Ambient—°C
579402
TO-220 Heat Sinks
19.05
(0.750)
12.32
(0.485)
14.22
(0.560)
3.81
(0.150)
28.45
(1.120)
THRU
ø
11.18
(0.440)
11.18
(0.440)
11.18
(0.440)
"A" "A"
579302
19.05
(0.750)
24.89
(0.980)
579402
3.15
(0.124)
LOCKING CATCH
View A-A View A-A
ø
FIGURE A FIGURE B
Material: 0.63 (0.025) Thick Aluminum
Finish: Black Anodize
For additional options see page 82
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
01 2 3 4 5
16
12
4
8
0
0400
200 600 800 1000
575102
Mounting Surface Temp
Rise Above Ambient—°C
47
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www.aavidthermalloy.com
ORDERING INFORMATION
6225 Space saving staggered fin heat sink
Space saving staggered fin heat sink
for vertical mounting T0-220 devices.
Features solderable mounting tabs for
easy attachment to the PC board.
8.00
(0.315)
27.18
(1.070)
ø3.18
(0.125)
THRU
15.16
(0.597)
3.18
(0.125)
26.01
(1.024)
17.78
(0.700)
2.28
(0.090)
4.83
(0.190)
2.02
(0.080)
Part Number Description
6225B-MT Space saving staggered fin heat sink 2.90 (0.114)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
0 1 2 3 4 5
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
12.70
(0.500)
35.05
(1.380)
25.40
(1.000)
50.80
(2.000)
2.46
(0.097) 25.40
(1.000)
18.28
(0.720)
4.75
(0.187)
3.18
(0.125)
ø 2x
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
0 2 4 6 8 10
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Copper, space saving staggered
fin heat sink for vertical mounting
T0-220 devices. Features solderable
mounting tabs for easy attachment
to the PC board.
6032 Copper, space saving staggered fin heat sink
6022 Space saving staggered fin heat sink
Space saving staggered fin
heat sink for vertical mounting
T0-220 devices. Features staked
on solderable mounting tabs for
easy attachment to the PC board.
6.35
(0.250)
22.23
(0.875)
3.18
(0.125)
30.73
(1.210)
18.54
(0.730) 1.07
(0.042)
17.78
(0.700)
2.79
(0.110)
ø
1.78
(0.070)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
0 2 4 6 8 10
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Part Number Finish
6022PB Pre-black anodize* 2.36 (0.093)
6022B Black anodize 2.36 (0.093)
ORDERING INFORMATION
Material: 1.02 (0.040) Thick Aluminum
Finish: Black Anodize
Material: 1.27 (0.050) Thick Copper
Finish: See Table
Material: 1.02 (0.040) Thick Aluminum
Finish: See Table
ORDERING INFORMATION
Part Number Finish
6032B-TT Black paint with tinned tabs 3.10 (0.122)
6032D Tin plated 3.10 (0.122)
Dia of PCB
Plated Thru
Hole for Tabs
TO-220 Heat Sinks
Dia of PCB
Plated Thru
Hole for Tabs
Dia of PCB
Plated Thru
Hole for Tabs
*Edges cut during the manufacturing process will be unfinished.
See page 110 for more information
For additional options see page 85
For additional options see page 85
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&
page112
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Kits
page 99
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Epoxy
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page112
Mounting
Kits
page 99
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48
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AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
ORDERING INFORMATION
6232 Space saving staggered fin heat sink
Space saving staggered fin heat sink
for vertical mounting T0-220 devices.
Features staked on triangular base and
solderable mounting tabs for easy
attachment to the PC board.
35.00
(1.378)
3.18
(0.125)
45.06
(1.774)
20.04
(0.789)
13.34
(0.525)
25.40
(1.000)
2.29
(0.090)
4.83
(0.190)
2.67
(0.105)
12.70
(0.500)
ø 2x
13.00
(0.512)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
0 2 4 6 8 10
4
3
1
2
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
ORDERING INFORMATION
6.34
(0.250)
22.22
(0.875)
17.78
(0.700)
1.57
(0.062)
8.89
(0.350)
31.75
(1.250)
19.56
(0.770)
3.96
(0.156)
10.67
(0.420)
3.18
(0.125)
THRU
ø
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
0 2 4 6 8 10
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Copper, space saving staggered fin
heat sink for vertical mounting T0-220
devices. Features integrated solderable
mounting tabs for easy attachment to
the PC board.
6025 Copper, space saving staggered fin heat sink
5932 Space saving twisted fin heat sink
Space saving twisted fin heat sink
for vertical mounting T0-220 devices.
Features solderable mounting tabs for
easy attachment to the PC board.
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
0 2 4 6 8 10
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
12.20
(0.480)
35.05
(1.380)
3.17
(0.125)
THRU
TYP 2
50.80
(2.000)
4.75
(0.187)
25.40
(1.000)
2.46
(0.097)
25.40
(1.000)
18.30
(0.720)
0.81
(0.032)
ø
16.51
(0.650)
C
L
Part Number Description
593202B03500 Space saving twisted fin heat sink with solderable tabs 2.84 (0.112)
ORDERING INFORMATION
Material: 1.27 (0.050) Thick Aluminum
Finish: See Table
Material: 1.27 (0.050) Thick Copper
Finish: See Table
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
Dia of PCB
Plated Thru
Hole for Tabs
TO-220 Heat Sinks
Position Code Description Details
A 34 Solderable tab for 0.094 plated thru hole Page 92
Part Number Finish
6232B-MT Black anodize 3.10 (0.122)
6232PB-MT Pre-black anodize* 3.10 (0.122)
Dia of PCB
Plated Thru
Hole for Tabs
Part Number Finish
6025D Tin plated 2.54 (0.100)
6025B-TT Black paint and tinned tabs 2.54 (0.100)
Dia of PCB
Plated Thru
Hole for Tabs
*Edges cut during the manufacturing process will be unfinished.
See page 110 for more information
POPULAR OPTIONS:
Base part no. A
593202B0 00 00
For additional options see page 82
For additional options see page 85
For additional options see page 85
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Mounting
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page 99
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AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
TO-220 Heat Sinks
ORDERING INFORMATION
5425 Space saving staggered fin heat sink
Space saving staggered fin heat
sink for vertical mounting T0-220
devices. Features integrated solderable
mounting tabs that can be twisted for
attachment to the PC board. Heat sink
is also available with tin plating for
soldering directly to the PC board.
22.22
(0.875)
10.67
(0.420)
1.57
(0.062)
17.78
(0.700)
6.35
(0.250)
19.56
(0.770)
31.75
(1.250)
3.96
(0.156)
THRU
3.17
(0.125)
8.89
(0.350)
ø
1.27
(0.050)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
0 1 2 3 4 5
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
22.20
(0.875)
3.17
(0.125)
THRU
31.75
(1.250)
19.56
(0.770)
6.35
(0.250)
1.91
(0.075)
2x
5.03
(0.198)
17.78
(0.700)
ø
C
L
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
0 1 2 3 4 5
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Space savings twisted fin heat sink
for vertical mounting T0-220 devices.
Features staked on solderable mounting
tabs for easy attachment to the PC board.
5925 Space saving twisted fin heat sink
Material: 1.27 (0.050) Thick Aluminum
Finish: See Table
Material: 1.27 (0.050) Thick Aluminum
Finish: See Table
ORDERING INFORMATION
Part Number Finish
592502B03400 Black anodize 2.39 (0.094)
592502U03400 Unfinished 2.39 (0.094)
Dia of PCB
Plated Thru
Hole for Tabs
Part Number Finish
542502B00000 Black anodize 2.39 (0.094)
542502D00000 Tin plated 2.39 (0.094)
Dia of PCB
Plated Thru
Hole for Tabs
For additional options see page 82
For additional options see page 82
Grease
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&
page112
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Kits
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page 99
50
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AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
TO-220 Heat Sinks
10.92
(0.430)
14.22
(0.560)
2.41
(0.095)
7.92
(0.312)
3.18
(0.125)
1.52
(0.060)
12.32
(0.485)
6.15
(0.242)
3.18
(0.125)
9.91
(0.390)
15.88
(0.625)
11.10
(0.437)
18.29
(0.720)
34.93
(1.375)
3.18
(0.125)
12.70
(0.500)
2.36
(0.093)
25.40
(1.000)
3.96
(0.156)
"A" HIGH DITTIN
0.63
(0.025)
x
ø
SLOT TYP 2
1.78
(0.070)
10.19
(0.401)
x
ø
ø
2.34
(0.092)
2x
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
0 5 10 15 20 25
4
3
1
2
0
0400
200 600 800 1000
534002
533902
533802
Mounting Surface Temp
Rise Above Ambient—°C
Extruded heat sink with radial fins
and channel clip attach feature
make device attachment easy.
Includes clip and two solderable
mounting pins which permit vertical
mounting and eliminate stress on
device leads. Available in three
heights for TO-220 devices.
5338, 5339, 5340 Extruded heat sink with radial fins
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number “A”Dim
533802B02554 25.40 (1.000) 2.67 (0.105)
533902B02554 38.10 (1.500) 2.67 (0.105)
534002B02554 50.80 (2.000) 2.67 (0.105)
Dia of PCB
Plated Thru
Hole for Pins
CLIP 54
19.05
(0.750)
25.40
(1.000)
2.54
(0.100)
11.68
(0.460)
41.91
(1.650)
2.36
(0.093)
THRU
3.66
(0.144)
20.96
(0.825)
3.96
(0.156)
"A"
25.40
(1.000)
12.70
(0.500)
ø
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
048121620
4
3
1
2
0
0400
200 600 800 1000
532702
532802
532602
Mounting Surface Temp
Rise Above Ambient—°C
High power extruded heat sink
with large radial fins and
increased fin count for additional
cooling capacity. Solderable pins
allow vertical mounting without
stress on the device leads. Available
in three heights for TO-220 devices.
5326, 5327, 5328 High power extruded heat sink with large radial fins
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number “A”Dim
532602B02500 38.10 (1.500) 2.67 (0.105)
532702B02500 50.80 (2.000) 2.67 (0.105)
532802B02500 63.50 (2.500) 2.67 (0.105)
Dia of PCB
Plated Thru
Hole for Pins
For additional options see page 83
2.00
(0.079)
2.15
(0.085)
15.00
(0.591)
20.00
(0.787)
3.15
(0.124)
THRU
6.00
(0.236)
10.30
(0.406)
25.00
(0.984)
19.50
(0.768)
7.49
(0.295)
ø
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
02 4 6 810
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Extruded channel style heat sink
features serrated fins for increased
cooling capacity. The base of the heat
sink is notched to clear the device
leads when mounted horizontally on
the printed circuit card. Narrow chan-
nel accommodates a TO-220 device.
ML26AA Extruded channel style heat sink featuring serrated fins
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number Description
ML26AA Extruded channel style heat sink
For additional options see page 83
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www.aavidthermalloy.com
ORDERING INFORMATION
5912 Plug in style heat sink featuring four spring action clips
Plug in style heat sink features
four spring action clips to firmly
hold the device to the heat sink
ensuring maximum metal to
metal thermal contact. Available
with solderable mounting tabs
for both horizontal and vertical
mounting to the PC board.
15.24
(0.600)
12.70
(0.500)
12.70
(0.500)
4.10
(0.160)
14.48
(0.570)
MAX
0.81
(0.032)
1.27
(0.050)
3.81
(0.150)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
0 1 2 3 4 5
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
5913 Plug in style heat sink featuring four spring action clips
Plug in style heat sink features four
spring action clips to firmly hold the
device to the heat sink ensuring maxi-
mum metal to metal thermal contact.
Includes 2 integrated standoffs to steady
the heat sink during wave soldering.
Available with solderable mounting tabs
for both horizontal and vertical mounting
to the PC board.
19.05
(0.750)
3.15
(0.124)
12.70
(0.500)
14.48
(0.570)
12.70
(0.500)
1.02
(0.040)
2.67
(0.105)
MAX
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
0 1 2 3 4 5
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
ORDERING INFORMATION
(0.570)
14.48
(0.040)
1.02
(0.500)
12.70
(0.245)
6.22
(0.050)
1.27
(0.032)
0.81
(0.750)
19.05
MAX
(0.124)
3.15
12.70
(0.500)
Material: 0.81 (0.032) Thick Aluminum
Finish: Black Anodize
Material: 0.81 (0.032) Thick Aluminum
Finish: Black Anodize
TO-220 & TO-262 Heat Sinks
Part Number Description Figure
591202B00000 Plug in style heat sink A
591202B03100 With horizontal mounting tab A 1.73 (0.068)
591202B04000 With vertical mounting tab B 1.75 (0.069)
Dia of PCB
Plated Thru
Hole for Tabs
1.27
(0.050)
15.24
(0.600)
6.22
(0.245)
0.81
(0.032)
12.70
(0.500)
14.48
(0.570)
12.70
(0.500)
MAX
Part Number Description Figure
591302B00000 Plug in style heat sink with integrated standoffs A
591302B02800 With Shur-LockTM tab for vertical mounting A 1.73 (0.068)
591302B04000 With tab for vertical mounting B 1.75 (0.069)
Dia of PCB
Plated Thru
Hole for Tabs
FIGURE A FIGURE B
FIGURE A FIGURE B
For additional options see page 84
For additional options see page 84
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www.aavidthermalloy.com
PF432, PF433, PF434, PF435, PF436 Plug in style heat sink features pre blackened finish
Plug in style heat sink features
Pre-blackened finish and two
spring action clips to firmly hold
the device to the heat sink
ensuring maximum metal to
metal thermal contact. Available
with solderable mounting tabs
for both horizontal and vertical
mounting to the PC board.
4.00
(0.157)
1.30
(0.051)
19.50
(0.768)
16.80
(0.661)
5.00
(0.197)
12.70
(0.500)
7.50
(0.295)
13.00
(0.512)
3.00
(0.118)
ø
0.40
(0.016)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From
Case to Ambient—°C/Watt
10
0
20
40
60
80
100
0 1 2 3 4 5
8
6
2
4
0
0400
200 600 800 1000
Case Temp Rise
Above Ambient—°C
Part Number Description Figure Dim “A”
PF432 Plug in style heat sink with solderable tab, vertical mount A 6.20 (0.244) 1.60 (0.063)
PF433 With vertical mount no tab A
PF434 With solderable tab, horizontal mount B 1.60 (0.063)
PF435 With solderable tab, vertical mount A 9.50 (0.374) 1.60 (0.063)
PF436 With solderable tab offset from center, horizontal mount C 1.60 (0.063)
ORDERING INFORMATION
19.50
(0.768)
4.00
(0.157)
2.85
(0.112)
12.70
(0.500)
7.50
(0.295)
13.00
(0.512)
3.00
(0.118)
ø
0.27
(0.010)
Material: 0.71 (0.028) Thick Aluminum
Finish: Pre-Black Anodize*
Dia of PCB
Plated Thru
Hole for Tabs
FIGURE A FIGURE B
ORDERING INFORMATION
5768 Plug in style heat sink featuring four spring action clips
Plug in style heat sink features
four spring action clips to firmly
hold the device to the heat sink
ensuring maximum metal to
metal thermal contact. Available
with solderable mounting tabs
for both horizontal and vertical
mounting to the PC board.
19.05
(0.750)
6.22
(0.245)
0.81
(0.032)
14.48
(0.570)
12.70
(0.500)
0.813
(0.032)
4.19
(0.165)
MAX
MAX
12.70
(0.500)
19.05
(0.750)
14.48
(0.570)
12.70
(0.500)
1.27
(0.050) 12.70
(0.500)
4.06
(0.160)
1.27
(0.050)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
0 1 2 3 4 5
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Material: 0.81 (0.032) Thick Aluminum
Finish: See Table
Part Number Description Figure Finish
576802B00000 Slim plug in heat sink A Black anodize
576802C00000 Slim plug in heat sink A Gold chromate
576802U00000 Slim plug in heat sink A Unfinished
576802B03100 With single tab for horizontal mounting A Black anodize 1.73 (0.068)
576802C03100 With single tab for horizontal mounting A Gold chromate 1.73 (0.068)
576802U03100 With single tab for horizontal mounting A Unfinished 1.73 (0.068)
576802B04000 With single tab for vertical mounting B Black anodize 1.75 (0.069)
576802C04000 With single tab for vertical mounting B Gold chromate 1.75 (0.069)
576802U04000 With single tab for vertical mounting B Unfinished 1.75 (0.069)
Dia of PCB
Plated Thru
Hole for Tabs
FIGURE A FIGURE B
For additional options see page 84
*Edges cut during the manufacturing process will be unfinished.
See page 110 for more information
19.50
(0.768)
12.00
(0.472)
3.00
(0.118)
1.30
(0.051)
5.70
(0.224)
"A"
13.00
(0.512)
12.70
(0.500)
0.40
(0.016)
ø
FIGURE C
TO-220 & TO-262 Heat Sinks
53
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United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
TO-220 & TO-262 Heat Sinks
5669 Plug in style heat sink with folded back fins
Plug in style heat sink with folded
back fins for extra cooling capacity.
Features four spring action clips to
firmly hold the device to the heat
sink ensuring maximum metal to
metal thermal contact. Available
with or without solderable mounting
tabs for both horizontal and vertical
mounting to the PC board.
12.70
(0.500)
12.70
(0.500)
0.81
(0.032)
21.59
(0.850)
25.40
(1.000)
1.27
(0.050)
6.20
(0.245)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
0 1 2 3 4 5
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Part Number Description Figure
566902B00000 Plug in style heat sink with folded back fins A
566902B03100 With horizontal mounting tab A 1.73 (0.068)
566902B04000 With vertical mounting tab B 1.75 (0.069)
ORDERING INFORMATION
12.70
(0.500)
12.70
(0.500)
1.27
(0.050)
14.86
(0.585)
4.06
(0.160)
0.81
(0.032)
21.59
(0.850)
25.40
(1.000)
C
L
Material: 0.81 (0.032) Thick Aluminum
Finish: Black Anodize
Dia of PCB
Plated Thru
Hole for Tabs
FIGURE A FIGURE B
TV96, TV97 Hat section heat sink with twisted fins
Hat section heat sink with
twisted fins is low profile and
perfect for use on circuit cards
with 0.500 spacing.The twisted
fins increase air turbulence for
better thermal performance.
17.80
(0.701)
10.20
(0.402)
17.80
(0.701)
"A"
3.66
(0.144)
13.50
(0.531)
ø
C
L
Air Velocity – Feet Per Minute
Heat Dissipated – Watts
Thermal Resistance From MTG
Surface to Ambient – °C/Watt
25
0
20
40
60
80
100
012 3 4 5
20
15
5
10
0
0400
200 600 800 1000
TV97
TV96
Mounting Surface Temp
Rise Above Ambient – °C
Material: 0.99 (0.039) Thick Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number “A”Dim
TV96 31.70 (1.248)
TV97 44.40 (1.748)
TO-220 & TO-218 & TO-247 Heat Sinks
For additional options see page 82
Grease
Epoxy
&
page112
Mounting
Kits
page 99
54
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AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
TO-220 & TO-218 & TO-247 Heat Sinks
ORDERING INFORMATION
5301 High rise style heat sink features twisted fins and Wave-OnTM solderable mounts
High rise style heat sink features
twisted fins and Wave-OnTM solder-
able mounts for easy attachment
to the PC card. Models include thru
holes on one side to attach devices
using standard hardware and dittins
with special slots on the other for
easy device attachment using con-
venient spring clip. Dual models use
two dittins and clips to locate and
attach devices.
Part Number Description Device Figure “A”Dim
530101B00100 Heat sink twisted fin TO-218, TO-247 21.08 (0.830) 4.75 (0.187)
530101B00150 With device clip #50 TO-218, TO-247 A 21.08 (0.830) 4.75 (0.187)
530102B00100 Heat sink twisted fin TO-220 18.29 (0.720) 4.75 (0.187)
530102B00150 With device clip #50 TO-220 A 18.29 (0.720) 4.75 (0.187)
530161B00162 With two device clips #62 Dual TO-218, TO-247 B 21.08 (0.830) 4.75 (0.187)
530162B00162 With two device clips #62 Dual TO-220 B 18.29 (0.720) 4.75 (0.187)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
0 4 8 12 16 20
4
3
1
2
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
530161 or 530162
530101 or 530102
5308 High rise style heat sink features twisted fins and solderable tabs
High rise style heat sink fea-
tures twisted fins and solder-
able tabs for easy attachment
to the PC card. Models include
thru holes on one side to
attach devices using standard
hardware and dittins with spe-
cial slots on the other for easy
device attachment using con-
venient spring clip. Dual mod-
els use two dittins and clips to
locate and attach devices.
RECOMMENDED
HOLE PATTERN
43.13
(1.698)
2.95
(0.116)
THRU 2x
44.45
(1.750)
2.54
(0.100)
3.20
(0.126)
"A"
3.00
(0.118)
22.90
(0.900)
14.99
(0.590)
3.48
(0.137)
14.99
(0.590)
7.62
(0.300)
ø
10.16
(0.400)
45.72
(1.800)
46.74
(1.841)
ø
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
0 4 8 12 16 20
4
3
1
2
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
530861 or 530862
530801 or 530802
Material: 1.60 (0.063) Thick Aluminum
Finish: Black Anodize
Material: 1.60 (0.063) Thick Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number Description Device Figure “A”Dim
530801B05100 Heat sink twisted fin and solderable tabs TO-218, TO-247 21.08 (0.830) 2.95 (0.116)
530801B05150 With device clip #50 TO-218,TO-247 A 21.08 (0.830) 2.95 (0.116)
530802B05100 Heat sink twisted fin and solderable tabs TO-220 18.29 (0.720) 2.95 (0.116)
530802B05150 With device clip #50 TO-220 A 18.29 (0.720) 2.95 (0.116)
530861B05162 With two device clips #62 Dual TO-218,TO-247 B 21.08 (0.830) 2.95 (0.116)
530862B05162 With two device clips #62 Dual TO-220 B 18.29 (0.720) 2.95 (0.116)
Dia of PCB
Plated Thru
Hole for Tabs
Dia of PCB
Plated Thru
Hole for Tabs
TYP
4.06
(0.160) 12.70
(0.500)
6.60
(0.260)
30.61
(1.205)
2.79
(0.110)
0.76
(0.030)
x
HIGH
ø
DITTIN
12.45
(0.490)
2.54
(0.100)
1.57
(0.062)
2.79
(0.110)
0.76
(0.030)
x
HIGH
Ø
DITTIN
12.45
(0.490)
2.54
(0.100)
1.57
(0.062)
2X
TYP
4.06
(0.160) 12.70
(0.500)
6.60
(0.260)
30.61
(1.205)
2.79
(0.110)
0.76
(0.030)
x
HIGH
ø
DITTIN
12.45
(0.490)
TYP
4.06
(0.160) 12.70
(0.500)
6.60
(0.260)
30.61
(1.205)
2.79
(0.110)
0.76
(0.030)
X
HIGH
ø
DITTIN
12.45
(0.490)
2X
TYP
4.06
(0.160) 12.70
(0.500)
6.60
(0.260)
30.61
(1.205)
FIGURE A FIGURE B
FIGURE A FIGURE B
CLIP 50
CLIP 50 CLIP 62
CLIP 62
BASE PART
44.45
(1.750)
2.54
(0.100)
3.20
(0.126)
THRU
"A"
3.00
(0.118)
4.24
(0.167) 14.99
(0.590)
3.48
(0.137)
14.99
(0.590)
7.50
(0.295)
ø
7.62
(0.300)
24.13
(0.950)
44.45
(1.750)
10.16
(0.400)
BASE PART
For additional options see page 82
For additional options see page 82
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
55
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Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
TO-220 & TO-218 & TO-247 Heat Sinks
5330, 5331, 5332, 5333 Extruded heat sink with radial fins
Extruded heat sink with radial
fins and clip attach feature makes
device attachment easy. Includes
two solderable mounting pins
which permit vertical mounting
and eliminate stress on device
leads. Available in four heights for
TO-220,TO-218 and TO-247 devices.
