LM5073MH/NOPB - NATIONAL SEMICONDUCTOR

+FAUX

-PoE

-FAUX

VOUT

VIN

UVLO

VEE

nSD

nPGOOD

RTN

UVLORTN

DCCL

RCLASS

FAUX

RAUX

VIN

GND

0.1 PF

LM5073

DC-DC

CONVERTER

+PoE

LM5073

www.ti.com

SNVS490C –MARCH 2007–REVISED APRIL 2013

LM5073 100V Power Over Ethernet PD Interface with Aux Support

Check for Samples: LM5073

1FEATURES DESCRIPTION

The LM5073 Powered Device (PD) interface provides

2PD Interface a high performance solution that is fully compliant to

• Fully Compliant IEEE 802.3af PD Interface IEEE 802.3af for a PD connecting into Power over

• Versatile Auxiliary Power Options Ethernet (PoE) networks. The LM5073 provides the

flexibility for the PD to also accept power from

• 13V Minimum Front Auxiliary Power Range unregulated auxiliary sources such as AC adapters

• 9V Minimum Rear Auxiliary Power Range and solar cells in a variety of configurations. The low

• Programmable DC Current Limit up to 800 mA RDS(ON) PD interface hot swap MOSFET and

programmable DC current limit extend the range of

• 100V, 0.7ΩHot Swap MOSFET LM5073 applications up to twice the power level of

• Integrated PD Signature Resistor IEEE 802.3af compliant devices. The 100V maximum

• Integrated PoE Input UVLO voltage rating simplifies selection of the transient

voltage suppressor that protects the PD from network

• Inrush Current Limit transients. Control outputs for a separate DC-DC

• PD Classification Capability converter are provided to allow freedom to select the

• Thermal Shutdown Protection best DC-DC converter topology for the particular

• Line Over Voltage Protection application.

• Complementary Open Drain Outputs for Packages

Controlling a DC-DC Converter • HTSSOP-14 EP (Exposed Pad)

• Power Good Indicator

APPLICATIONS

• IEEE 802.3af Compliant PoE Powered Devices

• Non-Compliant, Application Specific Devices

• Higher Power Ethernet Powered Devices

Simplified Application Diagram

1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

UVLO

VIN

RCLASS

FAUX

DCCL

VEE

RAUX

nSD

nPGOOD

RTN

UVLORTN

LM5073

SNVS490C –MARCH 2007–REVISED APRIL 2013

www.ti.com

Connection Diagram

14 Lead HTSSOP-EP

PIN DESCRIPTIONS

Pin Number Name Description

1 UVLORTN Return for the external UVLO programming resistor divider.

2 UVLO Line under-voltage lockout programming pin.

3 VIN Positive supply pin for the PD interface and the DC-DC converter interface.

4 RCLASS PD Classification programming pin.

5 FAUX Front auxiliary power enable pin.

6 DCCL PD interface DC current limit programming pin.

Negative supply pin for the PD interface; connected to PoE and/or front auxiliary

7 VEE power return path.

8 NC No internal connection.

DC-DC converter power return; connected to the drain of the internal PD interface

9 RTN hot swap MOSFET.

10 NC No internal connection.

PD interface power good delay and indicator. nPGOOD is low when the hot swap

11 nPGOOD MOSFET drain to source voltage is less than 1.5V.

Open drain, active low shut down signal to the DC-DC converter. The nSD pin

12 nSD switches to the high impedance state when nPGOOD is less than 2.5V.

Open drain, active high shut down signal to the DC-DC converter. The SD pin

13 SD switches to the low state when nPGOOD is less than 2.5V.

14 RAUX Rear auxiliary power enable pin, and dominant/non-dominant selection.

Exposed metal pad on the underside of the device. It is recommended to connect

EP this pad to a PC Board plane connected to the VEE pin to improve heat dissipation.

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Product Folder Links: LM5073

LM5073

www.ti.com

SNVS490C –MARCH 2007–REVISED APRIL 2013

Absolute Maximum Ratings(1)(2)

VIN, FAUX, UVLO, RTN to VEE(3) -0.3V to 100V

UVLORTN to VEE -0.3V to 16V

DCCL, RCLASS to VEE -0.3V to 7V

nPGOOD, nSD, SD to RTN -0.3V to 16V

RAUX to RTN -0.3V to 100V

ESD Rating Human Body Model(4) 2000V

Wave (4 seconds) 260°C

Lead Soldering Temp.(5) Infrared (10 seconds) 240°C

Vapor Phase (75 seconds) 219°C

Storage Temperature -55°C to 150°C

Junction Temperature 150°C

(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which

operation of the device is intended to be functional. For ensured specifications and test conditions, see the Electrical Characteristics.

