DATA SH EET
Product specification
Supersedes data of September 1993
File under Integrated Circuits, IC06
1998 Jul 08
INTEGRATED CIRCUITS
74HC/HCT4059
Programmable divide-by-n counter
For a complete data sheet, please also download:
•The IC06 74HC/HCT/HCU/HCMOS Logic Family Specifications
•The IC06 74HC/HCT/HCU/HCMOS Logic Package Information
•The IC06 74HC/HCT/HCU/HCMOS Logic Package Outlines
1998 Jul 08 2
Philips Semiconductors Product specification
Programmable divide-by-n counter 74HC/HCT4059
FEATURES
•Synchronous programmable divide-by-n counter
•Presettable down counter
•Fully static operation
•Mode select control of initial decade counting function
(divide-by-10, 8, 5, 4 and 2)
•Master preset initialization
•Latchable output
•Easily cascadable with other counters
•Four operating modes:
timer
divider-by-n
divide-by-10 000
master preset
•Output capability: standard
•ICC category: MSI
GENERAL DESCRIPTION
The 74HC/HCT4059 are high-speed Si-gate CMOS
devices and are pin compatible with the “4059” of the
“4000B” series. They are specified in compliance with
JEDEC standard no. 7A.
The 74HC/HCT4059 are divide-by-n counters which can
be programmed to divide an input frequency by any
number (n) from 3 to 15 999. There are four operating
modes, timer, divide-by-n, divide-by-10 000 and master
preset, which are defined by the mode select inputs (Ka to
Kc) and the latch enable input (LE) as shown in the
Function table.
The complete counter consists of a first counting stage, an
intermediate counting stage and a fifth counting stage. The
first counter stage consists of four independent flip-flops.
Depending on the divide-by-mode, at least one flip-flop is
placed at the input of the intermediate stage (the remaining
flip-flops are placed at the fifth stage with a place value of
thousands). The intermediate stage consists of three
cascaded decade counters, each containing four flip-flops.
All flip-flops can be preset to a desired state by means of
the JAM inputs (J1 to J16), during which the clock input
(CP) will cause all stages to count from n to zero. The
zero-detect circuit will then cause all stages to return to the
JAM count, during which an output pulse is generated. In
the timer mode, after an output pulse is generated, the
output pulse remains HIGH until the latch input (LE) goes
LOW. The counter will advance, even if LE is HIGH and
the output is latched in the HIGH state.
In the divide-by-n mode, a clock cycle wide pulse is
generated with a frequency rate equal to the input
frequency divided by n.
The function of the mode select and JAM inputs are
illustrated in the following examples. In the divide-by-2
mode, only one flip-flop is needed in the first counting
section. Therefore the last (5th) counting section has three
flip-flops that can be preset to a maximum count of seven
with a place value of thousands. This counting mode is
selected when Ka to Kc are set HIGH. In this case input J1
is used to preset the first counting section and J2 to J4 are
used to preset the last (5th) counting section.
If the divide-by-10 mode is desired for the first section, Ka
and Kb are set HIGH and Kc is set LOW. The JAM inputs
J1 to J4 are used to preset the first counting section (there
is no last counting section). The intermediate counting
section consists of three cascaded BCD decade
(divide-by-10) counters, presettable by means of the JAM
inputs J5 to J16.
The preset of the counter to a desired divide-by-n is
achieved as follows:
n = (MODE(1)) (1 000 x decade 5 preset
+ 100 x decade 4 preset
+10 x decade 3 preset
+1 x decade 2 preset)
+decade 1 preset
To calculate preset values for any “n” count, divide the “n”
count by the selected mode. The resultant is the
corresponding preset value of the 5th to the 2nd decade
with the remainder being equal to the 1st decade value;
preset value = n/mode.
If n = 8 479, and the selected mode = 5, the preset
value = 8 479/5 = 1 695 with a remainder of 4, thus the
JAM inputs must be set as shown in Table 1.
To verify the results, use the given equation:
n = 5 (1 000 ×1+100 ×6+10 ×9+1×5) +4
n = 8 479.
If n = 12 382 and the selected mode = 8, the preset
value = 12 382/8 = 1 547 with a remainder of 6, thus the
JAM inputs must be set as shown in Table 2.
To verify:
n = 8 (1 000 ×1+100 ×5+10 ×4+1×7) +6
n = 12 382.