39.10
(1.540)
6.60
(0.260)
13.50
(0.530)
25.40
(1.000)
2x
2.36
(0.093)
2x3.96
(0.156)
3.18
(0.125)
0.64
(0.025)
"A"
"B"
NOTCH
FOR CLIP 2x
34.92
(1.375)
12.70
(0.500)
DITTIN
HIGH
øX
"C"
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
02 4 6 810
8
6
2
4
0
0400
200 600 800 1000
53310X
53300X
Mounting Surface Temp
Rise Above Ambient—°C
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number Device “A”Dim “B”Dim “C”Dim
533001B02551 TO-218, TO-247 25.40 (1.000) 21.59 (0.850) 17.02 (0.670) 2.67 (0.105)
533002B02551 TO-220 25.40 (1.000) 18.29 (0.720) 15.88 (0.625) 2.67 (0.105)
533101B02551 TO-218, TO-247 38.10 (1.500) 21.59 (0.850) 17.02 (0.670) 2.67 (0.105)
533102B02551 TO-220 38.10 (1.500) 18.29 (0.720) 15.88 (0.625) 2.67 (0.105)
533201B02551 TO-218, TO-247 50.80 (2.000) 21.59 (0.850) 17.02 (0.670) 2.67 (0.105)
533202B02551 TO-220 50.80 (2.000) 18.29 (0.720) 15.88 (0.625) 2.67 (0.105)
533301B02551 TO-218, TO-247 63.50 (2.500) 21.59 (0.850) 17.02 (0.670) 2.67 (0.105)
533302B02551 TO-220 63.50 (2.500) 18.29 (0.720) 15.88 (0.625) 2.67 (0.105)
Dia of PCB
Plated Thru
Hole for Pins
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
02 4 6 810
8
6
2
4
0
0400
200 600 800 1000
53330X
53320X
Mounting Surface Temp
Rise Above Ambient—°C
For additional options see page 83
CLIP 51
5304 High rise style heat sink features staggered fins and Wave-OnTM solderable mounts
High rise style heat sink features
staggered fins and Wave-OnTM sol-
derable mounts for easy attachment
to the PC card. Models include thru
holes on one side to attach devices
using standard hardware and dittins
with special slots on the other for
easy device attachment using a
convenient spring clip.
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
0 4 8 12 16 20
4
3
1
2
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Part Number Description Device “A”Dim
530401B00100 High rise style heat sink staggered fins TO-218,TO-247 21.08 (0.830) 4.75 (0.187)
530401B00150 With device clip 50 TO-218,TO-247 21.08 (0.830) 4.75 (0.187)
530402B00100 High rise style heat sink staggered fins TO-220 18.29 (0.720) 4.75 (0.187)
530402B00150 With device clip 50 TO-220 18.29 (0.720) 4.75 (0.187)
ORDERING INFORMATION
24.13
(0.950)
44.45
(1.750)
ø
3.20
(0.126)
THRU
7.49
(0.295)
"A"
2.54
(0.100)
12.45
(0.490)
19.05
(0.750)
2.79
(0.110)
0.76
(0.030)
44.45
(1.750)
x
HIGH
ø
7.62
(0.300)
10.16
(0.400)
3.00
(0.118)
4.24
(0.167)
14.99
(0.590)
3.48
(0.137)
14.99
(0.590)
1.57
(0.060)
2.54
(0.100)
DITTIN
TYP
4.06
(0.160) 12.70
(0.500)
6.60
(0.260)
30.61
(1.205)
Material: 1.60 (0.063) Thick Aluminum
Finish: Black Anodize
Dia of PCB
Plated Thru
Hole for Tabs
CLIP 50
For additional options see page 82
Grease
Epoxy
&
page112
Grease
Epoxy
&
page112
Mounting
Kits
page 99
56
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5297, 5298, 5299, 5300 Extruded heat sink with large radial fins
Extruded heat sink with large radial
fins features equal channel widths on
both sides for single or dual device
mounting. Includes two solderable
mounting pins which permit vertical
mounting and eliminate stress on
device leads. Available in four heights
for TO-220, TO-218, and TO-247 devices.
3.18
(0.125)
14.22
(0.560)
13.72
(0.540)
25.40
(1.000)
"C"
"A"
"B"
20.96
(0.825)
41.91
(1.650)
17.02
(0.670)
1.57
(0.062)
3.96
(0.156)
25.40
(1.000)
2.36
(0.093)
2x
2x
ø
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
0 4 8 12 16 20
4
3
1
2
0
0400
200 600 800 1000
52980X
52970X
Mounting Surface Temp
Rise Above Ambient—°C
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number Device “A”Dim “B”Dim “C”Dim
529701B02500 TO-218,TO-247 25.40 (1.000) 21.59 (0.850) 3.66 (0.144) 2.67 (0.105)
529702B02500 TO-220 25.40 (1.000) 18.29 (0.720) 3.17 (0.125) 2.67 (0.105)
529801B02500 TO-218,TO-247 38.10 (1.500) 21.59 (0.850) 3.66 (0.144) 2.67 (0.105)
529802B02500 TO-220 38.10 (1.500) 18.29 (0.720) 3.17 (0.125) 2.67 (0.105)
529901B02500 TO-218,TO-247 50.80 (2.000) 21.59 (0.850) 3.66 (0.144) 2.67 (0.105)
529902B02500 TO-220 50.80 (2.000) 18.29 (0.720) 3.17 (0.125) 2.67 (0.105)
530001B02500 TO-218,TO-247 63.50 (2.500) 21.59 (0.850) 3.66 (0.144) 2.67 (0.105)
530002B02500 TO-220 63.50 (2.500) 18.29 (0.720) 3.17 (0.125) 2.67 (0.105)
Dia of PCB
Plated Thru
Hole for Pins
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
0 4 8 12 16 20
4
3
1
2
0
0400
200 600 800 1000
53000X
52990X
Mounting Surface Temp
Rise Above Ambient—°C
For additional options see page 83
TO-220 & TO-218 & TO-247 Heat Sinks
SW25, SW38, SW50, SW63 Extruded heat sink with unequal channel widths
Extruded heat sink with unequal
channel widths front and back
can accommodate a TO-220, TO-218,
or TO-247 devices. Includes two solder-
able mounting pins which permit ver-
tical mounting and eliminate stress on
device leads. Available in three heights.
Version without hole uses clip 5901
(sold separately) to attach device.
See page 97 for clip information.
25.00
(0.984) 19.90
(0.783) 15.00
(0.591)
4.00
(0.157)
2.50
(0.098)
25.40
(1.000)
3.20
(0.126)
"A"
SEE NOTE 1
TYP
ø
34.50
(1.358)
12.50
(0.492)
6.25
(0.246)
2.00
(0.079)
Air Velocity – Feet Per Minute
Heat Dissipated – Watts
Thermal Resistance From MTG
Surface to Ambient – °C/Watt
10
0
20
40
60
80
100
024 6 810
8
6
2
4
0
0400
200 600 800 1000
SW38
SW25
Mounting Surface Temp
Rise Above Ambient – °C
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number Description “A”Dim Holes
SW25-2 Extruded heat sink with unequal channel widths front and back 25.00 (0.984) No 3.00 (0.118)
SW25-4 With device mounting holes 25.00 (0.984) Yes 3.00 (0.118)
SW38-2 Extruded heat sink with unequal channel widths front and back 38.00 (1.496) No 3.00 (0.118)
SW38-4 With device mounting holes 38.00 (1.496) Yes 3.00 (0.118)
SW50-2 Extruded heat sink with unequal channel widths front and back 50.00 (1.968) No 3.00 (0.118)
SW50-4 With device mounting holes 50.00 (1.968) Yes 3.00 (0.118)
SW63-2 Extruded heat sink with unequal channel widths front and back 63.00 (2.480) No 3.00 (0.118)
SW63-4 With device mounting holes 63.00 (2.480) Yes 3.00 (0.118)
Dia of PCB
Plated Thru
Hole for Pins
Air Velocity – Feet Per Minute
Heat Dissipated – Watts
Thermal Resistance From MTG
Surface to Ambient – °C/Watt
10
0
20
40
60
80
100
024 6 810
8
6
2
4
0
0400
200 600 800 1000
SW63
SW50
Mounting Surface Temp
Rise Above Ambient – °C
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
NOTE 1:This hole not present in SW25 model
57
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Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
TO-220 & TO-218 & TO-247 Heat Sinks
7.62
(0.300)
16.51
(0.650)
25.65
(1.01)
REF
6.60
(0.260)
2.39
(0.093)
3.96
(0.156)
17.02
(0.670)
41.91
(1.650)
25.40
(1.000)
25.40
(1.000)
"B"
"A"
3.18 (0.125)
X 0.64 (0.025)
HIGH DITTIN
2x
2x
ø
ø
AA
3.17
(0.125)
VIEW A-A
SINGLE HEAT SINK DEVICE
17.02
(0.670)
41.91
(1.650)
25.40
(1.000)
VIEW A-A
DUAL HEAT SINK DEVICE
12.70
(0.500)
13.72
(0.540)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
0 4 8 12 16 20
4
3
1
2
0
0400
200 600 800 1000
5334XX
5335XX
Mounting Surface Temp
Rise Above Ambient—°C
Extruded heat sink with large
radial fins and channel clip
attach feature makes device
attachment easy. Includes clip
and two solderable mounting
pins which permit vertical
mounting and eliminate stress
on device leads. Available in four
heights for TO-220, TO-218, and
TO-247 devices.
5334, 5335, 5336, 5337 Extruded heat sink with large radial fins
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number Device Description “A”Dim “B”Dim
533401B02552 TO-218, TO-247 Extruded heat sink with radial fins and device clip #52 38.10 (1.500) 21.59 (0.850) 2.67 (0.105)
533402B02552 TO-220 Extruded heat sink with radial fins and device clip #52 38.10 (1.500) 18.29 (0.720) 2.67 (0.105)
533421B02552 Dual TO-218, TO-247 With 2 device clips #52 38.10 (1.500) 21.59 (0.850) 2.67 (0.105)
533422B02552 Dual TO-220 With 2 device clips #52 38.10 (1.500) 18.29 (0.720) 2.67 (0.105)
533501B02552 TO-218, TO-247 Extruded heat sink with radial fins and device clip #52 50.80 (2.000) 21.59 (0.850) 2.67 (0.105)
533502B02552 TO-220 Extruded heat sink with radial fins and device clip #52 50.80 (2.000) 18.29 (0.720) 2.67 (0.105)
533521B02552 Dual TO-218, TO-247 With 2 device clips #52 50.80 (2.000) 21.59 (0.850) 2.67 (0.105)
533522B02552 Dual TO-220 With 2 device clips #52 50.80 (2.000) 18.29 (0.720) 2.67 (0.105)
533601B02552 TO-218, TO-247 Extruded heat sink with radial fins and device clip #52 63.50 (2.500) 21.59 (0.850) 2.67 (0.105)
533602B02552 TO-220 Extruded heat sink with radial fins and device clip #52 63.50 (2.500) 18.29 (0.720) 2.67 (0.105)
533621B02552 Dual TO-218, TO-247 With 2 device clips #52 63.50 (2.500) 21.59 (0.850) 2.67 (0.105)
533622B02552 Dual TO-220 With 2 device clips #52 63.50 (2.500) 18.29 (0.720) 2.67 (0.105)
533701B02552 TO-218, TO-247 Extruded heat sink with radial fins and device clip #52 25.40 (1.000) 21.59 (0.850) 2.67 (0.105)
533702B02552 TO-220 Extruded heat sink with radial fins and device clip #52 25.40 (1.000) 18.29 (0.720) 2.67 (0.105)
533721B02552 Dual TO-218, TO-247 With 2 device clips #52 25.40 (1.000) 21.59 (0.850) 2.67 (0.105)
533722B02552 Dual TO-220 With 2 device clips #52 25.40 (1.000)) 18.29 (0.720) 2.67 (0.105)
Dia of PCB
Plated Thru
Hole for Pins
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
0 4 8 12 16 20
4
3
1
2
0
0400
200 600 800 1000
5336XX
5337XX
Mounting Surface Temp
Rise Above Ambient—°C
For additional options see page 83
CLIP 52
Grease
Epoxy
&
page112
SEE NOTE 1
SEE NOTE 1
NOTE 1: Graph depicts single device models. Dual device models
exhibit a 15% performance increase.
58
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
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ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
TO-220 & TO-218 & TO-247 Heat Sinks
5130, 5131, 5132, 5133 Extruded heat sink with radial fins
Extruded heat sink with radial
fins feature equal channel
widths on both sides for single
or dual device mounting.
Includes two solderable mount-
ing pins which permit vertical
mounting and eliminate stress
on device leads. Available in four
heights for TO-220,TO-218, and
TO-247 devices.
(0.500)
12.70
(0.125)
3.18
(1.375)
34.92
(0.062)
1.57
(1.000)
25.40
2x
(0.156)
3.96
2x
(0.093)
2.37
"A"
"B"
"C"
ø
17.48
(0.688)
"D"
"E"
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
02 4 6 810
8
6
2
4
0
0400
200 600 800 1000
51310X
51300X
Mounting Surface Temp
Rise Above Ambient—°C
Material: Aluminum
Finish: Black Anodize
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
02 4 6 810
4
3
1
2
0
0400
200 600 800 1000
51330X
51320X
Mounting Surface Temp
Rise Above Ambient—°C
ORDERING INFORMATION
Part Number Device “A”Dim “B”Dim “C”Dim “D”Dim “E”Dim
513001B02500 TO-218,TO-247 25.40 (1.000) 21.59 (0.850) 3.66 (0.144) 17.02 (0.670) 13.72 (0.540) 2.67 (0.105)
513002B02500 TO-220 25.40 (1.000) 18.29 (0.720) 3.17 (0.125) 15.88 (0.625) 11.10 (0.437) 2.67 (0.105)
513101B02500 TO-218,TO-247 38.10 (1.500) 21.59 (0.850) 3.66 (0.144) 17.02 (0.670) 13.72 (0.540) 2.67 (0.105)
513102B02500 TO-220 38.10 (1.500) 18.29 (0.720) 3.17 (0.125) 15.88 (0.625) 11.10 (0.437) 2.67 (0.105)
513201B02500 TO-218,TO-247 50.80 (2.000) 21.59 (0.850) 3.66 (0.144) 17.02 (0.670) 13.72 (0.540) 2.67 (0.105)
513202B02500 TO-220 50.80 (2.000) 18.29 (0.720) 3.17 (0.125) 15.88 (0.625) 11.10 (0.437) 2.67 (0.105)
513301B02500 TO-218,TO-247 63.50 (2.500) 21.59 (0.850) 3.66 (0.144) 17.02 (0.670) 13.72 (0.540) 2.67 (0.105)
513302B02500 TO-220 63.50 (2.500) 18.29 (0.720) 3.17 (0.125) 15.88 (0.625) 11.10 (0.437) 2.67 (0.105)
Dia of PCB
Plated Thru
Hole for Pins
BW38, BW50, BW63 Wide extruded heat sink with unequal channel
Wide extruded heat sink with
unequal channel widths on front
and back can accommodate a T0-220,
TO-218, or TO-247 device. Includes two
solderable mounting pins which permit
vertical mounting and eliminate stress
on device leads. Available in three
heights.Versions without hole use clip
6801 (sold separately) to attach device.
See page 97 for clip information.
25.40
(1.000)
4.00
(0.157)
2.60
(0.101)
25.40
(1.000)
21.60
(0.850)
2.00
(0.079)
3.6
(0.144) "A"
ø
34.90
(1.375)
12.70
(0.500)
Air Velocity – Feet Per Minute
Heat Dissipated – Watts
Thermal Resistance From MTG
Surface to Ambient – °C/Watt
10
0
20
40
60
80
100
048121620
8
6
2
4
0
0400
200 600 800 1000
BW50-2
BW63-2
BW38-2
Mounting Surface Temp
Rise Above Ambient – °C
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number Description “A”Dim Holes
BW38-2 Extruded heat sink with unequal channel widths front and back 38.00 (1.496) No 3.00 (0.118)
BW38-4 With device mounting holes 38.00 (1.496) Yes 3.00 (0.118)
BW50-2 Extruded heat sink with unequal channel widths front and back 50.00 (1.968) No 3.00 (0.118)
BW50-4 With device mounting holes 50.00 (1.968) Yes 3.00 (0.118)
BW63-2 Extruded heat sink with unequal channel widths front and back 63.00 (2.480) No 3.00 (0.118)
BW63-4 With device mounting holes 63.00 (2.480) Yes 3.00 (0.118)
Dia of PCB
Plated Thru
Hole for Pins
For additional options see page 83
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
59
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
TO-220 & TO-202 Heat Sinks
SW25-6, SW38-6 Extruded heat sink with unequal channel widths
Extruded heat sink with unequal
channel widths front and back
can accommodate a TO-220 or TO-202
device. Includes two solderable mount-
ing pins which permit vertical mounting
and eliminate stress on device leads.
Clip 5901 (sold separately) can be
used to attach device. See page 97
for clip information.
25.00
(0.984) 19.90
(0.783) 15.00
(0.591)
4.00
(0.157)
2.50
(0.098)
25.40
(1.000)
3.20
(0.126)
"A"
SEE NOTE 1
TYP
ø
34.50
(1.358)
12.50
(0.492)
6.25
(0.246)
2.00
(0.079)
NOTCH
11 DEEP
10.4 WIDE
Air Velocity – Feet Per Minute
Heat Dissipated – Watts
Thermal Resistance From MTG
Surface to Ambient – °C/Watt
10
0
20
40
60
80
100
024 6 810
8
6
2
4
0
0400
200 600 800 1000
SW38
SW25
Mounting Surface Temp
Rise Above Ambient – °C
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number Description “A”Dim
SW25-6 Extruded heat sink with unequal channel widths front and back 25.00 (0.984) 3.00 (0.118)
SW38-6 Extruded heat sink with unequal channel widths front and back. 38.00 (1.496) 3.00 (0.118)
(0.500)
12.70
(0.437)
11.10
(0.370)
9.40
(1.375)
34.92
(0.062)
1.57
(1.000)
25.40
2x
(0.156)
3.96
2x
(0.093)
2.37
"A"
ø
17.48
(0.688)
13.46
(0.530)
18.29
(0.720)
3x
(0.125)
3.18
ø
25.40
(1.000)
(0.625)
15.88
X
SEE NOTE 1
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
02 4 6 810
8
6
2
4
0
0400
200 600 800 1000
531102
531002
Mounting Surface Temp
Rise Above Ambient—°C
Extruded heat sink with radial fins
and notched base features equal
channel widths on both sides and
mounting holes to accomodate
TO-220 and TO-202 devices. Includes
two solderable mounting pins which
permit vertical mounting and elimi-
nate stress on device leads. Available
in four heights.
5310, 5311, 5312, 5313 Extruded heat sink with radial fins & notched base
Material: Aluminum
Finish: See Table
ORDERING INFORMATION
Part Number “A”Dim Finish
531002B02500 25.40 (1.000) Black anodize 2.67 (0.105)
531002C02500 25.40 (1.000) Gold chromate 2.67 (0.105)
531102B02500 38.10 (1.500) Black anodize 2.67 (0.105)
531102C02500 38.10 (1.500) Gold chromate 2.67 (0.105)
531202C02500 50.80 (2.000) Gold chromate 2.67 (0.105)
531202B02500 50.80 (2.000) Black anodize 2.67 (0.105)
531302B02500 63.50 (2.500) Black anodize 2.67 (0.105)
531302C02500 63.50 (2.500) Gold chromate 2.67 (0.105)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
02 4 6 810
8
6
2
4
0
0400
200 600 800 1000
531302
531202
Mounting Surface Temp
Rise Above Ambient—°C
Dia of PCB
Plated Thru
Hole for Pins
Dia of PCB
Plated Thru
Hole for Pins
For additional options see page 83
NOTE 1:This hole not present in 5310 series
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
NOTE 1:This hole not present in SW25 series
60
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
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ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
6396, 6398, 6399, 6400 High power extruded heat sink with large radial fins
High power extruded heat sink
with large radial fins and solderable
shoulder pins allows vertical mount-
ing without stress on the device leads.
Available with shoulder pins to pro-
vide fixed clearance between the bot-
tom of the heat sink and the board.
Available in four heights for TO-220,
TO-218,TO-247and multiwatt devices.
1.57
(0.062)
25.40
(1.000)
41.91
(1.650)
19.05
(0.750)
2.41
(0.095)
1.27
(0.050)
2.46
(0.097)
5.49
(0.216)
"A"
3.81
(0.150)
REF
REF
25.40
(1.000)
0.78
(0.031)
ø
SEE DETAIL A
P2 MODEL ONLY
DETAIL A
P2 MODEL ONLY
3.96
(0.156) 2.21
(0.087)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
048 121620
4
3
1
2
0
0400
200 600 800 1000
6398
6396
Mounting Surface Temp
Rise Above Ambient—°C
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number Description “A”Dim
6396B Extruded heat sink with large radial fins and straight pins 25.40 (1.000) 2.89 (0.114)
6396B-P2 With solderable shoulder pins 25.40 (1.000) 3.10 (0.122)
6398B Extruded heat sink with large radial fins and straight pins 38.10 (1.500) 2.89 (0.114)
6398B-P2 With solderable shoulder pins 38.10 (1.500) 3.10 (0.122)
6399B Extruded heat sink with large radial fins and straight pins 50.80 (2.000) 2.89 (0.114)
6399B-P2 With solderable shoulder pins 50.80 (2.000) 3.10 (0.122)
6400B Extruded heat sink with large radial fins and straight pins 63.50 (2.500) 2.89 (0.114)
6400B-P2 With solderable shoulder pins 63.50 (2.500) 3.10 (0.122)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
048 121620
4
3
1
2
0
0400
200 600 800 1000
6400
6399
Mounting Surface Temp
Rise Above Ambient—°C
Dia of PCB
Plated Thru
Hole for Pins
6380, 6381, 6382 High power extruded heat sink
High power extruded heat sink for
SIP packages. Solderable pins allows
vertical mounting without stress on
the device leads. Available in three
heights. Can also be used for dual
TO-220,TO-218, TO-247 and multi-
watt devices.
18.29
(0.720)
3.96
(0.156)
19.86
(0.782)
9.93
(0.391)
3.81
(0.150)
33.05
(1.301)
31.74
(1.250)
25.40
(1.000)
28.70
(1.130)
41.91
(1.650)
2.64
(0.104)
11.91
(0.469) 1.58
(0.062)
ø
"A"
2.21
(0.087)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
0 4 8 12 16 20
4
3
1
2
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
6381
6382
6380
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number Description “A”Dim
6380B Extruded heat sink with solderable pins 25.40 (1.000) 2.89 (0.114)
6381B Extruded heat sink with solderable pins 38.10 (1.500) 2.89 (0.114)
6382B Extruded heat sink with solderable pins 50.80 (2.000) 2.89 (0.114)
Dia of PCB
Plated Thru
Hole for Pins
TO-220 & TO-218 & TO-247 & Multiwatt Heat Sinks
For additional options see page 85
For additional options see page 85
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
61
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
6374 Extruded heat sink for SIP packages
Extruded heat sink for SIP
packages. Solderable pins
allows vertical mounting
without stress on the device
leads. Can also be used for
dual TO-220,TO-218, TO-247,
and multiwatt devices.
3.96
(0.156) 2.18
(0.086)
31.75
(1.250)
38.10
(1.500) 2.92
(0.115)
17.50
(0.689)
32.00
(1.260)
16.00
(0.630)
8.00
(0.315)
DETAIL A
SEE DETAIL A
24.38
(0.960)
59.99
(2.362)
17.78
(0.700)
3.81
(0.150)
ø
2X
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
02 4 6 810
4
3
1
2
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number Description
6374B Extruded heat sink with solderable pins 2.89 (0.114)
Dia of PCB
Plated Thru
Hole for Pins
YB32-4 High power flat back extruded channel style heat sink
High power flat back extruded channel
style heat sink features a wide channel
to accommodate several devices. Includes
two solderable pins to allow vertical
mounting without stress on the device
leads. Can be used with TO-220, TO-218,
TO-247, and multiwatt devices.
2X 3.00
(0.118)
19.00
(0.748)
4.00
(0.157) 38.30
(1.508)
Ø 3.10
(0.122)
THRU
16.00
(0.630)
32.00
(1.260)
4.70
(0.185)
60.00
(2.362)
2X
32.00
(1.260)
8.00
(0.315)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
0 2 4 6 8 10
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number Description
YB32-4 High power flat back extruded heat sink 3.48 (0.137)
TO-220 & TO-218 & TO-247 & Multiwatt Heat Sinks
5810, 5811, 5812 Flat back extruded heat sink featuring solderable pins
Flat back extruded heat sink features
solderable pins which allow vertical
mounting without stess on the device
leads. Available in three heights for
TO-220 and TO-218 devices.
