DATA SH EET
Product specification
Supersedes data of 1999 Feb 25
File under Integrated Circuits, IC12
1999 Apr 07
INTEGRATED CIRCUITS
PCF8575
Remote 16-bit I/O expander for
I2C-bus
1999 Apr 07 2
Philips Semiconductors Product specification
Remote 16-bit I/O expander for I2C-bus PCF8575
CONTENTS
1 FEATURES
2 GENERAL DESCRIPTION
3 ORDERING INFORMATION
4 BLOCK DIAGRAM
5 PINNING
6 CHARACTERISTICS OF THE I2C-BUS
6.1 Bit transfer
6.2 START and STOP conditions
6.3 System configuration
6.4 Acknowledge
7 FUNCTIONAL DESCRIPTION
7.1 Quasi-bidirectional I/Os
7.2 Addressing
7.3 Reading from a port (input mode)
7.4 Writing to the port (output mode)
7.5 Interrupt
8 LIMITING VALUES
9 HANDLING
10 CHARACTERISTICS
11 I2C-BUS TIMING CHARACTERISTICS
12 DEVICE PROTECTION
13 PACKAGE OUTLINE
14 SOLDERING
14.1 Introduction to soldering surface mount
packages
14.2 Reflow soldering
14.3 Wave soldering
14.4 Manual soldering
14.5 Suitability of surface mount IC packages for
wave and reflow soldering methods
15 DEFINITIONS
16 LIFE SUPPORT APPLICATIONS
17 PURCHASE OF PHILIPS I2C COMPONENTS
1999 Apr 07 3
Philips Semiconductors Product specification
Remote 16-bit I/O expander for I2C-bus PCF8575
1 FEATURES
•Operating supply voltage 2.5 to 5.5 V
•Low standby current consumption of 10 µA maximum
•I2C-bus to parallel port expander
•400 kbits/s FAST I2C-bus
•Open-drain interrupt output
•16-bit remote I/O port for the I2C-bus
•Compatible with most microcontrollers
•Latched outputs with high current drive capability for
directly driving LEDs
•Address by 3 hardware address pins for use of up to
8 devices
•SSOP24 package.
2 GENERAL DESCRIPTION
The PCF8575 is a silicon CMOS circuit. It provides general
purpose remote I/O expansion for most microcontroller
families via the two-line bidirectional bus (I2C-bus).
The device consists of a 16-bit quasi-bidirectional port and
an I2C-bus interface. The PCF8575 has a low current
consumption and includes latched outputs with high
current drive capability for directly driving LEDs. It also
possesses an interrupt line (INT) which can be connected
to the interrupt logic of the microcontroller. By sending an
interrupt signal on this line, the remote I/O can inform the
microcontroller if there is incoming data on its ports without
having to communicate via the I2C-bus. This means that
the PCF8575 is an I2C-bus slave transmitter/receiver.
Every data transmission from the PCF8575 must consist
of an even number of bytes, the first byte will be referred
to as P07 to P00 and the second byte as P17 to P10.
The third will be referred to as P07 to P00 and so on.
3 ORDERING INFORMATION
TYPE
NUMBER PACKAGE
NAME DESCRIPTION VERSION
PCF8575TS SSOP24 plastic shrink small outline package; 24 leads; body width 5.3 mm SOT340-1
1999 Apr 07 4
Philips Semiconductors Product specification
Remote 16-bit I/O expander for I2C-bus PCF8575
4 BLOCK DIAGRAM
Fig.1 Block diagram.