(1) MODE = first counting section divider
(10, 8, 5, 4 or 2).
1998 Jul 08 3
Philips Semiconductors Product specification
Programmable divide-by-n counter 74HC/HCT4059
If n = 8 479 and the selected mode = 10, the preset
value = 8 479/10 with a remainder of 9, thus the JAM
inputs must be set as shown in Table 3.
To verify:
n = 10 (1 000 ×0+100 ×8+10 ×4+1×7) +9
n = 8 479.
The three decades of the intermediate counting section
can be preset to a binary 15 instead of a BCD 9. In this
case the first cycle of a counter consists of 15 count
pulses, the next cycles consisting of 10 counting pulses.
Thus the place value of the three decades are still 1, 10
and 100. For example, in the divide-by-8 mode, the
number from which the intermediate counting section
begins to count-down can be preset to:
3rd decade: 1 500
2nd decade: 150
1st decade: 15
The last counting section can be preset to a maximum of
1, with a place value of 1 000. The first counting section
can be preset to a maximum of 7. To calculate n:
n = 8 (1 000 ×1+100 ×15 +10 ×15 +1×15) +7
n = 21 327.
21 327 is the maximum possible count in the divide-by-8
mode. The highest count of the various modes is shown in
the Function table, in the column entitled “binary counter
range”.
The mode select inputs permit, when used with decimal
programming, a non-BCD least significant digit. For
example, the channel spacing in a radio is 12.5 kHz, it may
be convenient to program the counter in decimal steps of
100 kHz subdivided into 8 steps of 12.5 kHz controlled by
the least significant digit. Also frequency synthesizer
channel separations of 10, 12.5, 20, 25 and 50 parts can
be chosen by the mode select inputs. This is called
“Fractional extension”. A similar extension called “Half
channel offset” can be obtained in modes 2, 4, 6 and 8, if
the JAM inputs are switched between zero and 1, 2, 3 and
4 respectfully. This is illustrated in Fig.5.
This feature is used primarily in cases where radio
channels are allocated according to the following formula:
Channel frequency = channel spacing x (N +0.5)
N is an integer.
Control inputs Kb and Kc can be used to initiate and lock
the counter in the “master preset” mode. In this condition
the flip-flops in the counter are preset in accordance with
the JAM inputs and the counter remains in that mode as
long as Kb and Kc both remain LOW. The counter begins
to count down from the preset state when a counting mode
other than the “master preset” mode is selected.
Whenever the “master preset” mode is used, control
signals Kb=K
c= LOW must be applied for at least 2 full
clock pulses. After the “master preset” mode inputs have
been changed to one of the counting modes, the next
positive-going clock transition changes an internal flip-flop
so that the count-down begins on the second
positive-going clock transition. Thus, after a “master
preset” mode, there is always one extra count before the
output goes HIGH. Figure 6 illustrates the operation of the
counter in the divide-by-8 mode starting from the preset
state 3.
If the “master preset” mode is started two clock cycles or
less before an output pulse, the output pulse will appear at
the correct moment. When the output pulse appears and
the “master preset” mode is not selected, the counter is
preset according to the states of the JAM inputs.
When Ka, Kb, Kc and LE are LOW, the counter operates in
the “preset inhibit” mode, during which the counter divides
at a fixed rate of 10 000, independent of the state of the
JAM inputs. However, the first cycle length after leaving
the “master preset” mode is determined by the JAM inputs.
When Ka, Kb and Kc are LOW and input LE = HIGH, the
counter operates in the normal divide-by-10 mode,
however, without the latch operation at the output.
This device is particularly advantageous in digital
frequency synthesizer circuits (VHF, UHF, FM, AM etc.)
for communication systems, where programmable
divide-by-”n” counters are an integral part of the
synthesizer phase-locked-loop sub-system. The
74HC/HCT4059 can also be used to perform the
synthesizer “fixed divide-by-n” counting function, as well
as general purpose counting for instrumentation functions
such as totalizers, production counters and “time out”
timers.
Schmitt-trigger action at the clock input makes the circuit
highly tolerant to slower clock rise and fall times.