10.29
(0.405)
TYP 2
2.36
(0.093)
3.96
(0.156)
8.13
(0.320)
16.26
(0.640)
"A"
16.26
(0.640)
3.45
(0.136)
#6 - 32 UNC THRU
"B"
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
012 345
8
6
2
4
0
0400
200 600 800 1000
58110X
58100X
Mounting Surface Temp
Rise Above Ambient—°C
58120X
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number Device “A”Dim “B”Dim
581001B02500 TO-218 25.40 (1.000) 21.59 (0.850) 2.67 (0.105)
581002B02500 TO-220 25.40 (1.000) 18.29 (0.720) 2.67 (0.105)
581101B02500 TO-218 38.10 (1.500) 21.59 (0.850) 2.67 (0.105)
581102B02500 TO-220 38.10 (1.500) 18.29 (0.720) 2.67 (0.105)
581201B02500 TO-218 50.80 (2.000) 21.59 (0.850) 2.67 (0.105)
581202B02500 TO-220 50.80 (2.000) 18.29 (0.720) 2.67 (0.105)
Dia of PCB
Plated Thru
Hole for Pins
For additional options see page 85
For additional options see page 83
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Dia of PCB
Plated Thru
Hole for Pins
62
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
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ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
5922 Plug in style heat sink
Plug in style heat sink requires no
hardware to attach to the device.
The four spring action clips apply
even pressure eliminating gaps
between the heat sink and device
which rob thermal performance.
24.89
(0.980)
50.04
(1.970)
49.53
(1.950)
11.94
(0.470)
12.70
(0.500)
5.08
(0.200)
1.27
(0.050)
1.90
(0.075)
1.02
(0.040)
0.81
(0.032)
26.54
(1.045)
25.40
(1.000)
Part Number Description
592201B03400 High power plug in heat sink with folded back fins 2.39 (0.094)
and solderable mounting tabs
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
2.0
0
20
40
60
80
100
048121620
1.6
1.2
0.4
0.8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
ORDERING INFORMATION
41.66
(1.640)
24.77
(0.975)
3.81
(0.150)
THRU
20.57
(0.810)
43.18
(1.700)
8.89
(0.350)
12.70
(0.500)
5.08
(0.200)
1.27
(0.050)
2.54
(0.100)
C
L
6.22
(0.245)
0.81
(0.032)
1.02
(0.040)
ø
Part Number Description
593101B03600 Channel style heat sink with folded back fins 2.92 (0.115)
and solderable tabs
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
02 46810
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Channel style heat sink with
folded back fins for extra cooling
capacity. The heat sink features sol-
derable tabs for easy attachment
to the PC board.
5931 Channel style heat sink with folded back fins
7130 Copper slide on heat sink
Copper slide on heat sink
requires no hardware to
attach the device. In addition,
the copper heat sink is tin/lead
plated to allow easy soldering
to the PC board.
26.04
(1.025)
9.52
(0.375)
25.53
(1.005)
15.49
(0.610)
16.51
(0.650)
1.27
(0.050)
3.81
(0.150)
2.79
(0.110)
1.27
(0.050)
17.15
(0.675)
TOP CUT AWAY
TO SHOW DETAIL
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
012 3 45
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Part Number Description
7130D Slide on, channel style heat sink with integrated tabs 2.54 (0.100)
ORDERING INFORMATION
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
TO-218 Heat Sinks
Position Code Description Details
A 1 Kon-DuxTM pad Page 86
A 3 In-Sil-8TM pad Page 86
POPULAR OPTIONS:
Base part no. A
593101B 0 0000
For additional options see page 82
For additional options see page 82
ORDERING INFORMATION
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Mounting
Kits
page 99
Dia of PCB
Plated Thru
Hole for Tabs
Dia of PCB
Plated Thru
Hole for Tabs
Dia of PCB
Plated Thru
Hole for Tabs
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TO-202 Heat Sinks
ORDERING INFORMATION
5063 Low profile hat section heat sink
Low profile hat section heat sink
has a total height of 0.375 making
it perfect for mounting to printed
circuit boards with 0.500 centering
between boards.
44.45
(1.750)
13.46
(0.530) 17.78
(0.700
)
ø3.66
(0.144)
THRU 7.78
(0.700) 9.52
(0.375)
10.41
(0.410)
5.59
(0.220)
NOTCH IS
0.410 WIDE
X 0.220 DEEP
Part Number Description
506304B00000 Hat section heat sink
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
01 2 3 4 5
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
ORDERING INFORMATION
14.66
(0.577)
7.75
(0.305)
6.35
(0.250)
20.32
(0.800)
9.40
(0.370)
10.16
(0.400)
2.36
(0.093)
ø
DITTIN
Part Number Finish
574004B00000 Black anodize
574004U00000 Unfinished
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
01 2 3 4 5
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Low cost slide on heat sink
provides postive retention with
an integral locking tab.The spring
tensions ensures excellent thermal
contact for maximum performance.
Requires no hardware to mount.
5740 Low cost slide on heat sink
5742, 5796, 5797 Low cost slide on cooler heat sink
Low cost slide on cooler heat sink
is easy to assemble to the device
and requires no mounting hardware.
Models have fins on both sides, or
the left or right. Available with or
without staked on solderable tab
for easy board mounting.
(0.420)
10.67
(0.420)
10.67
(1.020)
25.91
(0.900)
22.86
(0.380)
9.52
(0.063)
1.60
(0.240)
0.51
(0.990)
25.15
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
01 2 3 4 5
16
12
4
8
0
0400
200 600 800 1000
579604
579704
574204
Mounting Surface Temp
Rise Above Ambient—°C
Part Number Description Figure
574204B00000 Low cost slide on cooler A
574204B03300 With solderable tabs A 1.910 (0.075)
579604B00000 With left side fin only B
579604B03300 With left side fin only and solderable tabs B 1.910 (0.075)
579704B00000 With right side fin only B
579704B03300 With right side fin only and solderable tabs B 1.910 (0.075)
ORDERING INFORMATION
15.88
(0.630)
10.66
(0.420)
REF
18.92
(0.750)
9.52
(0.380)
1.60
(0.063)
22.86
(0.900)
10.67
(0.420)
18.54
(0.730)
2.36
(0.093)
5.97
(0.240)
ø
0.51
(0.020)
Material: 1.02 (0.040) Thick Aluminum
Finish: Black Anodize
Material: 0.63 (0.025) Thick Aluminum
Finish: See Table
Material: 0.63 (0.025) Thick Aluminum
Finish: Black Anodize
Dia of PCB
Plated Thru
Hole for Tabs
Note: Fins on Left or Right. Right hand fin model shown.
FIGURE A FIGURE B
For additional options see page 84
For additional options see page 84
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Kits
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TO-202 Heat Sinks
ORDERING INFORMATION
5769, 5773, 5774 Slim low profile channel style heat sink
Slim low profile channel style
heat sink is notched to accom-
modate the T0-202 center tab
packages. Available in 3 heights.
3.81
(0.150)
THRU
13.34
(0.525)
19.05
(0.750)
"A"
13.21
(0.520)
3.81
(0.150)
REF
REF
ø
Part Number “A”Dim
576904B00000 6.35 (0.250)
577304B00000 9.53 (0.375)
577404B00000 12.70 (0.500)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
01 2 3 4 5
16
12
4
8
0
0400
200 600 800 1000
577304
577404
576904
Mounting Surface Temp
Rise Above Ambient—°C
50.80
(2.000)
25.40
(1.000)
35.05
(1.380)
12.70
(0.500)
17.87
(0.704)
4.75
(0.187)
3.15
(0.124)
9.35
(0.368)
2.46
(0.097)
1.27
(0.050)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
024 6 810
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Space saving heat sink features
staggered fins for increased cool-
ing efficiency.This verticle mount
heat sink features integrated
tin plated tabs to solder directly
to the PC board.
6034 Space saving staggered fin heat sink
6046, 6047 Compact slide on heat sink
Compact slide on heat sink
makes assembly easy. The 6046
features a positive device catch
to lock heat sink to the device.
15.24
(0.600)
7.62
(0.300)
O.D.
6.35
(0.250)
21.59
(0.850)
"A"
"A"
REF
SECTION A–A
10.41
(0.410)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
012 34 5
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Part Number Description Figure
6046PB* With device catch A
6047PB* Compact slide on heat sink B
ORDERING INFORMATION
15.24
(0.600)
7.62
(0.300)
O.D.
6.35
(0.250)
21.59
(0.850)
"A"
"A"
REF
SECTION A–A
10.41
(0.410)
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
Material: 1.27 (0.050) Thick Copper
Finish: Black Enamel Paint
Material: 0.63 (0.025) Thick Aluminum
Finish: Pre-Black Anodize*
ORDERING INFORMATION
Part Number Description
6034B-TT Space saving staggered fin heat sink with 3.10 (0.122)
integrated tin plated tabs
Dia of PCB
Plated Thru
Hole for Tabs
*Edges cut during the manufacturing process will be unfinished.
See page 110 for more information.
FIGURE A FIGURE B
For additional options see page 84
Grease
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&
page112
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Kits
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page112
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Kits
page 99
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TO-126 Heat Sinks
ORDERING INFORMATION
5775 Slip on heat sink
Slip on heat sink requires no
hardware to attach to the device.
Spring pressure ensures excellent
retention. May be assembled
before or after the device is
attached to the board.
19.81
(0.780)
13.21
(0.520)
0.63
(0.025)
8.13
(0.320)
7.87
(0.310) 10.67
(0.420)
Part Number Finish
577500B00000 Black anodize
577500U00000 Unfinished
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
01 23 45
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Material: 0.63 (0.025) Thick Aluminum
Finish: See table
ORDERING INFORMATION
TV4 Narrow channel style heat sink featuring twisted fins
Narrow channel style heat sink
features twisted fins for
increased air turbulance for
better cooling. Can be mounted
horizontally or vertically.
19.00
(0.749)
13.40
(0.528)
22.00
(0.866)
19.00
(0.749)
C
L
4.00
(0.158)
Part Number Description
TV4 Narrow channel style heat sink with twisted fins
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
01 2 3 4 5
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Material: 1.63 (0.064) Thick Aluminum
Finish: Black Anodize
Grease
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SIPS
ORDERING INFORMATION
5660 Plug in style heat sink
Plug in style heat sink features
four spring action clips to firmly
hold the device to the heat sink
ensuring maximum metal to metal
contact. Available with or without
solderable tabs for horizontal or
vertical mounting to the PC board.
10.67
(0.420)
15.88
(0.625)
30.99
(1.220)
12.70
(0.500)
4.06
(0.160)
1.27
(0.050)
25.40
(1.000)
C
L
12.06
(0.475)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
024 6810
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
ORDERING INFORMATION
3.81
(0.150)
15.75
(0.620)
3.73
(0.147)
9.65
(0.380)
12.70
(0.500)
21.46
(0.845)
C
L
0.64
(0.025)
LOCKING CATCH
3.30
(0.130)
ø
Part Number Finish
530510U00000 Unfinished
530510B00000 Black anodize
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
012 34 5
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Channel style heat sink with
integrated clip features strong
spring tension and device locking
catch to attach device securely to the
heat sink. Available in two finishes.
5305 Channel style heat sink with integrated clip
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
Material: 0.81 (0.032) Thick Aluminum
Finish: See Table
Part Number Description Figure
566010B00000 Plug in style heat sink A
566010B03100 With solderable tab for horizontal mounting B 1.73 (0.068)
566010B03400 With solderable tabs for vertical mounting A 2.39 (0.094)
Dia of PCB
Plated Thru
Hole for Tabs
Position Code Description Details
A 28 Solderable Shur-LockTM Tab for vertical mounting Page 91
22.86
(0.900)
0.81
(0.032)
30.99
(1.220)
5.03
(0.198)
1.91
(0.075)
8.13
(0.320)
12.70
(0.500)
25.40
(1.000)
C
L
FIGURE A FIGURE B
POPULAR OPTIONS:
Base part no. A
566010B0 00 00
For additional options see page 84
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SIPS
ORDERING INFORMATION
7148 Copper channel style slide on heat sink featuring an integrated clip and solderable tabs
Copper channel style slide on
heat sink features an integrated
clip and solderable tabs. Includes
a device retaining tab to securely
hold the heat sink to the device.
Small footprint consumes less
board space.
DETAIL E
A
A
MAX
(0.160)
4.06 E
(0.075)
1.90
(0.050)
1.27
(0.150)
3.81
(0.200)
5.08
(0.380)
9.65
MAX AT BASE
(0.915)
23.24
20.19
(0.795)
2.79 - 3.18
(0.110) - (0.125)
15.24
(0.600)
SECTION A–A
17.78
(0.700)
Part Number Description
7148D Slide on heat sink with integrated clip 2.54 (0.100)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
012 34 5
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
(0.032)
0.81
(0.230)
5.84
(0.097)
2.46
(1.150)
29.21
(0.390)
9.91
DITTIN
TYP 2
(0.125)
3.18
(1.700)
43.18
(1.250)
31.75
(0.390)
9.91
(0.125)
3.18
ø
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
024 6810
4
3
1
2
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Clip on heat sink features louvers
to provide excellent cooling in natural
or forced air convection. Spring action
provides strong clamping force to
securely hold the heat sink to the
device. Available with or without
solderable tabs.
5840 Clip on heat sink featuring louvers
Material: 0.81 (0.032) Thick Copper
Finish: Tin Plated
Material: 1.02 (0.040) Thick Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number Description
584000B00000 Clip on heat sink
584000B03500 With solderable tabs for vertical mounting 2.84 (0.112)
Dia of PCB
Plated Thru
Hole for Tabs
7038 Channel style slide on heat sink featuring an integrated clip and device retaining tab
Channel style slide on heat sink
features an integrated clip and
device retaining tab to hold the
heat sink to the device. Small foot-
print consumes less board space.
Part Number Description
7038B Channel style slide on heat sink
ORDERING INFORMATION
(0.250)
6.35
(0.915)
23.24
(0.380)
9.65
(0.600)
15.24
A
A
(0.620)
15.75
(0.155)
3.95
13.28
(0.523)
SECTION A–A
7.37 / 8.89
(0.290) / (0.350) 1.65
(0.065)
2.39
(0.094)
3.05
(0.120)
R
R
R
Material: 0.81 (0.032) Thick Aluminum
Finish: Black Anodize
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
012 34 5
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
For additional options see page 84
Dia of PCB
Plated Thru
Hole for Tabs
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ORDERING INFORMATION
15.29
(0.602)
"A" 5.59
(0.220)
Part Number “A”Dim
575200B00000 18.29 (0.720)
575300B00000 24.64 (0.970)
575400B00000 30.99 (1.220)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
25
0
20
40
60
80
100
0.0 0.2 0.4 0.6 0.8 1.0
20
15
5
10
0
0400
200 600 800 1000
575200
575400
Mounting Surface Temp
Rise Above Ambient—°C
Low cost slip on heat sink
features an expandable collar
that tightly grips the device
meaning no extra mounting
hardware is required. Three
heights to choose from.
5752, 5753, 5754 Low cost slip on heat sink
Material: 0.63 (0.025) Thick Aluminum
Finish: Black Anodize
TO-92 Heat Sinks
ORDERING INFORMATION
13.70
(0.539)
13.80
(0.543)
10.16
(0.400)
1.00
(0.039)
11.40
(0.449)
2.50
(0.098)
0.40
(0.016)
8.50
(0.335)
4.27
(0.039)
Part Number Description
92F Brass clip on heat sink 1.73 (0.068)
Air Velocity – Feet Per Minute
Heat Dissipated – Watts
Thermal Resistance From MTG
Surface to Ambient – °C/Watt
25
0
20
40
60
80
100
012 345
20
15
5
10
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient – °C
Low cost brass clip on heat sink
requires no hardware to attach
to the device. Includes integrated
tabs that can be soldered or twisted
to attach the heat sink to the board
reducing stress on the device leads.
92F Low cost brass clip on heat sink
Material: 0.38 (0.015) Thick Brass
Finish: Unfinished
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
25
0
20
40
60
80
100
0.0 0.2 0.4 0.6 0.8 1.0
20
15
5
10
0
0400
200 600 800 1000
575300
Mounting Surface Temp
Rise Above Ambient—°C
Dia of PCB
Plated Thru
Hole for Tabs
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ORDERING INFORMATION
5203 Two piece heat sink
Two piece heat sink adds
extra cooling in the same
amount of board space as
other solutions. Base and Top
can be ordered separately.
(1.250)
31.75
(0.500)
12.70
(1.530)
38.86
(1.187)
30.15
2x
(0.218)
5.54
2x
THRU
(0.188)
4.78 THRU
16.89
(0.665)
4.34
(0.171)
5.46
(0.215)
10.92
(0.430)
ø
ø
Part Number Description Figure
520327B00000 Two piece heat sink assembly, base and top
520328B00000 Top only B
520329B00000 Base only A
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
02 4 6 810
8
6
2
4
0
0400
200 600 800 1000
520328
520329
520327
Mounting Surface Temp
Rise Above Ambient—°C
ORDERING INFORMATION
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
01 2 3 4 5
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Part Number Finish
579103B00000 Black anodize
579103C00000 Gold chromate
SLOT
30.15
(1.187)
REF
4.83
(0.190)
4.06
(0.160)
øx
39.12
(1.540)
22.10
(0.870)
9.91
(0.390)
28.57
(1.125)
Space saving expandable collar heat
sink has the same footprint as the device
being cooled meaning no extra board
space is required to fit the heat sink.The
expandable collar tightly grips the device
meaning no extra hardware is required.
May also be used with any diamond or
square basket heat sink to form a two
piece heat sink for additional cooling.
Available in conductive gold chromate
or black anodize finish.
5791 Space saving expandable collar heat sink
5060 Low profile hat section heat sink
Low profile hat section heat sink
is ideal for applications where low
component heights are required
such as card cages with PCBs
mounted on 0.500 centers.
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
048121620
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Part Number Description
506003B00000 Low profile hat section heat sink
ORDERING INFORMATION
Material: 1.60 (0.063) Thick Aluminum
Finish: Black Anodize
Material: 1.27 (0.050) Thick Aluminum
Finish: See Table
(2.000)
50.80
(1.200)
30.48
(1.750)
44.45
(0.375)
9.52
2x
THRU
(0.188)
4.78
(1.187)
30.15
(0.072)
1.82 (0.593)
15.06
(0.430)
10.92
(0.215)
5.46
2x
THRU
(0.218)
5.54 ø
C
L1
C
L2
ø
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
TO-3 Heat Sinks
For additional options see page 84
FIGURE A FIGURE B
21.34
(0.840)
2.81
(0.110)
38.95
(1.534)
THRU TYP 2
3.71
(0.146)
14.17
(0.558)
THRU TYP 2
4.06
(0.160)
30.65
(1.206)
7.87
(0.310)
9.27
(0.365)
For additional options see page 84
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ORDERING INFORMATION
5756, 5757, 5758, 5759 Space saver diamond shaped basket heat sink
Space saver diamond shaped
basket heat sink featuring a
narrow base with slanted fins to
increase air turbulence in natural
and forced convection applications.
Made from heavy gauge material.
Four heights to choose from.
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
024 6810
8
6
2
4
0
0400
200 600 800 1000
575603
575703
Mounting Surface Temp
Rise Above Ambient—°C
Part Number “A”Dim
575603B00000 12.70 (0.500)
575703B00000 19.05 (0.750)
575803B00000 25.40 (1.000)
575903B00000 31.75 (1.250)
(1.630)
41.40
(1.290)
32.77 TYP 2
(0.218)
5.54
TYP 2
(0.188)
4.78
(1.187)
30.15
(0.594)
15.07
(0.072)
1.83
(0.430)
10.92
(0.215)
5.46
1
2
"X"
"X"
C
L
C
L
ø
"A"
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
02 4 6 810
8
6
2
4
0
0400
200 600 800 1000
501303
501403
Mounting Surface Temp
Rise Above Ambient—°C
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
02 4 6 810
8
6
2
4
0
0400
200 600 800 1000
501503
501603
Mounting Surface Temp
Rise Above Ambient—°C
Low cost diamond shaped
basket heat sink with
straight fins. High fin count
enhances efficiency. Four
heights to choose from.
5013, 5014, 5015, 5016 Low cost diamond shaped basket heat sink
Material: 2.29 (0.090) Thick Aluminum
Finish: Black Anodize
Material: 1.60 (0.063) Thick Aluminum
Finish: Black Anodize
TO-3 Heat Sinks
Position Code Description Location Details
A 1 Kon-DuxTM pad Page 86
A 3 In-Sil-8TM pad Page 86
B 01 6-23 Wave-OnTM threaded insert Hole X Page 89
0.100 stand off
POPULAR OPTIONS:
Base part no. A
575_03B 0 00 00
For additional options see page 84
ORDERING INFORMATION
Part Number “A”Dim
501303B00000 12.70 (0.500)
501403B00000 19.05 (0.750)
501503B00000 25.40 (1.000)
501603B00000 31.75 (1.250)
Position Code Description Location Details
A 1 Kon-DuxTM pad Page 86
B 01 6-23 Wave-OnTM threaded insert 0.100 stand off Hole X Page 89
C 08 6-32 x 0.350 Long wave on stud Hole X Page 96
POPULAR OPTIONS:
For additional options see page 84
B
Base part no. A
501_03B 0 00 00
BC
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
02 4 6 810
4
3
1
2
0
0400
200 600 800 1000
575803
575903
Mounting Surface Temp
Rise Above Ambient—°C
TYP 2
5.54
(0.218)
10.92
(0.430)
5.46
(2.150)
TYP 2
4.75
(0.187)
AT BASE
47.75
(1.880)
AT BASE
35.56
(1.400)
"A"
30.15
(1.187)
15.07
(0.594)
1.83
(0.072)
"X"
"X"
ø
ø
C
L
C
L
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TO-3 Heat Sinks
ORDERING INFORMATION
5197, 5198, 5199, 5201 Heavy gauge square basket heat sink
Heavy gauge square basket
heat sink provides excellent
performance by using 1/8 thick
aluminum to maximize efficiency.
Available in 4 heights.
10.41
(0.410)
12.24
(0.482)
39.37
(1.550)
32.02
(1.300)
@ BASE
48.26
(1.900)
TYP 2
5.54
(0.218)
TYP 2
4.75
(0.187)
1
2
ø
ø
30.15
(1.187)
15.09
(0.594)
1.83
(0.072) 10.92
(0.430)
5.46
(0.215)
C
L
C
L
"A"
"X"
"X"
Part Number “A”Dim
519703B00000 38.10 (1.500)
519803B00000 44.45 (1.750)
519903B00000 50.80 (2.000)
520103B00000 31.12 (1.225)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
0 5 10 15 20 25
4
3
1
2
0
0400
200 600 800 1000
520103
519903
Mounting Surface Temp
Rise Above Ambient—°C
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
04 8121620
4
3
1
2
0
0400
200 600 800 1000
579003
569003
Mounting Surface Temp
Rise Above Ambient—°C
Square basket heat sink
features folded back fins to
increase surface area and
power dissipation.Two
heights are available.
5690, 5790 Square basket heat sink features folded back fins
Material: 3.17 (0.125) Thick Aluminum
Finish: Black Anodize
Material: 1.60 (0.063) Thick Aluminum
Finish: Black Anodize
Position Code Description Location Details
A 1 Kon-DuxTM pad Page 86
B 01 6-32 Wave-OnTM theaded insert 0.100 stand off Hole X Page 89
POPULAR OPTIONS:
Base part no. A
5_ _ _03B 0 00 00
For additional options see page 84
ORDERING INFORMATION
Part Number “A”Dim
569003B00000 33.27 (1.310)
579003B00000 25.40 (1.000)
Position Code Description Details
A 1 Kon-DuxTM pad Page 86
A 3 In-Sil-8TM pad Page 86
POPULAR OPTIONS:
For additional options see page 84
1.78
(0.070)
15.11
(0.595)
30.23
(1.190)
5.46
(0.215)
10.92
(0.430)
REF
27.69
(1.090)
THRU
TYP 8
3.66
(0.144)
THRU
TYP 2
5.08
(0.220) REF
6.35
(0.250)
SQ.
