All specifications are subject to change without notice.
Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
Chip Beads
For signal line
MMZ series
Type:
Issue date:
MMZ0402 0402[01005 inch]*
MMZ0603 0603[0201 inch]
MMZ1005 1005[0402 inch]
MMZ1608 1608[0603 inch]
MMZ2012 2012[0805 inch]
MMZ1005-E 1005[0402 inch]
* Dimensions Code JIS[EIA]
November 2011
• All specifications are subject to change without notice.
(1/26)
001-05 / 20111129 / e9412_mmz
Chip Beads
For Signal Line
MMZ Series MMZ0402
FEATURES
It is super small size(
L0.4×W0.2×T0.2mm
).
It prevents radiated noise from high-speed signal lines.
Maintain impedance to high frequency band.
Because it adopts silver in internal electrode, it is low DC
resistance.
Because it is not generate of cross talk with closed magnetic cir-
cuit structural design, high density assembly is possible.
It is a product conforming to RoHS directive.
APPLICATIONS
Removal of signal line noises of cellular phones, portable audio
players, various modules, etc.
PRODUCT IDENTIFICATION
(1) Series name
(2) Dimensions L×W
(3) Type name
(4) Impedance
121:120 at 100MHz
(5) Characteristic type
(6) Packaging style
T: Taping
(7) TDK internal code
HANDLING AND PRECAUTIONS
Before soldering, be sure to preheat components. The preheat-
ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
Do not expose the inductors to stray magnetic fields.
Avoid static electricity discharge during handling.
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD
PATTE RN
TEMPERATURE RANGES
PACKAGING STYLE AND QUANTITIES
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
ELECTRICAL CHARACTERISTICS
Test equipment: E4991A or equivalent
Test tool: 16197 or equivalent
Test temperature: 25±10°C
Conformity to RoHS Directive
MMZ 0402 S 121 C T
(1) (2) (3) (4) (5) (6) (7)
Operating/storage –55 to +125°C
Packaging style Quantity
Taping 20000 pieces/reel
Part No. Impedance
()[100MHz]
DC resistance
()max.
Rated current
(mA)max.
MMZ0402S100C 10±50.10 500
MMZ0402S700C 70±25% 0.45 260
MMZ0402S121C 120±25% 0.70 210
0.2±0.02
0.4±0.02
0.08 to 0.14
0.2±0.02
Weight: 0.08mg
Dimensions in mm
0.2
0.15 to 0.20.15 to 0.2
0.18 to 0.2
Natural
cooling
10s max.
Preheating
60 to 120s
Soldering
30 to 60s
230˚C
250 to 260˚C
180˚C
150˚C
Time(s)
Please contact our Sales office when your application is considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• All specifications are subject to change without notice.
(2/26)
001-05 / 20111129 / e9412_mmz
TYPICAL ELECTRICAL CHARACTERISTICS
Z FREQUENCY CHARACTERISTICS(DIFFERS ACCORDING TO SERIES)
MMZ0402S SERIES
Z, X, R vs. FREQUENCY CHARACTERISTICS
MMZ0402S100C MMZ0402S700C MMZ0402S121C
PACKAGING STYLES
REEL DIMENSIONS TAPE DIMENSIONS
100001000100101
Frequency(MHz)
0
250
150
200
100
50
Impedance()
MMZ0402S121C
MMZ0402S700C
MMZ0402S100C
100001000100101
Impedance()
Frequency(MHz)
0
20
40
60
80
100
120
140
160
Z
R
X
100001000100101
Impedance()
Frequency(MHz)
Z
R
X
5
10
15
20
0100001000100101
Frequency(MHz)
0
250
150
200
100
50
Impedance()
Z
R
X
1.0
ø180±2.0
2.0±0.5
ø13±0.2
ø21±0.8
ø60min.
14.4max.
Dimensions in mm
8.4 +2.0
–0.0
8.0±0.2 3.5±0.05
0.46±0.04
1.75±0.1
0.4max. 0.26±0.04 4.0±0.1
2.0±0.05 2.0±0.05
Sprocket hole Cavity
1.5 +0.1
–0.0
160min. Taping 200min.
300min.
Drawing direction
Dimensions in mm
• All specifications are subject to change without notice.
(3/26)
001-05 / 20111129 / e9412_mmz
Chip Beads
For Signal Line
MMZ Series MMZ0603
FEATURES
This is a multilayered chip bead product with dimensions of
L0.6×W0.3×T0.3mm.
