〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays
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TSZ02201-0V3V0A600120-1-2
© 2017 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111 • 14 • 001
16.Feb.2018 Rev.002
Power Supply IC for High Fidelity Audio
Negative Voltage Linear Regulator for
High Fidelity Audio
BD37215MUV
General Description
BD37215MUV is a linear regulator of low noise
(5.1µVrms) which is most suitable to high quality audio
system. It operates at -16V to -3V and capable of
supplying a maximum load of 1000mA.
In addition to the low noise, BD37215MUV has a high
PSRR and good input transient fluctuation
characteristic which makes it suitable for the
stabilization of DC/DC converter output, and an ideal
power supply to high precision analog circuits such as
operational amplifier and headphone amplifier for
audio.
Furthermore, when BD37215MUV is placed in standby
mode, the supply current can be as small as
9.2µA(Typ) which can greatly reduce power consump-
tion.
Features
■ Ultra Low Noise, High PSRR
■ Standby Mode controlled by Enable Pin
using the positive voltage
■ Soft Start Function controlled by External
Capacitor
■ Under Voltage Lockout Protection, Over Current
Protection, Thermal Shutdown Protection
Applications
■ High Quality Audio Equipment
■ Power Supply for Operational Amplifier and Head-
phone Amplifier
Key Specifications
■ Input Voltage Range: -16.0V to -3.0V
■ Output Voltage Range: -15.0V to -1.0V
■ Output Current: 1.0A(Max)
■ Output Voltage Noise(Note 1):
5.1µVrms(10Hz to 100kHz, Typ)
■ PSRR(Note 2): 90dB(1kHz, Typ), 55dB(1MHz, Typ)
■ Input Transient Response: 3mV(1.0V/µs, Typ)
■ Standby Current: 9.2µA(Typ)
■ Operating Temperature Range: -40°C to +85°C
(Note 1) CBC=10µF, VOUT= -1.0V, IOUT=0.5A setting
(Note 2) COUT=47µF, VOUT= -1.0V, IOUT=0.5A setting
Package W(Typ) x D(Typ) x H(Max)
VQFN020V4040 4.00mm x 4.00mm x 1.00mm
Typical Application Circuit
VIN
EN
BAS
BAO GND
BC
VO
CIN
10µF
CBC
1µF
COUT
10µF
VOUT= -5.0V
R1
120kΩ
R2
30kΩ
VS
Switching
Regulator
Amplifier Headphone
Amplifier
VIN= -6.0V
VEN= +3.0V
Figure 1. Basic Application Circuit Diagram (VOUT= -5.0V)
VQFN020V4040
Datashee
t
2/23
TSZ02201-0V3V0A600120-1-2
© 2017 ROHM Co., Ltd. All rights reserved.
16.Feb.2018 Rev.002
www.rohm.com
TSZ22111 • 15 • 001
BD37215MUV
Pin Configuration
1.VO
20.VO
2.VS
4.NC
19.VO
18.NC
17.VIN
16.VIN
15.VIN
14.NC
13.NC
12.BAO
11.BAS
5.BC
6.NC
7.GND
9.NC
8.EN
3.NC
10.NC
EXP-PAD
Figure 2. Pin Configuration
Pin Description
Pin No.
Pin Name
Function
1
VO
Output voltage
2
VS
Output voltage feedback
3
NC
No connect (Note 3)
4
NC
No connect (Note 3)
5
BC
Bypass capacitor pin connected to ground
6
NC
No connect (Note 3)
7
GND
Ground
8
EN
Enable
9
NC
No connect (Note 3)
10
NC
No connect (Note 3)
11
BAS
Programmed voltage feedback
12
BAO
Programmed voltage output
13
NC
No connect (Note 3)
14
NC
No connect (Note 3)
15
VIN
Input voltage
16
VIN
Input voltage
17
VIN
Input voltage
18
NC
No connect (Note 3)
19
VO
Output voltage
20
VO
Output voltage
-
EXP-PAD
The exposed pad should be connected to VIN
pattern.
(Note 3) The NC PINs should not be connected to any pattern or should be connected to GND.
(TOP VIEW)
3/23
TSZ02201-0V3V0A600120-1-2
© 2017 ROHM Co., Ltd. All rights reserved.