1998 Jul 08 4
Philips Semiconductors Product specification
Programmable divide-by-n counter 74HC/HCT4059
QUICK REFERENCE DATA
GND = 0 V; Tamb =25°C; tr=t
f= 6 ns
Notes
1. CPD is used to determine the dynamic power dissipation (PD in µW):
PD=C
PD ×VCC2×fi+∑(CL×VCC2×fo) where:
fi= input frequency in MHz
fo= output frequency in MHz
∑ (CL×VCC2×fo) = sum of outputs
CL= output load capacitance in pF
VCC = supply voltage in V
2. For HC the condition is VI= GND to VCC
For HCT the condition is VI= GND to VCC −1.5 V
ORDERING INFORMATION
SYMBOL PARAMETER CONDITIONS TYPICAL UNIT
HC HCT
tPHL/ tPLH propagation delay CP to Q CL= 15 pF; VCC =5 V1820ns
f
max maximum clock frequency 40 40 MHz
CIinput capacitance 3.5 3.5 pF
CPD power dissipation capacitance per package notes 1 and 2 30 32 pF
TYPE
NUMBER PACKAGE
NAME DESCRIPTION VERSION
74HC4059N3;
74HCT4059N3 DIP24 plastic dual in-line package; 24 leads (300 mil) SOT222-1
74HC4059N;
74HCT4059N DIP24 plastic dual in-line package; 24 leads (600 mil) SOT101-1
74HC4059D;
74HCT4059D SO24 plastic small outline package; 24 leads; body width 7.5 mm SOT137-1
1998 Jul 08 5
Philips Semiconductors Product specification
Programmable divide-by-n counter 74HC/HCT4059
PIN DESCRIPTION
PIN NO. SYMBOL NAME AND FUNCTION
1 CP clock input (LOW-to-HIGH, edge-triggered)
2 LE latch enable (active HIGH)
3, 4, 5, 6, 22, 21, 20, 19, 18, 17, 16, 15, 10, 9, 8, 7 J1 to J16 programmable JAM inputs (BCD)
12 GND ground (0 V)
14, 13, 11 Ka to Kcmode select inputs
23 Q divide-by-n output
24 VCC positive supply voltage
Fig.1 Pin configuration. Fig.2 Logic symbol. Fig.3 IEC logic symbol.
1998 Jul 08 6
Philips Semiconductors Product specification
Programmable divide-by-n counter 74HC/HCT4059
Fig.4 Functional block diagram.
APPLICATIONS
•Frequency synthesizer, ideally
suited for use with
PC74HC/HCT4046A,
PC74HC/HCT7046A and
PC74HC/HCT9046A (PLLs)
•Fixed or programmable frequency
division
•“Time out” timer
1998 Jul 08 7
Philips Semiconductors Product specification
Programmable divide-by-n counter 74HC/HCT4059
FUNCTION TABLE
Note
1. It is recommended that the device is in the master preset mode (Kb=K
c= logic 0) in order to correctly initialize the
device prior to start-up. An example of a suitable external circuit is shown in Fig.14.
H = HIGH voltage level
L = LOW voltage level
X = don’t care
Table 1
Table 2
Table 3
LATCH
ENABLE
INPUT
MODE
SELECT
INPUTS
FIRST COUNTING
SECTION
DECADE 1
LAST COUNTING
SECTION
DECADE 5
COUNTER
RANGE
OPERATION
LE KaKbKcMODE MAX
PRESET
STATE
JAM
INPUTS
USED
DIVIDED
BY
MAX.
PRESET
STATE
JAM
INPUTS
USED
BCD
MAX. BINARY
MAX.
HHHH21J
187J
2
J
3
J
4
15 999 17 331
timer mode
HLHH43J
1
J
243J
3
J
4
15 999 18 663
HHLH54J
1
J
2
J
3
21J
49 999 13 329
HLLH87J
1
J
2
J
3
21J
415 999 21 327
HHHL109J
1
J
2
J
3
J
4
10−9 999 16 659
LHHH21J
187J
2
J
3
J
4
15 999 17 331
divide-by-n mode
LLHH43J
1
J
2
43J
3
J
4
15 999 18 663
LHLH54J
1
J
2
J
3
21J
49 999 13 329
LLLH87J
1
J
2
J
3
21J
415 999 21 327
LHHL109J
1
J
2
J
3
J
4
10−9 999 16 659
HLHL109J
1
J
2
J
3
J
4
10−9 999 16 659
L L H L preset inhibited preset inhibited fixed
10 000 −divide-by-10 000
mode
X X L L master preset master preset −− master preset
mode
41 5 9 6
J
1
J
2
J
3
J
4
J
5
J
6
J
7
J
8
J
9
J
10 J11 J12 J13 J14 J15 J16
LLHHHLHLHLLHLHHL
61 7 4 5
J
1
J
2
J
3
J
4
J
5
J
6
J
7
J
8
J
9
J
10 J11 J12 J13 J14 J15 J16
L HHH HHHLLL HL HL HL
9748
J
1
J
2
J
3
J
4
J
5
J
6
J
7
J
8
J
9
J
10 J11 J12 J13 J14 J15 J16
HLLH HHHLLL HL LL LH
1998 Jul 08 8
Philips Semiconductors Product specification
Programmable divide-by-n counter 74HC/HCT4059
Fig.5 Half channel offset.
