Walsin Technology Corporation
Page 1 of 7 Multilayer Chip Varistor Version 02 Jan. 2008
MULTILAYER CHIP VARISTOR
For ESD / Surge Protection
VZ0402,VZ0603,VZ0805,VZ1206
Green Material Series – RoHS Compliance
Customer :
Approval No :
Issue Date :
Customer Approval :
Walsin Technology Corporation
Page 2 of 7 Multilayer Chip Varistor Version 02 Jan. 2008
DESCRIPTION
Walsin Multilayer Chip Varistor is a family of Transient Voltage Surge Suppression products.Today , electronic
circuits are becoming smaller and more sentive to external interference. Walsin Multilayer Chip Varistor is
designed to protect components from destruction of transients and ESD(Electronic Static Discharge). The wide
operating voltage and energy rage make Walsin Multilayer Chip Varistor suitable for numerous applications on
I/O protection , Vcc protectiion , Keyboard protection , LCD protection , Sensor protection…etc. The Walsin
Chip Varistor is manufactured by Multilayer fabrication technology providing excellent voltage clamping ability
and is supplied in leadless , surface mount form , compatible with modern reflow and wave soldering
procedures.
FEATURES
1. Multilayer fabrication technology
2. -55to 125 operating temperature Range
3. Operating voltage range VM(DC) at 5.5V ~ 85V
4. Able to withstand ESD test of IEC-61000-4-2
5. Bi-directional clamping characteristic
APPLICATIONS
1. Protection of cellular phones, PDA, High Speed Data Line…etc.
2. ESD Protection for components sensitive to IEC 61000-4-2, Provides Circuit Board Transient Voltage
Protection for Transistors.
3. Protection of Video & Audio Ports.
ELECTRICAL DATA
Item General Specification
Continuous Rating :
Steady State Applied Voltage :
DC voltage Range (VMDC)
AC voltage Range (VMDC RMS)
5.5V to 85V
4V to 60V
Transient Rating :
Non-Repetitive Surge Current( 8/20μs)
Non-Repetitive Surge Energy, 10/1000μs Waveform,(WTM)
Operating Ambient Temperature Range(TA)
Storage Temperature Range (TSTG)
Temperature Coefficient(αV) of clamping Voltage (VC) at Specified Test Current
20A to 100A
0.05J to 1.0J
-55°C to 125°C
-55°C to 150°C
<0.01 %/°C
DIMENSIONS
Terminal electrodeNi / Sn electrode
Note: * means VZ1206 5.5Vdc~22Vdc items
**means VZ1206 26Vdc~85Vdc items
SIZE VZ0402 VZ0603 VZ0805 VZ1206
L 1.00 ± 0.10 1.60 ± 0.15 2.00 ± 0.20 3.20 ± 0.20
W 0.50 ± 0.10 0.80 ± 0.15 1.25 ± 0.20 1.60 ± 0.20
T 0.50 ± 0.10 0.80 ± 0.15 0.80 ± 0.20 0.80 ± 0.10 mm*
1.10 ± 0.20 mm**
Ts 0.25 ± 0.15 0.35 ± 0.15 0.50 ± 0.20 0.65 ± 0.25
Walsin Technology Corporation
Page 3 of 7 Multilayer Chip Varistor Version 02 Jan. 2008
DEVICE RATING AND SPECIFICATIONS
MAXIMUM RATINGS SPECIFICATIONS
Typical
Capacitance
Max.
