Datasheet Power Supply IC for High Fidelity Audio Negative Voltage Linear Regulator for High Fidelity Audio BD37215MUV General Description Key Specifications BD37215MUV is a linear regulator of low noise (5.1Vrms) which is most suitable to high quality audio system. It operates at -16V to -3V and capable of supplying a maximum load of 1000mA. In addition to the low noise, BD37215MUV has a high PSRR and good input transient fluctuation characteristic which makes it suitable for the stabilization of DC/DC converter output, and an ideal power supply to high precision analog circuits such as operational amplifier and headphone amplifier for audio. Input Voltage Range: -16.0V to -3.0V Output Voltage Range: -15.0V to -1.0V Output Current: 1.0A(Max) Output Voltage Noise(Note 1): 5.1Vrms(10Hz to 100kHz, Typ) PSRR(Note 2): 90dB(1kHz, Typ), 55dB(1MHz, Typ) Input Transient Response: 3mV(1.0V/s, Typ) Standby Current: 9.2A(Typ) Operating Temperature Range: -40C to +85C (Note 1) CBC=10F, VOUT= -1.0V, IOUT=0.5A setting (Note 2) COUT=47F, VOUT= -1.0V, IOUT=0.5A setting Package W(Typ) x D(Typ) x H(Max) VQFN020V4040 Furthermore, when BD37215MUV is placed in standby mode, the supply current can be as small as 9.2A(Typ) which can greatly reduce power consumption. 4.00mm x 4.00mm x 1.00mm Features Ultra Low Noise, High PSRR Standby Mode controlled by Enable Pin using the positive voltage Soft Start Function controlled by External Capacitor Under Voltage Lockout Protection, Over Current Protection, Thermal Shutdown Protection VQFN020V4040 Applications High Quality Audio Equipment Power Supply for Operational Amplifier and Headphone Amplifier Typical Application Circuit Switching Regulator VIN= -6.0V VOUT= -5.0V VIN VO CIN 10F EN VEN= +3.0V R2 30k VS BAS R1 120k BAO BC GND COUT 10F CBC 1F Headphone Amplifier Amplifier Figure 1. Basic Application Circuit Diagram (VOUT= -5.0V) Product structure : Silicon monolithic integrated circuit www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 * 14 * 001 This product has no designed protection against radioactive rays 1/23 TSZ02201-0V3V0A600120-1-2 16.Feb.2018 Rev.002 BD37215MUV Pin Configuration 11.BAS 12.BAO 13.NC 14.NC 15.VIN (TOP VIEW) 16.VIN 10.NC 17.VIN 9.NC 18.NC 8.EN 19.VO 7.GND EXP-PAD 5.BC 4.NC 3.NC 2.VS 6.NC 1.VO 20.VO Figure 2. Pin Configuration Pin Description Pin No. Pin Name 1 VO Output voltage Function 2 VS Output voltage feedback 3 NC No connect (Note 3) 4 NC No connect (Note 3) 5 BC Bypass capacitor pin connected to ground 6 NC No connect (Note 3) 7 GND Ground 8 EN Enable 9 NC No connect (Note 3) 10 NC No connect (Note 3) 11 BAS Programmed voltage feedback 12 BAO Programmed voltage output 13 NC No connect (Note 3) 14 NC No connect (Note 3) 15 VIN Input voltage 16 VIN Input voltage 17 VIN Input voltage 18 NC No connect (Note 3) 19 VO Output voltage 20 VO - EXP-PAD Output voltage The exposed pad should be connected to VIN pattern. (Note 3) The NC PINs should not be connected to any pattern or should be connected to GND. www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 2/23 TSZ02201-0V3V0A600120-1-2 16.Feb.2018 Rev.002 BD37215MUV Block Diagram EN OCP , TSD , 8 UVLO 2 VS 1 VO 19 VO 20 VO BG ERR AMP 100k REF AMP BC CHARGE 7 11 12 5 15 16 17 GND BAS BAO BC VIN VIN VIN Figure 3. Block Diagram www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 3/23 TSZ02201-0V3V0A600120-1-2 16.Feb.2018 Rev.002 BD37215MUV Description of Block 1. Enable Assuming EN is set to L, the IC can be set to standby state. In standby