d DATA
SHEET
PHOTOREFLECTIVE SENSOR
LEADFRAME PACKAGE
HVS6003-002
FEATURES:
VCSEL and phototransistor in
industry standard leadframe
packaging
IEC 80625 Class 1 Laser Product
Optical plastics block visible
wavelength for better ambient light
rejection
Optical isolation of VCSEL and
Phototransistor
Narrow beam VCSEL allows sensing
distances of more than 20mm
Very low power consumption
The HVS6003-002 is designed as a higher performance alternative to LED based reflective sensors. This Vertical Cavity
Surface Emitting Laser (VCSEL) based sensor enables reflective sensing at longer distances and of targets with lower
specular reflection. In addition, the HVS6003-002 significantly decreases the total amount of electrical power dissipation.
To further suppress ambient light, the HVS6003-002 is potted with a visible wavelength absorbing optical plastic.
IEC 80625 Class 1 Laser Product.
Part Number Description
HVS6003-002 VCSEL and Phototransistor in leadframe package. Parts are shipped in industry standard tape
and reel package.
HVS6003-002 PHOTOREFLECTIVE SENSOR
ABSOLUTE MAXIMUM
RATINGS
Parameter Rating
Storage Temperature -40 to +85°C
Case Operating Temperature -40 to +85°C
Lead Solder Temperature 260°C, 10 sec.
Laser peak forward current with pulse
width less than 1μs
18mA
Laser continuous average current
15mA
Laser reverse voltage 5V
ESD Exposure (Human Body Model) 200V
Collector-Emitter Voltage 30V
Emitter-Collector Voltage 5V
Power Dissipation 100mW
*-20ºC operation under assessment
1 Heel and wrist straps must be used on a properly grounded
workstation
Notice
Stresses greater than those listed under “Absolute Maximum Ratings”
may cause permanent damage to the device. This is a stress rating
only and functional operation of the device at these or any other
conditions above those indicated in the operations section for
extended periods of time may affect reliability.
Notice
The inherent design of this component causes it to be sensitive to
electrostatic discharge (ESD). To prevent ESD-induced damage
and/or degradation to equipment, take normal ESD precautions when
handling this product
HVS6003-002 PHOTOREFLECTIVE SENSOR
Phototransistor
Parameters Test Condition Symbol Min. Typ. Max. Units Notes
VCSEL Operating Current Adjustable to
establish operating
power
IOP 6 15 mA 1
Optical Power Output IF=6mA PO 1 1.6 2.5 mW 1
Optical Power variation with
temperature
IF = 6mA, TA = -40 to
5°C
Δ
P/
Δ
T 1 3 dB 2
Threshold Current ITH 1 2 2.5 mA
Threshold Current
Temperature Variation
TA = 0oC to 70oC
Δ
ITH -1.5 1.5 mA 3
Slope Efficiency Po =1.6mW η0.25 0.4 0.5 mW/mA 4
Slope Efficiency
Temperature variation
TA = 0oC to 70oC
Δ
η
/
Δ
T -0.6 %/ oC 5
Peak Wavelength IF=6mA
λ
P 830 850 860 nm
Laser Forward Voltage IF=6 mA VF 1.5 1.8 2.2 V
Laser Reverse Voltage IR=10µA BVRLD -10 V
Rise and Fall Times Prebias Above
Threshold, 20%-80%
tr/tf 500 ps
Series Resistance IF=6 mA RS 25 35 50 Ohms
Series Resistance
Temperature Coefficient
Δ
R/
Δ
T -0.3 %/ oC
Beam Divergence IF=6 mA, FW1/e
Θ 18 24 30 DEG 6
Divergence change with
Current
ΔΘ/ΔΙ 0.6 DEG/mA
VCSEL ELECTRO-OPTICAL
CHARACTERISTICS
TA=25°C unless otherwise stated
TYPICAL (NOT GUARANTEED) VCSEL PERFORMANCE CHARACTERISTICS:
50%
60%
70%
80%
90%
100%
110%
-50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100
Temperature (C )
Normalized Power (%)
IF - 4mA
IF - 6mA
IF - 8mA
IF - 10mA
IF - 12mA
-20-15-10-5 0 5 101520
Divergence (Degrees)
5mA
10mA
15mA
Full Width at 10% Point
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
0 2 4 6 8 101214161820
Current (mA)
Pow er ( m W )
-50°C -40°C -30°C
-20°C -10°C 0°C
10°C 20°C 30°C
40°C 50°C 60°C
70°C 80°C 90°C
NOTES:
1. Operating power is set by the average current in the VCSEL
2. The VCSEL operating power can be more tightly controlled using simple circuitry discussed in the application note
“VCSEL Spice Model”
3. The VCSEL threshold current is parabolic with temperature. For specifications outside of the 0 to 70oC range, please
contact AOC.