handbook, full pagewidth
MGL537
I2C-BUS
CONTROL
INPUT
FILTER
1
2
3
22
23
21
INTERRUPT
LOGIC
16 BITS
P00 to P07
4 to 11
P10 to P17
13 to 20
I/O
PORT
SHIFT
REGISTER
LP FILTER
WRITE pulse
READ pulse
POWER-ON
RESET
24
12
VDD
VSS
SDA
SCL
A2
A1
A0
INT
PCF8575
1999 Apr 07 5
Philips Semiconductors Product specification
Remote 16-bit I/O expander for I2C-bus PCF8575
5 PINNING
SYMBOL PIN DESCRIPTION
INT 1 interrupt output (active LOW)
A1 2 address input 1
A2 3 address input 2
P00 4 quasi-bidirectional I/O 00
P01 5 quasi-bidirectional I/O 01
P02 6 quasi-bidirectional I/O 02
P03 7 quasi-bidirectional I/O 03
P04 8 quasi-bidirectional I/O 04
P05 9 quasi-bidirectional I/O 05
P06 10 quasi-bidirectional I/O 06
P07 11 quasi-bidirectional I/O 07
VSS 12 supply ground
P10 13 quasi-bidirectional I/O 10
P11 14 quasi-bidirectional I/O 11
P12 15 quasi-bidirectional I/O 12
P13 16 quasi-bidirectional I/O 13
P14 17 quasi-bidirectional I/O 14
P15 18 quasi-bidirectional I/O 15
P16 19 quasi-bidirectional I/O 16
P17 20 quasi-bidirectional I/O 17
A0 21 address input 0
SCL 22 serial clock line input
SDA 23 serial data line input/output
VDD 24 supply voltage Fig.2 Pin configuration.
handbook, halfpage
PCF8575
MGL538
1
2
3
4
5
6
7
8
9
10
11
12
INT
A1
A2
P00
P01
P02
P03
P04
P05
P06
P07
VSS
VDD
SDA
SCL
A0
P17
P16
P15
P14
P13
P12
P11
P10
24
23
22
21
20
19
18
17
16
15
14
13
1999 Apr 07 6
Philips Semiconductors Product specification
Remote 16-bit I/O expander for I2C-bus PCF8575
6 CHARACTERISTICS OF THE I2C-BUS
The I2C-bus is for bidirectional, 2-line communication
between different ICs or modules. The two lines are a
serial data line (SDA) and a serial clock line (SCL). Both
lines must be connected to a positive supply via a pull-up
resistor when connected to the output stages of a device.
Data transfer may be initiated only when the bus is not
busy.
6.1 Bit transfer
One data bit is transferred during each clock pulse.
The data on the SDA line must remain stable during the
HIGH period of the clock pulse as changes in the data line
at this time will be interpreted as control signals
(see Fig.3).
6.2 START and STOP conditions
Both data and clock lines remain HIGH when the bus is not
busy. A HIGH-to-LOW transition of the data line, while the
clock is HIGH is defined as the START condition (S).
A LOW-to-HIGH transition of the data line while the clock
is HIGH is defined as the STOP condition P (see Fig.4).
6.3 System configuration
A device generating a message is a ‘transmitter’, a device
receiving the message is the ‘receiver’. The device that
controls the message is the ‘master’ and the devices which
are controlled by the master are the ‘slaves’ (see Fig.5).
6.4 Acknowledge
The number of data bytes transferred between the START
and the STOP conditions from transmitter to receiver is not
limited. Each byte of eight bits is followed by one
acknowledge bit. The transmitter must release the SDA
line before the receiver can send an acknowledge bit.
A slave receiver which is addressed must generate an
acknowledge after the reception of each byte. Also a
master must generate an acknowledge after the reception
of each byte that has been clocked out of the slave
transmitter. The device that acknowledges has to pull
down the SDA line during the acknowledge clock pulse, so
that the SDA line is stable LOW during the HIGH period of
the acknowledge related clock pulse, set-up and hold
times must be taken into account.
A master receiver must signal an end of data to the
transmitter by not generating an acknowledge after the
last byte that has been clocked out of the slave. This is
done by the master receiver by holding the SDA line HIGH.
In this event the transmitter must release the data line to
enable the master to generate a STOP condition.