state, the output is OFF and since it will be in static state, the power consumption can be reduced. It is unavailable to input the negative voltage to EN. 2. Rising, Falling, and EN Controlled Timing 0V -0.9V(Typ) VIN -2.30V(Typ) -2.45V(Typ) -2.45V(Typ) +1.8V(Typ) -2.30V(Typ) +1.6V(Typ) EN 0V UVLO (internal signal) H L OUTPUT DISABLE (internal signal) H L 0V VOUT 85% 85% 85% 85% -1.0V 0V BC -1.0V 9ms 9ms EN OFF EN ON UVLO UVLO UVLO UVLO detect release detect release Figure 4. The Sequence Waveform During VIN/EN Rising and Falling (When at Capacitance of CBC 1F and Output -1.0V Settings) time It will operate if EN is H and UVLO (Under Voltage Lockout) is released. In addition, when EN is L or UVLO is detected, the regulator operation stops. VIN does not have the necessity to supply earlier than EN. The maximum slew rate of input voltage has to be set 1.0V/s or below. 3. Soft Start Function In BD37215MUV, there exists a function that limits the rising speed of output when EN rises by the capacitor connected to BC due to decrease of inrush current of output. The rising speed depends on the internal charging current 100A(Typ), the capacitance value connected to BC and on the output programmed voltage. It is about 9ms (Typ) if capacitance of CBC is 1F and output programmed voltage is -1.0V, and almost 40ms (Typ) if output programmed voltage is set to -5.0V. The above is an aim level, and soft start time may change depending on the input and output voltage condition. 4. REFAMP REFAMP sets its output voltage. Refer Selection of Components Externally Connected (Page 16) about setting of output voltage. 5. BC Noise at the output voltage of REFAMP is reduced because of the internal resistor 100k and the external BC capacitor. In addition to it, the external BC capacitor also has a soft start function so the rising speed can be adjusted by this value. The higher value of capacitor will decrease the noise but the soft start time will be longer. 6. ERRAMP The ERRAMP outputs the voltage set in REFAMP at 1 time of closed gain. VS must be connected to VO by all means. In addition, VS can decrease a voltage drop by the pattern resistance on the VO course by returning the voltage from the supply point. www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 4/23 TSZ02201-0V3V0A600120-1-2 16.Feb.2018 Rev.002 BD37215MUV Absolute Maximum Rating (Ta = 25C) Parameter Symbol Rating Unit Power Supply Voltage (PIN 15, 16, 17) EN Pin Voltage (PIN 8) VIN -17.5 to +0.3 V VEN -0.3 to +7.0 V Pin Voltage (PIN 11) VPIN1 -7.0 to +0.3 V Pin Voltage (PIN 1, 2, 5, 12, 19, 20) VPIN2 -17.5 to +0.3 V Storage Temperature Range Tstg -55 to +150 C Tjmax 150 C Maximum Junction Temperature Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the maximum junction temperature rating. Thermal Resistance (Note 4) Parameter Symbol Thermal Resistance (Typ) 1s (Note 6) 2s2p (Note 7) Unit VQFN020V4040 Junction to Ambient Junction to Top Characterization Parameter(Note 5) JA 153.90 37.40 C/W JT 13.00 7.00 C/W (Note 4) Based on JESD51-2A(Still-Air) (Note 5) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 6) Using a PCB board based on JESD51-3. Layer Number of Measurement Board Single Material Board Size FR-4 114.3mm x 76.2mm x 1.57mmt Top Copper Pattern Thickness Footprints and Traces 70m (Note 7) Using a PCB board based on JESD51-5, 7. Layer Number of Measurement Board 4 Layers Thermal Via (Note 8) Material Board Size FR-4 114.3mm x 76.2mm x 1.6mmt Top Pitch 1.20mm 2 Internal Layers Diameter 