TBD62503AFG,EL - TOSHIBA - Datasheet.Live

TBD62502A series, TBD62503A series

2015-07-24

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TOSHIBA BiCD Integrated Circu it Silicon Monolithic

TBD62502APG, TBD62502AFG, TB D6 2 502AFNG, TBD62502AFWG

TBD62503APG, TBD62503AFG, TB D6 2 50 3AFNG, TBD62 5 03AFWG

7channel sink type DMOS transistor array

TBD62502A series and TBD62503A series are DMOS

transistor array with 7 circuits. Please be careful about thermal

conditions during use.

Features

• 7 circuits built-in

• High voltage : VOUT = 50 V (MAX)

• High current : IOUT = 300 mA/ch (MAX)

• Input voltage(output on) : TBD62502A series 14 V (MIN)

TBD62503A series 2.5 V (MIN)

• Input voltage(output off) : TBD62502A series 7.0 V (MAX)

TBD62503A series 0.6 V (MAX)

• Package : PG type DIP16-P-300-2.54A

FG type SOP16-P-225-1.27

FNG type SSOP16-P-225-0.65B

FWG type P-SOP16-0410-1.27-002

Pin connection (top view)

Pin connection may be simpl ified for explanator y purpose.

TBD62502APG,TBD62503APG

DIP16-P-300-2.54A

TBD62502AFG,TBD62503AFG

SOP16-P-225-1.27

TBD62502AFNG,TBD62503AFNG

SSOP16-P-225-0.65B

TBD62502AFWG,TBD62503AFWG

P-SOP16-0410-1.27-002

Weight

DIP1

6-P-300-2.54A : 1.11g (Typ.)

SOP1

6-P-225-1.27 : 0.16g (Typ.)

S

SOP16-P-225-0.65B : 0.07g (Typ.)

P-SOP16-0410-1.27-002 : 0.15g (Typ.)

1

2

3

4

5

6

7

8

16

15

14

13

12

11

O1

O2

O3

O4

O5

O6

O7

NC

I1 I2 I3 I4 I5 I6 I7 GND

10

9

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Pin explanati ons

Pin No. Pin name Function

1

I1

Input pin

2

I2

Input pin

3

I3

Input pin

4

I4

Input pin

5

I5

Input pin

6

I6

Input pin

7

I7

Input pin

8

GND

GND pin

9

NC

Non-connection pin

10

O7

Output pin

11

O6

Output pin

12

O5

Output pin

13

O4

Output pin

14

O3

Output pin

15

O2

Output pin

16

O1

Output pin

Equivalent circuit (each driver)

Equivalent circuit may be simplif ied for explanatory purpose.

Clamp

INPUT

OUTPUT

TBD62502A series, TBD62503A series

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Absolute Maximum Ratings (Ta = 25°C)

Characteristics Symbol Rating Unit

Output voltage

V

OUT

50

V

Output cur r ent

I

OUT

300

mA/ch

Input v oltage

V

IN

−0.5 to 30

V

Power

dissipation

PG (Note 1)

PD

1.47

W

FG (Note 2)

0.625

FNG (Note 3)

0.78

FWG (Not e 4)

1.25

Operatin g t emperature

T

opr

−40 to 85

°C

Storage t em per at ur e

T

stg

−55 to 150

°C

Note 1: Device a lone. When Ta exceeds 2 5°C, it is necess ar y to do the derating with 11.8 m W/°C.

Note 2: On PCB (Size: 30 mm × 30 mm × 1.6 mm, Cu area : 50%, single-side glass epoxy ).

When Ta excee ds 25°C, it is necessary to do the der at ing wit h 5 mW/°C.

Note 3: On PCB (Size: 50 mm × 50 mm × 1.6 mm, Cu area : 40%, single-side glass epoxy).

When Ta excee ds 25°C, it is necessary to do the der at ing wit h 6.24 mW/°C.

Note 4: On PCB (J E DEC 2s2p).

When Ta excee ds 25°C, it is necessary to do the der at ing wit h 10 mW/°C.