Continuous
Working
Voltage
Maximum Non-
Repetitive
Surge Current
(8/20μs)
Maximum Non-
Repetitive Surge
Energy
(10/1000μs)
Max. Claming
Voltage at
Specified
Current
(8/20μs)
Nominal Voltage
At 1mA (DC)
Current @1KHz
VM(DC) V
M(AC) I
TM W
TM Vc
VN(DC)
Min. VN(DC)
Max. C
Part Number
(V) (V) (A) (J) (V) (V) (V) (pF)
VZ0402M050AGT 5.5 4 20 0.05 20 at 1A 8.0 11.0 295
VZ0402M090AGT 9 6 20 0.05 23 at 1A 10.2 13.8 190
VZ0402M110AGT 11 8 20 0.05 25 at 1A 12.75 17.25 160
VZ0402M140AGT 14 11 20 0.05 30 at 1A 15.3 20.7 135
VZ0402M180AGT 18 14 20 0.05 40 at 1A 21.6 26.4 93
VZ0603M050AGT 5.5 4 30 0.1 20 at 1A 8.0 11.0 800
VZ0603M090AGT 9 6 30 0.1 23 at 1A 10.2 13.8 680
VZ0603M140AGT 14 11 30 0.1 30 at 1A 15.3 20.7 350
VZ0603M180AGT 18 14 30 0.1 39 at 1A 21.6 26.4 270
VZ0603M260AGT 26 20 30 0.1 54 at 1A 29.7 36.3 200
VZ0603M300AGT 30 25 30 0.1 65 at 1A 35.1 42.9 120
VZ0603M380AGT 38 30 30 0.1 77 at 1A 42.3 51.7 100
VZ0805M050AGT 5.5 4 80 0.1 20 at 1A 8.0 11.0 1600
VZ0805M090AGT 9 6 80 0.1 23 at 1A 10.2 13.8 1180
VZ0805M180AGT 18 14 100 0.2 39 at 1A 21.6 26.4 550
VZ0805M220AGT 22 17 100 0.2 44 at 1A 24.3 29.7 400
VZ0805M260AGT 26 20 100 0.3 54 at 1A 29.7 36.3 350
VZ0805M300AGT 30 25 100 0.3 65 at 1A 35.1 42.9 310
VZ0805M380AGT 38 30 100 0.3 77 at 1A 42.3 51.7 280
VZ0805M450AGT 45 35 80 0.3 90 at 1A 50.4 61.6 195
VZ1206M050AGT 5.5 4 100 0.2 20 at 1A 8.0 11.0 3200
VZ1206M140AGT 14 11 100 0.3 30 at 1A 15.3 20.7 1150
VZ1206M180AGT 18 14 100 0.3 38 at 1A 21.6 26.4 900
VZ1206M220AGT 22 17 100 0.4 44 at 1A 24.3 29.7 840
VZ1206M260AGT 26 20 100 0.5 54 at 1A 29.7 36.3 490
VZ1206M300AGT 30 25 100 0.6 65 at 1A 35.1 42.9 440
VZ1206M380AGT 38 30 100 0.7 77 at 1A 42.3 51.7 400
VZ1206M450AGT 45 35 100 0.8 90 at 1A 50.4 61.6 310
VZ1206M560AGT 56 40 100 1.0 110 at 1A 61.2 74.8 280
VZ1206M650AGT 65 50 100 0.5 135 at 1A 73.8 90.2 240
VZ1206M850AGT 85 60 100 0.6 165 at 1A 90.0 110 160
Walsin Technology Corporation
Page 4 of 7 Multilayer Chip Varistor Version 02 Jan. 2008
Chi
p
varistor
STANDARD TESTING CONDITION
Unless otherwise specified
Temperature15 ~ 35°C
Humidity25%RH ~ 85%RH
Atmospheric pressure86kPa ~ 106kPa
SPECIFICATION
1. Electrical Reliability
Test item Test condition / Test method Specification
High temperature storage +125±3 for 1000 hours
Measurement to be made after keeping at room temp. for 24 ±2hr V at 1mA 10%
Low temperature storage -40±3 for 1000 hours
Measurement to be made after keeping at room temp. for 24 ±2hr V at 1mA 10%
Humidity storage 40±2 , 90 ~95%RH for 500 hours
Measurement to be made after keeping at room temp. for 24 ±2hr V at 1mA 10%
Temperature cycles Times5 cycles
Step Temp.() Time(min.)
1 -55±3 30±3
2 room temp. 2~3
3 +125±3 30±2
4 room temp. 2~3
Measurement to be made after keeping at room temp. for 24 ±2hr
V at 1mA 10%
2. Mechanical Reliability
Test item Test condition / Test method Specification
Solderability Solder temp.230±5°C
Immersion time2±0.5 sec
Immersion and emersion rates25mm/s
Min 90% electrode shall
be covered with solder.