16.Feb.2018 Rev.002
www.rohm.com
TSZ22111 • 15 • 001
BD37215MUV
Block Diagram
BG
EN OCP , TSD , UVLO
100kΩ
BAOBAS VIN
BC
11 12
8
516
1
2 VS
VO
15
VIN
VO
19
GND
7VIN
17
VO
20
BC
CHARGE
REF
AMP
ERR
AMP
Figure 3. Block Diagram
4/23
TSZ02201-0V3V0A600120-1-2
© 2017 ROHM Co., Ltd. All rights reserved.
16.Feb.2018 Rev.002
www.rohm.com
TSZ22111 • 15 • 001
BD37215MUV
Description of Block
1. Enable
Assuming EN is set to L, the IC can be set to standby state. In standby state, the output is OFF and since it will be in
static state, the power consumption can be reduced. It is unavailable to input the negative voltage to EN.
2. Rising, Falling, and EN Controlled Timing
VOUT
time
BC
L
0V
VIN
EN
0V
0V
-1.0V
-1.0V
L
H
H
-2.30V(Typ)
+1.8V(Typ)
9ms
EN ON
85%
85%
+1.6V(Typ)
9ms EN OFF
85%
85%
-0.9V(Typ)
-2.45V(Typ) -2.45V(Typ) -2.30V(Typ)
0V
UVLO
(internal
signal)
OUTPUT
DISABLE
(internal
signal)
UVLO
release UVLO
detect UVLO
release UVLO
detect
Figure 4. The Sequence Waveform During VIN/EN Rising and Falling
(When at Capacitance of CBC 1µF and Output -1.0V Settings)
It will operate if EN is H and UVLO (Under Voltage Lockout) is released. In addition, when EN is L or UVLO is detected,
the regulator operation stops.
VIN does not have the necessity to supply earlier than EN.
The maximum slew rate of input voltage has to be set 1.0V/µs or below.
3. Soft Start Function
In BD37215MUV, there exists a function that limits the rising speed of output when EN rises by the capacitor connected
to BC due to decrease of inrush current of output. The rising speed depends on the internal charging current
100µA(Typ), the capacitance value connected to BC and on the output programmed voltage. It is about 9ms (Typ) if
capacitance of CBC is 1µF and output programmed voltage is -1.0V, and almost 40ms (Typ) if output programmed
voltage is set to -5.0V. The above is an aim level, and soft start time may change depending on the input and output
voltage condition.
4. REFAMP
REFAMP sets its output voltage. Refer Selection of Components Externally Connected (Page 16) about setting of output
voltage.
5. BC
Noise at the output voltage of REFAMP is reduced because of the internal resistor 100kΩ and the external BC capacitor.
In addition to it, the external BC capacitor also has a soft start function so the rising speed can be adjusted by this value.
The higher value of capacitor will decrease the noise but the soft start time will be longer.
6. ERRAMP
The ERRAMP outputs the voltage set in REFAMP at 1 time of closed gain. VS must be connected to VO by all means. In
addition, VS can decrease a voltage drop by the pattern resistance on the VO course by returning the voltage from the
supply point.
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TSZ02201-0V3V0A600120-1-2
© 2017 ROHM Co., Ltd. All rights reserved.
16.Feb.2018 Rev.002
www.rohm.com
TSZ22111 • 15 • 001
BD37215MUV
Absolute Maximum Rating (Ta = 25°C)
Parameter
Symbol
Rating
Unit
Power Supply Voltage
(PIN 15, 16, 17)
VIN
-17.5 to +0.3
V
EN Pin Voltage (PIN 8)
VEN
-0.3 to +7.0
V
Pin Voltage (PIN 11)
VPIN1
-7.0 to +0.3
V
Pin Voltage (PIN 1, 2, 5, 12, 19, 20)
VPIN2
-17.5 to +0.3
V
Storage Temperature Range
Tstg
-55 to +150
°C
Maximum Junction Temperature
Tjmax
150
°C
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the
maximum junction temperature rating.
Thermal Resistance (Note 4)
Parameter
Symbol
Thermal Resistance (Typ)
Unit
1s (Note 6)
2s2p (Note 7)
VQFN020V4040
Junction to Ambient
θJA
153.90
37.40
°C/W
Junction to Top Characterization Parameter(Note 5)
ΨJT
13.00
7.00
°C/W
(Note 4) Based on JESD51-2A(Still-Air)
(Note 5) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 6) Using a PCB board based on JESD51-3.