0.30mm Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70m 74.2mm (Square) 35m 74.2mm (Square) 70m (Note 8) This thermal via connects with the copper pattern of all layers. Recommended Operating Conditions Parameter Symbol Min Typ Max Unit Power Supply Voltage Output Voltage Setting is within a Possible Range Output Current (Note 9) VIN -16.0 - -3.0 V VOUT -15.0 - -1.0 V IOUT - - 1.0 A Operating Temperature Topr -40 +25 +85 C (Note 9) Tjmax should not be exceeded. www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 5/23 TSZ02201-0V3V0A600120-1-2 16.Feb.2018 Rev.002 BD37215MUV Operating Condition Parameter Symbol Min Typ Max Unit CIN 2.2 10 - F Output Capacitor (Note 10, 11) COUT 1 10 - F BC Capacitor (Note 10, 11) CBC 0.01 1 - F Input Capacitor (Note 10) Conditions Film capacitors are recommended Film capacitors are recommended Film capacitors are recommended (Note 10) Set the capacity of the capacitor not to be less than the minimum in consideration of temperature or DC bias properties. (Note 11) Refer the Selection of Components Externally Connected written in Page 16 and Page 17, and decide the value of each capacitor. Electrical Characteristics (Unless otherwise specified, VIN= VOUT-1.0V or -3.0V whichever is smaller VOUT= -1.0V Ta=25C COUT=10F CBC=1F IOUT=5mA VEN= +3V) Parameter Circuit Current (Note 12) Standby Current (Note 12) Symbol Min Typ Max Unit Conditions ICC - 2.0 4.0 mA - ISTB - 9.2 22.5 A VIN= -16V, VEN=0V VREF -1.01 -1.00 -0.99 V BAO voltage Line Regulation DVI -20 -1 - mV VIN= -3V to -16V Load Regulation (Note 13) DVL -20 -3 - mV Dropout Voltage (Note 13) VSAT -0.5 -0.3 - V PSRR1kHz - 90 - dB IOUT=0A to 1000mA IOUT=1000mA, VOUT= -3.3V f=1kHz , COUT=47F PSRR1MHz - 55 - dB VNOISE - 5.1 - Vrms Reference Voltage PSRR 1kHz PSRR 1MHz Output Noise Voltage (Note 13) f=1MHz, COUT=47F BW=10Hz to 100kHz, CBC=10F, IOUT=500mA Over Current Protection Detect Current (Note 13) UVLO Detect Voltage IOCP 1000 - - mA - VUVLOH -2.50 -2.30 -2.10 V - UVLO Release Voltage VUVLOL -2.65 -2.45 -2.25 V - EN Input H Level VTHENH 2.5 - 5.5 V - EN Input L Level VTHENL 0.0 - 0.8 V - EN Input Current IEN - 1.23 2.20 A - (Note 12) The polarity of ICC and ISTB are defined that the direction of current flowing from VIN are positive. (Note 13) The polarity of IOCP and IOUT are defined that the direction of current flowing to VO are positive. . www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 6/23 TSZ02201-0V3V0A600120-1-2 16.Feb.2018 Rev.002 BD37215MUV Typical Performance Curves (Unless otherwise specified, VIN= VOUT-1.0V or -3.0V whichever is smaller VOUT= -1.0V Ta=25C COUT=10F CBC=1F IOUT=5mA VEN= +3V) 10.00 10.00 VOUT= -5.0V IOUT=0.5A COUT=10F Noise Spectral Density [V/Hz] Noise Spectral Density [V/Hz] VOUT= -1.0V IOUT=0.5A COUT=10F CBC=0.1F VNOISE=7.81Vrms 1.00 CBC=1F VNOISE=5.15Vrms CBC=10F VNOISE=5.16Vrms 0.10 CBC=0.1F VNOISE=30.40Vrms 1.00 CBC=1F VNOISE=6.44Vrms CBC=10F VNOISE=5.06Vrms 0.10 0.01 0.01 10 100 1k 10k 100k 10 1M 100 1k 10k 1M Frequency [Hz] Frequency [Hz] Figure 5. Noise Spectral Density vs Frequency (VOUT= -1.0V) Figure 6. Noise Spectral Density vs Frequency (VOUT= -5.0V) 10.00 10.00 VOUT= -1.0V CBC=1F COUT=10F VOUT= -5.0V CBC=1F COUT=10F Noise Spectral Density [V/Hz] Noise Spectral Density [V/Hz] 100k IOUT=1A VNOISE=5.51Vrms 1.00 IOUT=500mA VNOISE=5.15Vrms IOUT=50mA VNOISE=4.83Vrms 0.10 IOUT=5mA VNOISE=4.95Vrms IOUT=1A VNOISE=6.61Vrms 1.00 IOUT=500mA VNOISE=6.44Vrms IOUT=50mA VNOISE=6.05Vrms 0.10 IOUT=5mA VNOISE=6.01Vrms 0.01 0.01 10 100 1k 