4. Slope efficiency is defined as ΔPo/ΔIF at a total power output of 1.6 mW.
5. The VCSEL slope efficiency is a nearly linear function with temperature. For specifications outside of the 0 to 70oC
range, please contact AOC.
6. Beam divergence is defined as the 1/e2 power points.
HVS6003-002 PHOTOREFLECTIVE SENSOR
VCSEL Parameters Test Condition Symbol Min. Typ. Max. Units Notes
Optical crosstalk current VCE = 5V, IVCSEL =
6mA
IL, Feedback 0.001
5
0.01 mA 1,3
ICE IVCSEL = 6mA, VCE =
5V, RL = 100Ω 4 10 16 mA 2
Collector Dark Current VCE = 5V, IVCSEL=0 ICEO 100 nA 3
Collector – Emitter
Breakdown Voltage
IC=100
μ
A VBR-CEO 30 V
Emitter – Collector
Breakdown Voltage
IE=100
μ
A VBR-ECO 5 V
Collector – Emitter
Saturation Voltage
IC=IL/8, VSAT-CE 0.4 V
Photocurrent Rise/Fall Time VCC=5V, IL=1mA,
RL=1000Ω TR/TF 10
μ
s 4
PHOTOTRANSISTOR ELECTRO-OPTICAL
CHARACTERISTICS
TA=25°C unless otherwise stated
)
, with flex circuit.
NOTES:
1. The crosstalk current is measured in a dark environment with no optical feedback. Ambient light can cause an offset
in the measurement.
2. ICE is defined with a Kodak 90% diffuse whitecard (frequency scale) placed at a distance of 1mm. Refer to the
schematic representation below.
3. Collector dark current is measured with the VCSEL off and in an environment free of ambient light. Optical crosstalk is
measured in the same dark environment, but with the VCSEL forward biased at 6mA
4. The rise and fall times depend on the load resistor used.
VCSEL Phototransistor
Reflector
D
=
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
024681012
Distance (mm)
Normalized I
CE
HVS6003-002 PHOTOREFLECTIVE SENSOR
PIN Description
A VCSEL Anode
B VCSEL Cathode
C PT Collector
D PT Emitter
It is recommended in application that a 100-1000Ω load resistor be connected between the emitter and a negative
power supply between 5 and 15V. The output can be read as the voltage across the resistor. Alternatively, the case
can be connected to a power supply with the load resistor remaining connected to the emitter.
PIN OUT
ELECTRICAL SCHEMATIC
VCS
EL
Emi
tte
r
Co
ll
ector
VCS
EL
SOLDER REFLOW PROFILE
160ºC±10 ºC
260ºC MAX
+ 5 º C/sec max ramp
90-120s preheat
5s MAX
60s MAX at 200 ºC
-5º C /sec ma x r amp
160ºC±10 ºC
260ºC MAX
+ 5 º C/sec max ramp
90-120s preheat
5s MAX
60s MAX at 200 ºC
-5º C /sec ma x r amp
NOTES:
1. The above temperature profile shall be at the surface of LED resin.
2. Number of reflow process should be less than 2 times. If the second reflow process is performed, intervals between
the first and the second process should be as short as possible to prevent moisture absorption from LED resin.