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Operating Ranges (Ta = −40 to 85 °C)

Characteristics Symbol

Condition Min Typ. Max Unit

Output voltage

V

OUT

―

50

V

Output

current

PG(Note 1)

IOUT

1 circuits ON, Ta = 25 °C

0

―

250

mA/ch

tpw = 25 ms

7 circuits ON

Ta = 85 °C

Tj = 120 °C

Duty = 10 %

0

―

250

Duty = 50 % 0 ― 190

FG(Note 2)

1 circuits ON, Ta = 25 °C 0 ― 250

tpw = 25 ms

7 circuits ON

Ta = 85 °C

Tj = 120 °C

Duty = 10 %

0

―

250

Duty = 50 % 0 ― 120

FNG(Note 3)

1 circuits ON, Ta = 25 °C 0 ― 250

tpw = 25 ms

7 circuits ON

Ta = 85 °C

Tj = 120 °C

Duty = 10 %

0

―

250

Duty = 50 % 0 ― 130

FWG(Note 4)

1 circuits ON, Ta = 25 °C 0 ― 250

tpw = 25 ms

7 circuits ON

Ta = 85 °C

Tj = 120 °C

Duty = 10 %

0

―

250

Duty = 50 % 0 ― 170

Input v oltage

(Output on)

TBD62502A

series VIN

(ON)

IOUT = 100 mA or upper , VOUT = 2 V

14 ― 25 V

TBD62503A

series IOUT = 100 mA or upper, VOUT = 2 V

2.5 ― 25

Input v oltage

(Output off)

TBD62502A

series VIN

(OFF)

IOUT = 100 μA or less, VOUT = 2 V 0 ― 7.0 V

TBD62503A

series IOUT = 100 μA or less, VOUT = 2 V 0 ― 0.6

Note 1: Device a lone.

Note 2: On PCB (Size: 30 mm × 30 mm × 1.6 mm, Cu area : 50%, single-side glass epoxy ).

Note 3: On PCB (Size: 50 mm × 50 mm × 1.6 mm, Cu area : 40%, single-side glass epoxy).

Note 4: On PCB (J E DEC 2s2p).

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Electrical Characteristics (Ta = 25 °C unless otherwise noted)

Characteristics Symbol

Test

Circuit

Condition Min Typ. Max Unit

Output lea kage current Ileak 1

V

OUT

= 50V, T a = 85 °C

VIN = 0 V ― ― 1.0 μA

Output voltage

(Output

ON-resistance)

TBD62502A

series

VDS

(RON) 2

IOUT = 200 mA, VIN =14 V ― 0.4

(2.0) 0.65

(3.25)

V

(Ω)

IOUT = 100 mA, VIN =14 V ― 0.2

(2.0) 0.325

(3.25)

TBD62503A

series

IOUT = 200 mA, VIN =5.0 V ― 0.4

(2.0) 0.65

(3.25)

IOUT = 100 mA, VIN =5.0 V ― 0.2

(2.0) 0.325

(3.25)

Input current

(Output on)

TBD62502A

series IIN

(ON) 3 VIN = 14 V ― ― 1.0 mA

TBD62503A

series VIN = 2.5 V ― ― 0.1

Input current(Output off)

I

IN

(OFF) 4 VIN = 0 V, Ta = 85°C ― ― 1.0 μA

Input v oltage

(Output on)

TBD62502A

series VIN

(ON) 5 IOUT = 100 mA, VOUT = 2 V

― ― 14 V

TBD62503A

series ― ― 2.5

Turn−on delay

t

ON

6 VOUT = 50 V

RL = 200 Ω

CL = 15 pF

―

0.4

―

μs

Turn−off delay tOFF ― 0.8 ―

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Test circuit

1. Ileak 2. VDS (RON)

3. IIN (ON) 4. IIN (OFF)

5. VIN (ON)

Test circuit may be simpli fied for expla nat or y purpose.

OUTPUT

INPUT

GND

VOUT

OUTPUT

INPUT

GND

IOUT

VIN

VDS

RON = VDS / IOUT

Ileak

INPUT

GND

VIN

IIN(ON)

INPUT

GND

IIN(OFF)

OUTPUT

INPUT

GND

IOUT

VIN(ON)

VOUT

OUTPUT

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6. tON, tOFF

Note 1: Pul se width 50 μs, Duty cycle 10%

Output i mpe dance 50 Ω, tr ≤ 5 ns, tf ≤ 10 ns

Please refer t o t he followi ng table for the VIH condition.

Product

VIH

TBD62502A series

14.0 V

TBD62503A series

5.0 V

Note 2: CL includes the pr obe and the test board capacitance.

Test circuit an d timing chart may be simp lified for expla nat or y purpose.

Precautions for Us i ng

This IC does not include built-in protection circuits for ex cess cur rent or overvoltage.