Fig.6 Total count of 3.
1998 Jul 08 9
Philips Semiconductors Product specification
Programmable divide-by-n counter 74HC/HCT4059
DC CHARACTERISTIC FOR 74HC
For the DC characteristics see
“74HC/HCT/HCU/HCMOS Logic Family Specifications”
.
Output capability: standard
ICC category: MSI
AC CHARACTERISTICS FOR 74HC
GND = 0 V; tr=t
f= 6 ns; CL= 50 pF
Note
1. From master preset mode to any other mode.
SYMBOL PARAMETER
Tamb (°C)
UNIT
TEST CONDITIONS
74HC VCC
(V) WAVEFORMS
+25 −40 to +85 −40 to +125
min. typ. max. min. max. min. max.
tPHL/ tPLH propagation delay
CP to Q 58 200 250 300 ns 2.0 Fig.7
21 40 50 60 4.5
17 34 43 51 6.0
tPHL/ tPLH propagation delay
LE to Q 50 175 220 265 ns 2.0 Fig.8
18 35 44 53 4.5
14 30 37 45 6.0
tTHL/ tTLH output transition time 19 75 95 110 ns 2.0 Fig.7
7 15 19 22 4.5
6 13 16 19 6.0
tWclock pulse width
CP 90 7 115 135 ns 2.0 Fig.7
18 6 23 27 4.5
15 5 90 23 6.0
trem removal time
Kb, Kc to CP 75 19 95 110 ns 2.0 Fig.9; note 1
15 7 19 22 4.5
13 6 16 19 6.0
fmax maximum clock pulse
frequency 4.2 12 3.4 2.8 MHz 2.0 Fig.7
21 36 17 14 4.5
25 43 20 17 6.0
1998 Jul 08 10
Philips Semiconductors Product specification
Programmable divide-by-n counter 74HC/HCT4059
DC CHARACTERISTICS FOR 74HCT
For the DC characteristics see
“74HC/HCT/HCU/HCMOS Logic Family Specifications”
.
Output capability: standard
ICC category: MSI
Note to HCT types
The value of additional quiescent supply current (∆ICC) for a unit load of 1 is given in the family specifications.
To determine ∆ICC per input, multiply this value by the unit load coefficient shown in the table below.
AC CHARACTERISTICS FOR 74HCT
GND = 0 V; tr=t
f= 6 ns; CL= 50 pF
Note
1. From master preset mode to any other mode.
INPUT UNIT LOAD COEFFICIENT
CP 0.65
LE 0.65
Jn0.50
Ka1.00
Kb1.50
Kc0.85
SYMBOL PARAMETER
Tamb (°C)
UNIT
TEST CONDITIONS
74HCT VCC
(V) WAVEFORMS
+25 −40 to +85 −40 to +125
min. typ. max. min. max. min. max.
tPHL/ tPLH propagation delay
CP to Q 24 46 58 69 ns 4.5 Fig.7
tPHL/ tPLH propagation delay
LE to Q 24 46 58 69 ns 4.5 Fig.8
tTHL/ tTLH output transition time 7 15 19 22 ns 4.5 Fig.7
tWclock pulse width
CP 20 7 25 30 ns 4.5 Fig.7
trem removal time
Kb, Kc to CP 15 7 9 22 ns 4.5 Fig.9; note 1
fmax maximum clock pulse
frequency 21 36 17 14 MHz 4.5 Fig.7
1998 Jul 08 11
Philips Semiconductors Product specification
Programmable divide-by-n counter 74HC/HCT4059
AC WAVEFORMS
Fig.7 Waveforms showing the clock (CP) to output (Q) propagation delays, the clock pulse width, the output
transition times and the maximum clock frequency.