Layer Number of
Measurement Board
Material
Board Size
Single
FR-4
114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70µm
(Note 7) Using a PCB board based on JESD51-5, 7.
Layer Number of
Measurement Board
Material
Board Size
Thermal Via (Note 8)
Pitch
Diameter
4 Layers
FR-4
114.3mm x 76.2mm x 1.6mmt
1.20mm
Φ0.30mm
Top
2 Internal Layers
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70µm
74.2mm (Square)
35µm
74.2mm (Square)
70µm
(Note 8) This thermal via connects with the copper pattern of all layers.
Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
Power Supply Voltage
VIN
-16.0
-
-3.0
V
Output Voltage Setting is within a
Possible Range
VOUT
-15.0
-
-1.0
V
Output Current (Note 9)
IOUT
-
-
1.0
A
Operating Temperature
Topr
-40
+25
+85
°C
(Note 9) Tjmax should not be exceeded.
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TSZ02201-0V3V0A600120-1-2
© 2017 ROHM Co., Ltd. All rights reserved.
16.Feb.2018 Rev.002
www.rohm.com
TSZ22111 • 15 • 001
BD37215MUV
Operating Condition
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Input Capacitor (Note 10)
CIN
2.2
10
-
µF
Film capacitors are
recommended
Output Capacitor (Note 10, 11)
COUT
1
10
-
µF
Film capacitors are
recommended
BC Capacitor (Note 10, 11)
CBC
0.01
1
-
µF
Film capacitors are
recommended
(Note 10) Set the capacity of the capacitor not to be less than the minimum in consideration of temperature or DC bias properties.
(Note 11) Refer the Selection of Components Externally Connected written in Page 16 and Page 17, and decide the value of each capacitor.
Electrical Characteristics
(Unless otherwise specified, VIN= VOUT-1.0V or -3.0V whichever is smaller VOUT= -1.0V Ta=25°C COUT=10µF CBC=1µF IOUT=5mA
VEN= +3V)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Circuit Current (Note 12)
ICC
-
2.0
4.0
mA
-
Standby Current (Note 12)
ISTB
-
9.2
22.5
µA
VIN= -16V, VEN=0V
Reference Voltage
VREF
-1.01
-1.00
-0.99
V
BAO voltage
Line Regulation
DVI
-20
-1
-
mV
VIN= -3V to -16V
Load Regulation (Note 13)
DVL
-20
-3
-
mV
IOUT=0A to 1000mA
Dropout Voltage (Note 13)
VSAT
-0.5
-0.3
-
V
IOUT=1000mA,
VOUT= -3.3V
PSRR 1kHz
PSRR1kHz
-
90
-
dB
f=1kHz , COUT=47µF
PSRR 1MHz
PSRR1MHz
-
55
-
dB
f=1MHz, COUT=47µF
Output Noise Voltage (Note 13)
VNOISE
-
5.1
-
µVrms
BW=10Hz to 100kHz,
CBC=10µF, IOUT=500mA
Over Current Protection
Detect Current (Note 13)
IOCP
1000
-
-
mA
-
UVLO Detect Voltage
VUVLOH
-2.50
-2.30
-2.10
V
-
UVLO Release Voltage
VUVLOL
-2.65
-2.45
-2.25
V
-
EN Input H Level
VTHENH
2.5
-
5.5
V
-
EN Input L Level
VTHENL
0.0
-
0.8
V
-
EN Input Current
IEN
-
1.23
2.20
µA
-
(Note 12) The polarity of ICC and ISTB are defined that the direction of current flowing from VIN are positive.
(Note 13) The polarity of IOCP and IOUT are defined that the direction of current flowing to VO are positive.
.
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TSZ02201-0V3V0A600120-1-2
© 2017 ROHM Co., Ltd. All rights reserved.