REF
46.48
(1.830)
THRU
TYP 2
4.83
(0.190)
ø
ø
C
L
"A"
C
L
ø
Base part no. A
5_9003B 0 0000
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
048121620
4
3
1
2
0
0400
200 600 800 1000
519703
519803
Mounting Surface Temp
Rise Above Ambient—°C
B
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www.aavidthermalloy.com
TO-3 Heat Sinks
ORDERING INFORMATION
5001, 5002, 5003, 5004 Square basket heat sink featuring slanted fins
Square basket heat sink featuring
a slanted fin design for increased
air turbulence and four integrated
mounting holes. Four heights to
choose from.
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
04 8121620
4
3
1
2
0
0400
200 600 800 1000
500203
500103
Mounting Surface Temp
Rise Above Ambient—°C
Part Number “A”Dim
500103B00000 12.70 (0.500)
500203B00000 19.05 (0.750)
500303B00000 25.40 (1.000)
500403B00000 31.75 (1.250)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
048121620
4
3
1
2
0
0400
200 600 800 1000
500403
500303
Mounting Surface Temp
Rise Above Ambient—°C
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
02 4 6 810
4
3
1
2
0
0400
200 600 800 1000
505303
505403
505103
Mounting Surface Temp
Rise Above Ambient—°C
Square basket heat sink
features straight fins and
0.090 thick aluminum for
increased cooling capacity.
Three heights to choose from.
5051, 5053, 5054 Square basket heat sink featuring straight fins
Material: 2.29 (0.090) Thick Aluminum
Finish: Black Anodize
Material: 2.29 (0.090) Thick Aluminum
Finish: Black Anodize
Position Code Description Details
A 1 Kon-DuxTM pad Page 86
A 3 In-Sil-8TM pad Page 86
POPULAR OPTIONS:
Base part no.
500_03B 0 0000
For additional options see page 84
ORDERING INFORMATION
Part Number “A”Dim
505103B00000 12.70 (0.500)
505303B00000 25.40 (1.000)
505403B00000 31.75 (1.250)
Position Code Description Location Details
A 01 6-23 Wave-OnTM threaded insert 0.100 stand off Hole X Page 89
For additional options see page 84
TYP 2
(0.218)
5.54
(0.072)
1.83
(1.187)
30.15
(0.215)
5.46
(0.593)
15.06
(1.780)
45.21
(0.430)
10.92
TYP 2
(0.188)
4.78
1
C
L
C
L2
øø
"X"
"X"
"A"
POPULAR OPTIONS:
Base part no. A
505_03B0 00 00
A
TYP 2
5.54
(0.218)
THRU TYP 4
ø 3.81
(0.150)
15.06
(0.593)
10.92
(0.430)
30.15
(1.187)
TYP 2
ø 4.78
(0.188)
5.46
(0.215)
1.83
(0.072)
38.10
(1.500)
SQ.
45.97
(1.810)
C
L1
L2
C
"A"
ø
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TO-3 Heat Sinks
ORDERING INFORMATION
5761, 5762, 5763, 5764 Square basket heat sink featuring slanted vane fins
Square basket heat sink features
slanted vane fins for efficient heat
dissipation. Air movement from any
direction is diverted into the center
of the heat sink to create turbulence
and improve heat transfer. Four
heights to choose from.
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
04 8121620
4
3
1
2
0
0400
200 600 800 1000
576203
576103
Mounting Surface Temp
Rise Above Ambient—°C
Part Number “A”Dim
576103B00000 12.70 (0.500)
576203B00000 19.05 (0.750)
576303B00000 25.40 (1.000)
576403B00000 31.75 (1.250)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
04 8121620
4
3
1
2
0
0400
200 600 800 1000
576403
576303
Mounting Surface Temp
Rise Above Ambient—°C
Material: 2.29 (0.090) Thick Aluminum
Finish: Black Anodize
Position Code Description Location Details
A 1 Kon-DuxTM pad Page 86
B 01 6-32 Wave-OnTM theaded insert Hole X Page 89
0.100 stand off
POPULAR OPTIONS:
Base part no.
576 _ 03B 0 00 00
For additional options see page 84
"A"
12.32
(0.485)
12.32
(0.485)
REF
45.97
(1.810)
5.46
(0.215)
10.92
(0.430)
30.15
(1.187)
TYP 2
4.77
(0.188)
TYP 2
5.54
(0.218)
2
1
15.09
(0.594)
1.83
(0.072)
ø
"X"
"X"
C
L
C
L
ø
A B
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ORDERING INFORMATION
5017, 5018, 5019, 5020 Low cost diamond shaped basket heat sink
Low cost diamond shaped
basket heat sink with straight
fins. High fin count enhances
efficiency. Four heights to
choose from.
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
024 6 810
8
6
2
4
0
0400
200 600 800 1000
501806
501706
Mounting Surface Temp
Rise Above Ambient—°C
Part Number “A”Dim
501706B00000 12.70 (0.500)
501806B00000 19.05 (0.750)
501906B00000 25.40 (1.000)
502006B00000 31.75 (1.250)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
024 6 810
8
6
2
4
0
0400
200 600 800 1000
502006
501906
Mounting Surface Temp
Rise Above Ambient—°C
20.62
(0.812)
31.00
(1.220)
13.72
(0.540)
24.38
(0.960)
3.96
(0.156)
4.95
(0.195)
11.68
(0.460)
9.27
(0.365)
4.44
(0.175)
SLOT
x
ø
ø
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
01 2 3 45
16
12
4
8
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Space saving expandable collar
heat sink has the same footprint
as the device being cooled meaning
no extra board space is required to
fit the heat sink. The expandable
collar tightly grips the device.
5792 Space saving expandable collar heat sink
Material: 1.60 (0.063) Thick Aluminum
Finish: Black Anodize
Material: 1.27 (0.050) Thick Aluminum
Finish: See Table
TO-66 Heat Sinks
@ BASE
39.37
(1.550)
@ BASE
26.42
(1.040)
1
2
TYP 4
3.96
(0.156)
24.38
(0.960)
2.54
(0.100)
5.08
(0.200)
12.19
(0.480)
2.54
(0.100)
C
L
C
L
"A"
ø
ORDERING INFORMATION
Part Number Finish
579206B00000 Black anodize
579206C00000 Gold chromate
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ORDERING INFORMATION
6.35
(0.250)
10.03
(0.395)
21.08
(0.830)
8.03
(0.316)
ø
"A"
Part Number “A”Dim
578105B00000 3.96 (0.156)
578205B00000 6.35 (0.250)
578305B00000 12.70 (0.500)
578405B00000 19.05 (0.750)
578505B00000 25.40 (1.000)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
50
0
20
40
60
80
100
0.0 0.4 0.8 1.2 1.6 2.0
40
30
10
20
0
0400
200 600 800 1000
578205
578105
Mounting Surface Temp
Rise Above Ambient—°C
Snap on cooler features easy
no tools installation. Folded
back fins provide maximum
surface area while preserving
valuable board space.
5781, 5782, 5783, 5784, 5785 Snap on cooler heat sink
6201, 6202, 6203 Space saving expandable heat sink
Space saving expandable heat sink
features a collar that tightly grips the
device meaning no extra hardware is
required. Heat sinks are constructed of
pre-black anodize material to lower cost.
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
50
0
20
40
60
80
100
0.0 0.4 0.8 1.2 1.6 2.0
40
30
10
20
0
0400
200 600 800 1000
6202PB
6201PB
Mounting Surface Temp
Rise Above Ambient—°C
6203PB
32.51
(1.280)
6.35
(0.250)
ø 8.03
(0.316)
I.D.
"A"
Part Number “A”Dim # Fins
6201PB 6.35 (0.250) 1
6202PB 12.70 (0.500) 2
6203PB 19.56 (0.770) 3
ORDERING INFORMATION
Material: 0.63 (0.025) Thick Aluminum
Finish: Black Anodize
Material: 0.63 (0.025) Thick Aluminum
Finish: Pre Black Anodize*
TO-05 Heat Sinks
* Edges cut during the manufacturing process will be unfinished.
See page 110 more more information
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
50
0
20
40
60
80
100
0.0 0.4 0.8 1.2 1.6 2.0
40
30
10
20
0
0400
200 600 800 1000
578405
Mounting Surface Temp
Rise Above Ambient—°C
578305
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
50
0
20
40
60
80
100
0.0 0.4 0.8 1.2 1.6 2.0
40
30
10
20
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
578505
5F Low cost push on heat sink
Low cost push on heat sink
uses spring pressure to firmly
grip the device case creating
a good thermal interface.
12.70
(0.500)
16.00
(0.630)
7.90
(0.311)
ø
ø
Air Velocity – Feet Per Minute
Heat Dissipated – Watts
Thermal Resistance From MTG
Surface to Ambient – °C/Watt
50
0
20
40
60
80
100
0 0.5 1 1.5 2 2.5
40
30
10
20
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient – °C
Part Number Description
5F Low cost push on heat sink
ORDERING INFORMATION
Material: Aluminum
Finish: Black Anodize
76
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TO-5 Heat Sinks
3257, 3260 Extruded collar style heat sink with radial fins
Extruded collar style heat sink
with radial fins. The split collar
design provides a press fit
between the transistor and the
heat sink creating an excellent
thermal conduction path.
Available in two heights.
8.07
(0.318) THRU
12.70
(0.500)
"A"
ø
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
50
0
20
40
60
80
100
0.0 0.4 0.8 1.2 1.6 2.0
40
30
10
20
0
0400
200 600 800 1000
325705
326005
Mounting Surface Temp
Rise Above Ambient—°C
ORDERING INFORMATION
12.70
(0.500) 6.35
(0.250)
"A"
Part Number “A”Dim
320105B00000 8.07 (0.318)
320205B00000 7.75 (0.305)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
50
0
20
40
60
80
100
0.0 0.4 0.8 1.2 1.6 2.0
40
30
10
20
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Extruded collar style heat sink with
swept back fins for increased surface
area in a small volume.The split collar
design provides a press fit between the
transistor and the heat sink creating an
excellent thermal conduction path.
Available in two inside diameters.
3201, 3202 Extruded collar style heat sink with swept back fins
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
19.05
(0.750)
ø 8.08
(0.318)
6.35
(0.250)
3.17
(0.125)
ø
7.62
(0.300)
R
Part Number Description
323005B00000 Extruded collar style heat sink with mounting boss
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
50
0
20
40
60
80
100
0.0 0.4 0.8 1.2 1.6 2.0
40
30
10
20
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Extruded collar style heat sink with
mounting hole for hardware attachment
to the circuit card. The heat sink includes
a mount boss that will accept a 4-40 screw
for secure mounting in high vibration
environments.The split collar design
provides a press fit between the transistor
and the heat sink creating an excellent
thermal conduction path.
3230 Extruded collar style heat sink with mounting hole
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number “A”Dim
325705B00000 6.35 (0.250)
326005B00000 9.53 (0.375)
Material: Aluminum
Finish: Black Anodize
77
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www.aavidthermalloy.com
Axial Lead Devices
ORDERING INFORMATION
6000 Copper heat sink for axial lead devices
Copper heat sink for axial
lead device requires no extra
board space to mount. One
lead of the heat sink is soldered
to the device while the other
solders to the PC board.
Available in two finishes.
C SYM
L
14.20
(0.559)
25.40
(1.000)
15.24
(0.600)
(0.250)
6.35
@ BASE
(1.200)
30.48
REF
REF
25.40
(1.000)
27.30
(1.075)
1.90
(0.075) 1.27
(0.050)
15.24
(0.600)
20.32
(0.800) DIA AS REQUIRED
FOR LEAD SIZE
2.36
(0.093)
FIGURE A
Part Number Description Finish
6000U Heat sink for axial lead device Unfinished See figure A
6000PD Heat sink for axial lead device Pre-Tin plated* See figure A
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
024 6810
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
ORDERING INFORMATION
(1.060)
26.92
(1.250)
31.75
"A"
(0.600)
15.24
SQ
Part Number “A”Dim
6222B 3.61(0.142) Dia Thru
6223B 4.14 (0.163) Dia Thru
6224B 4.77 (0.188) Dia Thru
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
024 6810
8
6
2
4
0
0400
200 600 800 1000
Mounting Surface Temp
Rise Above Ambient—°C
Square basket style heat sink
for bridge rectifiers uses no
additional board space.
Available with three different
mounting hole diameters.
6222, 6223, 6224 Square basket style heat sink for bridge rectifiers
Material: 0.53 (0.021) Thick Copper
Finish: See Table
Bridge Rectifiers
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
Dia of PCB
Plated Thru
Hole for Tabs
* Edges cut during the manufacturing process will be unfinished.
See page 110 more more information
78
OPTIONS & ACCESSORIES CONTENTS
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AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
Thermal solutions go beyond the heat dissipator itself.
Aavid Thermalloy offers a total solution package,
which includes a number of option and accessory
items described in this section of the catalog.
A total thermal solution includes an efficient thermal
interface and means of mechanical attachment. Aavid
Thermalloy has a full-line of interface materials that
can be pre-applied or supplied as an accessory item.
Mechanical assembly options include attachment of
semiconductors to heat sinks, heat sinks to printed
circuit boards, and heat sinks to sockets of CPU’s.
Aavid Thermalloy offers the most complete line
of value added options of any supplier in the industry.
Our full line of accessories includes mounting kits,
shoulder washers, insulators, mounting pads,
and various grease products and epoxies, which
are sold separately, and can be used with a variety
of Aavid heat sinks.
This section will provide the most complete solution
to your thermal requirement.
CONTENTS
How to decipher or construct an Aavid 12 digit part number.......................
How to decipher or construct a "Thermalloy" origin part number...............
Indexes.................................................................................................................................
Interface Materials
Pads
In-Sil-8™pads...................................................................................................................
Kon-Dux™ pads...............................................................................................................
Alignment pads................................................................................................................
Grafoil™pads....................................................................................................................
Double Sided Tape Options (factory applied)
Ther-A-Grip™1050/T404.............................................................................................
Ther-A-Grip™1070/T405.... .........................................................................................
Ther-A-Grip™1090/T412.............................................................................................
T410/T411...........................................................................................................................
Labor Savings Heat Sink to Board and Device to Heat Sink Mounts
Wave-On™Mounts.........................................................................................................
Semiconductor Mounts.................................................................................................
Shur-Lock™Tabs..............................................................................................................
Solderable Staked on Tabs............................................................................................
Solderable Mounting Tabs............................................................................................
Solderable Pins.................................................................................................................
Solderable Nuts.................................................................................................................
Clinch Nuts..........................................................................................................................
Solderable Studs...............................................................................................................
Device Mounting Studs..................................................................................................
Clips
Aavid Kool-Klips™............................................................................................................
Thermal Clips.....................................................................................................................
80
81
82–85
86
86
87
87
88
88
88
88
89
90
91
91–93
93
94
94
95
96
96
97
98
79
OPTIONS & ACCESSORIES CONTENTS
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AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
CONTENTS
Accessories
Mounting Kits
TO-220/TO-3 Mounting Kits......................................................................................................................... 99
Insulating Shoulder Washers
Polyphenylene Sulfide PPS Shoulder Washers......................................................................................100
Nylon Shoulder Washers................................................................................................................................100
Insulators
Thermalfilm™/Thermalfilm™MT.............................................................................................................. 101–102
Thermalfilm™Polymide Plastic Films...................................................................................................... 101–102
Mica Thermalsil™.............................................................................................................................................103
Aluminum Oxide Ceramic Insulators................................................................................................... .....104
Stanchion Pads..................................................................................................................................................105
Insulating Covers
TO-3 Insulating Covers................................................................................................................................... 106
Teflon-Filled Acetal Insulators......................................................................................................................106
Teflon-Filled Acetal Bushings.......................................................................................................................106
Mounting Pads (TO-5,TO-18, IC, Universal, TO-18 Lead Conversion, Epoxy Lead Conversion).......107–109
Finishes ..............................................................................................................................................................110
Card Ejectors
Snap-On Ejectors............................................................................................................................................. 111
Standard Ejectors.............................................................................................................................................111
Thermal Greases and Epoxies
Sil-Free™............................................................................................................................................................. 112
Ther-O-Link™.................................................................................................................................................... 112
Ultrastick™......................................................................................................................................................... 112
ThermalCote™.................................................................................................................................................. 113
ThermalCote™II...............................................................................................................................................113
Ther-O-Bond™1500.......................................................................................................................................114
Ther-O-Bond™1600.......................................................................................................................................114
Ther-O-Bond™2000.......................................................................................................................................114
Thermalbond™.................................................................................................................................................115
80
HOW TO DECIPHER A 12 DIGIT PART NUMBER
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www.aavidthermalloy.com
Aavid Thermalloy's standard product line in most cases consists of a 12-digit part number sequence. In most standard offerings, Digits 1 through 4,
define the model basic part number. Digits 5 and 6 designate the package style that a particular heat sink is designed to cool. The 7th digit deter-
mines the finish, and the 8th identifies the interface material, if one can be used for that particular style heat sink. The 9th and 10th digits define
the PC board mounting method, and the 11th and 12th digits define the method of attachment of the package to the heat sink. For digits
8,9,10,11 and 12, the absence of any of those options is always designated by a zero in those positions. Important NOTE:The 12 digit part number
sequence is a general format. Due to the different variations and styles of heat sinks, we have included an option index on pages 82–84 to show
available options and accessories for the products covered in this catalog.
To order most Aavid Thermalloy heat sinks, you must use a 12 digit part number using the following options:
How to decipher an Aavid standard 12 digit part number?
Digits 5-6: Package style
CODE DEVICE
00 Blank
01 TO-218
02 TO-220, TO-216, TO-217
03 TO-3
04 TO-202
05 TO-5, TO-39
06 TO-66
08 TO-247
10 Multiwatt/SIP
21 Dual TO-218
22 Dual TO-220
Digit 7: Finish
CODE DESCRIPTION
BBlack anodize
CGold chromate
DSolderable tin finish
JPre-black anodize
MGreen anodize
TBlack paint with solderable tabs
UUnfinished
For additional information see page 110
Digit 8: Interface material
CODE DESCRIPTION
0None
1One Kon-Dux™ Pad
2Two Kon-Dux™ Pads
3One In-Sil-8™ Pad
4Two In-Sil-8™ Pad
Kon-Dux™ is both thermally and
electrically conductive. Factory applied only.
In-Sil-8™ is thermally conductive
and electrically isolating.
For additional information see page 86
Solderable Wave-On™ mounts
CODE STAND-OFF THREAD
01 0.100” #6-32
02 0.100” #4-40
03 0.045” #4-40
04* 0.100” #6-32
05 0.045” #6-32
07 0.100” 3.5mm
09 0.200” #6-32
13 0.129 #6-32
* .090 PCB (others .062”)
For additional information see page 89
Solderable staked on **tabs
CODE DESCRIPTION
28 Shur-Lock™ Tab (.130 for .062” PC Boards)
31 Centered horizontal (.050 W x .130 L)
32 Centered horizontal (.050 W x .130 L)
33 Centered vertical (.062 W x .340 L)
34 Vertical pair L & R (.075 W x .170 L)
35 Vertical pair L & R (.097 W x .200 L )
36 Centered vertical (.100 W x .150 L )
37 Centered step (.062 W x .250 L with .125 wide step)
39 Centered vertical (.050 W x .375 L)
40 Centered vertical (.050 W x .245 L )
43 Centered step (.050 W x .375 L )
53 MT Tab Vertical pair (.090 W x .125 L)
54 MT2 Tab Vertical pair (.090 W x .125 L)
55 MT3 Tab Vertical pair (.090 W x .125 L)
56 Bifurcated Tab Vertical pair (.110 W x .125 with .190 step)
57 Bifurcated Tab Vertical pair (.110 W x .125 with .100 step)
For additional information see pages 91–93
** For additional tab options, please contact
Application Engineering at (603) 224-9988
Semiconductor mounts
CODE DESCRIPTION LENGTH
01 #6-32 female
02 #4-40 female
03 M-3 female
04 #6-32 male .380”
05 #4-40 male .380”
For additional information see page 90
Stud
CODE DESCRIPTION LENGTH
06 SE-2 Stud #6-32 .485"
07 SM-3 M-3 Male .350”
08 SE-1 Stud #6-32 .350"
09 SE-3 Stud #4-40 .350"
11 SF-1 M3 x 0.5 .302"
14 SE-4 Stud #6-32 .350"
17 SM-1M-3 Male .350"
For additional information see page 96
Clinch nuts
CODE DESCRIPTION
12 CNE-42 4-40 Clinch nut
13 CNM-1 M3 X 0.5 Clinch nut
For additional information see page 95
Standard clips
Kool-Klips™
Sold separately
CODE PART#
50 115000
51 115100
52 115200
53 115300
54 115400
62 116000
For additional information see page 97
Thermal clips
Factory applied to heat sink
CODE PART#
32 TC-1
33 TC-10
34 TC-11
35 TC-12
For additional information see page 98
Solderable pins
for Board mounted extrusions
CODE DESCRIPTION
21 Solid pin with
stand off shoulder .050”
25 Solid solderable pin
For additional information see page 94
Solderable nut
CODE DESCRIPTION LENGTH
13 SNE-2 6-32 UNC-2B 0.305
14 SNE-4 4-40 UNC-2B 0.305
For additional information see page 94
Digits 11-12: Package Mounting
Digits 9-10: PC Board mounting
A= Base part number
B= Package style
C= Finish
D= Interface material
E= PC Board mounting
F= Package mounting
Standard board level: 5748 02 B 0 37 00
ABCDEF
81
HOW TO DECIPHER A THERMALLOY ORIGIN PART NUMBER
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www.aavidthermalloy.com
Aavid Thermalloy features a variety of Thermalloy origin standard products that consist of a different part
number sequence than the standard Aavid 12 digit part numbering system. In most cases, digits 1 through
4, designate the basic model number of the heat sink. Digits 5-6, designate the finish of the heat sink. Digits
6-13 can designate any number of different options that come with a specific model number. (Please refer
to Option Index D on page 85 to see Aavid Thermalloy‘s offerings per base number.)
Popular productivity enhancing options:
Digits (Figure C-D above)
P_= Solderable roll pins (see page 94)
TC_ _ = Thermal clip (see page 98)
CNE_ _ = Clinch nuts (see page 95)
CNM_= Clinch nuts metric (see page 95)
MT= Mounting tabs (see page 93)
8223-CL03,8241-CL11 = Alignment pad (see page 87)
SE-_= Solerable studs (see page 96)
SF_= Mounting studs (see page 96)
G_= GrafoilTM pad (see page 87)
SNM_= Solderable nuts metric (see page 94)
SNE= Solderable nuts (see page 94)
BGS_= BGS clip (See BGA-Fluted Fin page 20)
How to decipher a Thermalloy origin part number?