The product is magnetically shielded, allowing high density
mounting.
We refined the rules for internal conductor design to reduce
floating capacity between conductors, which in turn has
contributed to a dramatic improvement in high frequency
characteristics. We have also been able to expand and reinforce
the EMI suppression in the GHz range.
It is a product conforming to RoHS directive.
APPLICATIONS
Removal of signal line noises of cellular phones, portable audio
players, various modules, DSCs, portable game machines, etc.
PRODUCT IDENTIFICATION
(1) Series name
(2) Dimensions L×W
(3) Type name
(4) Impedance
121:120 at 100MHz
(5) Characteristic type
(6) Packaging style
T:Taping
(7) TDK internal code
HANDLING AND PRECAUTIONS
Before soldering, be sure to preheat components. The preheat-
ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
Do not expose the inductors to stray magnetic fields.
Avoid static electricity discharge during handling.
When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
MATERIAL CHARACTERISTICS
S material: Standard type that features impedance characteristics
similar to those of a typical ferrite core.
For signal line applications in which the blocking region
is near 100MHz. Impedance values selected for effec-
tiveness at 40 to 300MHz.
Y material: High frequency range type intended for the 100MHz
region and above.
For signal line applications in which the signal fre-
quency is far from the cutoff frequency. Impedance val-
ues selected for effectiveness at 80 to 400MHz.
D material: For applications calling for low insertion loss at low fre-
quencies and sharply increasing impedance at high
frequencies. Designed for high impedance at high fre-
quencies (300MHz to 1GHz) for signal line applica-
tions.
F material: This new product inherits the characteristic of our D-
material, namely its sharp impedance rise time, and its
impedance peak frequency has been shifted higher
into range. The product offers excellent noise suppres-
sion from 600MHz to as high as in the GHz range.
TYPICAL MATERIAL CHARACTERISTICS
Conformity to RoHS Directive
MMZ 0603 S 121 C T
(1) (2) (3) (4) (5) (6) (7)
0
200
400
600
800
1000
1200
1400
1600
1800
2000
10 100 1000
Frequency(MHz)
Impedance()
S
D
F
Y
Please contact our Sales office when your application is considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• All specifications are subject to change without notice.
(4/26)
001-05 / 20111129 / e9412_mmz
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD
PATTE RN
TEMPERATURE RANGES
PACKAGING STYLE AND QUANTITIES
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
ELECTRICAL CHARACTERISTICS
Test equipment: E4991A or equivalent
Test tool: 16197 or equivalent
Test temperature: 25±10°C
TYPICAL ELECTRICAL CHARACTERISTICS
Z FREQUENCY CHARACTERISTICS(DIFFERS ACCORDING TO SERIES)
MMZ0603S SERIES MMZ0603Y SERIES MMZ0603D SERIES
MMZ0603F SERIES
Operating/storage –55 to +125°C
Packaging style Quantity
Taping 15000 pieces/reel
0.3±0.03
0.6±0.03
0.1min.
0.3±0.03
Weight: 0.3mg
Dimensions in mm
0.30 0.250.25
0.30
Natural
cooling
10s max.
Preheating
60 to 120s
Soldering
30 to 60s
230˚C
250 to 260˚C
180˚C
150˚C
Time(s)
Part No. Impedance
()[100MHz]
DC resistance
()max.
Rated current
(mA)max.
MMZ0603S100C 10±50.09 500
MMZ0603S800C 80±25% 0.30 200
MMZ0603S121C 120±25% 0.45 200
MMZ0603S241C 240±25% 0.57 200
MMZ0603S471C 470±25% 1.30 100
MMZ0603S601C 600±25% 1.45 100
MMZ0603Y121C 120±25% 0.39 200
MMZ0603Y241C 240±25% 0.80 200
MMZ0603Y471C 470±25% 1.40 200
MMZ0603Y601C 600±25% 1.50 200
MMZ0603D330C 33±25% 0.70 100
MMZ0603D560C 56±25% 0.95 100
MMZ0603D800C 80±25% 1.25 100
MMZ0603F100C 10±50.50 200
MMZ0603F220C 22±25% 1.00 200
MMZ0603F330C 33±25% 1.30 150
100001000100101
Frequency(MHz)
Impedance()
0
100
200
300
400
500
600
700
800
900
1000 MMZ0603Y601C
MMZ0603Y471C
MMZ0603Y241C
MMZ0603Y121C
100001000100101
Frequency(MHz)
Impedance()
0
100
200
300
400
500
600
700
800
900
1000 MMZ0603S601C
MMZ0603S471C
MMZ0603S241C
MMZ0603S121C
MMZ0603S800C
MMZ0603S100C
100001000100101
Frequency(MHz)
Impedance()
0
100
200
300
400
500
600
700
800
900
MMZ0603D800C
MMZ0603D560C
MMZ0603D330C
100001000100101
Frequency(MHz)
Impedance()
0
200
400
600
800
1000
1200
MMZ0603F330C
MMZ0603F220C
MMZ0603F100C
• All specifications are subject to change without notice.
