Memory Module Specifications KVR1333D3E9SK4/16G 16GB (4GB 2Rx8 512M x 72-Bit x 4 pcs.) PC3-10600 CL9 ECC 240-Pin DIMM Kit DESCRIPTION SPECIFICATIONS ValueRAM's KVR1333D3E9SK4/16G is a kit of four 512M x 72- CL(IDD) 9 cycles bit (4GB) DDR3-1333 CL9 SDRAM (Synchronous DRAM), 2Rx8 Row Cycle Time (tRCmin) 49.5ns (min.) ECC memory modules, based on eighteen 256M x 8-bit DDR3- Refresh to Active/Refresh Command Time (tRFCmin) 160ns (min.) 1333 FBGA components per module. Total kit capacity is 16GB. The SPD's are programmed to JEDEC standard latency Row Active Time (tRASmin) 36ns (min.) DDR3-1333 timing of 9-9-9 at 1.5V. Each 240-pin DIMM uses Power (Operating) gold contact fingers. The electrical and mechanical specifications are as follows: 1.575 W* (per module) UL Rating 94 V - 0 Operating Temperature 0o C to 85o C Storage Temperature -55o C to +100o C FEATURES *Power will vary depending on the SDRAM used. * JEDEC standard 1.5V (1.425V ~1.575V) Power Supply * VDDQ = 1.5V (1.425V ~ 1.575V) * 667MHz fCK for 1333Mb/sec/pin * 8 independent internal bank * Programmable CAS Latency: 9, 8, 7, 6 * Programmable Additive Latency: 0, CL - 2, or CL - 1 clock * Programmable CAS Write Latency(CWL) = 7 (DDR3-1333) * 8-bit pre-fetch * Burst Length: 8 (Interleave without any limit, sequential with starting address "000" only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS] * Bi-directional Differential Data Strobe * Internal(self) calibration: Internal self calibration through ZQ pin (RZQ : 240 ohm 1%) * On Die Termination using ODT pin * On-DIMM thermal sensor (Grade B) * Average Refresh Period 7.8us at lower than TCASE 85C, 3.9us at 85C < TCASE < 95C * Asynchronous Reset * PCB: Height 1.18" (30mm), double sided component Continued >> Document No. VALUERAM1080-001.A00 04/02/12 Page 1 MODULE DIMENSIONS: T E C H N O L O G Y 133.35 Units: millimeters 30.00 18.80 15.80 11.00 8.00 54.70 0.00 0.00 Document No. VALUERAM1080-001.A00 Page 2