To order most Thermalloy origin heat sinks you must use the basic part numbering system below:
A= Model number
B= Finish
C= Productivity enhancement (if applicable)
D= Second productivity enhancement (if applicable)
Note: For a wide range of part number specific options, please see our Aavid Option Index D on Page 85
Standard board level: 6021 – – -
AB C
Popular finishes*
(followed after base number in Figure B above)
B=Black anodize
PB= Pre-black anodized
B-TT= Black paint w/tinned tabs
C=Gold chromate
D=Tin plated
U=Clean, no finish
D
*For additional information see page 110
82
OPTION INDEX
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www.aavidthermalloy.com
Option Index A
Base part Finishes Solderable tabs Clips Wave-OnTM mounts KonduxTM pads In-Sil-8TM pads Semiconductor mnts Studs
(page 110) (page 91–93) (page 97) (page 89) (page 86) (page 86) (page 90) (page 96)
504102 B U 53 54 55 56 57 01 02 03 05 1 3
504222 B U 01 02 03 05 2 4 01 02 03 05 07 08
506902 B U 01 02 03 05 1 3
507002 B U J 53 54 55 56 57 01 02 03 05 1 3 01 02 03 05 07 08
507102 B U J
507222 B U J C 53 54 55 56 57 01 02 03 05 1 2 3 4 01 02 03 05 07 08
507302 B U J C 33 36 39 40 01 02 03 05 1 3 01 02 03 05 07 08
530101 B U C 50 01 04 05 07 1 2 3 4
530102 B U 50 01 04 05 07 1 2 3 4
530161 B U 62 01 04 05 07 1 2 3 4
530162 B U 62 01 04 05 07 1 2 3 4
530401 B 50 01 04 05 07 1 2 3 4
530402 B U 50 01 04 05 07 1 2 3 4
530613 B U J C 53 54 55 56 57 1 3
530614 B U J 53 54 55 56 57 1 3
530714 B U C 53 54 55 56 57 1 3
530801 B U 50 01 04 05 07 1 2 3 4
530802 B U 50 01 04 05 07 1 2 3 4
530861 B U 62 01 04 05 07 1 2 3 4
530862 B U 62 01 04 05 07 1 2 3 4
534202 B U 28 34 35 53 1 3
542502 B U J T 05 1 3 01 02 03 05 07 08
551002 B C 01 02 03 05 1 3 01 02 03 05 07 08
563002 B U J T
569022 B U 01 02 03 05 01 02 03 05 07 08
574102 B U 32 33 36 37 39 40
574402 B 32 33 36 37 39 40
574502 B U C 32 33 36 37 39 40
574602 B U 32 33 36 37 39 40
574802 B U 33 37
574902 B U 28 33 36 37 39 40 43
575002 B U T
575102 B U C 1 3
576012 B U C 1 3
576014 B U C 1 3
576602 B U D T
577002 B U C 33 36 39 40 01 02 03 05 1 3 01 02 03 05 07 08
577102 B U C 33 36 39 40 01 02 03 05 1 3 01 02 03 05 07 08
577202 B U J C 33 36 39 40 01 02 03 05 1 3 01 02 03 05 07 08
577922 B U C 24
578622 B U C 28 32 34 35 2 4 01 02 03 05 07 08
579302 B U
579402 B U
579802 B U 33
579902 B U 33
590102 B U 36
590302 B U 36
592201 B U 34
592502 B U 28 34 35 01 02 03 05 1 3 01 02 03 05 07 08
592902 B U 28 34 1 3 01 02 03 05 07 08
593002 B U C 28 34 35 1 3 01 02 03 05 07 08
593101 B U 36 1 3
593202 B U C 28 34 35 01 02 03 05 1 3 01 02 03 05 07 08
Available option codes for Aavid 12 digit part numbers. For additional information on option codes see "How to decipher
an Aavid 12 digit part number" on page 80. To find the appropriate Option Index for a selected part number please refer
to the main product section in the front of the catalog or "How to use this catalog" on page 2.
Ordering Codes
83
OPTION INDEX
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Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
513001 B U 1 2 3 4 01 03 21 25
513002 B U 1 2 3 4 21 25
513101 B U 1 2 3 4 21 25
513102 B U 1 2 3 4 01 02 03 21 25
513201 B U 1 2 3 4 01 05 21 25
513202 B U C 1 2 3 4 01 02 03 21 25
513301 B U 1 2 3 4 02 21 25
513302 B U C 1 2 3 4 01 02 21 25
529701 B 1 2 3 4 21 25
529702 B 1 2 3 4 21 25
529801 B 1 2 3 4 01 02 21 25 11 12
529802 B 1 2 3 4 01 02 21 25 11 12
529901 B 33 34 1 2 3 4 01 02 05 21 25 11 13
529902 B 33 34 1 2 3 4 01 02 05 21 25
530001 B U 33 1 3 01 21 25
530002 B U 1 3 02 21 25
531002 B U C 1 3 21 25
531102 B U C 1 3 02 03 21 25
531202 B U C 1 3 01 02 21 25
531302 B U C 1 3 02 21 25
532602 B 1 3 01 02 21 25
532702 B 1 3 01 21 25
532802 B 1 3 02 21 25
533001 B U 51 1 3 21 25
533002 B U 51 1 3 21 25
533101 B U 51 1 3 21 25
533102 B U 51 1 3 21 25
533201 B U 51 1 3 21 25
533202 B U 51 1 3 21 25
533301 B U 51 1 3 21 25
533302 B U 51 1 3 21 25
533401 B 52 21 25
533402 B 52 1 2 3 4 21 25
533421 B 52 1 2 3 4 21 25
533422 B 52 1 2 3 4 21 25
533501 B 52 1 2 3 4 21 25
533502 B 52 1 2 3 4 21 25
533521 B 52 21 25
533522 B 52 1 2 3 4 21 25
533601 B 52 1 2 3 4 21 25
533602 B 52 1 2 3 4 21 25
533621 B 52 1 2 3 4 21 25
533622 B 52 1 2 3 4 21 25
533701 B 52 21 25
533702 B 52 1 2 3 4 21 25
533721 B 52 1 2 3 4 21 25
533722 B 52 2 4 21 25
533802 B U 54 1 2 3 4 21 25
533902 B U 54 1 2 3 4 21 25
534002 B U 54 1 2 3 4 21 25
581001 B U 1 3 21 25
581002 B U C 1 3 21 25
581101 B U 1 3 21 25
581102 B U 1 3 21 25
581201 B U 1 3 21 25
581202 B U 1 3 21 25
Option Index B
Base part Finishes Clips Kondux pads In-Sil-8TM pads Semiconductor mounts Solderable pins Studs Clinch nuts
(page 110) (page 97–98) (page 86) (page 86) (page 90) (page 94) (page 96) (page 95)
Available Option codes for Aavid 12 digit part numbers. For additional information on option codes see "How to decipher
an Aavid 12 digit part number" on page 80. To find the appropriate Option Index for a selected part number please refer
to the main product section in the front of the catalog or "How to use this catalog" on page 2.
Ordering Codes
84
OPTION INDEX
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886 (2) 2698-9888 email: sales@aavid.com.tw
AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
500103 B U 01 02 04 05 07 1 3 06 08 09
500203 B U 01 02 04 05 09 1 3 06 08 09
500303 B U 01 02 03 04 05 1 3 06 08 09
500403 B U 01 02 03 04 05 1 3 06 08 09
501303 B U 01 03 04 05 07 1 3 13 06 07 08 09
501403 B U 01 02 03 05 07 1 3 13 06 08 17
501503 B U C 01 03 05 07 09 1 3 04 13 06 08 17
501603 B U C 01 02 04 05 07 1 3 13 14 08 17
505103 B U 01 02 03 04 05 1 3
505303 B U 01 02 03 04 05 1 3
505403 B U 01 02 03 04 05 1 3
506003 B U 13 14
506304 B U 01 53 14
519703 B U 01 03 04 05 07 1 3
519803 B U 01 03 04 05 07 1 3
519903 B U C 01 03 04 05 09 1 3
520103 B U C 01 04 05 07 09 1 3
520328 B U C
520329 B U C 08
566010 B U 28 31 34 37
566902 B U 31 37 39 40
569003 B U C 01 02 04 05 1 3 06 08 17
574204 B U 32 33
575603 B U C 01 03 04 05 1 3
575703 B U 01 03 04 05 1 3
575803 B U 01 04 05 07 09 1 3
575903 B U 01 03 04 05 07 1 3
576103 B U C 01 02 03 04 05 1 3
576203 B U C 01 02 03 04 05 1 3
576303 B U 01 02 04 05 1 3
576403 B U C 01 02 04 05 1 3
576802 B U C 31 32 33 37 39 40
576904 B U 01 02 03 05
577304 B U 01 02 03 05 01
577404 B U C 01 02 03 05 05 09 11
579003 B U 05
579604 B U 32 33
579704 B U 32 33
584000 B U 33 35
591202 B U 31 33 37 39 40
591302 B U 28 40
Option Index C
Base Part Finishes Wave-OnTM mounts KonduxTM In-Sil-8TM Semiconductor Solderable Solderable Solderable
(page 110) pads pads mounts tabs nuts studs
(page 89) (page 86) (page 86) (page 90) (page 91–93) (page 94) (page 96)
Available option codes for Aavid 12 digit part numbers. For additional information on option codes see "How to decipher
an Aavid 12 digit part number" on page 80. To find the appropriate Option Index for a selected part number please refer
to the main product section in the front of the catalog or "How to use this catalog" on page 2.
Ordering Codes
85
OPTION INDEX
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
6021 B U PB SF1 CNM1 G5
6022 B U PB SF1 SF2 CNM1
6025 PB B-TT TC-10 SF1 SF3 CNE42 G5
6109 B U PB MT MT5 TC-1 SE3 SE1 SF1 CNE42 G5
6110 B U PB MT SE1 SM3 CNE42
6225 B U PB MT TC-10 SF1 G5
6230 B U PB B-TT
6232 B U PB MT MT3 MT5 TC-1 SF1 G5
6238 B U PB MT MT5 MT6 G5
6239 B U MT
6374 B P2
6380 B P2 CNE42
6396 B P2 P3 CNM1 CNM2
6398 B TC-6 P2 CNE42 CNE43 G7
6399 B TC-6 P2 CNM2 G7
6400 B P2
7019 B U PB MT MT6 SE3 SF1 SNM1
7020 B U MT MT2 MT5 MT6 TC-10 TC-11 TC-12 SE3 CNM1 CNE42 8223-CL03 G5 G4
7021 B U MT MT5 MT6 TC-10 TC-11 TC-12 CNE42 8223-CL03 G5
7022 B U PB MT MT5 TC-1 TC-11 TC-12 SE3 SF1 8241-CL11 8223-CL03
7023 B U MT MT5 TC-1 TC-6 TC-7 TC-12 SNE2 G4
7025 B U MT MT3 MT6 TC-12 SE3 8223-CL03
Base Finishes Mounting Clips Solderable Device Clinch Solderable Alignment GrafoilTM
Part tabs studs & pins mtg. studs nuts nuts pads pads
(page 110) (page 93) (page 98) (page 94–96) (page 96) (page 95) (page 94) (page 87) (page 87)
Option Index D
Available option codes for Thermalloy origin part numbers. For additional information on option codes see "How to decipher
a Thermalloy Origin part number" on page 81. To find the appropriate Option Index for a selected part number, refer to the
main product section in the front of the catalog or "How to use this catalog" on page 2.
Ordering Codes
86
INTERFACE MATERIALS
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ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886 (2) 2698-9888 email: sales@aavid.com.tw
AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
In-Sil-8TM
When you need thermal conductance and elec-
trical isolation in one package, In-Sil-8TM Pads
offer you the best of both.These silicone-based
insulators come with thermally conductive
fillers to isolate up to 6000 volts AC. In-Sil-8TM
pads withstand the rigors of assembly, harsh
environments, and aging under continuous
use.You'll save time with these cost-effective
pads too; installation is 4 times faster than mica
and grease, and they won't contaminate solder
baths. Order In-Sil-8TM Pads with or without
pressure-sensitive adhesive, and in standard
or custom shapes.
The shape and hole pattern of the heat sink will determine the shape and hole
pattern of the pad. If you are ordering a heat sink which mounts to a semicon-
ductor on both sides, the ordering code for two pads should be used. To order
additional In-SilTM pads separate, or factory applied variations please contact
an Aavid sales rep for inquiries.
Interface Material/Pads
Thermal interface pads are thicker than double-sided tapes,
but can be provided without adhesive if removal of the pad
may be necessary. Pads can also be either electrically conduc-
tive or isolating. Performance of the interface pad is dependent
on maintaining correct, constant mounting pressure.
TO-3 TO-220 TO-218
Adhesive one side yes yes yes
Color Grey Grey Grey
Thickness 0.18 (0.007) 0.18 (0.007) 0.18 (0.007)
Thermal res. (°C/W) 0.33 1.25 0.77
Breakdown voltage 4000 4000 4000
Dielectric constant 5.5 5.5 5.5
Figure AB C
Kon-DuxTM
Kon-DuxTM interface pads are a cost-effective
alternative to thermally conductive grease
compounds. Aavid pre-applies Kon-DuxTM to
your heat sink to enhance heat conductance
from the semiconductor case and speed your
manufacturing process. Kon-DuxTM pads are
the equivalent of SoftfaceTM for low-volume
applications.This material is ideal for use with
small, discrete semiconductors.
TO-3 TO-220 TO-218
Color Black (metallic) Black (metallic) Black (metallic)
Thickness 0.13 (0.005) 0.13 (0.005) 0.13 (0.005)
Thermal resistance 0.08 °C-in2/W 0.08 °C-in2/W 0.08 °C-in2/W
Electrical resistivity 15 x 10-6 Ohms 15 x 10-6 Ohms 15 x 10-6 Ohms
Compression strength: 580 psi 580 psi 580 psi
for 10% reduction in thickness
Tensile strength 650 psi 650 psi 650 psi
Ultimate compression strength 12500 psi 12500 psi 12500 psi
Service temperature -240°C to +300°C -240°C to +300°C -240°C to +300°C
Liner None None None
Figure ABC
(1.650)
41.91
(1.140)
28.96
2X (0.093)
2.36
2X
(0.140)
3.56
ø
ø
507222B _ 0000
Ordering code
575703B _ 0000
Ordering code
ORDERING INFORMATION
example 12 digit part
ORDERING INFORMATION
example 12 digit part
MATERIAL PROPERTIES
Ordering code Description
0 No pads
3 One In-Sil-8TM pad
4 Two In-Sil-8TM pads
The shape and hole pattern of the heat sink will determine the shape and hole
pattern of the pad. If you are ordering a heat sink which mounts to a semicon-
ductor on both sides, the ordering code for two pads should be used.
Ordering code Description
0 No pads
1 One Kon-DuxTM pad
2 Two Kon-DuxTM pads
MATERIAL PROPERTIES
21.84
(0.860)
18.80
(0.740) 2.69
(0.160)
16.76
(0.660)
DIA
19.05
(0.750)
12.70
(0.500) 3.73
(0.147)
14.30
(0.563)
DIA
(1.562)
39.67
(1.050)
26.67
2X (0.218)
5.54
2X
(0.187)
4.75
ø
ø
DIA
19.05
(0.750)
15.24
(0.600)
4.09
(0.161)
4.57
(0.180)
DIA
15.88
(0.625)
10.67
(0.420)
3.81
(0.150)
13.20
(0.520)
DIA
Figure A Figure B Figure C
Figure A Figure B Figure C
*Factory applied only
87
INTERFACE MATERIALS
EUROPE
ASIA
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United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886 (2) 2698-9888 email: sales@aavid.com.tw
AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
Alignment Pads
GrafoilTM is a non-insulating material which
reduces interface thermal resistance in a
bare joint application. A dry material, basical-
ly a graphite compound, GrafoilTM was origi-
nally developed for high temperature gas-
keting applications and is covered by U.S.
Patent 3,404,061 granted to Union Carbide.
Basic shapes in stock are designed to acco-
modate TO-3, TO-218,TO-220, and Multiwatt
case styles. GrafoilTM is factory applied to the
heat sink and is available on all stamped and
extruded models.
ORDERING INFORMATION
Insulating Pads
Solderable alignment pads are an innovative way
to attach the heat sink to your transistor that could
cut your assembly time by more than half.
Alignment pads provide cost effective solderability,
while providing numerous additional benefits.
Alignment pads are factory applied and can be
bought separately as well. Please refer to accessory
Index D on page 85.
Suffix Device Figure
8223-CL03 TO-220 B
8241-CL11 TO-218 A
GrafoilTM Conducta-Pad
(1.000)
25.40
(0.030)
0.76
(0.122)
3.10
(0.985)
25.02
(0.520)
13.21
(1.200)
30.48
(0.860)
21.84
9.40
(0.370)
5.08
(0.200)
3.25
(0.128)
1
CLIP ASSEMBLY
C
L
(0.460)
11.68
(0.300)
7.62
(0.670)
17.02
0.51
(0.020)
TYP THK
14.22
(0.560)
3.18
(0.125)
0.76
(0.030)
(0.860)
21.84
5.08
(0.200)
(0.790)
20.07
(0.005)
0.13
(1.562)
39.67 (1.187)
30.15
(0.666)
16.90
(1.050)
26.67
(0.430)
10.92 (0.215)
5.46
2X (0.218)
5.54
2X
(0.187)
4.75
(0.072)
1.82
ø
ø
"F"
"A"
"B"
"C"
"D"
"E"
Note: Grafoil is used as an alternative to thermal grease, and provides essentially the same thermal performance.
Suffix Device Figure "A" Dim "B" Dim "C"Dim "D" Dim "E" Dim "F" Dim
G1 TO-3 A
G4 TO-218 B 19.30 (0.760) 4.83 (0.190) 7.87 (0.310) 15.75 (0.620) 3.81 (0.150) 0.13 (0.005)
G5 TO-220 B 16.51 (0.650) 3.43 (0.135) 5.33 (0.210) 10.67 (0.420) 3.43 (0.135) 0.13 (0.005)
G7 Multiwatt B 17.53 (0.690) 2.92 (0.115) 10.03 (0.395) 20.07 (0.790) 3.81 (0.150) 0.13 (0.005)
FIGURE A FIGURE B
Figure A
ORDERING INFORMATION
example
Thermalloy origin part 7022B–8223–CL03
A
6109 - -
A
example
Thermalloy origin part
B
A= Model number
B= Alignment pad
Figure B
Typical installation
B C
A= Model number
B= Finish
C= GrafoilTM pad
Shown with part number 8241-CL11 Recommended hole pattern for 8223-CL03 Recommended hole pattern for 8241-CL11
14.73
(0.580)
7.37
(0.290)
2.54
(0.100)
2.54
(0.100)
PLATED THRU HOLE PER
DEVICE MANUFACTURERS
RECOMMENDATION
2.95
(0.116)
DIA PLATED
THRU HOLE
25.40
(1.000)
12.70
(0.500)
5.46
(0.215)
2.95
(0.116)
DIA PLATED
THRU HOLE
5.46
(0.215)
1.60
(0.063)
DIA PLATED
THRU HOLE
TYP(3) TYP(2)
88
INTERFACE MATERIALS
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Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886 (2) 2698-9888 email: sales@aavid.com.tw
AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
Interface Material / Double Sided Tape
Ther-A-GripTM 1050 / T404 for ceramic or metal packages
Ther-A-GripTM 1050 uses a 0.001 inch (0.03 mm) Kapton MTTM
filled polymide film coated on both sides with high-bond
strength, pressure-sensitive acrylic adhesive that is loaded
with aluminum oxide particles. This provides both good
thermal performance and excellent electrical isolation.
Double-sided thermal tapes adhere the heat sink to the device and offer
good thermal characteristics.They are easy to apply, require no curing time,
can be electrically conductive or isolating, and need no mechanical support
to provide thermal or physical contact between the device and the heat sink.
Aavid can apply one side to a heat sink.
Color Beige
Electrical function Insulating
Thickness 0.127 mm (0.005)
Carrier Kapton MTTM
Thermal impedance 0.60 °C-in2/w
Thermal resistance 0.37 w/m-k
Breakdown voltage 5000 VAC
Volume resistivity 3 x 1014 Ohm-cm
UL flammability V-O
Lap shear adhesion 125 (0.862) psi
Die shear adhesion
Aluminum 25°C130 psi
Aluminum 150°C50 psi
Alum. Oxide 25°C170 psi
Alum. Oxide 150°C50 psi
Creep adhesion
25°C @ 12psi >50 days
150°C @ 12psi >50 days
Ther-A-GripTM 1070 / T405 for ceramic or metal packages
Ther-A-GripTM 1070 uses a 0.002 inch (0.05 mm) aluminum foil core coated
on both sides with high-bond strength, pressure-sensitive acrylic adhesive
that is loaded with aluminum oxide particles. The aluminum foil provides
added thermal conductivity for applications where electrical isolation is not
required. The combination of filter, expanded metal and embossed surface
enhances both tape conformability and thermal performance.
Ther-A-GripTM 1090 / T412 for ceramic or metal packages
Ther-A-GripTM 1090 uses an expanded foil carrier
coated on both sides with high-bond strength,
pressure sensitive acrylic that is loaded with titanium
diboride particles. The combination of filter, expand-
ed metal and embossed surface enhances both tape
conformability and thermal performance.
Color Grey
Electrical Function Conductive
Thickness 0.009 (0.23 )
Carrier Expanded aluminum
Thermal impedance 0.25 °C-in2/w
Thermal conductivity 1.40 w/m-k
Breakdown voltage N/A
Volume resistivity N/A
UL flammability N/A
Lap shear adhesion 70 psi
Die shear adhesion
Aluminum 25°C135 psi
Aluminum 150°C25 psi
Alum.oxide 25°C125 psi
Alum.oxide 150°C40 psi
Creep adhesion
25°C @ 12 psi >50 days
150°C @ 12 psi >10 days
T410 / T411 for plastic packages
T410 thermally conductive tape consists of a high bond strength,
pressure sensitive acrylic adhesive loaded with aluminum oxide and
coated onto a 0.002 inch (0.05mm) aluminum foil carrier. The other
side of the foil carrier has a silicone pressure sensitive adhesive which
provides excellent adhesion to silicone-contaminated plastics and
other low energy surfaces.
T411 thermally conductive tape consists of a high bond strength,
pressure sensitive adhesive with an aluminum mesh carrier layer.The
mesh carrier allows the tape to conform to curved surfaces of plastic
molded IC packages, providing a high adhesive strength attachment
for heat sinks.The high performance silicone PSA allows adhesion to
silicone-contaminated plastics and other low energy surfaces.
Typical properties T410 T411
Construction Acrylic Silicone
Adhesive (to heat sink side)
Color White Clear (silver)
Carrier Aluminum foil Aluminum mesh
Adhesive (onto component side) Silicone Silicone
Color (to component side) Clear (Silver) Clear (Silver)
Thickness, mm (inch) 0.18 (0.007) 0.28 (0.011)
Thermal impedance @<1 psi °C-cm2/w (°C-in2/w) 7.1 (1.1) 6.5 (1.0)
Operating temperature range, °C-50 to + 150 -50 to + 150
Lap shear adhesion, psi (MPa) 60 (0.414) 14 (0.094)
Die shear adhesion, psi (MPa) steel/FR4
25°C170 (1.172) 80 (0.552)
125 °C40 (0.276) 20 (0.138)
Note: Double Sided Tapes are factory applied only.
Color White
Electrical Function Conductive
Thickness 0.006 (0.015)
Carrier Aluminum
Thermal Impedance 0.54 °C-in2/w
Thermal Conductivity 0.50 w/m-k
Breakdown Voltage N/A
Volume Resistivity 3 x 10-2 Ohm-cm
UL Flammability 94V-0
Rating U.L.94
Lap Shear Adhesion 134 psi
Die Shear Adhesion
Aluminum 25°C125 psi
Aluminum 150°C55 psi
Alum.Oxide 25°C145 psi
Alum.Oxide 150°C60 psi
Creep Adhesion
25°C @ 12 psi >50 days
150°C @ 12 psi >50 days
375224B000 _ _
Ordering code
ORDERING INFORMATION
example 12 digit part
Ordering code Tape option
31 T404
32 T405
33 T412
34 T410
35 T411
89
LABOR SAVING HEAT SINK TO BOARD & DEVICE TO HEAT SINK MOUNTS
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Taiwan Tel: +886 (2) 2698-9888 email: sales@aavid.com.tw
AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
Wave-OnTM Mounts
Wave-OnTM Mounts
"D"
"C"
"B"
"A"
7.92
(0.312)
Ordering code Model “A”Dim “B”Dim “C”Dim “D”Dim
01 E 4.32 (0.170) 2.54 (0.100) 2.54 (0.100) 0.96 (0.038) #6-32
02 EA 3.43 (0.135) 2.54 (0.100) 2.54 (0.100) 0.96 (0.038) #4-40
03 EG 3.43 (0.135) 2.54 (0.100) 1.14 (0.045) 0.96 (0.038) #4-40
04 EH 4.32 (0.170) 3.43 (0.135) 2.54 (0.100) 0.96 (0.038) #6-32
05 EK 4.32 (0.170) 2.54 (0.100) 1.14 (0.045) 0.96 (0.038) #6-32
07 EM 4.32 (0.170) 2.54 (0.100) 2.54 (0.100) 0.96 (0.038) 3.5MM
09 ER 4.32 (0.170) 2.54 (0.100) 5.08 (0.200) 0.96 (0.038) #6-32
Solderable mounts can be factory installed to practically
every board-mountable heat sink and flat sided extrusion.
The female threaded through holes permit pre-assembly
to the semiconductor via machine screws , allowing the
heat sink/semiconductor package to be treated as one unit
when fitted in PC board through holes for wave soldering.