(5/26)
001-05 / 20111129 / e9412_mmz
TYPICAL ELECTRICAL CHARACTERISTICS
Z, X, R vs. FREQUENCY CHARACTERISTICS
MMZ0603S100C MMZ0603S800C MMZ0603S121C
MMZ0603S241C MMZ0603S471C MMZ0603S601C
MMZ0603Y121C MMZ0603Y241C MMZ0603Y471C
MMZ0603Y601C
01 10 100 1000 10000
Frequency(MHz)
Impedance
()
20
40
60
80
100
120
140
160
Z
X
R
1 10 100 1000 10000
Frequency(MHz)
Impedance
()
Z
X
R
2
0
4
6
8
10
12
14
16
18
01 10 100 1000 10000
Frequency(MHz)
Impedance()
50
100
150
200
250
Z
X
R
800
600
400
200
01 10 100 1000 10000
Frequency(MHz)
Impedance
()
Z
X
R
1000
800
600
400
200
01 10 100 1000 10000
Frequency(MHz)
Impedance
()
Z
X
R
450
400
350
300
250
200
150
100
50
01 10 100 1000 10000
Frequency(MHz)
Impedance
()
Z
X
R
1 10 100 1000 10000
Frequency(MHz)
0
Impedance()
100
200
300
400
500
600
Z
X
R
0
50
100
150
200
250
Impedance()
1 10 100 1000 10000
Frequency(MHz)
Z
X
R
1 10 100 1000 10000
Frequency(MHz)
0
Impedance()
100
200
300
400
500
600
700
800
900
Z
X
R
1 10 100 1000 10000
Frequency(MHz)
0
200
400
600
800
1000
Impedance()
Z
X
R
• All specifications are subject to change without notice.
(6/26)
001-05 / 20111129 / e9412_mmz
TYPICAL ELECTRICAL CHARACTERISTICS
Z, X, R vs. FREQUENCY CHARACTERISTICS
MMZ0603D330C MMZ0603D560C MMZ0603D800C
MMZ0603F100C MMZ0603F220C MMZ0603F330C
PACKAGING STYLES
REEL DIMENSIONS TAPE DIMENSIONS
1 10 100 1000 10000
Frequency(MHz)
0
Impedance()
100
200
300
400
500
600
700
Z
X
R
1 10 100 1000 10000
Frequency(MHz)
0
100
200
300
400
500
Impedance()
Z
X
R
1 10 100 1000 10000
Frequency(MHz)
0
Impedance()
100
200
300
400
500
600
700
800
900
Z
X
R
1 10 100 1000 10000
Frequency(MHz)
0
100
200
300
400
500
600
700
Impedance()
Z
X
R
1 10 100 1000 10000
Frequency(MHz)
0
Impedance()
Z
X
R
50
100
150
200
250
300
1 10 100 1000 10000
Frequency(MHz)
0
200
400
600
800
1000
1200
Impedance()
Z
XR
1.0
ø180±2.0
2.0±0.5
ø13±0.2
ø21±0.8
ø60min.
14.4max.
Dimensions in mm
8.4 +2.0
–0.0
8.0±0.3 3.5±0.05
1.75±0.1
4.0±0.1
2.0±0.05 2.0±0.05
Sprocket hole Cavity
1.5 +0.1
–0.0
0.5max. 0.38±0.05
0.68±0.05
160min. Taping 200min.
300min.
Drawing direction
Dimensions in mm
• All specifications are subject to change without notice.
(7/26)
001-05 / 20111129 / e9412_mmz
Chip Beads
For Signal Line
MMZ Series MMZ1005
FEATURES
Size standardized for use by automatic assembly equipment.
No preferred orientation.
Electroplated terminal electrodes accommodate reflow
soldering.
High reliability due to an entirely monolithic structure.
Closed magnetic circuit structure allows high-density installation
while preventing crosstalk between circuits.
