ATSAMR21G18-MR210UAT - MICROCHIP TECHNOLOGY

802.15.4

ATSAMR21G18-MR210UA

DATASHEET PRELIMINARY

Description

The ATSAMR21G18-MR210UA is a 20mm x 19mm wireless module with a

solder mount footprint. It integrates an ATSAMR21G18 IC together with a

serial flash and a crypto authentication device.

Features

•ATSAMR21G18 system in package

–Single-chip ARM® Cortex®-M0+ based 32-bit Microcontroller

–Low power 2.4GHz transceiver for IEEE 802.15.4 and ZigBee

applications

–256KB Flash

–Maximum Operating Frequency: 48 MHz

–128-bit AES crypto engine

–32-bit MAC symbol counter

–Temperature sensor

–Automatic transmission modes

•AT45DB041E 4-Mbit DataFlash

•ATECC508A CryptoAuthentication Device

–Secure Hardware-based Key Storage

–Performs High-Speed Public Key Algorithms

–NIST Standard P256 Elliptic Curve Support

–SHA-256 Hash Algorithm with HMAC Option

–Guaranteed Unique 72-bit Serial Number

–High-quality FIPS Random Number Generator (RNG)

–Intrusion Latch for External Tamper Switch

•Single 1.8V - 3.6V supply

•Radio module with a link budget of 103dBm

•FCC / ETSI compliant RF front end with harmonic filter

•Three SERCOM units left for external applications

•32.768kHz crystal oscillator

•High precision 16MHz crystal oscillator

•12-bit, 350ksps Analog-to-Digital Converter (ADC)

Atmel-42475B-ATSAMR21G18-MR210UA_Datasheet_Preliminary-09/2015

•I2C up to 3.4MHz

•Full-speed (12Mbps) Universal Serial Bus (USB) 2.0 interface

•17 external GPIO lines

•One GPIO for ATECC508A intrusion latch

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Table of Contents

Description.......................................................................................................................1

Features.......................................................................................................................... 1

1. Integrated Devices and Block Diagram..................................................................... 4

1.1. Module Block Diagram................................................................................................................. 4

1.2. Integrated Peripherals.................................................................................................................. 4

1.3. RF Front End Control................................................................................................................... 5

2. Mechanical Description..............................................................................................7

2.1. Mechanical Dimensions................................................................................................................7

2.2. Footprint and Layout Recommendation....................................................................................... 7

3. I/O Pin Assignment....................................................................................................9

4. Electrical Characteristics..........................................................................................11

4.1. Absolute Maximum Ratings........................................................................................................11

4.2. Recommended Operating Ratings............................................................................................. 11

4.3. Module Performance Data..........................................................................................................11

5. Non-Volatile Memory Information............................................................................ 13

6. Radio Certification................................................................................................... 14

6.1. United States (FCC)................................................................................................................... 14

6.2. Europe (ETSI).............................................................................................................................14

6.3. Industry Canada (IC) Compliance Statements...........................................................................15

6.4. Approved Antennas....................................................................................................................16

7. Boot Loader............................................................................................................. 17

8. Ordering Information................................................................................................18

9. References.............................................................................................................. 19

10. Revision History.......................................................................................................20

1. Integrated Devices and Block Diagram

1.1. Module Block Diagram

Figure 1-1 Module Block Diagram

ATSAMR21G18-MR210UA

AT45DB041E

ATECC508

4-Mbit DataFlash

CryptoAuthentication

Device

Balun &

Harmonic Filter

Antenna Diversity

Switch

U.Fl

50Ohm

U.Fl

50Ohm

1 GPIO 17 GPIO

SPI

SWI

ATSAMR21G18

ARM® Cortex®-M0+

1.2. Integrated Peripherals

1.2.1. Serial Flash Interconnection

Table 1-1 Serial Flash Interconnection

DataFlash Signal MCU Function MCU Pin Port and SERCOM Configuration

SO MISO 37 PA22 SERCOM5 PAD[2] DIPO=0x2

SI MOSI 38 PA23 SERCOM5 PAD[3] DOPO=0x2

SCK SCK 48 PB03 SERCOM5 PAD[1] DOPO=0x2

#CS GPIO 47 PB02 to be set low in software before SPI access

The signals in this table are not available as module I/O. More information about the FLASH IC can be

found in its related datasheet [ADESTO].

1.2.2. UART with Hardware Flow Control (RTS/CTS)

For an Application where the ADC is not in use, SERCOM0 can be multiplexed as shown in the table

below.