(1) HC: VM= 50%; VI= GND to VCC.
HCT: VM= 1.3 V; VI= GND to 3 V.
Fig.8 Waveforms showing the LE input to Q output propagation delay.
(1) HC: VM= 50%; VI= GND to VCC.
HCT: VM= 1.3 V; VI= GND to 3 V.
Fig.9 Waveforms showing the Kb or Kc removal times, when the operating mode is switched from master preset
to any other mode.
(1) HC: VM= 50%; VI= GND to VCC.
HCT: VM= 1.3 V; VI= GND to 3 V.
1998 Jul 08 12
Philips Semiconductors Product specification
Programmable divide-by-n counter 74HC/HCT4059
APPLICATION INFORMATION
Fig.10 Example showing the application of the PC74HC/HCT4059 in a phase-locked-loop (PLL) for a FM band
synthesizer.
Calculating the minimum and maximum divide-by-n
values:
Output frequency range = 87.6 to 103.8 MHz
(CCIR band 2)
Channel spacing frequency (fc) = 300 kHz
Division factor prescaler (k) = 10
Reference frequency (fr) =
Maximum divide-by-n value =
Minimum divide-by-n value =
Fixed divide-by-n value =
Application of the “4059” as divide-by-n counter allows
programming of the channel spacing (shown in equations
as 300 kHz). A channel in the CCIR band 2 is selected by
the divide-by-n counter as follows:
channel = n −290
fc
k
---- 300
10
---------- 30 kHz==
103.8 MHz
300 kHz
----------------------------- 346=
87.6 MHz
300 kHz
------------------------- 292=
3MHz
30 kHz
------------------ 100=
Figure 11 shows a BCD switch compatible arrangement
suitable for divide-by-5 and divide-by-8 modes, which can
be adapted (with minimal changes) to the other
divide-by-modes. In order to be able to preset to any
number from 3 to 256 000, while preserving the BCD
switch compatible character of the JAM inputs, a rather
complex cascading scheme is necessary because the
“4059” can never be preset to count less than 3. Logic
circuitry is required to detect a condition where one of the
numbers to be preset in the “4059” is <3. In order to
simplify the detection logic, only that condition is detected
where the JAM inputs to terminals 6, 7 and 9 would be
LOW during one count. If such a condition is detected, and
if at least 1 is expected to be jammed into the MSB
counter, the detection logic removes one from the number
to be jammed into the MSB counter (with a place value of
2 000 times the divide-by-mode) and jams the same 2 000
into the “4059” by forcing pins 6, 7 and 9 HIGH.
The general circuit in Fig.11 can be simplified considerably
if the range of the cascaded counters do not start at a very
low value.
Figure 12 shows an arrangement in the divide-by-4 mode,
where the counting range extends in a BCD switch
compatible manner from 99 003 to 114 999.
1998 Jul 08 13
Philips Semiconductors Product specification
Programmable divide-by-n counter 74HC/HCT4059
The arrangement shown in Fig.12 is easy to follow; once
during every cycle the programmed digits are jammed in
(15 616 in this example) and then a round number of
11 000 is jammed in, nine times in succession, by forcing
the JAM inputs via AND/OR gates.
Numbers larger than the extended counter range can also
be produced by cascading the PC74HC/HCT4059 with
some other counting devices. Figure 13 shows such an
arrangement where only one fixed divide-by number is
desired. The dual flip-flop wired to produce a divide-by-3
count can be replaced by other counters such as the “190”,
“191”, “192”, “193”, “4017”, “4510” and “4516”.
In Fig.13 the divide-by-n sub-system is preset once to a
number which represents the least significant digits of the
divide-by number (15 690 in the example shown in Fig.13).
The sub-system is then preset twice to a round number
(8 000 in the example shown in Fig.13) and multiplied by
the number of the divide-by mode (2 in the example shown
in Fig.13).
To verify:
15 690 +2×8 000 ×2 = 47 690.
It is important that the second counting device has an
output that is HIGH or LOW during only one of its counting
states.
1998 Jul 08 14
Philips Semiconductors Product specification
Programmable divide-by-n counter 74HC/HCT4059
Fig.11 BCD switch compatible divide-by-n system suitable for divide-by-5 and divide-by-8 mode. Divides by any
number from 3 to 256 000.