Cooling process to normal temperature is required between the first and the second reflow process.
3. Temperature fluctuation to LED at pre-heat process should be minimized. (less than 6ºC)
HVS6003-002 PHOTOREFLECTIVE SENSOR
DIP SOLDER PROFILE:
1. Preheat temperature for soldering : 120 - 150 ºC, for 60 - 120 seconds
2. At 200ºC, soldering time is 30s - 60s
3. At 260ºC, MAX soldering time is less than 5 sec
4. Number of dip soldering process must be less than 2 times and the process is to be performed in sequence. Cooling
process to normal temperature will be required between the first and the second soldering process.
RECOMMENDED PAD LAYOUT:
4.0mm 5.1mm
1.2mm
2.3mm
Dimensions in mm, tolerance ±0.1mm
1.2mm
2.3mm
Dimensions in mm, tolerance ±0.1mm
HVS6003-002 PHOTOREFLECTIVE SENSOR
MOUNTING DIMENSIONS
For reference only. All dimensions in mm [inches].
HVS6003-002 PHOTOREFLECTIVE SENSOR
ADVANCED OPTICAL COMPONENTS
Finisar’s ADVANCED OPTICAL COMPONENTS division
was formed through strategic acquisition of key optical
component suppliers. The company has led the industry
in high volume Vertical Cavity Surface Emitting Laser
(VCSEL) and associated detector technology since 1996.
VCSELs have become the primary laser source for
optical data communication, and are rapidly expanding
into a wide variety of sensor applications. VCSELs’
superior reliability, low drive current, high coupled power,
narrow and circularly symmetric beam and versatile
packaging options (including arrays) are enabling
solutions not possible with other optical technologies.
ADVANCED OPTICAL COMPONENTS is also a key
supplier of Fabrey-Perot (FP) and Distributed Feedback
(DFB) Lasers, and Optical Isolators (OI) for use in single
mode fiber data and telecommunications networks
LOCATION
Allen, TX - Business unit headquarters, VCSEL
wafer growth, wafer fabrication and TO package
assembly.
Fremont, CA – Wafer growth and fabrication of
1310 to 1550nm FP and DFB lasers.
Shanghai, PRC – Optical passives assembly,
including optical isolators and splitters.
SALES AND SERVICE
Finisar’s ADVANCED OPTICAL COMPONENTS division
serves its customers through a worldwide network of
sales offices and distributors. For application assistance,
current specifications, pricing or name of the nearest
Authorized Distributor, contact a nearby sales office or
call the number listed below.
AOC CAPABILITIES
ADVANCED OPTICAL COMPONENTS’ advanced
capabilities include:
1, 2, 4, 8, and 10Gbps serial VCSEL solutions
1, 2, 4, 8, and 10Gbps serial SW DETECTOR
solutions
VCSEL and detector arrays
1, 2, 4, 8, and 10Gbps FP and DFB solutions at
1310 and 1550nm
1, 2, 4, 8, and 10Gbps serial LW DETECTOR
solutions
Optical Isolators from 1260 to 1600nm range
Laser packaging in TO46, TO56, and Optical
subassemblies with SC, LC, and MU interfaces
for communication networks
VCSELs operating at 670nm, 780nm, 980nm,
and 1310nm in development
Sensor packages include surface mount, various
plastics, chip on board, chipscale packages, etc.
Custom packaging options
Phone: 1-866-MY-VCSEL USA (toll free)
1-214-509-2700 USA (Direct dial)
44 (0) 174 336 5533 Europe
886-935-409898 China & Taiwan
81-90-4437-1130 Japan
82-11-220-6153 Asia Pacific &
Korea
Fax: 1-2140509-3709 USA
Email: support@adopco.com
WEB: www.finisar.com/aoc.php
©2008 Finisar Corporation. All rights reserved. Finisar is a registered trademark of Finisar Corporation. Features and specifications are subject to change without notice. 11/10