16.Feb.2018 Rev.002
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TSZ22111 • 15 • 001
BD37215MUV
Typical Performance Curves
(Unless otherwise specified, VIN= VOUT-1.0V or -3.0V whichever is smaller VOUT= -1.0V Ta=25°C COUT=10µF CBC=1µF IOUT=5mA
VEN= +3V)
Figure 5. Noise Spectral Density vs Frequency Figure 6. Noise Spectral Density vs Frequency
(VOUT= -1.0V) (VOUT= -5.0V)
Figure 7. Noise Spectral Density vs Frequency Figure 8. Noise Spectral Density vs Frequency
(VOUT= -1.0V) (VOUT= -5.0V)
0.01
0.10
1.00
10.00
10 100 1k 10k 100k 1M
Noise Spectral Density [μV/√Hz]
Frequency [Hz]
0.01
0.10
1.00
10.00
10 100 1k 10k 100k 1M
Noise Spectral Density [μV/√Hz]
Frequency [Hz]
0.01
0.10
1.00
10.00
10 100 1k 10k 100k 1M
Noise Spectral Density [μV/√Hz]
Frequency [Hz]
0.01
0.10
1.00
10.00
10 100 1k 10k 100k 1M
Noise Spectral Density [μV/√Hz]
Frequency [Hz]
VOUT= -5.0V
IOUT=0.5A
COUT=10µF
CBC=0.1µF
VNOISE=30.40µVrms
CBC=1µF
VNOISE=6.44µVrms
CBC=10µF
VNOISE=5.06µVrms
VOUT= -1.0V
IOUT=0.5A
COUT=10µF
CBC=0.1µF
VNOISE=7.81µVrms
CBC=1µF
VNOISE=5.15µVrms
CBC=10µF
VNOISE=5.16µVrms
IOUT=500mA
VNOISE=5.15µVrms
VOUT= -1.0V
CBC=1µF
COUT=10µF
IOUT=50mA
VNOISE=4.83µVrms
IOUT=5mA
VNOISE=4.95µVrms
IOUT=1A
VNOISE=5.51µVrms
IOUT=500mA
VNOISE=6.44µVrms
VOUT= -5.0V
CBC=1µF
COUT=10µF
IOUT=50mA
VNOISE=6.05µVrms
IOUT=5mA
VNOISE=6.01µVrms
IOUT=1A
VNOISE=6.61µVrms
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TSZ02201-0V3V0A600120-1-2
© 2017 ROHM Co., Ltd. All rights reserved.
16.Feb.2018 Rev.002
www.rohm.com
TSZ22111 • 15 • 001
BD37215MUV
Typical Performance Curves – continued
Figure 9. Noise Spectral Density vs Frequency Figure 10. Line Regulation (DVI)
(VOUT= -1.0V)
Figure 11. Line Regulation (DVI) Figure 12. Load Regulation (DVL)
(VOUT= -5.0V) (VOUT= -1.0V)
0.01
0.10
1.00
10.00
10 100 1k 10k 100k 1M
Noise Spectral Density [μV/√Hz]
Frequency [Hz]
VOUT= -1.0V
VOUT= -5.0V
VOUT= -1.0V
0.980
0.985
0.990
0.995
1.000
1.005
1.010
1.015
1.020
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17
-VOUT [V]
Input Voltage:-VIN [V]
0.980
0.985
0.990
0.995
1.000
1.005
1.010
1.015
1.020
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
-VOUT [V]
Output Current:IOUT [A]
4.90
4.92
4.94
4.96
4.98
5.00
5.02
5.04
5.06
5.08
5.10
5 6 7 8 9 10 11 12 13 14 15 16 17
-VOUT [V]
Input Voltage:-VIN [V]
VOUT= -12.0V
VNOISE=11.22µVrms
IOUT=0.5A
CBC=1µF
COUT=10µF
VOUT= -5.0V
VNOISE=6.44µVrms
VOUT= -1.0V
VNOISE=5.15µVrms
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TSZ02201-0V3V0A600120-1-2
© 2017 ROHM Co., Ltd. All rights reserved.
16.Feb.2018 Rev.002
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TSZ22111 • 15 • 001
BD37215MUV
Typical Performance Curves – continued
Figure 13. Load Regulation (DVL) Figure 14. VOUT vs VIN
(VOUT= -5.0V) (VOUT= -3.3V)
Figure 15. VOUT vs VIN Figure 16. ICC vs VIN
(VOUT= -5.0V)
VOUT= -3.3V
IOUT=1.0A
IOUT=0.0A
VOUT= -5.0V
VOUT= -5.0V
IOUT=1.0A
VOUT= -5.0V
VOUT= -1.0V
0.0
1.0
2.0
3.0
4.0
0 1 2 3 4 5
-VOUT [V]
Input Voltage:-VIN [V]
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0 2 4 6 8 10 12 14 16
ICC [mA]
Input Voltage:-VIN [V]
4.90
4.92
4.94
4.96
4.98
5.00
5.02
5.04
5.06
5.08
5.10
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
-VOUT [V]
Output Current:IOUT [A]
0.0
1.0
2.0
3.0
4.0
5.0
6.0
0123456
-VOUT [V]
Input Voltage:-VIN [V]
10/23
TSZ02201-0V3V0A600120-1-2
© 2017 ROHM Co., Ltd. All rights reserved.