Table 1-2 UART with Hardware Flow Control (RTS/CTS)

Module Pin MCU Function MCU Pin Port and SERCOM Configuration

14 UART TX 15 SERCOM0; MUX=C; PAD[0] TXPO=0x2

25 UART RX 10 SERCOM0; MUX=D; PAD[1] RXPO=0x1

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Module Pin MCU Function MCU Pin Port and SERCOM Configuration

26 UART RTS 11 SERCOM0; MUX=D; PAD[2] TXPO=0x2

13 UART CTS 12 SERCOM0; MUX=D; PAD[3] TXPO=0x2

The signals in this table are not available as module IO. More information about the FLASH IC can be

found in its related datasheet. (ADESTO)

1.2.3. 32kHz Crystal

PA00 and PA01 are used for the 32kHz crystal. This pins are not available as module IO.

1.2.4. SAM R21 USB Availability

The USB pins are made available as differential pair routed GPIO’s. A base board with the required

connection hardware can support an USB interface.

Table 1-3 SAM R21 USB Availability

Module Pin Function MCU Pin Port Configuration or Xplain Function

19 GPIO or USB_D+ 33 PA24: For USB MUX=G

20 SPIO or USB_D- 34 PA25: For USB MUX=G

The module power supply can’t be operated directly from a 5V USB source. The module base board has

to implement the required voltage regulator.

1.3. RF Front End Control

The antenna diversity signals ANT_DIV_P/N are used to control the diversity switch U4. The signal

ANT_DIV_P is available at the IO ring pin 18 to indicate the antenna currently in use.

In addition at pin 17, the RX_TX indicator signal is available to indicate if the module is currently in

transmit mode.

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Table 1-4 RF Front End Control

RF Front End Signal MCU Function MCU Pin Port and SERCOM

Configuration

ANT_DIV_P FECTRL2 21 PA12; MUX=F;

F3CFG=DIG1

Available at module pin

ANT_DIV_N FECTRL1 16 PA09; MUX=F;

F1CFG=DIG2

FEM_RX_TX FECTRL3 22 PA13; MUX=F;

F0CFG=DIG3 for High

active TX indication

F0CFG=DIG4 for Low

active TX indication

Available at module pin

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2. Mechanical Description

2.1. Mechanical Dimensions

Dimensions are in mm. The module pins are arranged with a 1mm pitch distance. The module is

designed in a symmetric way.

Figure 2-1 Module Bottom Dimensions ( Seen from a CAD top perspective )

The module can be mounted to a base board with a soldered RF connection. For this case one or both

U.Fl connectors are left unconnected and the RF pads on the bottom side are used to feed an antenna

located on the base board.

2.2. Footprint and Layout Recommendation

Since the module does not contain an antenna, the module does not set any limits for the base board

material selection or the board stack-up construction. The module does also not require a certain

positioning on the board in relation to the board edge. The module must be placed away from interference

sources on the base board like clock oscillators or step converters. The area underneath the module must

be filled with a grounded copper plane. The RF-Pad area needs special attention. The following sections

provide more information on that.

A typical design is supposed to connect the I/O ring to the base board while the antenna feeds are using

the U.Fl connectors. Using the antennas in Approved Antennas on page 16, the modular approval for

the final product can be used without re-certification.

2.2.1. Design without RF-Pads

For a design without U.Fl connected antennas, the base board design has to have no copper fill within the

RF-Pad area (*!). All layers with less than 0.5mm distance from top shall not be filled with copper

underneath the RF-Pad area.

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For all other I/O pads the geometry in below figure should be used.

Figure 2-2 Recommended Base Board Layout

2.2.2. Design without RF-Pads

For applications where the antenna is implemented on the base PCB, the RF-Pads can be used to

connect the RF signals. The pad layout is available in Figure 2-2 Recommended Base Board Layout on

page 8. The base board traces shall be designed with a line impedance of 50Ohm. Depending on the

base board stack construction a microstrip or a grounded coplanar design can be implemented. The best

choice will be the line type with the best match in between line width and the 0.8mm pad width.

For all other IO pads the geometry in Figure 2-2 Recommended Base Board Layout on page 8 should be

used.

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3. I/O Pin Assignment

The module pin assignment is shown in below table. The Column "MCU pin" is referring to the

ATSAMR21G18 datasheet [SAMR21]. The column “Port Configuration” is intended to help determine the

required SAMR21 port configuration..