Fig.3 Bit transfer.
handbook, full pagewidth
MBC621
data line
stable;
data valid
change
of data
allowed
SDA
SCL
1999 Apr 07 7
Philips Semiconductors Product specification
Remote 16-bit I/O expander for I2C-bus PCF8575
Fig.4 Definition of START and STOP conditions.
handbook, full pagewidth
MBC622
SDA
SCL P
STOP condition
SDA
SCL
S
START condition
Fig.5 System configuration.
MBA605
MASTER
TRANSMITTER /
RECEIVER SLAVE
RECEIVER SLAVE
TRANSMITTER /
RECEIVER MASTER
TRANSMITTER MASTER
TRANSMITTER /
RECEIVER
SDA
SCL
Fig.6 Acknowledgment on the I2C-bus.
handbook, full pagewidth
MGL539
S
START
condition
9821
clock pulse for
acknowledgement
not acknowledge
DATA OUTPUT
BY TRANSMITTER
DATA OUTPUT
BY RECEIVER
SCL FROM
MASTER
acknowledge
1999 Apr 07 8
Philips Semiconductors Product specification
Remote 16-bit I/O expander for I2C-bus PCF8575
7 FUNCTIONAL DESCRIPTION
7.1 Quasi-bidirectional I/Os
The PCF8575’s 16 ports (see Fig.7) are entirely independent and can be used either as input or output ports. Input data
is transferred from the ports to the microcontroller in the READ mode (see Fig.10). Output data is transmitted to the ports
in the WRITE mode (see Fig.9).
This quasi-bidirectional I/O can be used as an input or output without the use of a control signal for data direction.
At power-on the I/Os are HIGH. In this mode only a current source (IOH) to VDD is active. An additional strong pull-up to
VDD (IOHt) allows fast rising edges into heavily loaded outputs. These devices turn on when an output is written HIGH,
and are switched off by the negative edge of SCL. The I/Os should be HIGH before being used as inputs. After power-on
as all the I/Os are set HIGH all of them can be used as input. Any change in setting of the I/Os as either inputs or outputs
can be done with the write mode. Warning: If a HIGH is applied to an I/O which has been written earlier to LOW, a large
current (IOL) will flow to VSS. (see Characteristics note 3).
7.2 Addressing
Figures 8, 9 and 10 show the address and timing diagrams. Before any data is transmitted or received the master must
send the address of the receiver via the SDA line. The first byte transmitted after the START condition carries the address
of the slave device and the read/write bit. The address of the slave device must not be changed between the START and
the STOP conditions. The PCF8575 acts as a slave receiver or a slave transmitter.
Fig.7 Simplified schematic diagram of each I/O.
d
book, full pagewidth
MGL540
DQ
C
I
C
I
S
FF
D
IOH
IOL
IOHt
Q
S
FF
100
µA
to interrupt
logic
VSS
VDD
P00 to P07
P10 to 17
write pulse
data from
shift register
power-on
reset
read pulse
data to
shift register
Fig.8 Byte containing the slave address and the R/W bits.
MGL541
handbook, halfpage
S 0 1 0 0 A2 A1 A0 R/W A
slave address
1999 Apr 07 9
Philips Semiconductors Product specification
Remote 16-bit I/O expander for I2C-bus PCF8575
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MGL542
handbook, full pagewidth
S 0 1 0 0 A2 A1 A0 0 A P07 P06 P00 P17 P101
start condition R/W P05
acknowledge
from slave
A ASDA
SCL
Integral multiples of two bytes
WRITE TO
PORT
tpv
IOHt
DATA OUTPUT
FROM PORT
P05 OUTPUT
VOLTAGE
P05 PULL-UP
OUTPUT CURRENT
INT
slave address (PCF8575) data to port 0 data to port 1
12345678
I
OH
acknowledge
from slave acknowledge
from slave
tir
Data A0 and
B0 valid
Fig.9 WRITE mode (output).