If this IC is sub ject ed to excess cur r ent or overvoltage, it may be dest r oyed.

Hence, the utmost care m ust be ta ken when systems which incorporate th is I C are designed.

Utmost care is necessar y in the design o f the output line, COM M ON and GND line since I C may be

destroy ed due t o short−circuit between outputs, air contamination fault, or fault by improper grounding.

(注2)

(注1) (Note 2)

(Note 1)

TBD62502A series, TBD62503A series

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Package Dimensions

DIP16-P-300-2.54A Unit: mm

Weight: 1.11 g (Typ.)

SOP16-P-225-1.27 Unit: mm

Weight: 0.16 g (Typ.)

TBD62502A series, TBD62503A series

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SSOP16-P-225-0.65B Unit: mm

Weight: 0.07 g (Typ.)

P-SOP16-0410-1.27-002 Unit: mm

Weight: 0.15 g (Typ.)

TBD62502A series, TBD62503A series

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Notes on Contents

1. Pin connection

Pin connect i on may be simplified for explanatory purpose.

2. Equivalent Circuits

Equivalent circuit may be simplif ied for explanatory purpose.

3. Test circuit

Test circuit may be simpli fied for expla nat or y purpose.

4. Timing chart

Timing charts may be si m plif ied for explanator y purposes.

IC Usage Considerations

Notes on handling of ICs

(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for

a moment. Do not exceed any of these ratings.Exceeding the rating(s) may cause device breakdown, damage or

deterioration, and may result in injury by explosion or combustion.

(2) Do not insert devices in the wrong orientation or incorrectly.Make sure that the positive and negative terminals

of power supplies are connected properly.Otherwise, the current or power consumption may exceed the absolute

maximum rating, and exceeding the rating(s) may cause device breakdown, damage or deterioration, and may

result in injury by explosion or combustion.In addition, do not use any device inserted in the wrong orientation

or incorrectly to which current is applied even just once.

(3) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in the case of

overcurrent and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute

maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the

wiring or load, causing a large current to continuously flow and the breakdown can lead to smoke or ignition. To

minimize the effects of the flow of a large current in the case of breakdown, appropriate settings, such as fuse

capacity, fusing time and insertion circuit location, are required.

(4) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to

prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON

or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause

injury, smoke or ignition.Use a stable power supply with ICs with built-in protection functions. If the power

supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause

injury, smoke or ignition.

(5) Carefully select external components (such as inputs and negative feedback capacitors) and load components

(such as speakers), for example, power amp and regulator.If there is a large amount of leakage current such as

from input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is

connected to a speaker with low input withstand voltage, overcurrent or IC failure may cause smoke or ignition.

(The overcurrent may cause smoke or ignition from the IC itself.) In particular, please pay attention when using

a Bridge Tied Load (BTL) connection-type IC that inputs output DC voltage to a speaker directly.

Points to reme m ber on handling of ICs

Heat Radiation Design

When using an IC with large current flow such as power amp, regulator or driver, design the device so that heat is

appropriately radiated, in order not to exceed the specified junction temperature (TJ ) at any time or under any condition.

These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life,

deterioration of IC characteristics or IC breakdown. In addition, when designing the device, take into consideration the

effect of IC heat radiation with peripheral components.

Back-EMF

When a motor rotates in the reverse direction, stops or slows abruptly, current flows back to the motor’s power supply

owing to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s motor power

supply and output pins might be exposed to conditions beyond the absolute maximum ratings. To avoid this problem, take

the effect of back-EMF into consideration in system design.

TBD62502A series, TBD62503A series

2015-07-24

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RESTRICTIONS ON PRODUCT USE

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responsibl e for compl ying with safety standards and for providing adequate designs and safeguards for their hardware, software and

systems which minimize risk and avoid situations in which a malfunction or fail ure of Product could cause loss of human life, bodily inj ury

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incorporate t he Product into their own applicati ons, cust om ers must also ref er to and comply with (a) the latest versions of all relevant

TOSHIBA inform ation, includi ng without limitation, this document, the specifications, the data sheets and application notes for Product

and the precautions and conditi ons set fort h in the "TOSHIBA Semiconductor Reli ability Handbook" and (b) the instructions for the

applicat i on with which the Product will be used with or for. Cust om ers are solely responsibl e for all aspects of their own product design or

applicat i ons, includi ng but not limited to (a) determi ni ng the appropriateness of t he use of this Product in such design or applications; (b)

evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms,

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