Threaded
thru holes
PCB
thickness “T”
Model
EA, EG 3.68 (0.145) 1.57 (0.062)
E, EK, EM, ER 4.75 (0.187) 1.57 (0.062)
EH, EP 4.75 (0.187) 2.29 (0.090)
Dia of PCB Plated
thru hole
ORDERING INFORMATION
example part
FEATURES
Saves production time and cost
•Cuts production steps by half
•Factory installation eliminates steps
•Permits soldering in one step
•All the benefits of female threaded mount
•Automated fastening
•Excellent solderability
Better thermal performance
•Built in stand-off adds air space between PC
and heat sink for improved air flow and easier
cleaning reduces inventory requirements
•No lockwashers, nuts or separate mounts
with various thread lengths
574802B0 _ _ 00
Ordering code
DIM "C"
STAND-OFF LENGTH
DIM "T"
PC BOARD
HEAT SINK
Typical Wave-OnTM mount installation
90
LABOR SAVING HEAT SINK TO BOARD & DEVICE TO HEAT SINK MOUNTS
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www.aavidthermalloy.com
Semiconductor Mounts
Ordering code Thread “A”Dim “B”Dim “C”Dim “D”Dim
01 #6-32 7.11 (0.280) 4.75 (0.187) 1.78 (0.070) 2.74 (0.108)
02 #4-40 6.35 (0.250) 4.19 (0.165) 1.78 (0.070) 2.74 (0.108)
03 3.00(0.118) 6.35 (0.250) 4.22 (0.166) 1.50 (0.059) 2.47 (0.097)
ORDERING INFORMATION
example 12 digit part
Female Semiconductor Mounts
•Fastens semiconductor to heat sink fast and efficiently
•Up to 10 times faster than fastening with standard
nuts and bolts
•Used with most JEDEC case sizes, factory installed
"A"
"B"
"C" "D"
Ordering code Thread
04 #6-32
05 #4-40
507302B000 _ _
Ordering code
ORDERING INFORMATION
example 12 digit part
Male Semiconductor Mounts
•Captive male studs for semiconductor attachments
•Used with most JEDEC case sizes, factory installed
MALE SEMICONDUCTOR
MOUNT
9.65
(0.380) 0.63
(0.025)
"C"
"A"
INSTALL
MOUNT
542502B000 _ _
Ordering code
91
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www.aavidthermalloy.com
3.56
(0.140)
1.27
(0.050)
6.35
(0.250)
0.76
(0.030)
4.37
(0.172)
4.06
(0.160)
1.57
(0.062)
0.51
(0.020) 1.02
(0.040)
2.79
(0.110)
9.53
(0.375)
6.10
(0.240)
6.10
(0.240)
Tab ordering code 31 Tab ordering code 32
Tabs
Aavid’s Shur-Lock™ self locking stand-off tab (U.S. Patent #5,437,561)
positively secures any heat sink to the printed circuit board.This Shur-Lock™
tab exhibits many unique design features.
The rounded and bifurcated tip of the Shur-Lock™ solderable tab has been
designed to easily snap into any 0.093”diameter hole. Once through the
hole, the tab provides a positive resistance to backing or falling out of the
hole. In addition, the spring action between the tab and the plated through
hole prevents leaning or lift-off of the heat sink prior to or during the solder-
ing process.The tip extension of the Shur-Lock™ tab has been designed to
protrude less than 0.060”beyond the back of a standard .0625”PC board,
which is below the normal lead trimming allowance for assembled PCBs.
Shur-Lock’s™ stand-off design facilitates the cleaning of assembled PCBs
and permits electrical traces to be routed under the heat sink.The wide base
supports of the tab further improve the stability of the heat sink assembly.
•Positive PCB engagement
•Integrated PCB stand-off
•Quick “snap-in”assembly design
•Reduces installed assembly cost
•Designed for rugged shock
and vibration environments
•Can be installed on a variety of stamped
and extruded board level heat sinks
1.58
(0.062)
2.67
(0.105)
6.35
(0.250)
10.41
(0.410)
6.35
(0.250)
0.76
(0.030)
Variations of the above specifications are possible. Contact Aavid Thermalloy for
additional details for use with thicker PCB sizes, such as, .093”or other hole diameters.
*Vertical force applied to the sink-tab joint.
Material Spring steel
Finish Tin plating over a copper flash
Pull-out force* 70 lbs/tab minimum
Recommended
PCB hole diameter 0.092”- 0.096
PCB thickness .065”- 0.068”
PRODUCT INFORMATION
FEATURES
TM
Shur-LockTM Tabs
Tab ordering code 28
574802B0 _ _ 00
Ordering code
ORDERING INFORMATION
example 12 digit part
Aavid solderable tabs stake onto heat sinks for solder mounting into the
PC board.The tabs are available in a variety of lengths, widths and thickness.
Tabs are factory applied for both vertical and horizontal mountings includ-
ing: step tabs, which keep the heat sink elevated above the board, and tabs
with a triangular base for extra stability.
Many of Aavid’s tabs are customized. Below are examples of standard tabs.
Please consult Aavid’s customer service department for information about
other tab options.
574802B0 _ _ 00
Ordering code
ORDERING INFORMATION
example 12 digit part
TM
Solderable Staked on Tabs
Factory applied only
92
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AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
Note: The drawing above shows the right hand of a matched pair which are supplied,
mounted to the heat sink.
6.10
(0.240)
1.57
(0.062)
8.89
(0.350)
0.51
(0.020)
0.76
(0.030)
15.62
(0.615)
C
L
R
Tabs
7.87
(0.310)
6.10
(0.240)
12.14
(0.478)
0.81
(0.032)
1.90
(0.075)
0.76
(0.030)
0.64
(0.025)
1.75
(0.069)
7.11
(0.280)
5.03
(0.198)
Tab ordering code 33 Tab ordering code 34
12.95
(0.510)
6.10
(0.240)
0.81
(0.032)
2.46
(0.097)
1.63
(0.064)
7.11
(0.280)
5.08
(0.200)
5.08
(0.200) 2.41
(0.095)
8.89
(0.350)
1.78
(0.070)
0.81
(0.032)
Tab ordering code 35 Tab ordering code 36
6.35
(0.250)
9.53
(0.375)
6.35
(0.250)
15.88
(0.625)
3.18
(0.125)
1.60
(0.063)
0.51
(0.020) 1.02
(0.040)
6.35
(0.250)
9.53
(0.375)
15.88
(0.625)
1.27
(0.050)
0.81
(0.032) 1.63
(0.064)
Tab ordering code 37 Tab ordering code 39
93
LABOR SAVING HEAT SINK TO BOARD & DEVICE TO HEAT SINK MOUNTS
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www.aavidthermalloy.com
Tabs
Solderable Mounting Tabs
Heat sinks ordered with solderable mounting
tabs have tin-plated spring steel tabs per-
manantly locked onto the heat sink to provide
wave solderability.The solderable tabs are
mounted on the heat sink after anodizing,
thus eliminating any special coating or han-
dling.The result is a wave solderable heat sink
with black anodized performance.
Suffix Ordering code Stand-off height Features “A”DIM “B”DIM Figure
MT 53 5.21(0.205) Solderable mounting tab 15.88 (0.625) 4.83 (0.190) A 2.90 ± 0.10 (0.114 ± 0.004)
MT2 54 8.51 (0.335) Solderable mounting tab 19.18 (0.755) 8.13 (0.320) A 2.90 ± 0.10 (0.114 ± 0.004)
MT3 55 5.21 (0.205) 50 degree beveled corners on stand-off portion reducing board footprint 15.88 (0.625) 4.83 (0.190) A 2.90 ± 0.10 (0.114 ± 0.004)
from 7.87 (0.310) to 4.83 (0.190)width. Only tab with this feature.
MT5 56 5.21 (0.205) Bifurcated tabs in lieu of triangular shape 15.88 (0.625) 4.83 (0.190) B 2.95 ± 0.05 (0.116 ± 0.002)
MT6 57 2.92 (0.115) Bifurcated tabs in lieu of triangular shape 13.59 (0.535) 2.54 (0.100) B 2.95 ± 0.05 (0.116 ± 0.002)
7.62
(0.300)
(0.310)
(0.090)
2.03
(0.080)
3.18
(0.125)
2.28
7.87
"A"
"B"
(0.190)
MT3 ONLY
4.83 BEVELED
CORNERS
MT3 ONLY
3.09
(0.122)
2.79
(0.110)
(0.310)
7.87
3.18
(0.125)
7.62
(0.300)
DETAIL B
SEE DETAIL B
"A"
"B"
Notes: Mounting tabs have unique locking features built into their design. Aavid Thermalloy adds
to standard and custom heat sinks. For this reason, the tabs are factory applied, and cannot be sold
seperately. Please see page 85 for additional tab options.
574802B0 _ _ 00
Ordering code
6070B–
B
ORDERING INFORMATION
example 12 digit part
example
Thermalloy origin part
FIGURE B
FIGURE A
A
A= Model number
B= Mounting tab suffix
TRIANGULAR
TAB
"A" REF
ADD TO
HEIGHT OF PART
Typical Installation
Recommended
PCB plated
thru hole:
0.81
(0.032)
1.63
(0.064)
6.35
(0.250)
6.32
(0.245)
1.27
(0.050)
12.57
(0.495)
C
L
6.35
(0.250)
3.18
(0.125)
1.27
(0.050)
3.18
(0.125)
1.02
(0.040)
6.35
(0.250)
15.88
(0.625)
0.51
(0.020)
Tab ordering code 40 Tab ordering code 43
94
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AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
Solderable Pins / Solderable Nuts
Solderable nuts are permanently swaged into the heat sink
for quick pre-assembly with the transistor. Screws are used
to mount to the heat sink and are installed from the top.
Solderable nuts feature a closed end that prevents solder
from wicking into threads and trapping contaminants or flux.
Heat sink and transistor are then handled as a single compo-
nent and dropped into plated-thru holes in the PC board for
wave soldering. (Solderable nuts require slightly larger printed
circuit board hole sizes)
•Pre-mounted to heat sink at factory
•Ease of pre-assembly in production
•Mechanical and electrical integrity
•Wave solderability
Solderable Nuts
Note: If a part number requires 2 solderable nuts, simply add a "/2" after the solderable
nut character suffix on Thermalloy origin parts.
FEATURES
Suffix Ordering code Dia of PCB thru hole Thread
SNM-1 N/A 3.81, 4.78 (0.150, 0.188) M3X0.5
SNE-1 14 3.81, 4.78 (0.150, 0.188) 4-40 UNC-2B
SNE-2 13 3.81, 4.78 (0.150, 0.188) 6-32 UNC-2B
(0.170)
4.32
(0.050)
1.27
(0.129)
3.28
(0.140)
3.56
ø
SOLDERABLE NUT
(0.170)
4.32
SOLDERABLE
NUT
(0.129)
3.28
(0.140)
3.56
C
L
(0.065)
1.65
ø
THREAD
7.62
(0.300)
ø
7.75
(0.305)
3.56
(0.140)
3.28
(0.129)
4.32
(0.170)
Mechanical drawings showing heat sinks with solderable nuts
506003B0 _ _ 00
Ordering code
7019B–
B
ORDERING INFORMATION
example 12 digit part
example
Thermalloy origin part
A
A= Model number
B= Solderable nut suffix
Vertically mounted, extruded heat sinks are
converted to wave solderable with the addition
of solderable roll pins. Roll pins are available
with stand-off shoulders in different heights for
easier cleaning after wave soldering.
Suffix Ordering code Description Stand-off height “A”DIM “B”DIM Figure
P2 21 Solid pin w/stand-off shoulder 0.050" 0.050 + 0.015/-0.005 (1.27+ 0.38/-0.13) 0.050 0.155 A
P3 N/A Solid pin w/stand-off shoulder 0.125" 0.125 + 0.015/0.005 (3.18 + 0.38/-0.13) 0.125 0.130 A
NA 25 Solid solderable pin B
Solderable Pins
12.70
(0.500)
4.45
(0.175)
2.34
(0.092)
Typical installation P2-P3
529902B0 _ _ 00
Ordering code
ORDERING INFORMATION
example 12 digit part
FIGURE B
(0.097)
2.46
(0.095)
2.41
(0.216)
5.49
(0.500)
12.70
ø
ø
"A"
"B"
FIGURE A
Stand-Off Shoulder
Heat sink
PC Board
"A"
Pin 25
1.27
(0.500)
2.41
(0.095)
REF
5.49
(0.216)
REF
2.46
(0.097)
REF
3.96 ± 0.51
(0.156 ± 0.020)
Pin P2-P3
6396B–
B
example
Thermalloy origin part
A
A= Model number
B= Solid pin suffix
95
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www.aavidthermalloy.com
Clinch Nuts
Clinch nuts are threaded nuts that allow quick assembly of the
transistor to the heat sink. A single screw mounts the transistor
to the heat sink, reducing your hardware requirements. Clinch
nuts are permanently pressed into the heat sink, and come in a
variety of English and Metric threads–CNE designates an English
thread, and CNM designates a Metric thread.
Note: Minimum recommended distance from center line of mounting hole to material edge:
4.83 (0.190) for 4-40
4.80 (0.189) for M3
Clinch Nuts
Suffix Ordering code Thread “A”Dim “B”Dim Figure Min mat'l thickness
CNE42 12 4-40 UNC-2B 0.96 (0.038) A 1.02 (0.040)
CNE43 N/A 4-40 UNC-2B 1.37 (0.054) A 1.42 (0.056)
CNM1 13 M3 X 0.5 0.76 (0.030) 4.06 (0.160) B 0.79/0.99 (0.031/0.039)
CNM2 N/A M3 X 0.5 0.96 (0.038) 4.22 (0.166) B 0.79/0.99 (0.031/0.039)
CLINCH NUT
CLINCH NUT
INSTALLED
(0.248)
6.30
"A"
1.50
(0.059)
"B"
"A"
SECTION A-A
"A"
1.78
(0.070)
6.35
(0.250
"A"
Mechanical drawing showing heat sink with clinch nut
529801B000 _ _
Ordering code
7019B–
A
ORDERING INFORMATION
example 12 digit part
example
Thermalloy origin part
FIGURE A FIGURE B
B
A= Model number
B= Clinch nut suffix
96
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Taiwan Tel: +886 (2) 2698-9888 email: sales@aavid.com.tw
AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
Solderable Studs
Studs
Threaded solderable studs are permanently swaged in place
for quick pre-assembly with the transistor. The device is
placed over the stud (s) followed by the lock washer and
nut. This entire component is then dropped into plated-thru
holes in the printed circuit board for wave soldering.The
end of the stud is tin-plated for excellent solderability and
extends only 0.040" below a 0.062" PC board to clear lead
trimming saws.
Device mounting studs for "Thermalloy-origin"
items are available as options on certain vertical
and board mount heat sinks as a labor-saving aid
for mounting semiconductors.This optional feature
speeds production assembly time and reduces
hardware requirements.
Device Mounting Studs
Suffix Ordering code Dia of PCB thru hole “A”Dim “B”Dim “C”Dim Figure
SE-1 08 3.81, 4.78 (0.150, 0.188) 8.89 (0.350) 6-32 1.13-1.26 (0.045-0.050) A
SE-2 06 3.81, 4.78 (0.150, 0.188) 12.32 (0.485) 6-32 1.14-1.27 (0.045-0.050) A
SE-3 09 3.81, 4.78 (0.150, 0.188) 8.89 (0.350) 4-40 1.14-1.26 (0.045-0.050) A
SE-4 14 4.78 (0.188) 8.89 (0.350) 6-32 3.05 (0.120) B
SM-1 17 3.81, 4.78 (0.150, 0.188) 8.89 (0.350) M3 x 0.5 3.05 (0.120) B
SM-3 07 3.81, 4.78 (0.150, 0.188) 8.89 (0.350) M3 x 0.5 1.13-1.26 (0.045-0.050) A
Suffix Ordering code Dia of PCB thru hole “A”Dim “B”Dim “C”Dim “D”Dim
SF1 11 3.18 (0.125) 7.92 (0.312) 4-40 UNC-2A 0.25 (0.010) 4.75 (0.187)
SF2 N/A 3.18 0.125) 8.00 (0.315) M3 x 0.5 0.25 (0.010) 4.60 (0.181)
SF3 N/A 3.48 (0.137) 7.92 (0.312) 6-32 UNC-2A 0.25 (0.010) 5.23 (0.206)
"B"
"D"
"A"
"C"
C
L
Device
Mounting
Stud
Mechanical drawing showing heat sink with device mounting studs
PC BOARD
"C" "C"
HEAT
SINK
PC BOARD
HEAT
SINK
5.49
(0.216)
ø
"A"
"B"
"C"
501303B000 _ _
Ordering code
7022B–
B
529801B000 _ _
Ordering code
7019B–
B
ORDERING INFORMATION
example 12 digit part
example
Thermalloy origin part
ORDERING INFORMATION
example 12 digit part
example
Thermalloy origin part
A
A= Model number
B= Stud Suffix
A
A= Model number
B= Stud suffix
FIGURE B
FIGURE A
Typical installation
Note: Factory installed only
Note: Factory installed only
97
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AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
Aavid Kool-KlipsTM
Clips
These one piece stainless steel clips eliminate the need for
screws, lock washers and nuts in the assembly process, there-
fore reducing assembly time and cost.These can be bought
separately, or found in the 11th or 12th position when deci-
phering an Aavid Standard product. Please reference Indexes
to see which clips are popular with which product offering.
Note: These clips are sold separately using Aavid part number
below.
Part Number Transistor case style Ordering code
115000F00000 TO-220, TO-218 50
115100F00000 TO-220, TO-218 51
115200F00000 TO-220, TO-218 52
115300F00000 TO-220, TO-218 53
115400F00000 TO-220 54
116200F00000 TO-220, TO-218 62
5901 TO-220,TO-218,TO-247 Sold separately only
6801 TO-220,TO-218,TO-247 Sold separately only
7701 TO-220 Sold separately only
6.60
(0.260)
25.65
(1.010)
7.62
(0.300)
13.84
(0.545)
12.06
(0.475)
3.18
(0.125)
7.92
(0.312)
5.97
(0.235)
10.92
(0.430)
14.22
(0.560)
30.61
(1.205)
8.69
(0.342)
6.60
(0.260)
12.70
(0.500)
30.60
(1.205)
8.70
(0.342) 12.70
(0.500)
6.60
(0.260)
39.10
(1.540)
13.50
(0.530)
6.60
(0.260)
115000F00000 Code 50 115100F00000 Code 51
115200F00000 Code 52 115300F00000 Code 53
115400F00000 Code 54 116200F00000 Code 62
530101B000 _ _
Ordering code
ORDERING INFORMATION
example 12 digit part
37.08
(1.460)
7.24
(0.285)
3.99
(0.157)
5901
6801
37.10
(1.461)
14.25
(0.561)
7.54
(0.297)
4.75
(0.187)
16.00
(0.630)
11.00
(0.433)
6.60
(0.260)
7701
98
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www.aavidthermalloy.com
Clips
Thermal Clips
Factory-Installed ONLY thermal clips, available on many stan-
dard heat sinks (shown below) eliminate the use of screws and
nuts in assembling the heat sink and transistor. Plastic case tran-
sistors slip into place for easy assembly. Thermal clips are avail-
able in a variety of configurations. Locking clips have an internal
tab to lock the transistor permanently in place.
Suffix Ordering code Transistor case style Clip/Cover features
TC1 32 TO-220 Locking
TC6 36 TO-218, TO-220, Multiwatt Locking
TC7 N/A ITO-218, TO-220, Multiwatt Insulated
TC10 33 TO-220, TO-218 Locking
TC11 34 TO-220 Insulated
TC12 35 TO-218, TO-220 Locking
(1.138)
28.91
(0.700)
17.78
(0.400)
10.16
(0.500)
12.70
(0.750)
19.05
(0.207)
5.26
6.35
(0.250)
10.16
(0.400)
11.81
(0.465)
28.91
(1.138)
10.16
(0.400)
6.35
(0.250)
12.70
(0.500)
19.05
(0.750)
28.91
(1.138)
10.16
(0.400)
6.35
(0.250)
12.70
(0.500)
28.90
(1.138)
6.98
(0.275)
(0.155)
3.94
(0.465)
11.82
(0.700)
17.78
(0.202)
5.13
(1.138)
28.90
(0.400)
10.16
17.78
(0.700)
6.35
(0.250)
11.82
(0.465)
19.90
(0.783)
28.88
(1.137)
TC-1 Code 32 TC-6 Code 36
TC-7 Code N/A TC-10 Code 33
TC-11 Code 34 TC-12 Code 35
7023B–
B
ORDERING INFORMATION
example 12 digit part 530600B000 _ _
Ordering code
example
Thermalloy origin part
A
A= Model number
B= Clip suffix
99
ACCESSORIES
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Italy Tel: +39 051 764011 email: sales.it@aavid.com
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Mounting Kits
5
2
1
3
6
4
TRANSISTOR
NOT INCLUDED
5
1
23
7
6
4
TRANSISTOR
NOT INCLUDE
D
•Pre-packaged in heat-sealed plastic bags for use on assembly line.
•Stock mounting hardware using one number for better control and
identification. Part number can be printed on the bag if requested.
•Standard kit contains ThermalfilmTM insulator. For high maximum
operating temperatures (550ºC), order a mica insulator by adding
suffix letter “M”to the part number. For electrical isolation and excel-
lent thermal resistance, use ThermalsilTM III for an insulator by adding
suffix letter “S”to the part number.
•Other insulator materials available include: hard anodized
aluminum and aluminum oxide.
•Refer to proper product section for drawings of insulators
and shoulder washers used in the mounting kits.
Note: Smooth side of flat washer should be placed against insulator when using the kit.
TO-220 Mounting Kit part number 4880
Part Number Item Qty Description
1 1 Insulator
43-77-9 ThermalfilmTM (see page xxx)
(56-77-9) Mica (see page xxx)
(53-77-9) ThermalsilTM III (see page xxx)
7721-7PPS 2 1 Shoulder washer
MS15795-804 3 1 Flat washer #4
No. 4-40 UNC-2B
MS35649-244 4 1 Hex nut
No. 4-40 UNC-2A X
MS51957-17 5 1 1/2 Long phillips pan head screw
MS35338-135 6 1 Lock washer, No. 4
No. 4880 (ThermalfilmTM)
No. 4880M (Mica Insulator)
No. 4880S (ThermalsilTM III)
TO-3 Mounting Kit part number 4804
Part Number Item Qty Description
1 1 Insulator
43-03-2 ThermalfilmTM (see page xxx)
(56-03-2) Mica (see page xxx)
(53-03-2) ThermalsilTM III (see page xxx)
7721-5PPS 2 2 Shoulder washer
MS15795-805 3 2 Flat washer #6
MS35649-264 4 2 No. 6-32 UNC-2B
Hex nut
MS 51957-30 5 2 No. 6-32 UNC-2A X
1/2 Long phillips pan head screw
MS35338-136 6 2 Lock washer, No. 6
322-156 7 1 Solder lug
No. 4804 (Thermalfilm)
No. 4804M (Mica Insulator)
No. 4804S (Thermalsil III)
FEATURES
ORDERING INFORMATION
Note: Smooth side of flat washer should be placed against insulator when using the kit.
ORDERING INFORMATION
100
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•40% glass filled polyphenylene sulfide (PPS).
•Chemically inert [no known solvents under 200ºC (392ºF).
•Maximum recommended service temperature of 260ºC (500ºF).
•Recommended torque is .565Nm to .678Nm (5 to 6 inch-pounds)
on all shoulder washers except –7, which has recommended
torque of .452Nm (4 inch-pounds).
"A"
"E"
"D"
DIA
"B"
"C"
Shoulder
Washer
Note: A single gate extension, not to exceed 0.64 (0.025) in length, is allowable on the outside of all shoulder washers.
* Design allows insertion in the tab of a TO-220.