1999 Apr 07 10
Philips Semiconductors Product specification
Remote 16-bit I/O expander for I2C-bus PCF8575
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d
book, full pagewidth
MGL543
S 0 1 0 0 A2 A1 A0 1 A P07 P06 P05 P04
P07 to P00 P17 to P10P07 to P00 P17 to P10 P07 to P00 P17 to P10
P03 P02 P01 P00 P17 P10
R/W acknowledge
from slave
A A P07 P00 A P17 P10 1P
SDA
SCL
READ FROM PORT
th
DATA INTO PORT
INT
acknowledge
from receiver acknowledge
from receiver acknowledge
from receiver non acknowledge
from receiver
tsu
tir
tir
tiv
Fig.10 READ mode (input).
A LOW-to-HIGH transition of SDA, while SCL is HIGH is defined as the STOP condition (P). Transfer of data can be stopped at any moment by a STOP condition. When this occurs, data present
at the latest acknowledge phase is valid (output mode). Input data is lost.
1999 Apr 07 11
Philips Semiconductors Product specification
Remote 16-bit I/O expander for I2C-bus PCF8575
7.3 Reading from a port (input mode)
All ports programmed as input should be set to logic 1.
To read, the master (microcontroller) first addresses the
slave device after it receives the interrupt. By setting the
last bit of the byte containing the slave address to logic 1
the read mode is entered. The data bytes that follow on the
SDA are the values on the ports.
If the data on the input port changes faster than the master
can read, this data may be lost.
7.4 Writing to the port (output mode)
To write, the master (microcontroller) first addresses the
slave device. By setting the last bit of the byte containing
the slave address to logic 0 the write mode is entered.
The PCF8575 acknowledges and the master sends the
first data byte for P07 to P00. After the first data byte is
acknowledged by the PCF8575, the second data byte
P17 to P10 is sent by the master. Once again the
PCF8575 acknowledges the receipt of the data after which
this 16-bit data is presented on the port lines.
The number of data bytes that can be sent successively is
not limited. After every two bytes the previous data is
overwritten.
The first data byte in every pair refers to Port 0
(P07 to P00), whereas the second data byte in every pair
refers to Port 1 (P17 to P10), see Fig.11.
7.5 Interrupt
The PCF8575 provides an open-drain interrupt (INT)
which can be fed to a corresponding input of the
microcontroller (see Figs 9, 10 and 12). This gives these
chips a kind of a master function which can initiate an
action elsewhere in the system.
An interrupt is generated by any rising or falling edge of the
port inputs. After time tiv the signal INT is valid.
The interrupt disappears when data on the port is changed
to the original setting or data is read from or written to the
device which has generated the interrupt.
In the write mode the interrupt may become deactivated
(HIGH) on the rising edge of the write to port pulse. On the
falling edge of the write to port pulse the interrupt is
definitely deactivated (HIGH).
The interrupt is reset in the read mode on the rising edge
of the read from port pulse.
During the resetting of the interrupt itself any changes on
the I/Os may not generate an interrupt. After the interrupt
is reset any change in I/Os will be detected and transmitted
as an INT.
Fig.11 Correlation between bits and ports.
handbook, full pagewidth
MGL545
07 06 05 04 03 02 01 00
P07 P06 P05 P04 P03 P02 P01 P00
A
First Byte
17 16 15 14 13 12 11 10
P17 P16 P15 P14 P13 P12 P11 P10
A
Second Byte
1999 Apr 07 12
Philips Semiconductors Product specification
Remote 16-bit I/O expander for I2C-bus PCF8575
Fig.12 Application of multiple PCF8575s with interrupt.
handbook, full pagewidth
MGL544
MICROCOMPUTER
INT
INT INT
PCF8575
(1) PCF8575
(2)
VDD
INT
PCF8575
(8)
1999 Apr 07 13
Philips Semiconductors Product specification
Remote 16-bit I/O expander for I2C-bus PCF8575
8 LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134); note 1.
Note
1. Stress above those listed under ‘Absolute Maximum Ratings’ may cause permanent damage to the device. This is
a stress ratings only and functional operation of the device at these or any other conditions above those indicated in
the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
9 HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take precautions appropriate to handling MOS devices. Advice can be found in Data Handbook IC12 under
“Handling MOS Devices”
.