16.Feb.2018 Rev.002
www.rohm.com
TSZ22111 • 15 • 001
BD37215MUV
Typical Performance Curves – continued
Figure 17. ISTB vs VIN Figure 18. VOUT vs IOUT
Figure 19. VOUT vs Ta Figure 20. VOUT vs Ta
(VOUT= -1.0V) (VOUT= -5.0V)
IOUT=0.0A
VOUT= -5.0V
VOUT= -1.0V
0.0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0
0 2 4 6 8 10 12 14 16
ISTB[μA]
Input Voltage:-VIN [V]
0.980
0.985
0.990
0.995
1.000
1.005
1.010
1.015
1.020
-60 -40 -20 0 20 40 60 80 100
-VOUT [V]
Temperature:Ta [°C]
0.0
1.0
2.0
3.0
4.0
5.0
6.0
0.0 0.5 1.0 1.5 2.0 2.5
-VOUT [V]
Output Current:IOUT [A]
4.90
4.92
4.94
4.96
4.98
5.00
5.02
5.04
5.06
5.08
5.10
-60 -40 -20 0 20 40 60 80 100
-VOUT [V]
Temperature:Ta [°C]
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TSZ02201-0V3V0A600120-1-2
© 2017 ROHM Co., Ltd. All rights reserved.
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www.rohm.com
TSZ22111 • 15 • 001
BD37215MUV
Typical Performance Curves – continued
Figure 21. Power-Supply Rejection Ratio Figure 22. Power-Supply Rejection Ratio
(VOUT= -1.0V) (VOUT= -1.0V)
Figure 23. Power-Supply Rejection Ratio Figure 24. Power-Supply Rejection Ratio
(VOUT= -5.0V) (VOUT= -3.3V)
VOUT= -3.3V
IOUT=500mA
COUT=47µF
VSAT=1.0V
VSAT=0.5V
VSAT=0.3V
VSAT=0.7V
IOUT=500mA
IOUT=50mA
IOUT=5mA
IOUT=0A
VOUT= -5.0V
COUT=47µF
IOUT=1A
IOUT=500mA
IOUT=50mA
IOUT=5mA
IOUT=0A
VOUT= -1.0V
COUT=47µF
IOUT=1A
0
20
40
60
80
100
120
10 100 1k 10k 100k 1M
PSRR [dB]
Frequency [Hz]
0
20
40
60
80
100
120
10 100 1k 10k 100k 1M
PSRR [dB]
Frequency [Hz]
0
20
40
60
80
100
120
10 100 1k 10k 100k 1M
PSRR [dB]
Frequency [Hz]
0
20
40
60
80
100
120
10 100 1k 10k 100k 1M
PSRR [dB]
Frequency [Hz]
IOUT=500mA
VOUT= -1.0V
COUT=10µF
COUT=47µF
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TSZ02201-0V3V0A600120-1-2
© 2017 ROHM Co., Ltd. All rights reserved.