Low DC resistance structure of electrode prevents wasteful
electric power consumption.
It is a product conforming to RoHS directive.
APPLICATIONS
Removal of signal line noises of cellular phones, PCs, note PCs,
TVs, TV tuners, STBs, audio players, DVDs, DSCs, DVCs, game
machines, digital photo frames, car navigation system, PNDs, etc.
PRODUCT IDENTIFICATION
(1) Series name
(2) Dimensions L×W
(3) Type name
(4) Impedance
121:120 at 100MHz
(5) Characteristic type
(6) Packaging style
T:Taping
(7) TDK internal code
HANDLING AND PRECAUTIONS
Before soldering, be sure to preheat components. The preheat-
ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
Do not expose the inductors to stray magnetic fields.
Avoid static electricity discharge during handling.
When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
MATERIAL CHARACTERISTICS
B material: This type is perfectly suited for fast digital signals. By
equalizing R components and X components that
beads possess at a frequency of 5MHz, it is able to
suppress overshooting, undershooting and ringing of
fast digital signals.
S material: Standard type that features impedance characteristics
similar to those of a typical ferrite core.
For signal line applications in which the blocking region
is near 100MHz. Impedance values selected for effec-
tiveness at 40 to 300MHz.
Y material: High frequency range type intended for the 100MHz
region and above.
For signal line applications in which the signal fre-
quency is far from the cutoff frequency. Impedance val-
ues selected for effectiveness at 80 to 400MHz.
D material: For applications calling for low insertion loss at low fre-
quencies and sharply increasing impedance at high
frequencies. Designed for high impedance at high fre-
quencies (300MHz to 1GHz) for signal line applica-
tions.
F material: This new product inherits the characteristic of our D-
material, namely its sharp impedance rise time, and its
impedance peak frequency has been shifted higher
into range. The product offers excellent noise suppres-
sion from 600MHz to as high as in the GHz range.
TYPICAL MATERIAL CHARACTERISTICS
Conformity to RoHS Directive
MMZ 1005 S 121 C T
(1) (2) (3) (4) (5) (6) (7)
B
S
D
Y
0
200
400
600
800
1000
1200
1400
1600
1800
2000
10 100 1000
Frequency(MHz)
Impedance()
F
Please contact our Sales office when your application is considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• All specifications are subject to change without notice.
(8/26)
001-05 / 20111129 / e9412_mmz
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD
PATTE RN
TEMPERATURE RANGES
PACKAGING STYLE AND QUANTITIES
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
ELECTRICAL CHARCTERISTICS
Test equipment: E4991A or equivalent
Test tool: 16192A or equivalent
Test temperature: 25±10°C
TYPICAL ELECTRICAL CHARACTERISTICS
Z FREQUENCY CHARACTERISTICS(DIFFERS ACCORDING TO SERIES)
MMZ1005B SERIES MMZ1005S SERIES MMZ1005Y SERIES
MMZ1005D SERIES MMZ1005F SERIES
Operating/storage –55 to +125°C
Packaging style Quantity
Taping 10000 pieces/reel
0.1min.
0.5±0.05
1±0.05
0.5±0.05
0.40.5 0.5
0.5
Weight: 1mg
Dimensions in mm
Natural
cooling
10s max.
Preheating
60 to 120s
Soldering
30 to 60s
230˚C
250 to 260˚C
180˚C
150˚C
Time(s)
Part No. Impedance
()[100MHz]
DC resistance
()max.
Rated current
(mA)max.