** Also for M3 screw.
Material is nylon type 6
FIGURE A
"A"
5.59
(0.220)
"E"
DIA
FIGURE B
"A"
"B"
0.33
(0.013)
"C"
"D"
"E"
Insulating Shoulder Washers
Polyphenylene Sulfide PPS Shoulder Washers
Nylon Shoulder Washers
Part Number “A”Dim “B”DIM “C" Dim "D" Dim "E" Dim Screw size Figure
7721-1PPS 7.11 (0.280) 3.18 (0.125) 1.07 (0.042) 2.84 (0.112) 3.81 (0.150) 4 A
7721-2PPS 7.11 (0.280) 4.70 (0.185) 1.07 (0.042) 2.84 (0.112) 3.81 (0.150) 4 A
7721-3PPS 7.11 (0.280) 3.18 (0.125) 1.07 (0.042) 2.84 (0.112) 3.56 (0.140) 4 A
7721-5PPS 7.92 (0.312) 0.79 (0.031) 1.19 (0.047) 3.66 (0.144) 4.50 (0.177) 6 A
7721-6PPS 7.11 (0.280) 0.79 (0.031) 1.19 (0.047) 3.00 (0.118) 3.68 (0.145) 4 A
7721-7PPS* 5.46 (0.215) 0.81 (0.032) 1.02 (0.040) 2.95 (0.116) 3.43 (0.135) 4 A
7721-10PPS 7.62 (0.300) 2.41 (0.095) 1.40 (0.055) 2.97 (0.117) 3.56 (0.140) 4 B
Part Number “A”DIM “B”DIM "C" Dim "D" Dim "E" Dim
7721-11N 7.80 / 8.05 (0.307 / 0.317) 2.87 / 3.00 (0.113 / 0.118) 3.56 / 3.81 (0.140 / 0.150) 3.76 / 3.89 (0.148 / 0.153) 1.09 / 1.35 (0.043 / 0.053)
7721-13N 5.89 / 6.05 (0.232 / 0.238) 2.87 / 3.00 (0.113 / 0.118) N/A 3.43 / 3.56 (0.135 / 0.140) 1.19 / 1.40 (0.047 / 0.055)
7721-15N 5.59 / 6.10 (0.220 / 0.240) 2.90 / 2.95 (0.114 / 0.116) 1.73 / 1.91 (0.068 / 0.075) 3.43 / 3.58 (0.135 / 0.140) .51 / .64 (0.020 / 0.025)
FEATURES
Note: This figure is common to
figures A and B
**
101
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"A"
"B"
"A"
"B"
C DIA
TYP
(3)
"C"
DIA
TYP
(4)
"B"
30.15
(1.187)
10.92
(0.430)
"A"
1.83
(0.072)
"C"
DIA
TYP (2)
"D"
DIA
TYP (2)
"A"
"B"
"C"
"D"
DIA
Insulators – Thermalfilm™ and Thermalfilm™ MT
Part Number “A”DIM “B”DIM “C”DIM “D”DIM
43-03-2 42.04(1.655) 27.00(1.063) 3.96(0.156) 1.57(0.062)
43-03-4 39.70(1.563) 26.67(1.050) 3.56(0.140) 1.57(0.062)
Thermalfilm™ for TO-3
Thermalfilm™ for TO-5 and TO-18
Thermalfilm™ for TO-220,TO-126, Case 77, Case 199, Case 90,TO-218 and TO-3P
Part Number Device Figure “A”DIM “B”DIM “C”DIM
43-05-1 TO-5 A 9.91(0.390) 5.08(0.200) 0.91(0.036)
43-05-2 TO-5 B 9.91(0.390) 5.08(0.200) 0.91(0.036)
43-18-1 TO-18 A 6.35(0.250) 2.54(0.100) 0.91(0.036)
Part Number Device “A”DIM “B”DIM “C”DIM “D”DIM
43-77-1 TO-126, Case 77 11.10 (0.437) 7.92 (0.312) 3.56 (0.140) 2.36 (0.093)
43-77-2 Case 90,Case 199 17.45 (0.687) 14.27 (0.562) 5.54 (0.218) 3.18 (0.125)
43-77-8 Case 90,Case 199 18.92 (0.745) 13.84 (0.545) 5.38 (0.212) 3.81 (0.150)
43-77-9 TO-220 18.42 (0.725) 13.21 (0.520) 4.32 (0.170) 2.92 (0.115)
46-77-9* TO-220 18.42 (0.725) 13.21 (0.520) 4.32 (0.170) 2.92 (0.115)
43-77-20 TO-220,TO-218,TO-3P 23.24 (0.915) 18.80 (0.740) 6.98 (0.275) 3.66 (0.144)
ORDERING INFORMATION
ORDERING INFORMATION
ORDERING INFORMATION
FIGURE A FIGURE B
* ThermalfilmTM MT part numbers begin with “46”
ThermalfilmTM information on page 102
ThermalfilmTM information on page 102
ThermalfilmTM information on page 102
102
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THERMALFILM™ MT
177.2 x 103volts/mm
(4500 volts/mm)
4.3
0.002
1017 ohm-cm
1016 ohms
465 volts
100.000 megohm mfds.
103 MPa (1500 psi)
0.31 MPa (45 psi)
35,433 gm/mm (900 gm/mil)
1.78 gm/cm3(111.1 lb/ft3)
>10,000 cycles
NONE
815ºC (1499ºF)
435ºC (815ºF)
525ºC (977ºF)
-260ºC to 240ºC
(-436ºF to 464ºF)
0.379 Wm-’K’
(.219 BTU/hr-ft-ºF)
V-0, UL “E”card E39505
Thermalfilm™ and Thermalfilm™ MT are low cost polymide plastic insulating films designed
to be an improved replacement for mica.These insulators have a distinctive amber color and
can be easily recognized and assembled on a production line.
Thermalfilm™ MT, made from high performance Kapton™ MT material, provides thermal
conductivity nearly 2-5 times greater than standard Thermalfilm™. Both insulators have
an extremely high resistance to flow or thin out under high compressive stresses, particularly
at elevated temperatures. Excellent physical, mechanical and electrical properties remain
nearly constant over a wide range of temperatures and frequencies.They are radiation
resistant, have no melting points, and have no known organic solvents.The polymide plastic
film is UL listed as a component in UL’s publication “Component – Plastic Material”dated
September 18, 1969. The UL card number is E39505R, Guide QMFZ2 filed by E. I. du Pont de
Nemours & Co., Inc. ThermalfilmTM is rated 94-V/0.
PROPERTY
Dielectric strength
Dielectric constant
Dissipation factor
Volume resistivity
Surface resistivity
Corona start voltage .025mm (1-mil)
Insulation resistance
Ultimate tensile strength (MD)
Bursting strength Test (Mullen)
Tear strength – initial
Density
Folding endurance (MIT)
Melting point
Zero strength temperature
Cut through temperature
Service temperature
Thermal conductivity
Flammability
THERMALFILM™
0.03mm (1-mil)
275.6 x 103volts/mm
(7,000 volts/mil)
3.5
0.002
1017 ohm-cm
1016 ohms
465 volts
100.000 megohm mfds.
1.72 x 108Pa (25,000 psi)
3.10 x 105Pa (45 psi)
27,559 gm/mm (700 gm/mil)
1.42 gm/cm3(88.7 lb/ft3)
>10,000 cycles
NONE
815ºC (1499ºF)
435ºC (815ºF)
525ºC (977ºF)
-260ºC to 240ªC
(-436ºF to 464ºF)
0.156Wm-’K’
(.09 BTU/hr-ft-ºF)
V-0, UL “E”card E39505
TEST METHOD
ASTM D149-64
ASTM D150-64T
ASTM D150-64T
ASTM D257-61
ASTM D257-61
ASTM D1868-61T
Based on 0.05 mfd wound
capacitor using 0.25 mm
(1-mil) Film
ASTM D882-64T
ASTM 0774-63
ASTM D1004-61
ASTM D1505-63T
ASTM D2176-63T
Hot Bar (Du Pont test)
Weighted probe on heated film
(Du Pont test)
Model TC-1000 twin heatmeter
Comparitive tester
UL 94
Notes: One mil equals .001 inch
Thermalfilm™ MT part numbers begin with “46”.
Insulator thickness is .05mm (.002”) unless otherwise specified.
Dimensional tolerances are ± . 38mm (.015”), hole diameters are ± . 25mm (.010”) and angularity is ± 1 1/2º unless otherwise specified.
PHYSICAL
THERMAL
ELECTRICAL – TYPICAL VALUE @ 25ºC
Thermalfilm™ and Thermalfilm™ MT
Thermalfilm™ Polyimide Plastic Films
ORDERING INFORMATION
For standard pre-cut sizes of ThermalfilmTM
and ThermafilmTM MT see page 101.
103
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Insulators – Mica and ThermalsilTM III
Mica and ThermalsilTM III
ORDERING INFORMATION
Part number Description Device "A" Dim "B" Dim "C" Dim "D" Dim Figure
56-77-9 Mica TO-220 18.42 (0.725) 13.21 (0.520) 4.32 (0.170) 2.92 (0.115) B
56-03-2 Mica TO-3 42.04 (1.655) 27.00 (1.063) 3.96 (0.156) 1.57 (0.062) A
53-77-9 ThermalsilTM III TO-220 18.42 (0.725) 13.21 (0.520) 4.32 (0.170) 2.92 (0.115) B
53-03-2 ThermalsilTM III TO-3 42.04 (1.655) 27.00 (1.063) 3.96 (0.156) 1.57 (0.062) A
Property
Electrical
Dielectric strength 172 X 103volts/mm (4500 volts/mil)
0.025 mm to 0.076 mm thick in air (1 to 3 mils thick in air)
Dielectric constant 6.5 to 8.7
Dissipation factor
106cycles .0001-.0004
Volume resistivity 1015 ohm-cm
Physical
Modules of elasticity in tension 172 X 103Mpa (25 X 106) psi
Tensile strength 310 Mpa (45,000 psi)
Hardness mohs, shore 3.0, 115
Compressive strength 2.21 X 108Pa (32,000 psi)
Specific gravity 2.9
Thermal
Thermal conductivity 0.528 wm (-1 ºC -1) (.30 Btu/hr-ft ºF)
Coefficient of thermal expansion 3.24 X 10-5ºC (1.8 X 10-5 ºF)
Specific heat 0.084 KJ/Kg ºC (0.02 Btu/Lb ºF)
Melting point 1275 ºC (2327 ºF)
Max. operating temperature 550 ºC (1022 ºF)
TYPICAL PROPERTIES FOR MICA INSULATORS
Thermalsil™ III provides excellent thermal conductivity
and thermal resistance. It is used as an electrically-isolating
interface material composed of silicone elastomer binder
with a thermally conductive filler. It is reinforced with glass
cloth to resist tearing and cut-through due to burrs on
transistors or heat sinks.
Thermalsil™ III eliminates the need for grease application
and conforms to mounting surfaces under clamping pres-
sure for optimum heat conduction.The finely woven glass
cloth provides the thinnest possible matrix for enhanced
thermal resistance.Thermalsil™ III is available in any con-
figuration with adhesive backing.
Mica insulators provide high maximum operating temper-
atures (550º C) and excellent electrical properties.
FIGURE A FIGURE B
"B"
30.15
(1.187)
10.92
(0.430)
"A"
1.83
(0.072)
"C"
DIA
TYP (2)
"D"
DIA
TYP (2)
"A"
"B"
"C"
"D"
DIA
Property Typical value 25°C Test Method
Electrical
Dielectric constant 2.5@50 Hz ASTM D-150
2.5@103Hz
2.5@106Hz
Dielectric breakdown voltage 26.3 x 103volts/mm (667 volts/mil) ASTM D-149
Volume resistivity 5.7 x 1015 ohm-cm ASTM D-257
Dielectric dissipation factor .008@50 Hz ASTM D-150
.004 @103Hz
.004 @106Hz
Physical
Thickness .15 + .03/-.05mm
(.006 + .001/-.002 in.)
Color Gray-Green
Tensile strength 6.1 x 107Pa (8786 psi)
Hardness, shore A 87
Elongation 2% or less
Thermal
Thermal conductivity 0.0022 cal/sec. cm ºC(0.532 Btu/hr. ft ºF)
Flame resistance UL 94V-0 UL card #E-58126 (S)
Service temperature -60°C to 180°C
(-76°F to 356°F)
TYPICAL PROPERTIES FOR THERMALSILTM III
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* Thickness 1.52 (0.060) to 2.03 (0.080)
* Thickness 1.57mm ± 0.08 (0.062”± 0.003”); surface flatness is .10mm (0.004”) TIR
** Thickness 1.52 (0.060) to 2.03 (0.080)
"C"
"A"
"B"
"E"
DIA
"D"
Insulators – Aluminum Oxide
Aluminum oxide insulating washers have a dielectric strength
of approximately 21.7 x 103volts/mm for .76mm material
(550 volts/mil for 0.030 inch material) and 16.9 x 103volts/mm
for 1.57mm material (430 volts/mil for 0.062 inch material). The
thermal conductivity of aluminum oxide is 0.036cal/cm-sec ºC
at 75ºC (167ºF) [ 8.71 Btu/hr-ft-º F].
Aluminum oxide has unique thermal conductivity qualities
and features low loss factors at high frequencies. It has high
compressive strengths, high volume resistivity, low thermal
expansion and resists radiation.
PROPERTY
A1203
Dielectric Constant 25ºC (77ºF)
Dissipation Factor 25ºC (77ºF)
Electrical Resistivity 25ºC (77ºF)
Dielectric Strength (AC)
Density
Hardness
Flexural Strength 25ºC (77ºF)
Modules of Elasticity
Poisson’s Ratio
Tensile Strength 25ºC (77ºF)
Compressive Strength 25ºC (77ºF)
Coefficient of Thermal Expansion
Thermal Conductivity
Specific Heat (100ºC)
Melting Point
Maximum Temperature for
Continuous Use
CHEMICAL – TYPICAL VALUE
94% nominal
ELECTRICAL
8.9 (1MHz)
8.9 (10GHz)
0.0001 (MHz)
0.0010 (10GHz)
>1014 ohm-cm
8.66 x 103volts/mm (6.35mm thick)
[220 volts/mil (0.250”thick)]
16.73 x 103volts/mm (1.27mm thick)
[425 volts/mil (0.050”thick)]
28.35 x 103volts/mm (0.25mm thick)
[720 volts/mil (0.010”thick)]
PHYSICAL
3.62 g/cm3(226 lb/ft3)
78 (Rockwell 45 N)
MECHANICAL
3.17 x 108Pa (minimum) [46.00 psi (minimum)]
3.52 x 108Pa (typical) [51,000 psi (typical)]
2.83 x 1011 Pa (41 x 106psi)
0.21
1.93 x 108Pa (28,000 psi)
2.10 x 109Pa (305,000 psi)
THERMAL
7.9 x 106/ºC (4.4 x 106/ºF)
18.0067 Wm / 1K-1[10.40 Btu/hr-ft ºF (68ºF)]
14.2379 Wm / 1K-1[8.22 Btu/hr-ft ºF (212ºF)]
79.564 Wm / 1K-1400ºC [4.60 Btu/hr-ft ºF (752ºF)]
8.79 x 104KJ/kgºC [2.1 x 104Btu/lb ºF]
>3600ºC (6512ºF)
1700ºC (3100ºF)
TEST METHOD
Spectrographic Analysis
(100%-% by wt. of total
metallic impurity)
ASTM D150-70
ASTM D2520-70
ASTM D150-70
ASTM D2520-70
ASTM D1829-66
ASTM D116-69
ASTM C20-70
ASTM E18-67
ACMA Test #2
ASTM C623-69T
ASTM C623-69T
ACMA Test #4
ASTM C528-63T
ASTM C372-56
ASTM C408-58
ASTM C351-61
* Thickness:
4103: 1.78 (0.070) to 2.03 (0.080)
4104: 1.52 (0.060) to 2.03 (0.080)
"B"
10.92
(0.430)
"A"
1.83
(0.072)
"E"
15.09
(0.594)
"D"
RAD
TYP (2)
5.46
(0.215)
3.68
(0.145)
TYP (4)
"C" RAD
TYP (2)
DIA
Aluminum Oxide
Aluminum Oxide for TO-3
Aluminum Oxide ceramic for TO-220
Aluminum Oxide Ceramic for TO-218,TO-247, and TO-3P
Note: Hole diameters are ± 0.13mm (.005”), angularity is ± 1º
and flatness is 0.05mm (0.002”) TIR unless otherwise specified.
Part Number “A”DIM “B”DIM “C”DIM “D”DIM “E”DIM
4103* 39.70 (1.563) 26.67 (1.050) 13.34 (0.525) 4.75 (0.187) 30.40 (1.197)
4104* 44.45 (1.750) 31.75 (1.250) 15.88 (0.625) 7.16 (0.282) 30.15 (1.187)
Part Number “A”DIM “B”DIM “C”DIM “D”DIM “E”DIM
4169* 19.30 (0.760) 13.97 (0.550) 4.78 (0.188) 6.98 (0.275) 3.68 (0.145)
4170** 19.30 (0.760) 13.97 (0.550) 4.78 (0.188) 6.98 (0.275) 3.68 (0.145)
4171** 16.51 (0.650) 12.70 (0.500) 4.32 (0.170) 6.35 (0.250) 3.81 (0.150)
4177** 17.45 (0.687) 14.27 (0.562) 5.54 (0.218) 7.14 (0.281) 3.18 (0.125)
Part Number “A”DIM “B”DIM “C”DIM “D”DIM “E”DIM
4180* 23.24 (0.915) 18.80 (0.740) 6.98 (0.275) 9.40 (0.370) 3.96 (0.156)
ORDERING INFORMATION
ORDERING INFORMATION
ORDERING INFORMATION
"A"
"B"
"C"
"D"
"E"
105
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•Reduces stress on leads during wave solder and post-soldering operations
•Provides stable mount to resist shock and vibration damage to leads
•8923-1, 8923-2, and 8924 fit the TO-220
Note: Tolerances ± 0.25 (0.010”) unless otherwise specified.
Material is nylon 6/6 rated 94 V-O
1.52
(0.060)
TYP (4) "A"
3.05
(0.120)
"B"
8.26
(0.325)
3.05
(0.120)
10.16
(0.400)
"C"
11.18
(0.440)
1.40
(0.055)
2.54
(0.100)
2.54
(0.100)
2.03
THRU
(0.080)
TYP (3)
4.06
(0.160)
1.02
(0.040)
1.52
(0.060)
SQ
SEE DETAIL "D"
(8924 ONLY)
DIA
DETAIL "D"
(8924 ONLY)
Insulators – Stanchion Pads
8923-1, 8923-2, 8924 Stanchion Pads
Part Number “A”DIM “B”DIM “C”DIM
8923-1 2.54 (0.100) 20.32 + .00/-.25 (0.800 + .00/-0.010) 8.00 (0.315)
8923-2 1.27 (0.050) 19.05 + .00/-.25 (0.750 + .00/-0.010) 8.00 (0.315)
8924 1.27 (0.050) 19.05 (0.750) 7.87 (0.310)
FEATURES
ORDERING INFORMATION
106
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Insulating Covers
Insulating covers are designed to provide protection from accidental shock during field service or repair. Included
are No. 6 split washers as inserts to provide electrical connection of mounting screws to the TO-3 collector and an
insulating snap-in cover for the screw heads.
Pan head screws not provided – MS 51957-30 or equivalent recommended-secure the cover to the TO-3. At the typical
mounting screw torque of .68-.90 Nm (6-8 inch pounds), the TO-3 cover material cold-flows around the screw head to
securely fasten the cover.
The 8903VB is made from thermoplastic polyester that meets the requirements of UL Bulletin 94 V-O. In addition to its
excellent flammability rating, thermoplastic polyester offers resistance to most chemical environments, heat deflection
temperature to 215.6 ºC (420 ºF) and UL continuous use temperature of 130 ºC (266 ºF).
Designed to prevent accidental electrical shock, the 8909 fits TO-3 case styles. A test probe hole in top eliminates the
need to remove cover for testing. Friction fit for easy snap on assembly. Recommended for low vibration applications.
41.91
(1.650)
30.23
(1.190)
28.45
(1.120)
1.19
(0.047)
THRU
6.22
(0.245)
THRU TYP (2)
22.61
(0.890)
39.88
(1.570)
9.91
(0.390)
4.57
(0.180)
DIA
DIA
40.26
(1.585)
26.52
(1.044)
1.19
(0.047)
DIA THRU
9.14
(0.360)
8.38
(0.330)
0.76
(0.030)
TYP WALL
5.54
(0.218)
"A"
1.47
(0.058)
3.58
(0.141) Ø 9.52
(0.375)
Ø
"T"
"O.D." "I.D."
TO-3 Insulating Covers
Teflon-filled Acetal Insulators for To-3
Teflon-filled Acetal Bushings for To-3
Part Number Figure Material Color Flammability standards
8903NW A Nylon White Self-extinguishing UL 94 V-2
8903VB A Thermoplastic polyester Black Self-extinguishing UL 94 V-0 UL 492 Type 1
8909NB B Nylon Black U.L. 94V-2
Part Number Fits notch “A”Dim
103 4.83 (0.190) 4.90 (0.193)
109 6.35 (0.250) 6.35 (0.250)
Part Number “I.D.”“O.D.”“T”
110 5.03 / 5.21(.198 / .205) 6.81 / 6.98(.268 / .275) 1.57 / 1.40(.062 / .055)
113 6.43 / 6.60(.253 / .260) 7.82 / 8.00(.308 / .315) 1.57 / 1.40(.062 / .055)
ORDERING INFORMATION
FIGURE A FIGURE B
107
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Mounting Pads
• Prevent heat damage during soldering
• Facilitate board clean-up
• Prevent solder bridges
• Assure uniform device height
MAXIMUM OPERATING TEMPERATURE
* All “-DAP”mounting pads meet UL 94 V-0
Index of Semiconductor Lead Conversion Pads
Index of Semiconductor Mounting Pads
Suffix Base material Continuous Deflection Color
N Nylon base resin 121.0ºC 250ºF 243.3ºC 470ºF Natural
per ASTM STD
D4066-82-PA111
DAP* Diallyl phthalate 204.4ºC 400ºF 282.2ºC 540ºF Black only
per MIL-M-14G
type SDG
Converts lead
Part Number spacing from To # of Leads Outside dia Thickness
7717-130 0.05 In-Line TO-92 & TO-15 3 5.84 (0.230) 1.02 (0.040)
7717-247 TO-18 TO-5 3 7.11 (0.280) 3.81 (0.170)
7717-26 TO-18 TO-5 3 8.71 (0.343) 3.05 (0.120)
7717-44 TO-18 TO-5 4 7.75 (0.305) 3.18 (0.125)
For TO-18
For epoxy transistors
For TO-5
For TO-18
For integrated circuits
Misc. mounting pads
FEATURES PRODUCT INFORMATION
ORDERING INFORMATION
ORDERING INFORMATION
See pages 108 and 109 for mechanical drawings
See pages 108 and 109 for mechanical drawings
Note: Please specify material for each mounting pad: “N”= nylon; “DAP”= Diallyl Phtalate.
Example: 7717-3N, 7717-86DAP
Part Number Leads Outside dia Thickness
7717-86 3 8.71 (0.343) 1.91 (0.075)
7717-178 3 8.89 (0.350) 0 .53 (0.021)
7717-79 3 9.02 (0.355) 0.97 (0.038)
7717-3 3–4 8.64 (0.340) 1.91 (0.075)
7717-15 4 8.89 (0.350) 0.51 (0.020)
7717-5 4 8.89 (0.350) 3.18 (0.125)
7717-4 4 9.53 (0.375) 1.91 (0.075)
7717-16 4 5.08 (0.200) 0.51 (0.020)
7717-18 4 5.08 (0.200) 2.54 (0.100)
7717-108 4 5.16 (0.203) 1.78 (0.070)
7717-89 4 6.35 (0.250) 2.03 (0.080)
7717-7 4 6.35 (0.250) 3.18 (0.125)
7717-122 8 9.27 (.365) 1.78 (0.070)
7717-8 8 9.53 (0.375) 1.91 (0.075)
7717-156 14 19.05 x 11.43 (0.750 x 0.450) 1.27 (0.050)
7717-175 Crystal Can Relay 10.16 /20.32 (0.400 x 0.800) 1.27 (0.050)
108
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Mounting Pads
0.13
(0.005)
Ø 8.64
(0.340)
2.54
(0.100)
TYP
0.64
(0.025) 1.91
(0.075)
1.27
(0.050)
Ø 5.08
(0.200)
Ø5.08
(0.200)
Ø 0.91
(0.036)
TYP (4)
1.27
Ø
C SINK
(0.050)
TYP (4)
Ø1.52 DIA
(0.060)
TYP (4)
1.40
(0.055)
1.90
(0.075)
Ø 9.52
(0.375)
0.64
(0.025)
Ø
1.90
(0.075)
TYP(8)
Ø 5.08
(0.200)
Ø 1.27
(0.050)
C SINK TYP (4) Ø 0.71
(0.028)
TYP (4)
1.27
(0.050)
0.51
(0.020)
8.89
(0.350)
0.64
(0.025)
3.18
(0.125)
1.27
(0.050)
1.65
(0.065)
TYP
0.71
(0.028)
TYP
3.18
(0.125)
MAX
6.35
(0.250)
ø 2.54
(0.100)
0.51
(0.020)
TYP
B.C.