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TSZ22111 • 15 • 001
BD37215MUV
Typical Performance Curves – continued
Figure 25. Power-Supply Rejection Ratio Figure 26. Power-Supply Rejection Ratio
(VOUT= -5.0V) (VOUT= -3.3V)
Figure 27. Power-Supply Rejection Ratio Figure 28. Power-Supply Rejection Ratio
(VOUT= -5.0V)
VOUT= -5.0V
IOUT=500mA
COUT=47µF
VSAT=1.0V
VSAT=0.5V
VSAT=0.3V
VSAT=0.7V
0
20
40
60
80
100
120
10 100 1k 10k 100k 1M
PSRR [dB]
Frequency [Hz]
0
20
40
60
80
100
120
10 100 1k 10k 100k 1M
PSRR [dB]
Frequency [Hz]
0
20
40
60
80
100
120
10 100 1k 10k 100k 1M
PSRR [dB]
Frequency [Hz]
0
20
40
60
80
100
120
10 100 1k 10k 100k 1M
PSRR [dB]
Frequency [Hz]
VOUT= -3.3V
IOUT=50mA
COUT=47µF
VSAT=1.0V
VSAT=0.5V
VSAT=0.3V
VSAT=0.7V
IOUT=500mA
COUT=47µF
VOUT= -1.0V
VOUT= -3.3V
VOUT= -5.0V
VOUT= -12.0V
VOUT= -5.0V
IOUT=50mA
COUT=47µF
VSAT=1.0V
VSAT=0.5V
VSAT=0.3V
VSAT=0.7V
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TSZ02201-0V3V0A600120-1-2
© 2017 ROHM Co., Ltd. All rights reserved.
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TSZ22111 • 15 • 001
BD37215MUV
Typical Performance Curves – continued
Figure 29. Soft Start Figure 30. Soft Start
(VOUT= -1.0V) (VOUT= -5.0V)
Figure 31. Line Transient Figure 32. Line Transient
(IOUT=500mA Slew Rate=1.0V/µs VOUT= -1.0V COUT=2.2µF) (IOUT=500mA Slew Rate=1.0V/µs VOUT= -5.0V COUT=2.2µF)
VIN: 2V/Div
VOUT: 10mV/Div (AC)
EN: 2V/Div
VOUT: 200mV/Div
EN: 2V/Div
VOUT: 1V/Div
VIN: 5V/Div
VOUT: 10mV/Div (AC)
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Typical Performance Curves – continued
Figure 33. Line Transient Figure 34. Line Transient
(IOUT=500mA Slew Rate=0.2V/µs VOUT= -1.0V COUT=2.2µF) (IOUT=500mA Slew Rate=0.2V/µs VOUT= -5.0V COUT=2.2µF)
Figure 35. Load Transient Figure 36. Load Transient
(IOUT=0mA ～ 500mA VOUT= -1.0V COUT=2.2µF) (IOUT=0mA ～ 500mA VOUT= -5.0V COUT=2.2µF)
VIN: 5V/Div
VOUT: 10mV/Div (AC)
IOUT: 200mA/Div
VOUT: 50mV/Div (AC)
VIN: 2V/Div
VOUT: 10mV/Div (AC)
IOUT: 200mA/Div
VOUT: 50mV/Div (AC)
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BD37215MUV
Application Examples
VIN
EN
BAS
BAO GND
BC
VO
R1
120kΩ
R2
30kΩ
VS
CIN
10µF COUT
10µF
CBC
1µF
VIN= -6.0V VOUT= -5.0V
VEN= +3.0V
Parts
Maker
Value
Parts Number
R1
ROHM
120kΩ
MCR03EZPD1203
R2
ROHM
30kΩ
MCR03EZPD3002
CIN
Rubycon
10µF
16MU106M4532
COUT
Rubycon
10µF
16MU106M4532
CBC
Rubycon
1µF
16MU105M3216
(Note) This application example is just one case. Actual setting will be decided after a thorough evaluation and verification in the set.
(Note) The value of R1 and R2 is set that R1 + R2 becomes 100kΩ or above.
The resistance for voltage setting is recommended the one that is 1% accuracy or below.
(Note) Set the capacity of the capacitor not to be less than the minimum in consideration of temperature or DC bias properties.
Figure 37. Application Circuit (VOUT= -5.0V)
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Selection of Components Externally Connected
VIN
EN
BAS
BAO GND
BC
VO
R1
R2
VS
CIN COUT
CBC
VIN VOUT
VEN
Figure 38. External Components Connection
1. Output Voltage Setting
To set output voltage, connect resistance of R1 between BAO-BAS and connect resistance of R2 in between BAS-GND.
The value of R1 and R2 is set that R1 + R2 becomes 100kΩ or above. In addition, the resistance for voltage setting is
recommended the one that is 1% accuracy or below. In the case to use -1.0V setting, short BAS with BAO.
[V]
= -1.0V (Typ)
2. Output Capacitor COUT
Output capacitor should be selected 1µF or above considering about the voltage modulation, thermal characteristics,
and distribution of the value. Installation of output capacitor in the position near the pin in between VO and GND is
recommended. In addition, the rated voltage of capacitor should be set with enough margins to output voltage.