10k 100k 1M 100 1k 10k 100k 1M Frequency [Hz] Frequency [Hz] Figure 7. Noise Spectral Density vs Frequency (VOUT= -1.0V) www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 10 Figure 8. Noise Spectral Density vs Frequency (VOUT= -5.0V) 7/23 TSZ02201-0V3V0A600120-1-2 16.Feb.2018 Rev.002 BD37215MUV Typical Performance Curves - continued 10.00 1.020 1.015 1.010 1.00 VOUT= -12.0V VNOISE=11.22Vrms 1.005 VOUT= -5.0V VNOISE=6.44Vrms 1.000 -VOUT [V] Noise Spectral Density [V/Hz] IOUT=0.5A CBC=1F COUT=10F VOUT= -1.0V VNOISE=5.15Vrms 0.10 0.995 0.990 0.985 0.01 10 100 1k 10k 100k VOUT= -1.0V 0.980 1M 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 Frequency [Hz] Input Voltage:-VIN [V] Figure 9. Noise Spectral Density vs Frequency Figure 10. Line Regulation (DVI) (VOUT= -1.0V) 5.10 1.020 5.08 1.015 5.06 1.010 5.02 1.005 5.00 1.000 -VOUT [V] -VOUT [V] 5.04 4.98 0.995 4.96 0.990 4.94 4.92 0.985 VOUT= -5.0V 4.90 VOUT= -1.0V 0.980 5 6 7 8 9 10 11 12 13 14 15 16 17 Input Voltage:-VIN [V] Output Current:IOUT [A] Figure 11. Line Regulation (DVI) (VOUT= -5.0V) www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 Figure 12. Load Regulation (DVL) (VOUT= -1.0V) 8/23 TSZ02201-0V3V0A600120-1-2 16.Feb.2018 Rev.002 BD37215MUV Typical Performance Curves - continued 5.10 4.0 5.08 5.06 3.0 5.04 5.00 -VOUT [V] -VOUT [V] 5.02 4.98 2.0 4.96 1.0 4.94 4.92 VOUT= -3.3V IOUT=1.0A VOUT= -5.0V 4.90 0.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0 1 2 Output Current:IOUT [A] 3 4 5 Input Voltage:-VIN [V] Figure 13. Load Regulation (DVL) (VOUT= -5.0V) Figure 14. VOUT vs VIN (VOUT= -3.3V) 6.0 5.0 IOUT=0.0A 4.5 5.0 4.0 3.5 4.0 3.0 ICC [mA] -VOUT [V] 3.0 2.0 2.5 2.0 1.5 1.0 VOUT= -5.0V IOUT=1.0A 1.0 VOUT= -5.0V 0.5 0.0 VOUT= -1.0V 0.0 0 1 2 3 4 5 6 Input Voltage:-VIN [V] 2 4 6 8 10 12 14 16 Input Voltage:-VIN [V] Figure 15. VOUT vs VIN (VOUT= -5.0V) www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 0 Figure 16. ICC vs VIN 9/23 TSZ02201-0V3V0A600120-1-2 16.Feb.2018 Rev.002 BD37215MUV Typical Performance Curves - continued 10.0 6.0 IOUT=0.0A 9.0 5.0 8.0 7.0 4.0 5.0 -VOUT [V] ISTB [A] 6.0 4.0 3.0 3.0 2.0 VOUT= -5.0V VOUT= -1.0V 2.0 1.0 1.0 0.0 0.0 0 2 4 6 8 10 12 14 16 0.0 0.5 Input Voltage:-VIN [V] 1.0 1.5 2.0 2.5 Output Current:IOUT [A] Figure 17. ISTB vs VIN Figure 18. VOUT vs IOUT 1.020 5.10 5.08 1.015 5.06 1.010 5.04 5.02 1.000 -VOUT [V] -VOUT [V] 1.005 0.995 5.00 4.98 4.96 0.990 4.94 0.985 4.92 0.980 4.90 -60 -40 -20 0 20 40 60 80 100 Temperature:Ta [C] -40 -20 0 20 40 60 80 100 Temperature:Ta [C] Figure 19. VOUT vs Ta (VOUT= -1.0V) www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 -60 Figure 20. VOUT vs Ta (VOUT= -5.0V) 10/23 TSZ02201-0V3V0A600120-1-2 16.Feb.2018 Rev.002 BD37215MUV Typical Performance Curves - continued 120 120 VOUT= -1.0V COUT=47F 100 100 80 80 PSRR [dB] PSRR [dB] IOUT=500mA VOUT= -1.0V 60 40 60 IOUT=1A 40 IOUT=500mA IOUT=50mA 20 COUT=47F 20 IOUT=5mA COUT=10F IOUT=0A 0 10 100 1k 10k 100k 0 1M 10 100 Frequency [Hz] 1k 10k 1M Frequency [Hz] Figure 21. Power-Supply Rejection Ratio (VOUT= -1.0V) Figure 22. Power-Supply Rejection Ratio (VOUT= -1.0V) 120 120 VOUT= -3.3V IOUT=500mA COUT=47F VOUT= -5.0V COUT=47F 100 100 80 80 PSRR [dB] PSRR [dB] 100k 60 IOUT=1A 40 60 40 IOUT=500mA VSAT=0.3V VSAT=0.5V IOUT=50mA 20 20 IOUT=5mA VSAT=0.7V VSAT=1.0V IOUT=0A 0 0 10 100 1k 10k 100k 1M Frequency [Hz] 100 1k 10k 100k 1M Frequency [Hz] Figure 23. Power-Supply Rejection Ratio (VOUT= -5.0V) www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 10 Figure 