Resistance to Soldering Heat Pre-heating120~ 150 , 60 sec
Solder temp.260±5°C
Immersion time10±1 sec
Measurement to be made after keeping at room temp. for 24 ±2h
V at 1mA 10%
Disappearance of
electrode due to
immersion into solder
shall not exceed 25% of
edges of each
electrode.
Adhesive Strength of
Termination Solder chip on PCB and applied
0805/1206 Series: 10N(1Kgf) for 10 sec No visible damage
0402/0603 Series: 5N(0.5Kgf) for 10 sec
Vibration Solder chip on PCB.
Frequency10 Hz55 Hz10 Hz (1min)
Oscillation amplitude1.5 mm
Times2 hrs in each of three perpendicular direction
No visible damage
Bending Test The middle part of substrate shall be pressurized by means of the
pressurizing rod at a rate of 1mm per second until the deflection becomes 1
mm and then the pressure shall be maintained for 5 sec..
No visible damage
V at 1mA 10%
Walsin Technology Corporation
Page 5 of 7 Multilayer Chip Varistor Version 02 Jan. 2008
SOLDERING CONDITION
Typical examples of soldering processes that provide reliable joints without any damage are given in figure below:
Infrared soldering profile
ORDERING CODE
VZ 0402 M 050 A G T
Type Code Chip Size Style Rated Voltage Capacitance
Tolerance Termination Packing
VZ: Walsin
Varistor
Code is LxW(in
inches)
0402=04x02
0603=06x03
0805=08x05
1206=12x06
M: Multilayer
A: Array 050 = 5.5V
070 = 7V
090 = 9V
140 = 14V
180 = 18V
A: Standard
G: Green Material T: Reeled
B: Bulk
Walsin Technology Corporation
Page 6 of 7 Multilayer Chip Varistor Version 02 Jan. 2008
PACKAGING
Paper Tape specifications (unit :mm) and Packaging quantity
Series A B E F ΦD
VH0402 Series 1.12 ± 0.03 0.62 ± 0.03 1.75 ± 0.05 3.50 ± 0.05 1.55 ± 0.05
VZ0603 Series 1.80 ± 0.05 0.95 ± 0.05 1.75 ± 0.05 3.50 ± 0.05 1.55 ± 0.05
VZ0805 Series 2.25 ± 0.05 1.45 ± 0.05 1.75 ± 0.05 3.50 ± 0.05 1.55 ± 0.05
VZ1206 Series 3.50 ± 0.05 1.88 ± 0.05 1.75 ± 0.05 3.50 ± 0.05 1.55 ± 0.05
Series P0 P1 T W Quantity/Reel
VH0402 Series 4.00 ± 0.10 2.00 ± 0.10 0.60 ± 0.03 8.00 ± 0.20 10Kpcs
VZ0603 Series 4.00 ± 0.10 2.00 ± 0.10 0.87 ± 0.05 8.00 ± 0.20 4Kpcs
VZ1206 Series 4.00 ± 0.10 2.00 ± 0.10 1.24 ± 0.05 8.00 ± 0.20 4KGcs
y Tape Material : Paper tape.
Reel dimensions
A
B
C
D
Symbol A B C D
Dimension Φ178.0±2.0 Φ60.0±1.0 13.0±0.2 10.0±1.5
Walsin Technology Corporation
Page 7 of 7 Multilayer Chip Varistor Version 02 Jan. 2008
CAUTION OF HANDLING
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects, which might directly cause damage to the third party’s life, body or
property.
(1) Aircraft equipment
(2) Aerospace equipment
(3) Undersea equipment
(4) Medical equipment
(5) Traffic signal equipment
(6) Applications of similar complexity and /or reliability requirements to the applications listed in the
above.
Storage condition
(1) Products should be used in 6 months from the day of WALSIN outgoing inspection, which can be
confirmed.
(2) Storage environment condition.
Products should be storage in the warehouse on the following conditions.
Temperature : -10 to +40°C
Humidity : 30 to 70% relative humidity
Don’t keep products in corrosive gases such as sulfur. Chlorine gas or acid or it may cause
oxidization of electrode, resulting in poor solderability.
Products should be storage on the palette for the prevention of the influence from humidity,
dust and son on.
Products should be storage in the warehouse without heat shock, vibration, direct sunlight
and so on.
Products should be storage under the airtight packaged condition.