The ESR of Output Capacitor effect the stability of IC operation. Refer the stable operation range for the selection of
Output Capacitor which is given in the reference data of Figure 39. This reference data is measured in combination of
the ceramic capacitor of 2.2µF and resistance in series to Output. The Stable operation range of this graph is given by
only the IC and load resistance. For actual applications the stable operating range is influenced by the wiring impedance
of the PCB panel, input supply impedance and load impedance. Therefore verification of the final operating environment
is needed.
Figure 39. ESR of COUT vs IOUT
0.01
0.10
1.00
10.00
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
ESR of COUT [Ω]
Output Current:IOUT [A]
Stable Operation Range
Unstable Operation Range
VIN= -6.0V
VOUT= -5.0V
-40°C≤Ta≤85°C
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Selection of Components Externally Connected – continued
3. Input Capacitor CIN
Input capacitor should be selected 2.2µF or above considering about the voltage modulation, thermal characteristics,
and distribution of the value. Installation of input capacitor in the position close to the pin in between VIN and GND is
recommended also. In addition, the rated voltage of capacitor shall be set with enough margins with respect to input
voltage.
4. Filter Capacitor CBC
Filter capacitor CBC and built-in resistance formed a low pass filter that reduces the noise that appears in output voltage.
In addition, the filter capacitor CBC also has a soft start function because it limits the rush current of output when it starts.
The rising speed depends on the internal charging current 100µA (Typ), the capacitance value connected to BC and on
the output programmed voltage. The time of the soft start is about 9ms (Typ) if capacitance is 1µF and output
programmed voltage is -1.0V, and almost 40ms (Typ) if output programmed voltage is set to -5.0V.
Because the higher value of capacitor will decrease the noise but the soft start time will be longer, it should be decided
that the proper value of the capacitance.
Refer the following calculation for CBC capacitance. Depending on the output capacitor, there is a possibility not to
operate properly.
[F]
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BD37215MUV
I/O Equivalence Circuits
VIN (PIN 15,16,17) / VO (PIN 1,19,20)
EN (PIN 8)
BAO (PIN 12)
VIN
(PIN 15, 16, 17)
VO
(PIN 1, 19, 20)
100kΩ
EN
(PIN 8)
BAO
(PIN 12)
VIN
BAS (PIN 11)
BC (PIN 5)
VS (PIN 2)
BAS
(PIN 11)
BC
(PIN 5)
VIN
VS
(PIN 2)
VIN
Figure 40. I/O Equivalence Circuits
PCB Layout Example
TOP BOTTOM
(Board Size 60mm x 60mm, Board Thickness 1.6mm, Material FR-4)
Figure 41. Circuit Diagram of Evaluation Board (Typical Application Circuit setting)
(Note) This PCB Layout example includes the other device pattern also. This IC position is U1.
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BD37215MUV
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3. Ground Voltage
Except for EN pin, ensure that no pins are at a voltage above that of the ground pin at any time, even during transient
condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
7. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
8. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
9. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
10. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
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Operational Notes – continued
11. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When VIN > Pin A and VIN > Pin B, the P-N junction operates as a parasitic diode.
When VIN > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the VIN voltage to an input pin (and thus to the P substrate) should be
avoided.
Figure 42. Example of monolithic IC structure
12. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
13. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all within
the Area of Safe Operation (ASO).
14. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls
below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
15. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
N N
P+PN N
P+
P Substrate
GND
NP+N N
P+
NP
P Substrate
GND GND
Parasitic
Elements
Pin A
Pin A
Pin B Pin B
B C
EParasitic
Elements
GND
Parasitic
Elements
CB
E
Transistor (NPN)Resistor
N Region
close-by
Parasitic
Elements
VIN
VIN
VIN
VIN
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Ordering Information
B
D
3
7
2
1
5
M
U
V
-
E 2
Part Number
Package
MUV:VQFN020V4040
Packaging and forming specification
E2: Embossed tape and reel
(VQFN020V4040)
Marking Diagram
VQFN020V4040 (TOP VIEW)
3 7 2 1 5
Part Number Marking
LOT Number
1PIN MARK
Notice-PGA-E Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅣ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