Each AND gate is 1/4 of PC74HC/HCT08.
Each OR gate is 1/3 of PC74HC/HCT4075.
Each NOR gate is 1/2 of PC74HC/HCT4002.
Each inverter is 1/6 of PC74HC/HCT04.
1998 Jul 08 15
Philips Semiconductors Product specification
Programmable divide-by-n counter 74HC/HCT4059
Fig.12 Dividing-by any number from 99 003 to 114 999 (in this example n = 114 616).
Fig.13 Division by 47 690 in divide-by-2 mode.
Fig.14 External circuit for master preset at start-up.
(1)
(2) It is assumed that the fCP starts directly after the power-on. Any
additional delay in starting fCP must be added to the RC time.
RC 1
0.2 fCP Hz()×
--------------------------------------
≥
1998 Jul 08 16
Philips Semiconductors Product specification
Programmable divide-by-n counter 74HC/HCT4059
PACKAGE OUTLINES
UNIT A
max. 1 2 b1cD E e M
H
L
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
SOT222-1 95-03-11
A
min. A
max. bZ
max.
w
ME
e1
1.63
1.14 0.56
0.43 0.36
0.25 31.9
31.5 6.73
6.48 3.51
3.05 0.252.54 7.62 8.13
7.62 10.03
7.62 2.05
4.70 0.38 3.94
0.064
0.045 0.022
0.017 0.014
0.010 1.256
1.240 0.265
0.255 0.138
0.120 0.010.100 0.300 0.32
0.30 0.395
0.300 0.081
0.185 0.015 0.155
MS-001AF
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
24
1
13
12
b
E
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.01 inches maximum per side are not included.
pin 1 index
(1)
(1)(1)
DIP24: plastic dual in-line package; 24 leads (300 mil) SOT222-1
1998 Jul 08 17
Philips Semiconductors Product specification
Programmable divide-by-n counter 74HC/HCT4059
UNIT A
max. 1 2 b1cD E e M
H
L
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
SOT101-1 92-11-17
95-01-23
A
min. A
max. bw
ME
e1
1.7
1.3 0.53
0.38 0.32
0.23 32.0
31.4 14.1
13.7 3.9
3.4 0.252.54 15.24 15.80
15.24 17.15
15.90 2.25.1 0.51 4.0
0.066
0.051 0.021
0.015 0.013
0.009 1.26
1.24 0.56
0.54 0.15
0.13 0.010.10 0.60 0.62
0.60 0.68
0.63 0.0870.20 0.020 0.16
051G02 MO-015AD
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
24
1
13
12
b
E
pin 1 index
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
Z
max.
(1)
(1)(1)
DIP24: plastic dual in-line package; 24 leads (600 mil) SOT101-1
1998 Jul 08 18
Philips Semiconductors Product specification
Programmable divide-by-n counter 74HC/HCT4059
UNIT A
max. A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZ
ywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
2.65 0.30
0.10 2.45
2.25 0.49
0.36 0.32
0.23 15.6
15.2 7.6
7.4 1.27 10.65
10.00 1.1
1.0 0.9
0.4 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.1
0.4
SOT137-1
X
12
24
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
c
L
vMA
13
(A )
3
A
y
0.25
075E05 MS-013AD
pin 1 index
0.10 0.012
0.004 0.096
0.089 0.019
0.014 0.013
0.009 0.61
0.60 0.30
0.29 0.050
1.4
0.055
0.419
0.394 0.043
0.039 0.035
0.016
0.01
0.25
0.01 0.004
0.043
0.016
0.01
e
1
0 5 10 mm
scale
SO24: plastic small outline package; 24 leads; body width 7.5 mm SOT137-1
95-01-24
97-05-22
1998 Jul 08 19
Philips Semiconductors Product specification
Programmable divide-by-n counter 74HC/HCT4059
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“Data Handbook IC26; Integrated Circuit Packages”
(order code 9398 652 90011).
DIP
SOLDERING BY DIPPING OR BY WAVE
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
REPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
SO
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
WAVE SOLDERING
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
•A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
•The longitudinal axis of the package footprint must be
parallel to the solder flow.
•The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
REPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
1998 Jul 08 20
Philips Semiconductors Product specification
Programmable divide-by-n counter 74HC/HCT4059
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