Table 3-1 RF Front End Control

Module Pin Function MCU Pin Port Configuration

1 GND

2 GND

3 VCC

4 VCC

5 RSTN 40

6 SPI_CS 26 SERCOM1; MUX=C; DOPO=0x1; Master PAD1

7 SPI_MOSI 27 SERCOM1; MUX=C; DOPO=0x1 Master PAD2

For slave operation this pin is MISO

8 SPI_MISO 25 SERCOM1; MUX=C; DIPO=0x0 Master PAD0

For slave operation this pin is MOSI

9 SPI_SCLK 28 SERCOM1; MUX=C; DOPO=0x1 Master PAD3

10 GPIO 41 PA28 (Yellow LED; low active)

11 - Not connected

12 GND

13 RXD1 12 SERCOM0; MUX=D; PAD[3] RXPO=0x3

Can be used for UART with RTS/CTS

14 TXD1 15 SERCOM0; MUX=C; PAD[0] TXPO=0x0

Can be used for UART with RTS/CTS

15 - Not connected

16 - Not connected

17 FEM_RX_TX 22 PA13; MUX=F; FECTRL3 (LED red)

18 ANT_DIV_P 21 PA12; MUX=F; FECTRL2 (LED green)

19 GPIO/USB_DM 33 PA24 for USB MUX=G

20 GPIO/USB_DP 34 PA25 for USB MUX=G

21 - Not connected

22 RXD0 24 SERCOM2; MUX=C; PAD[3]; RXPO=0x3

23 TXD0 23 SERCOM2; MUX=C; PAD[2]; TXPO=0x1

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Module Pin Function MCU Pin Port Configuration

24 AREF 9 MUX=B; disable digital

25 ADC0 10 MUX=B; AIN[1]; disable digital

Can be used for UART with RTS/CTS

26 ADC1 11 MUX=B; AIN[2]¸ disable digital

Can be used for UART with RTS/CTS

27 - Not connected

28 - Not connected

29 GND

30 SWCLK 45 Programming interface

31 SWDIO 46 Programming interface

32 - Not connected

33 ATECC508 GPIO Crypto IC GPIO with intrusion detection feature

34 - Not connected

35 - Not connected

36 I2C SCL 32 SERCOM3 PAD1 MUX=C

37 I2C SDA 31 SERCOM3 PAD0 MUX=C

38 - Not connected

39 - Not connected

40 - Not connected

41 GND

42 GND

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4. Electrical Characteristics

This section will outline the main parameters required to build applications. The module characteristics

are determined by the implemented parts. See References on page 19 for required datasheet

references.

4.1. Absolute Maximum Ratings

Table 4-1 Absolute Maximum Ratings

Symbol Parameter Condition Min. Typ. Max. Unit

TSTOR Storage temperature -40 +125 °C

VPIN Pin voltage with

respect to GND and

VDD

GND-0.3V VDD+0.3V V

VESD ESD robustness Modules I/O's

routed to SAM

R21

Human Body

Model

4 kV

Charged

Device Model

550 V

PRF Input RF level +10 dBm

4.2. Recommended Operating Ratings

Table 4-2 Recommended Operating Ratings

Symbol Parameter Condition Min. Typ. Max. Unit

TOP Operating temperature range -40 85 °C

VDD Supply voltage 1.8 3.6 V

4.3. Module Performance Data

If not otherwise stated the measurements are done with VDD=3.3V at 25°C.

Table 4-3 Module Performance Data

Symbol Parameter Condition Min. Typ. Max. Unit

IDD Supply current MCU at TBD MHz(1)

With transceiver in RX_ON state

With transceiver in TX state

PRF RF transmit power U.Fl interface 2 3.5 dBm

Pemit Radiated transmit power Using antenna ANT-24G-S21-P5FL(2)

Using antenna M07-FL(3)

3.5

8dBm

EIRP

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Symbol Parameter Condition Min. Typ. Max. Unit

PSPUR_TX Transmitter spurious

emissions

U.Fl connector, conducted, >2.5GHz -50 dBm

PSENS Receiver sensitivity U.Fl interface -98 dBm

dod Outdoor range Using antenna ANT-24G-S21-P5FL

ANT-24G-S21-P5FL in Ch26(2)

Using antenna M07-FL

M07-FL in Ch26(3)

TBD

fRef_0 Reference crystal

deviation

T = 25°C default XTAL_TRIM setting

T = 25°C NV memory XTAL_TRIM setting

-5

+20

ppm

fRef_T Reference crystal drift

over temperature

-40°C <TOP< +85°C -15 +15 ppm

f32k_0 Watch crystal deviation T = 25°C default XTAL_TRIM setting

T = 25°C NV memory XTAL_TRIM setting

TBD

ppm

f32lk_T Watch crystal drift over

temperature

-40°C <TOP< +85°C TBD ppm

Note:

1. Transceiver state TRX_OFF, FLASH deselect.

2. For FCC band edge compliance it is required to operate Ch26 with not more than power level 13.

3. For FCC band edge compliance it is required to operate Ch26 with not more than power level 14

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5. Non-Volatile Memory Information

The SAM R21 provides a user readable Non-Volatile Memory (NVM) space referred to as the user row in

the data sheet. The base address for the application is 0x804008.