10 CHARACTERISTICS
VDD = 2.5 to 5.5 V; VSS =0V; T
amb =−40 to +85 °C; unless otherwise specified.
SYMBOL PARAMETER MIN. MAX. UNIT
VDD supply voltage −0.5 +6.5 V
IDD supply current −±100 mA
ISS supply current −±100 mA
VIinput voltage VSS −0.5 VDD + 0.5 V
IIDC input current −±20 mA
IODC output current −±25 mA
Ptot total power dissipation −400 mW
POpower dissipation per output −100 mW
Tstg storage temperature −65 +150 °C
Tamb operating ambient temperature −40 +85 °C
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supplies
VDD supply voltage 2.5 −5.5 V
IDD supply current operating mode; no load;
VI=V
DD or VSS;
fSCL = 400 kHz
−100 200 µA
IDD(stb) standby current standby mode; no load;
VI=V
DD or VSS
−2.5 10 µA
VPOR power-on reset voltage note 1 −1.2 1.8 V
VIL1 LOW-level input voltage pins A0,
A1 and A2 0.0 −0.2VDD V
VIL2 LOW-level input voltage on all other
signal pins 0.0 −0.3VDD V
VIH HIGH-level input voltage 0.7VDD −VDD V
IL1 leakage current at pins A0,
A1 and A2 VI=V
DD or VSS −1−+1 µA
1999 Apr 07 14
Philips Semiconductors Product specification
Remote 16-bit I/O expander for I2C-bus PCF8575
Notes
1. The power-on reset circuit resets the I2C-bus logic with VDD <V
POR and sets all I/Os to logic 1 (with current source
to VDD).
2. The value is not tested, but verified on sampling basis.
3. A single LOW-level output current (IOL) must not exceed 20 mA for an extended time. The sum of all IOLs at any point
in time must not exceed 100 mA.
IL2 leakage current on all other signal
pins VI=V
DD or VSS −10 −+10 µA
Input SCL; input/output SDA
IOL LOW-level output current VOL = 0.4 V; note 3 3 −−mA
CIinput capacitance VI=V
SS; note 2 −−7pF
I/Os; P00 to P07 and P10 to P17
IOL LOW-level output current VOL = 1 V; note 3 10 25 −mA
IOH HIGH-level output current VOH =V
SS −30 −−300 µA
IOHt transient pull-up current VOH =V
SS; see Fig.9 −0.5 −1.0 −mA
CIinput capacitance note 2 −−10 pF
COoutput capacitance note 2 −−10 pF
Port timing; CL≤100 pF (see Figs 9 and 10)
tpv output data valid −−4µs
t
su input data set-up time 0 −−µs
t
hinput data hold time 4 −−µs
Interrupt INT (see Fig.13)
IOL LOW-level output current VOL = 0.4 V 1.6 −−mA
TIMING;C
L≤100 pF (see Figs 9 and 10)
tiv input data valid time −−4µs
t
ir reset delay time −−4µs
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
1999 Apr 07 15
Philips Semiconductors Product specification
Remote 16-bit I/O expander for I2C-bus PCF8575
11 I2C-BUS TIMING CHARACTERISTICS
See Fig.13 and note 1.
Notes
1. All the timing values are valid within the operating supply voltage and ambient temperature range and refer to VIL
and VIH with an input voltage swing of VSS to VDD.
2. The device inputs SDA and SCL are filtered and will reject spikes on the bus lines of widths less than tSW(max).
3. The rise and fall times specified here refer to the driver device (PCF8575) and are part of the general fast I2C-bus
specification when PCF8575 asserts an acknowledge on SDA, the minimum fall time is 20 ns + 0.1Cb.