MMZ1005B800C 80±25% 0.19 450
MMZ1005B121C 120±25% 0.25 400
MMZ1005B601C 600±25% 0.85 200
MMZ1005S800C 80±25% 0.12 500
MMZ1005S121C 120±25% 0.22 500
MMZ1005S241C 240±25% 0.28 400
MMZ1005S601C 600±25% 0.52 300
MMZ1005S102C 1000±25% 0.75 200
MMZ1005Y400C 40±25% 0.10 550
MMZ1005Y800C 80±25% 0.17 450
MMZ1005Y121C 120±25% 0.18 400
MMZ1005Y241C 240±25% 0.26 300
MMZ1005Y301C 300±25% 0.38 250
MMZ1005Y471C 470±25% 0.47 250
MMZ1005Y601C 600±25% 0.54 250
MMZ1005Y102C 1000±25% 0.70 200
MMZ1005Y152C 1500±25% 1.00 100
MMZ1005D100C 10±50.10 500
MMZ1005D220C 22±25% 0.17 400
MMZ1005D330C 33±25% 0.24 400
MMZ1005D680C 68±25% 0.38 400
MMZ1005D121C 120±25% 0.60 350
MMZ1005D241C 240±25% 0.90 200
MMZ1005F330C 33±25% 0.50 200
MMZ1005F470C 47±25% 0.60 100
MMZ1005F560C 56±25% 0.70 100
100001000100101
Frequency(MHz)
Impedance()
0
200
400
600
800
1000
1200
1400
1600
1800 MMZ1005Y152C
MMZ1005Y102C
MMZ1005Y601C
MMZ1005Y471C
MMZ1005Y301C
MMZ1005Y241C
MMZ1005Y121C
MMZ1005Y800C
MMZ1005Y400C
100001000100101
Frequency(MHz)
Impedance()
0
100
200
300
400
500
600
700
800 MMZ1005B601C
MMZ1005B121C
MMZ1005B800C
100001000100101
Frequency(MHz)
Impedance()
0
200
400
600
800
1000
1200
1400 MMZ1005S102C
MMZ1005S601C
MMZ1005S241C
MMZ1005S121C
MMZ1005S800C
100001000100101
Frequency(MHz)
Impedance()
0
500
1000
1500
2000
2500
3000
MMZ1005D241C
MMZ1005D121C
MMZ1005D680C
MMZ1005D330C
MMZ1005D220C
MMZ1005D100C
100001000100101
Frequency(MHz)
Impedance()
0
200
400
600
800
1000
1200
MMZ1005F560C
MMZ1005F470C
MMZ1005F330C
• All specifications are subject to change without notice.
(9/26)
001-05 / 20111129 / e9412_mmz
TYPICAL ELECTRICAL CHARACTERISTICS
Z, X, R vs. FREQUENCY CHARACTERISTICS
MMZ1005B800C MMZ1005B121C MMZ1005B601C
MMZ1005S800C MMZ1005S121C MMZ1005S241C
MMZ1005S601C MMZ1005S102C
MMZ1005Y400C MMZ1005Y800C MMZ1005Y121C
800
700
600
500
400
300
200
100
01 10 100 1000 10000
Frequency(MHz)
Impedance()
Z
R
X
120
40
20
60
80
100
01 10 100 1000 10000
Frequency(MHz)
Impedance()
Z
R
X
1 10 100 1000 10000
Frequency(MHz)
0
Impedance()
20
40
60
80
100
120
140
160
180
Z
R
X
400
350
300
250
200
150
100
50
01 10 100 1000 10000
Frequency(MHz)
Impedance()
ZR
X
01 10 100 1000 10000
Frequency(MHz)
Impedance()
20
40
60
80
100
120
140
160
Z
R
X
01 10 100 1000 10000
Frequency(MHz)
Impedance()
ZR
X
50
100
150
200
250
01 10 100 1000 10000
Frequency(MHz)
Impedance()
Z
R
X
100
200
300
400
500
600
700
800
900
01 10 100 1000 10000
Frequency(MHz)
Impedance()
Z
X
R
200
400
600
800
1000
1200
1400
01 10 100 1000 10000
Frequency(MHz)
Impedance()
Z
R
X
50
100
150
200
250
01 10 100 1000 10000
Frequency(MHz)
Impedance()
20
40
60
80
100
120
140
160
Z
R
X
1 10 100 1000 10000
Frequency(MHz)
0
Impedance()
10
20
30
40
50
60
70
80
Z
R
X
• All specifications are subject to change without notice.