Table 5-1 NVM (User Row) Data

Offset Address Field Name Field Description Length

+0x00 MIB_REVISION Data structure revision 0x1501 2 Bytes

+0x02 MAC_IEEE_ADDRESS Module specific IEEE MAC Address 8 Bytes

+0x0A BOARD_SERIAL Module specific serial number 10 Bytes

+0x14 ATMEL_PART_NO Product specific part number 8 Bytes

+0x1C PCBA_REV Product PCB/assembly revision 1 Byte

+0x1D XTAL_TRIM Reference crystal calibration value 1 Byte

+0x1E CRC16 Checksum for this data structure 2 Bytes

The end user application software has to copy two data fields to radio transceiver registers. The data in

MAC_IEEE_ADDRESS have to be copied to the registers IEEE_ADDR_0 to _7. The

MAC_IEEE_ADDRESS is stored little endian with the first byte stored at the lowest address.

The XTAL_TRIM value has been determined during production test and needs to be copied to the

transceiver XTAL_TRIM section inside the XOSC_CTRL register. This will reduce the absolute deviation

for the 16MHz reference crystal. See Module Performance Data on page 11 for parameter details.

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6. Radio Certification

The module ATSAMR21G18-MR210UA in combination with the approved antennas listed in Approved

Antennas on page 16 have received regulatory approvals for modular devices in the United States and

European countries.

6.1. United States (FCC)

The module ATSAMR21G18-MR210UA complies with the requirements of FCC part 15.

To fulfill FCC Certification requirements, an OEM manufacturer must comply with the following

regulations:

•The modular transmitter must be labeled with its own FCC ID number, and, if the FCC ID is not

visible when the module is installed inside another device, then the outside of the device into which

the module is installed must also display a label referring to the enclosed module.

•This exterior label can use wording such as the following. Any similar wording that expresses the

same meaning may be used.

Sample Label for integration of ATSAMR21G18-MR210UA:

Contains FCC-ID: VNR-ATSAMR210UA-0

This device complies with Part 15 of the FCC Rules. Operation is subject to the following

two conditions: (1) this device may not cause harmful interference, and (2) this device

must accept any interference received, including interference that may cause undesired

operation.

This equipment complies with Part 15 of the FCC Rules. Operation is subject to the following two

conditions: (1) this device may not cause harmful interference, and (2) this device must accept any

interference received, including interference that may cause undesired operation (FCC 15.19). The

antenna(s) used for this mobile transmitter must provide a separation distance of at least 20 cm from all

persons and must not be co-located or operating in conjunction with any other antenna or transmitter.

Installers must be provided with antenna installation instructions and transmitter operating conditions for

satisfying RF exposure compliance. This device is approved as a mobile device with respect to RF

exposure compliance, and may only be marketed to OEM installers. Use in portable exposure conditions

(FCC 2.1093) requires separate equipment authorization.

Modifications not expressly approved by this company could void the user's authority to operate this

equipment (FCC section 15.21).

To be compliant with FCC part 15 the transmit power setting (register 0x05, PHY_TX_PWR) for channel

26 must not exceed the values in Table 6-1 Approved Antennas on page 16. The module application

software must ensure this settings for operation within the FCC territory.

6.2. Europe (ETSI)

The module ATSAMR21G18-MR210UA is conform for use in European Union countries.

If the ATSAMR21G18-MR210UA module is incorporated into a product, the manufacturer must ensure

the compliance of the final product to the European harmonized EMC and low-voltage/safety standards. A

Declaration of Conformity must be issued for each of these standards and kept on file as described in

Annex II of the R&TTE Directive.

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The manufacturer must maintain a copy of the ATSAMR21G18-MR210UA module documentation and

ensure the final product does not exceed the specified power ratings, antenna specifications, and/or

installation requirements as specified in the user manual. If any of these specifications are exceeded in

the final product, a submission must be made to a notified body for compliance testing to all required

standards.

The CE marking must be affixed to a visible location on the OEM product. The CE mark shall consist of

the initials "CE" taking the following form:

•If the CE marking is reduced or enlarged, the proportions must be respected.

•The CE marking must have a height of at least 5 mm except where this is not possible on account

of the nature of the apparatus.

•The CE marking must be affixed visibly, legibly, and indelibly.