ø
ø
Ø
5.08
(0.200)
Ø 0.91
(0.036)
TYP (4)
0.51
(0.020)
8.89
(0.350)
Ø
2.54
(0.100)
B.C.
Ø 0.91
(0.036)
TYP (4)
0.51
(0.020)
5.08
(0.200) 0.64
(0.025)
THRU
TYP (4)
5.08
(0.200)
Ø1.52
(0.060)
0.51
(0.020)
1.02
(0.040)
1.02
(0.040)
2.54
(0.100)
Ø
ØØ
8.71
(0.343)
1.40
(0.055)
3.05
(0.120)
TYP
Ø 5.08
(0.200)
1.14
(0.045)
1.57
(0.062)
TYP (6)
Ø
Ø
5.08
(0.200)
Ø
1.27
(0.050)
TYP (8)
9.52
(0.375)
1.90
(0.075) 1.40
(0.055)
Ø 0.91
(0.036)
TYP (8)
0.64
(0.025)
Ø
1.52
(0.060)
TYP (4) B.C.
1.02
(0.040)
0.51
(0.020)
Ø
1.02
(0.040)
OPP TYP (4)
Ø 5.08
(0.200)
B.C.
Ø 0.83
(0.033)
THRU
TYP (4)
Ø 6.48
(0.255)
2.67
(0.105)
7.75
(0.305)
0.51
(0.020)
0.25
(0.010) 0.51
(0.020)
B.C.
7717-3 7717-4
7717-5 7717-7
7717-15
7717-16 7717-18
7717-26 Lead Conversion
7717-8
7717-44 Lead Conversion
109
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Mounting Pads
Ø 5.08
(0.200)
Ø1.14
(0.045)
TYP (3)
0.76
(0.030)
1.90
(0.075)
DIA TYP (3)
0.51
(0.020)
1.91
(0.075)
Ø 8.74
(0.344)
1.57
(0.062) TYP (3)
Ø
Ø
1.14
(0.045)
THRU TYP (3)
Ø 5.08
(0.200)
Ø 1.52
(0.060)
C SINK
TYP (3)
Ø
8.89
(0.350)
0.53
(0.021) 0.25
(0.010)
Ø 1.52
(0.060)
Ø
1.14
(0.045)
0.25
(0.010)
0.43
(0.017)
0.97
(0.038)
Ø 1.27
(0.050)
TYP (6)
Ø5.08
(0.200)
Ø 9.02
(0.355)
Ø
4.78
(0.188)
Ø 0.71
(0.028)
TYP (4)
Ø
1.52
(0.060)
TYP (4)
Ø
C SINK
1.27
(0.050)
TYP (4)
Ø 2.54
(0.100) B.C.
1.14
(0.045)
6.35
(0.250)
0.56
(0.022)
2.03
(0.080)
OPP
5.08
(0.200)
TYP
5.08
(0.200)
TYP
2.54
(0.100) TYP
2.54
(0.100)
4.19
(0.165)
20.32
(0.800)
10.16
(0.400)
0.89
(0.035)
THRU TYP (8)
1.57
(0.062)
TYP (6)
1.27
(0.050)
TYP (8) 0.51
(0.020)
0.76
(0.030)
0.51
(0.020)
Ø
Ø
Ø
C SINK
2.39
(0.094)
Ø
THRU
0.64
(0.025)
TYP (4)
2.39
(0.094)
2.67
(0.105)
Ø1.40
(0.055)
TYP (4)
0.25
(0.010) 1.02
(0.040)
Ø 1.02
(0.040) TYP
5.16
(0.203)
Ø 0.79
(0.031) TYP
1.78
(0.070)
0.51
(0.020)
2.67
(0.105)
9.27
(0.365)
0.13
(0.005)
1.78
(0.070)
0.76
(0.030)
Ø 5.08
(0.200)
Ø 1.02
(0.040)
TYP (4)
Ø 8.00
(0.315)
B.C.
3.81
(0.150)
2.54
(0.100)
6.35
(0.250)
Ø
7.11
(0.280)
5.08
(0.200)
0.56
(0.022)
2.03
(0.080)
1.02
(0.04)
4 BOSSES
0.51
(0.020)
P.C.
Ø
1.43
(0.450)
12.70
(0.500)
6.35
(0.250)
Ø
1.57
(0.062)
TYP (4)
7.62
(0.300)
9.86
(0.388)
1.27
(0.050)
Ø
C SINK TYP (14)
2.54
(0.100)
TYP 6 PLCS
Ø 0.89
(0.035)
THRU TYP (14)
1.27
(0.050) 0.51
(0.020)
19.05
(0.750)
2.54
(0.100)
5.84
(0.230)
MAX
1.02
(0.040)
0.51
(0.020)
0.63
(0.025)
TYP (3)
1.02
(0.040)
TYP (4)
0.64
(0.025)
0.71
(0.028)
TYP (2)
Ø
Ø
7717-86
7717-178
7717-79
7717-89
7717-175
7717-108
7717-122
7717-247 Lead Conversion
7717-156
7717-130 Lead Conversion
110
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Finish Aavid Code Thermalloy Suffix Description
Black Anodize B B Recommended for increased thermal performance.
Anodize is electrically isolating and does not provide electrical insulation.
Gold Chromate C C For corrosion protection or painting only. Color variation
may be expected with this finish. Chromate is electrically conductive.
Does not provide electrical insulation.
Tin Plating D D Allows heat sink to be soldered to the PC Board.
Raw material is tin plated prior to processing.
Pre-Black Anodized J PB Edges cut during the manufacturing process will be unfinished.
Pre-Tin Plated PD Raw material is tin coated prior to processing.
Edges cut during the manufacturing process will be unfinished.
Green Anodize M Alternative finish to Black anodize.
Recommended for increased thermal performance.
Electrically isolating but does not provide electrical insulation.
Black Paint T B-TT Black paint finish with tin plated tabs
with Solderable Tabs for soldering heat sink to PC board.
Unfinished U U Clean, no finish.
Note : All thermal graphs reflect black anodize finish.
Aavid Thermalloy code –Finish option must be noted by one of the above letters in the 7th position.
Aavid's standard finish is black anodize (B) unless otherwise noted.
Thermalloy origin suffix – The suffixes should be added after the model number to indicate the desired finish
Finishes
6396B
B
ORDERING INFORMATION
530122B00000
example
Thermalloy origin part
A
A= Model number
B= Finish suffix
A= Base part
B= Finish code
B
A
example 12 digit part
111
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Card Ejectors
•Saves time – no roll pin required
•Excellent for retrofit applications
•Material is nylon per ASTM D4066-82PA162F11
•Cost no more than conventional ejector/puller
•Rated at 222.5N (50 lbs.) / ejector force per pair
•One piece – no assembly required
•May be heat stamped
•Lever action releases card from its connector safely and quickly
•Cards, their components and connectors are less frequently damaged when extracting PC boards
•No special extraction tools are needed for board removal
•Material is nylon per ASTM D4066-82 PA120B4413F24, UL 94 V-O rated (natural color)
•Roll pins are provided (NAS 561-P3-4)
22.22
(0.875)
9.52
(0.375)
11.12
(0.438)
1.90
(0.075)
63.50
(2.500)
50.80
(2.000) 4.70
(0.185)
11.12
(0.438)
3.18
(0.125)
DIA TYP (2)
6.55
(0.258)
FIGURE A 5005-09N PULLER *
31.75
(1.250)
11.10
(0.437)
7.14
(0.281)
Ø 2.46
(0.097)
7.24
(0.285)
1.57
(0.062)
14.27
(0.562)
FIGURE B 5005-08N SLIM FACE/ FLAT
5021N Ejector
FIGURE C 5005-25N COMBINATION EJECTOR/PULLER
30.48
(1.200)
15.88
(0.625)
3.05
(0.120)
22.22
(1.875)
7.14
(0.281)
1.78
(0.070)
6.35
(0.250)
ø2.36
(0.093)
0.51
(0.020)
7.24
(0.285)
0.89
(0.035)
2.67
(0.105)
31.75
(1.250)
21.26
(0.837)
7.14
(0.281) 13.97
(0.550)
17.02
(0.670)
2.49
(0.098)
Ø
Snap-On Ejectors / Pullers
Standard Ejectors / Pullers
FEATURES
FEATURES
ORDERING INFORMATION
Part Number Figure
5005-09 N A
5005-08 N B
5005-25 N C
*No roll pins provided
112
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Sil-FreeTM 1020 is a metal-oxide-filled, silicone-free synthetic grease
specially formulated to enhance heat transfer across the interface
between the semiconductor case and the heat sink without the
migration or contamination associated with silicone-based products.
Dry interface case-to-sink thermal resistance is typically reduced
50% to 75% with proper application of Sil-FreeTM 1020.
This virtually "no-bleed", high-performance compound will not
dry out, harden, melt, or run, even after long-term continuous exposure
to temperatures up to 200°C. Even in a vacuum atmosphere (10-5 Torr, 24
hours@100°C), Sil-FreeTM 1020 exhibits virtually "no bleed" or evaporation.
ORDERING INFORMATION
Sil-FreeTM
Part Number Package Size
101700F00000 Syringe 43 grams (1.5 Oz.)
101800F00000 Tube 57 grams (2.0 Oz.)
101900F00000 Jar 57 grams (2.0 Oz.)
102000F00000 Tube 143 grams (5.0 Oz.)
102100F00000 Jar 457 grams (16.0 Oz)
Color White
Thermal 0.79 W/(m-°C)
conductivity
Operating -40°C to +200°C
Temperature range
Volume 1012 Ohm-cm 2.3 ± 0.5
Weight 47.5 grams
Dielectric strength 225 Volts/mil
Consistency Paste
Bleed 0.09 max
% after 24hr @ 200°C
Specific gravity 2.8 ± 0.2
Shelf Life Indefinite
(unopened)
Ther-O-LinkTM is a silicone-based thermal compound that
cost effectively enhances the heat transfer between a semi-
conductor case and a heat sink. Easy to apply,Ther-O-LinkTM
substantially reduces dry interface thermal resistance, while
providing long life under a variety of conditions.
ORDERING INFORMATION
Ther-O-LinkTM
Part Number Package Size
100000F00000 Ampule 1g. (0.03 oz.)
100100F00000 Syringe 35.7 grams (1.25 oz.)
100200F00000 Tube 57 grams (2.0 oz.)
100500F00000 Tube 143 grams (5.0 oz.)
100800F00000 Can 228.6 grams (8.0 oz.)
101600F00000 Can .45 kg (1 lb)
108000F00000 Can 2.27 kg (5 lb)
132000F00000 Can 9.07 kg (20 lb)
Color White
Thermal conductivity 0.73 W/(m-K)
Operating -40°C to +200°C
Temperature range
Volume resistivity 1.0 x 1015 Ohm-cm
Dielectric strength 250 Volts/mil
Consistency Paste
Bleed 0.6 max
Specific gravity 2.8
Shelf life Indefinite (unopened)
Aavid's UltrastickTM is a unique phase-change thermal inter-
face material that surpasses grease in thermal performance
and long-term stability. This solid, silicone-free, paraffin-
based thermal compound changes phase at 60°C, with a
concurrent volumetric expansion that fills gaps between the
mating surfaces. UltrastickTM comes in a convenient applica-
tor bar, allowing for neat, fast application to both heat sink
and component surfaces. One cost-effective application
leaves a thin, film-like deposit, providing excellent heat
transfer and low interface thermal resistance.
UltrastickTM
Temperature range -40ºC to +200°
Volume resistivity 1.0 X 1.015 Ohm-cm
Dielectric strength 250 volts/mil
Consistency Paste
Bleed 0.6 max
Specific gravity 0.28
Color Opaque White
Thermal resistance 0.03ºC/W per square inch @ 20 psi
0.02ºC/W per square inch @ 100 psi
Shelf Life Indefinite*
Grease & Epoxy
ORDERING INFORMATION
Part Number Package Size
100300F00000 Bar 47.5 grams (0.16 oz.)
PRODUCT INFORMATION
PRODUCT INFORMATION
PRODUCT INFORMATION
* Recommended max. storage temperature: 40ºC (105ºF)
113
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ThermalcoteTM
Thermalcote™ II was developed as the sensible alternative
to silicone-based thermal greases.ThermalcoteTM II employs
a highly conductive synthetic base fluid that enables the
finished product to exhibit the same thermal characteris-
tics as the silicone-based products.
Thermalcote™ II contains no silicone. The high lubricity of
the base oil permits efficient application to both semicon-
ductor case or heat sink, and it will effectively fill the micro-
scopic air gaps on the metal-to-metal mating surfaces. It is
non-toxic, extremely stable, and neither cakes or runs from
-40°to 200°C (-40°F to 392°F).
ORDERING INFORMATION
Grease & Epoxy
ThermalcoteTM is a superior thermal joint compound of ther-
mally loaded silicone based grease for use with all heat sinks.
It improves the transfer of thermal energy across the metal
to metal interfaces between the transistor or rectifier case
and the heat sink. ThermalcoteTM conducts heat approximately
15 times better than air and more than 4 times better than
unloaded silicone grease. It is non-toxic, extremely stable,
and neither cakes or runs from -40°to 204°C (-40°F to 399°F).
Color Opaque white
Operating -40°C to 204°C (-40°F to 399°F)
Temperature range
Thermal conductivity 0.765Wm-1°C-1(.226 Btu/hr ft °F)
Dielectric strength 11.8 x 103volts/mm (300volts/mil)
1.27 mm gap(.050" gap)
Cleaning solvent Mineral spirits or turpentine
Specific gravity 1.6
Evaporation
24 hours@200°C (392°F), wt% 1
Shelf life Indefinite (unopened)
ThermalcoteTM ll
Part Number Net weight
349 28 grams (1 oz) tube
350 57 grams (2 oz) jar
351 .45Kg. (1 lb) can
ORDERING INFORMATION
Part Number Net weight
249 28 grams (1 oz) tube
250 57 grams (2 oz) tube
251 0.45Kg. (1 lb) can
252 2.27Kg. (5 lb) can
253 4.54Kg. (10 lb) can
Color Blue
Operating -40°C to 200°C (-40°F to 392°F)
Temperature range
Thermal conductivity 0.699Wm-1°C-1(.204 Btu/hr ft °F)
Dielectric strength 7.9 x 103volts/mm (200volts/mil)
1.27 mm gap (.050" gap)
Cleaning solvent Mineral spirits or turpentine
Specific gravity 2.93@60°F(15.6°C)
Evaporation,
24 hours@200°C (392°F), wt% 0.6 max
Shelf life Indefinite (unopened)
PRODUCT INFORMATION
PRODUCT INFORMATION
114
ACCESSORIES
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United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
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AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
Grease & Epoxy
Ther-O-BondTM 1500 is a versatile epoxy casting system developed
for high performance, production potting and encapsulating appli-
cations where low shrinkage and rapid air evacuation are required.
This formulation has a very low surface tension and a flowable
viscosity, which affords excellent air release.Ther-O-BondTM 1500
adhers to rigid plastics and laminates, metals and ceramics, has
a low coefficient of thermal expansion and is readily machined
and shaped with ordinary shop tools. The fully cured epoxy system
is an excellent electrical insulator which provides good resistance
to electrolysis, leakage and corrosion room water, weather, gases
and chemical compounds.
Ther-O-BondTM Adhesive
Mix Ratio by Weight, 100 to 15
Resin to Hardener:
Mixed Viscosity @ 25°C, cps: 1000 - 1500
Work-Life @ 25°C45 Minutes
Gel Time @ 25°C3-6 Hours
Cure Schedule @ 25°C8 Hours
Cure Schedule @ 65°C1 Hour
Cure Schedule @ 100°C0.5 Hour
For smaller applications, Ther-O-BondTM 1600 produces a stable,
durable, high-impact bond, with good heat transfer characteris-
tics. It is a thixotropic (smooth paste) thermally conductive epoxy
system used for staking thermistors, diodes, resistors, integrated
circuits and other heat sensitive components to printed circuit
boards.This two-part adhesive develops strong, durable, high
impact bonds at room temperature, which improve heat transfer
while maintaining electrical insulation. Ther-O-bondTM 1600 bonds
readily to itself, to metals, silica, steatie, alumina, sapphire and
other ceramics, glass, plastics and many other materials because
its coefficient of thermal expansion provides a good match for
those materials over a fairly wide temperature range.
Mix Ratio by Weight, 100 to 5
Resin to Hardener:
Mixed Viscosity @ 25°C, cps: 33,000
Work-Life @ 25°C45 Minutes
Gel Time @ 25°C3-6 Hours
Cure Schedule @ 25°C8 Hours
Cure Schedule @ 65°C1 Hour
Cure Schedule @ 100°C0.5 Hour
HANDLING CHARACTERISTICS
Color Blue
Specific Gravity: 2.30
Operating Temp, °C-70 to 115
Hardness, Shore D: 90
Izod impact, F1 Lbs/Inch of Notch 0.49
Thermal 0.85
Conductivity W/(m-°C)
C.T.E. (ppm/°C) 25
Tensile Strength (@25°C) 9200 psi
Tensile Lap Shear, psi 2900
Dielectric Strength (volts/mil) 410
Dielectric Constant (1 KHz @ 25°C) 5.9
Dissipation Factor, KH@ 25°C5.9
Shelf Life 12 months
From D.O.M.
Ther-O-BondTM 2000 acrylic adhesive cures rapidly
at room temperature, while providing a repairable,
thermally conductive bond.
Color White
Thermal 0.48
Conductivity W/(m-°C)
C.T.E. (ppm/°C) 25
Tensile Strength (@25°C) 2360 psi
Dielectric Strength (volts/mil) 220
Shelf Life 12 months
From D.O.M.
Part Number Description Package/Kit Size
159900F00000 Ther-O-BondTM 1500 Resin and hardener 0.946 liter (1 Qt.)
161000F00000 Ther-O-BondTM 1600 2-Part plastic kit 10gm (0.35 oz.)
164000F00000 Ther-O-BondTM 1600 2-Part plastic kit 40gm (1.40 oz.)
200000F00000 Ther-O-BondTM 2000 Adhesive syringe 25ml
Activator bottle 13ml
ORDERING INFORMATION
PRODUCT INFORMATION
Ther-O-BondTM 1500 Ther-O-BondTM 1600
Ther-O-BondTM 2000
HANDLING CHARACTERISTICS
PHYSICAL PROPERTIES
Color Black
Specific Gravity 1.5
Operating Temp, °C-60 to 155
Heat Distortion Temp, °C100
Hardness, Shore D: 88
Thermal 1.26
Conductivity W/(m°C)
Compressive Strength, psi 14,000
Dissipation Factor, 0.01
Self Extinguishing?: yes
C.T.E. (ppm/°C) 25
Tensile Strength (@25°C) 9200 psi
Dielectric 800
Shelf Life 12 months
From D.O.M.
PHYSICAL PROPERTIES
115
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AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
Grease & Epoxy
Thermalbond™ is a thermally conductive, high strength
epoxy adhesive. It provides exceptional adhesion to copper,
aluminum, steel, glass, ceramics, and most plastics.
ThermalbondTM also has a coefficient of thermal expansion
compatible with aluminum, copper, and brass, making it
particularly well suited for thermally bonding semiconduc-
tors and other components to chassis or heat sinks.
Thermalbond™
Characteristics Typical Values
Color Green
Specific gravity 2.35
Working viscosity 25,000 cps
Thermal conductivity 1.34Wm-1 °C-1 (.77 Btu/hr •ft• °F)
Thermal resistivity 29.4°C in/watt
Tensile strength 6.34 x 107Pa(9,2000 psi)
Compressive strength 1.44 x 108Pa(20,9000 psi)
Bond shear strength 3.17 x 107Pa(4,6000 psi)
aluminum to aluminum, 25.4mm (1") overlap @ 25°C, (77°F)
Thermal coefficient of expansion 24 x 10-6/°C (1.32 x 10-6/°F)
Water absorption, % after 10 days@ 25°C (77°F) 0.20
Hardness, Shore D 86
Volume resistivity 1.0 x 1016
Dielectric strength 59.1 x 103volts/mm (1500 volts/mil)
Dielectric constant@25°C (77°F) 100KHz 6.1
Dielectric factor@25°C (77°F) 100KHz 0.020
Operating temperatures -65°C to 155°C (-85°F to 311°F)
Linear shrinkage 0.002 in/in
Shelf life 12 months* from D.O.M.
Pot life@25°C (77°F) 2-3 hours
Suggested stripping agent Miller-Stephenson MS 111
Cleaning solvent Acetone
HANDLING CHARACTERISTICS
Mix resin thoroughly before removing material.
Add 7.1 parts of RT-7 hardener to 100 parts of resin
by weight, or 17 parts of RT-7hardener to 100 parts
of resin by volume. Adhesive will set up in:
24 hrs at 25°C (77°F) 1 hr. at 100°C (212°F)
2 hrs. at 65°C (149°F) 30min. at 130°C (266°F)
Note: For maximum electrical and physical properties, a post cure is neccessary.
Post cure at room temperature for 4 days or for 4 hours at 93°C (200°F).
Typical electrical and physical properties at room temperature with RT-7 hardener
*It is recommended that the containers be turned over every six months to minimize settling for ease of mixing.
MIXING INSTRUCTIONS
ORDERING INFORMATION
Part Number Net weight
4949 0.8 oz. (25 gram kit)
4950 1.7 oz (50 gram kit)
4951 3.5 oz. (100 gram kit)
4952 7.0 oz (200 gram kit)
4953 4 lbs (1814 grams)
4954 15 lbs (6804 grams)
116
THE TOTAL INTEGRATED SOLUTION FOR COOLING ELECTRONICS
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
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Taiwan Tel: +886 (2) 2698-9888 email: sales@aavid.com.tw
AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
Aavid Thermal Technologies, Inc.
The Total Integrated Solution for Cooling Electronics ®
Aavid Thermal Technologies, Inc., operates through its subsidiaries in three business areas–Thermal Management
Solutions, Computational Fluid Dynamics (CFD) software and Customized Computer Aided Engineering (CAE). Each of these
businesses has an established reputation for high product quality, service excellence, and engineering innovation.
WWW.AATT.COM
Aavid Thermalloy, LLC is the partner of choice for electronics companies focused on introducing next generation products
to market faster, with greater reliability, and increased functionality. Leading the way with the industries broadest line of
standard products, Aavid Thermalloy is the most recognized heat sink manufacturer in the world. Our design capabilities
extend beyond standard products and use the most advanced thermal engineering resources available to design applica-
tion specific products. Aavid Thermalloy solutions cool critical electronic components in computers, transportation, commu-
nications infrastructure, power supplies, motor controls, power conversion equipment, and more.
WWW.AAVIDTHERMALLOY.COM
Fluent Inc., is the world’s largest provider of commercial CFD software and services.The company offers general-purpose
CFD software for a wide range of industrial applications, along with highly-automated, application-focused packages
including ICEPAK® for cooling electronics. CFD consulting services are also available worldwide. Its staff includes CFD engi-
neers, plus experts in computational methods, mesh generation, and software development.
WWW.FLUENT.COM
Applied Thermal Technologies is the leading thermal engineering company specializing in system, board, and component
level design and analysis using CFD/FEA and experimental techniques. Applied can analyze and solve all your thermal chal-
lenges.With US offices in Santa Clara, California, Richardson,Texas as well as international offices in the Pacific Rim, Applied
assists companies globally. Dedicated thermal engineers characterize your system and provide the most advanced and
effective cooling solutions, saving thousands in engineering resources, thermal modeling software, and test hardware..
WWW.THERMALCOOLING.COM
VISIT OUR WEB SITE:
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