(10/26)
001-05 / 20111129 / e9412_mmz
TYPICAL ELECTRICAL CHARACTERISTICS
Z, X, R vs. FREQUENCY CHARACTERISTICS
MMZ1005Y241C MMZ1005Y301C MMZ1005Y471C
MMZ1005Y601C MMZ1005Y102C MMZ1005Y152C
MMZ1005D100C MMZ1005D220C MMZ1005D330C
MMZ1005D680C MMZ1005D121C MMZ1005D241C
800
700
600
500
400
300
200
100
01 10 100 1000 10000
Frequency(MHz)
Impedance()
Z
R
X
01 10 100 1000 10000
Frequency(MHz)
Impedance()
Z
R
X
100
200
300
400
500
600
01 10 100 1000 10000
Frequency(MHz)
Impedance()
100
200
300
400
500
Z
R
X
1800
1600
1400
1200
1000
800
600
400
200
01 10 100 1000 10000
Frequency(MHz)
Impedance()
ZR
X
0
200
400
600
800
1000
1200
1400
1 10 100 1000 10000
Frequency(MHz)
Impedance()
Z R
X
01 10 100 1000 10000
Frequency(MHz)
Impedance()
Z
R
X
200
400
600
800
1000
1200
01 10 100 1000 10000
Frequency(MHz)
Impedance()
ZR
X
50
100
150
200
250
300
1 10 100 1000 10000
Frequency(MHz)
0
Impedance()
50
100
150
200
R
X
Z
70
60
50
40
30
20
10
01 10 100 1000 10000
Frequency(MHz)
Impedance()
R
X
Z
3000
2500
2000
1500
1000
500
01 10 100 1000 10000
Frequency(MHz)
Z, X, R()
R
X
Z
1 10 100 1000 10000
Frequency(MHz)
Impedance()
0
200
400
600
800
1000
R
X
Z
0
100
200
300
400
500
600
1 10 100 1000 10000
Frequency(MHz)
Impedance()
ZR
X
• All specifications are subject to change without notice.
(11/26)
001-05 / 20111129 / e9412_mmz
TYPICAL ELECTRICAL CHARACTERISTICS
Z, X, R vs. FREQUENCY CHARACTERISTICS
MMZ1005F330C MMZ1005F470C MMZ1005F560C
PACKAGING STYLES
REEL DIMENSIONS TAPE DIMENSIONS
1200
1000
800
600
400
200
01 10 100 1000 10000
Frequency(MHz)
Impedance()
Z
X
R
1000
900
800
700
600
500
400
300
200
100
01 10 100 1000 10000
Frequency(MHz)
Impedance()
Z
X
R
01 10 100 1000 10000
Frequency(MHz)
Impedance()
Z
X
R
100
200
300
400
500
600
700
1.0
ø180±2.0
2.0±0.5
ø13±0.2
ø21±0.8
ø60min.
14.4max.
Dimensions in mm
8.4 +2.0
–0.0
1.15±0.1
0.8max. 0.65±0.1
8.0±0.3 3.5±0.05
1.75±0.1
4.0±0.1
2.0±0.05 2.0±0.05
Sprocket hole Cavity
1.5 +0.1
–0.0
160min. Taping 200min.
300min.
Drawing direction
Dimensions in mm
• All specifications are subject to change without notice.
(12/26)
001-05 / 20111129 / e9412_mmz
Chip Beads
For Signal Line
MMZ Series MMZ1608
FEATURES
Chip bead(impeder), MMZ series offers 8 construction materials.
Size standardized for use by automatic assembly equipment.
No preferred orientation.
Either flow or reflow soldering methods can be used due to
electroplating of the terminal electrodes.
High reliability due to an entirely monolithic structure.
Closed magnetic circuit structure allows high-density installation
while preventing crosstalk between circuits.
Low DC resistance structure of electrode prevents wasteful
electric power consumption.
The products contain no lead and also support lead-free
soldering.
It is a product conforming to RoHS directive.
APPLICATIONS
Removal of signal line noises of cellular phones, PCs, note PCs,
TVs, TV tuners, STBs, audio players, DVDs, DSCs, DVCs, game
machines, digital photo frames, car navigation system, PNDs, etc.
PRODUCT IDENTIFICATION
(1) Series name
(2) Dimensions L×W
(3) Type name
(4) Impedance
121:120 at 100MHz
(5) Characteristic type
(6) Packaging style
T:Taping
(7) TDK internal code
HANDLING AND PRECAUTIONS
Before soldering, be sure to preheat components. The preheat-
ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
Do not expose the inductors to stray magnetic fields.
Avoid static electricity discharge during handling.
When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD
PATTE RN
TEMPERATURE RANGES
PACKAGING STYLE AND QUANTITIES
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
Conformity to RoHS Directive
MMZ 1608 R 121 A T
(1) (2) (3) (4) (5) (6) (7)
Operating/storage –55 to +125°C
Packaging style Quantity
Taping 4000 pieces/reel
0.8±0.15
T
0.3±0.2
1.6±0.15
0.80.6 0.6
0.8
Dimensions in mm
Thickness(T)Weight
0.6±0.15mm
0.8±0.15mm
3mg
4mg
Natural
cooling
10s max.
Preheating
60 to 120s
Soldering
30 to 60s
230˚C
250 to 260˚C
180˚C
150˚C
Time(s)
Please contact our Sales office when your application is considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.