24. Power-Supply Rejection Ratio (VOUT= -3.3V) 11/23 TSZ02201-0V3V0A600120-1-2 16.Feb.2018 Rev.002 BD37215MUV Typical Performance Curves - continued 120 120 VOUT= -5.0V IOUT=500mA COUT=47F 100 100 80 PSRR [dB] 80 PSRR [dB] VOUT= -3.3V IOUT=50mA COUT=47F 60 40 60 40 VSAT=0.3V VSAT=0.3V VSAT=0.5V 20 VSAT=0.5V 20 VSAT=0.7V VSAT=0.7V VSAT=1.0V VSAT=1.0V 0 0 10 100 1k 10k 100k 10 1M 100 10k 100k 1M Frequency [Hz] Frequency [Hz] Figure 25. Power-Supply Rejection Ratio (VOUT= -5.0V) Figure 26. Power-Supply Rejection Ratio (VOUT= -3.3V) 120 120 IOUT=500mA COUT=47F VOUT= -5.0V IOUT=50mA COUT=47F 100 100 80 PSRR [dB] 80 PSRR [dB] 1k 60 40 60 40 VSAT=0.3V VOUT= -12.0V VOUT= -5.0V VSAT=0.5V 20 20 VSAT=0.7V VOUT= -3.3V VOUT= -1.0V VSAT=1.0V 0 0 10 100 1k 10k 100k 1M Frequency [Hz] 100 1k 10k 100k 1M Frequency [Hz] Figure 27. Power-Supply Rejection Ratio (VOUT= -5.0V) www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 10 Figure 28. Power-Supply Rejection Ratio 12/23 TSZ02201-0V3V0A600120-1-2 16.Feb.2018 Rev.002 BD37215MUV Typical Performance Curves - continued EN: 2V/Div EN: 2V/Div VOUT: 200mV/Div VOUT: 1V/Div Figure 29. Soft Start (VOUT= -1.0V) Figure 30. Soft Start (VOUT= -5.0V) VIN: 2V/Div VIN: 5V/Div VOUT: 10mV/Div (AC) VOUT: 10mV/Div (AC) Figure 31. Line Transient (IOUT=500mA Slew Rate=1.0V/s VOUT= -1.0V COUT=2.2F) www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 13/23 Figure 32. Line Transient (IOUT=500mA Slew Rate=1.0V/s VOUT= -5.0V COUT=2.2F) TSZ02201-0V3V0A600120-1-2 16.Feb.2018 Rev.002 BD37215MUV Typical Performance Curves - continued VIN: 2V/Div VIN: 5V/Div VOUT: 10mV/Div (AC) VOUT: 10mV/Div (AC) Figure 33. Line Transient (IOUT=500mA Slew Rate=0.2V/s VOUT= -1.0V COUT=2.2F) Figure 34. Line Transient (IOUT=500mA Slew Rate=0.2V/s VOUT= -5.0V COUT=2.2F) IOUT: 200mA/Div IOUT: 200mA/Div VOUT: 50mV/Div (AC) VOUT: 50mV/Div (AC) Figure 35. Load Transient (IOUT=0mA 500mA VOUT= -1.0V COUT=2.2F) www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 Figure 36. Load Transient (IOUT=0mA 500mA VOUT= -5.0V COUT=2.2F) 14/23 TSZ02201-0V3V0A600120-1-2 16.Feb.2018 Rev.002 BD37215MUV Application Examples VIN= -6.0V VOUT= -5.0V VIN CIN 10F VEN= +3.0V R2 30k R1 120k VO EN VS BAS BC BAO GND COUT 10F CBC 1F Parts Maker Value Parts Number R1 ROHM 120k MCR03EZPD1203 R2 ROHM 30k MCR03EZPD3002 CIN Rubycon 10F 16MU106M4532 COUT Rubycon 10F 16MU106M4532 CBC Rubycon 1F 16MU105M3216 (Note) This application example is just one case. Actual setting will be decided after a thorough evaluation and verification in the set. (Note) The value of R1 and R2 is set that R1 + R2 becomes 100k or above. The resistance for voltage setting is recommended the one that is 1% accuracy or below. (Note) Set the capacity of the capacitor not to be less than the minimum in consideration of temperature or DC bias properties. Figure 37. Application Circuit (VOUT= -5.0V) www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 15/23 TSZ02201-0V3V0A600120-1-2 16.Feb.2018 Rev.002 BD37215MUV Selection of Components Externally Connected VIN VOUT VIN VO EN VS BAS BC CIN VEN R2 COUT CBC R1 BAO GND Figure 38. External Components Connection 1. Output Voltage Setting To set output voltage, connect resistance of R1 between BAO-BAS and connect resistance of R2 in between BAS-GND. The value of R1 and R2 is set that R1 + R2 becomes 100k or above. In addition, the resistance for voltage setting is recommended the one that is 1% accuracy or below. In the case to use -1.0V setting, short BAS with BAO. = x 1 +2 [V] 