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
fSCL SCL clock frequency −400 kHz
tSW tolerable spike width on bus note 2 −50 ns
tBUF BUS free time between a STOP
and START condition 1.3 −µs
t
SU;STA START condition set-up time 0.6 −µs
t
HD;STA START condition hold time 0.6 −µs
t
LOW SCL LOW time 1.3 −µs
t
HIGH SCL HIGH time 0.6 −µs
t
rSCL and SDA rise time note 3 20 + 0.1Cb300 ns
tfSCL and SDA fall time note 3 20 + 0.1Cb300 ns
tSU;DAT data set-up time 100 −ns
tHD;DAT data hold time 0 −ns
tSU;STO STOP condition set-up time 0.6 −µs
C
bcapacitive load represented by
each bus line −400 pF
Fig.13 I2C-bus timing diagram.
handbook, full pagewidth
PROTOCOL
SCL
SDA
MGL546
BIT 0
LSB
(R/W)
tSU;STA
tSU;DAT tSU;STO
tHD;STA tHD;DAT
tBUF trtf
tLOW tHIGH 1/fSCL
START
CONDITION
(S)
BIT 7
MSB
(A7)
BIT 6
(A6) ACKNOWLEDGE
(A) STOP
CONDITION
(P)
1999 Apr 07 16
Philips Semiconductors Product specification
Remote 16-bit I/O expander for I2C-bus PCF8575
12 DEVICE PROTECTION
Fig.14 Device protection diagram.
handbook, full pagewidth
MGR789
1
2
3
4
5
6
7
8
9
10
11
12
15
16
17
18
19
20
21
22
23
24
14
13
P12
P13
P14
P15
P16
P17
A0
SCL
SDA
VDD
P11
P10
INT
A1
A2
P00
P01
P02
P03
P04
P05
P06
P07
VSS
substrate VSS
VDD
1999 Apr 07 17
Philips Semiconductors Product specification
Remote 16-bit I/O expander for I2C-bus PCF8575
13 PACKAGE OUTLINE
UNIT A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 0.21
0.05 1.80
1.65 0.38
0.25 0.20
0.09 8.4
8.0 5.4
5.2 0.65 1.25
7.9
7.6 0.9
0.7 0.8
0.4 8
0
o
o
0.13 0.10.2
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
1.03
0.63
SOT340-1 MO-150AG 93-09-08
95-02-04
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
112
24 13
0.25
y
pin 1 index
0 2.5 5 mm
scale
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm SOT340-1
A
max.
2.0
1999 Apr 07 18
Philips Semiconductors Product specification
Remote 16-bit I/O expander for I2C-bus PCF8575
14 SOLDERING
14.1 Introduction to soldering surface mount
packages
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
14.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
14.3 Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
•Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
•For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
•For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
14.4 Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
1999 Apr 07 19
Philips Semiconductors Product specification
Remote 16-bit I/O expander for I2C-bus PCF8575
14.5 Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
PACKAGE SOLDERING METHOD
WAVE REFLOW(1)
HLQFP, HSQFP, HSOP, SMS not suitable(2) suitable
PLCC(3), SO suitable suitable
LQFP, QFP, TQFP not recommended(3)(4) suitable
SQFP not suitable suitable
SSOP, TSSOP, VSO not recommended(5) suitable
1999 Apr 07 20
Philips Semiconductors Product specification
Remote 16-bit I/O expander for I2C-bus PCF8575
15 DEFINITIONS
16 LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
17 PURCHASE OF PHILIPS I2C COMPONENTS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
1999 Apr 07 21
Philips Semiconductors Product specification
Remote 16-bit I/O expander for I2C-bus PCF8575
NOTES
1999 Apr 07 22
Philips Semiconductors Product specification
Remote 16-bit I/O expander for I2C-bus PCF8575
NOTES
1999 Apr 07 23
Philips Semiconductors Product specification
Remote 16-bit I/O expander for I2C-bus PCF8575
NOTES
Internet: http://www.semiconductors.philips.com
Philips Semiconductors – a worldwide company
© Philips Electronics N.V. 1999 SCA63
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
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Printed in The Netherlands 465006/00/03/pp24 Date of release: 1999 Apr 07 Document order number: 9397 750 05528