More detailed information about CE marking requirements can be found at "DIRECTIVE 1999/5/EC OF

THE EUROPEAN PARLIAMENT AND OF THE COUNCIL" on 9 March 1999 at section 12.

For the operation in Europe, there is no power setting limit.

6.3. Industry Canada (IC) Compliance Statements

This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the

following two conditions: (1) this device may not cause interference, and (2) this device must accept any

interference, including interference that may cause undesired operation of the device.

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts

de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire

de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le

brouillage est susceptible d'en compromettre le fonctionnement.

This equipment complies with radio frequency exposure limits set forth by Industry Canada for an

uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm

between the device and the user or bystanders.

Cet équipement est conforme aux limites d'exposition aux radiofréquences définies par Industrie Canada

pour un environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20

cm de distance entre le dispositif et l'utilisateur ou des tiers.

CAUTION: Any changes or modifications not expressly approved by the party responsible for compliance

could void the user’s authority to operate the equipment. The OEM integrator is still responsible for testing

their end-product for any additional compliance requirements required with this module installed (for

example, digital device emissions, PC peripheral requirements, etc.). This Module is labeled with its own

IC ID. If the IC ID Certification Number is not visible while installed inside another device, then the device

should display the label on it referring the enclosed module. In that case, the final end product must be

labelled in a visible area with the following:

“Contains Transmitter Module IC: 20266-ATSAMR210UA0”

“Contains IC: 20266-ATSAMR210UA0”

Ce module est étiqueté avec son propre ID IC. Si le numéro de certification IC ID n'est pas visible lorsqu'il

est installé à l'intérieur d'un autre appareil, l'appareil doit afficher l'étiquette sur le module de référence ci-

joint. Dans ce cas, le produit final doit être étiqueté dans un endroit visible par le texte suivant:

“Contains Transmitter Module IC: 20266-ATSAMR210UA0”

Atmel ATSAMR21G18-MR210UA [DATASHEET]

Atmel-42475B-ATSAMR21G18-MR210UA_Datasheet_Preliminary-09/2015

“Contains IC: 20266-ATSAMR210UA0”

6.4. Approved Antennas

The device has been tested and approved for use with the antenna type listed below. The device may be

integrated with other custom design antennas which OEM installer must authorize with respective

regulatory agencies. The used antenna is to be connected to the Radio PCB via U.Fl connection.

Table 6-1 Approved Antennas

Manufacturer Part Number Description Gain FCC Max. Ch26

Power Register

Settings

RF Solutions ANT-24G-S21-P5FL 21mm quarter wave monopole with

U.Fl pigtail

0dBi 13..15

TekfunCo.,LTD M07-FL 170mm quarter wave monopole

with U.Fl pigtail

5dBi 14..15

The above table shows the allowed power settings for Channel 26 if the equipment is operated under

FCC conditions.

According to KDB 178919 [Policy] it is allowed to substitute approved antennas through equivalent

antennas of the same type with equal or less antenna gain:

‘Equivalent antennas must be of the same type (e.g., yagi, dish, etc.), must be of equal or less gain than

an antenna previously authorized under the same FCC ID, and must have similar in band and out-of-band

characteristics (consult specification sheet for cutoff frequencies).’

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7. Boot Loader

The module will be delivered with a pre flashed boot loader. Refer to the boot loader manual for detailed

information. It is online available under the Application Note code AVR2054.

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8. Ordering Information

Module Type Packaging(1) Ordering Code Package Operational Range

ATSAMR21G18-

MR210UA Tape & Reel ATSAMR21G18-

MR210UA-T

19mm x 20mm

SMT

Industrial (-40oC to

85°C)

Note:

1. MOQ is a reel with 200 modules.

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9. References

1. ADESTO. (n.d.). Adesto Technologies. Retrieved from AT45DB041E Datasheet: http://

www.adestotech.com

2. ATECC508. (n.d.). www.atmel.com. Retrieved from ECC-based Devices: http://www.atmel.com/

products/security-ics/cryptoauthentication/ecc-256.aspx

3. Policy, P. C. (n.d.). 178919 D01 Permissive Change Policy. Retrieved from FCC OET: https://

apps.fcc.gov/oetcf/kdb/forms/FTSSearchResultPage.cfm?id=33013&switch=P

4. SAM R21. (n.d.). www.atmel.com. Retrieved from http://www.atmel.com/Images/Atmel-42223-SAM-

R21_Datasheet.pdf

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10. Revision History

Doc Rev. Date Description

42475B 09/2015 •Updated United States (FCC) on page 14.

•Added Industry Canada (IC) Compliance Statements on page 15

42475A 07/2015 Initial document release.

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