2 = -1.0V (Typ) 2. Output Capacitor COUT Output capacitor should be selected 1F or above considering about the voltage modulation, thermal characteristics, and distribution of the value. Installation of output capacitor in the position near the pin in between VO and GND is recommended. In addition, the rated voltage of capacitor should be set with enough margins to output voltage. The ESR of Output Capacitor effect the stability of IC operation. Refer the stable operation range for the selection of Output Capacitor which is given in the reference data of Figure 39. This reference data is measured in combination of the ceramic capacitor of 2.2F and resistance in series to Output. The Stable operation range of this graph is given by only the IC and load resistance. For actual applications the stable operating range is influenced by the wiring impedance of the PCB panel, input supply impedance and load impedance. Therefore verification of the final operating environment is needed. 10.00 ESR of COUT [] Unstable Operation Range 1.00 0.10 Stable Operation Range VIN= -6.0V VOUT= -5.0V -40CTa85C 0.01 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 Output Current:IOUT [A] Figure 39. ESR of COUT vs IOUT www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 16/23 TSZ02201-0V3V0A600120-1-2 16.Feb.2018 Rev.002 BD37215MUV Selection of Components Externally Connected - continued 3. Input Capacitor CIN Input capacitor should be selected 2.2F or above considering about the voltage modulation, thermal characteristics, and distribution of the value. Installation of input capacitor in the position close to the pin in between VIN and GND is recommended also. In addition, the rated voltage of capacitor shall be set with enough margins with respect to input voltage. 4. Filter Capacitor CBC Filter capacitor CBC and built-in resistance formed a low pass filter that reduces the noise that appears in output voltage. In addition, the filter capacitor CBC also has a soft start function because it limits the rush current of output when it starts. The rising speed depends on the internal charging current 100A (Typ), the capacitance value connected to BC and on the output programmed voltage. The time of the soft start is about 9ms (Typ) if capacitance is 1F and output programmed voltage is -1.0V, and almost 40ms (Typ) if output programmed voltage is set to -5.0V. Because the higher value of capacitor will decrease the noise but the soft start time will be longer, it should be decided that the proper value of the capacitance. Refer the following calculation for CBC capacitance. Depending on the output capacitor, there is a possibility not to operate properly. 1000 [F] www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 17/23 TSZ02201-0V3V0A600120-1-2 16.Feb.2018 Rev.002 BD37215MUV I/O Equivalence Circuits VIN (PIN 15,16,17) / VO (PIN 1,19,20) 100k VO (PIN 1, 19, 20) EN (PIN 8) EN (PIN 8) BAO (PIN 12) BAO (PIN 12) VIN (PIN 15, 16, 17) VIN BAS (PIN 11) BC (PIN 5) VS (PIN 2) VS (PIN 2) BC (PIN 5) BAS (PIN 11) VIN VIN Figure 40. I/O Equivalence Circuits PCB Layout Example TOP BOTTOM (Board Size 60mm x 60mm, Board Thickness 1.6mm, Material FR-4) Figure 41. Circuit Diagram of Evaluation Board (Typical Application Circuit setting) (Note) This PCB Layout example includes the other device pattern also. This IC position is U1. www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 18/23 TSZ02201-0V3V0A600120-1-2 16.Feb.2018 Rev.002 BD37215MUV Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC's power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Except for EN pin, ensure that no pins are at a voltage above that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Recommended Operating Conditions The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics. 6. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 7. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 8. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC's power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 9. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 10. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 19/23 TSZ02201-0V3V0A600120-1-2 16.Feb.2018 Rev.002 BD37215MUV Operational Notes - continued 11. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When VIN > Pin A and VIN > Pin B, the P-N junction operates as a parasitic diode. When VIN > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the VIN voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate Parasitic Elements Pin B B GND VIN GND VIN GND VIN Parasitic Elements N Region close-by GND VIN Figure 42. Example of monolithic IC structure 12. Ceramic Capacitor When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 13. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all within the Area of Safe Operation (ASO). 14. Thermal Shutdown Circuit(TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC's maximum junction temperature rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 15. Over Current Protection Circuit (OCP) This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 20/23 TSZ02201-0V3V0A600120-1-2 16.Feb.2018 Rev.002 BD37215MUV Ordering Information B D 3 7 2 Part Number 1 5 M U V - Package MUV:VQFN020V4040 E2 Packaging and forming specification E2: Embossed tape and reel (VQFN020V4040) Marking Diagram VQFN020V4040 (TOP VIEW) Part Number Marking 3 7 2 1 5 LOT Number 1PIN MARK www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 21/23 TSZ02201-0V3V0A600120-1-2 16.Feb.2018 Rev.002 BD37215MUV Physical Dimension, Tape and Reel Information Package Name www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 VQFN020V4040 22/23 TSZ02201-0V3V0A600120-1-2 16.Feb.2018 Rev.002 BD37215MUV Revision History Date Revision 02.May.2017 16.Feb.2018 001 002 Changes New Release Renewed the title Renewed Typical Performance Curves www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 23/23 TSZ02201-0V3V0A600120-1-2 16.Feb.2018 Rev.002 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) intend to use our Products in devices requiring extremely high reliability (such as medical equipment , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ("Specific Applications"), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM's Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASS CLASSb CLASS CLASS CLASS CLASS 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM's Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM's internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Datasheet General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM's Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM's Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an "as is" basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or concerning such information. Notice - WE (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet bd37215muv - Web Page Buy Distribution Inventory Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS bd37215muv VQFN020V4040 2500 2500 Taping inquiry Yes