(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3) During rear auxiliary operation, the RTN pin can be approximately -0.4V with respect to VEE. This is caused by normal internal bias

currents, and will not harm the device. Application of external voltage or current must not cause the absolute maximum rating to be

exceeded.

(4) The human body model is a 100 pF capacitor discharged through a 1.5 kΩresistor into each pin.

(5) For detailed information on soldering the plastic HTSSOP package, refer to the Packaging Databook.

Operating Ratings

VIN voltage 9V to 70V

Operating Junction Temperature -40°C to 125°C

Electrical Characteristics(1)

Limits in standard type are for TJ= 25°C only; limits in boldface type apply over the junction temperature (TJ) range of -40°C

to +125°C. Minimum and Maximum limits are ensured through test, design, or statistical correlation. Typical values represent

the most likely parametric norm at TJ= 25°C, and are provided for reference purposes only. VIN = 48V unless otherwise

indicated(2).

Symbol Parameter Conditions Min Typ Max Units

Supply Current

VIN Supply Current Normal Operation 2 3mA

Detection and Classification

VIN Signature Startup Voltage 1.5 V

Signature Resistance 23.25 24.5 26 kΩ

Signature Resistor Disengage / Classification Engage VIN Rising 11.0 12 12.8 V

Hysteresis 1.9 V

Classification Current Turn Off VIN Rising 22 23.5 25 V

RCLASS Voltage 1.213 1.25 1.287 V

Supply Current During Classification VIN = 17V 0.7 1.1 mA

Line Under Voltage Lock-Out

Default UVLO Release VIN Rising 36 38.5 40 V

Default UVLO Lock out VIN Falling 29.5 31 32.5 V

Default UVLO Hysteresis 6V

(1) Minimum and Maximum limits are ensured through test, design, or statistical correlation using Statistical Quality Control (SQC) methods.

Typical values represent the most likely parametric norm at TJ= 25°C, and are provided for reference purpose only. Limits are used to

calculate Average Outgoing Quality Level (AOQL).

(2) For detailed information on soldering the plastic HTSSOP package, refer to the Packaging Databook.

Product Folder Links: LM5073

LM5073

SNVS490C –MARCH 2007–REVISED APRIL 2013

www.ti.com

Electrical Characteristics(1) (continued)

Limits in standard type are for TJ= 25°C only; limits in boldface type apply over the junction temperature (TJ) range of -40°C

to +125°C. Minimum and Maximum limits are ensured through test, design, or statistical correlation. Typical values represent

the most likely parametric norm at TJ= 25°C, and are provided for reference purposes only. VIN = 48V unless otherwise

indicated(2).

Symbol Parameter Conditions Min Typ Max Units

Programmed UVLO Reference Voltage VIN > 12.5V 1.2 1.24 1.28 V

Programmed UVLO Hysteresis Current VIN > UVLO 16 20 24 µA

UVLORTN Pull Down Resistance VIN > 12.5V 55 150 Ω

UVLO Filter 300 µs

Power Good

VDS Required for Power Good Status 1.3 1.5 1.7 V

VDS Hysteresis of Power Good Status 0.8 11.2 V

VGS Required for Power Good Status 4.5 5.5 6.5 V

Default Delay Time of Loss-of Power Good Status 30 µs

nPGOOD Current Source 40 55 70 µA

nPGOOD Open circuit Voltage 3.5 45.5 V

nPGOOD Pull Down Resistance 180 300 Ω

nPGOOD Threshold 22.5 3V

Shutdown Outputs

nSD/SD Pull Down Resistance 180 300 Ω

Leakage nSD/SD = 16V 1µA

Hot Swap

RDS(ON) Hot Swap MOSFET Resistance 0.7 1.5 Ω

Hot Swap MOSFET Leakage 100 µA

Inrush Current Limit VDS = 4.0V 120 150 180 mA

Default DC Current Limit VDS = 4.0V 380 440 510 mA

High DC Current Limit VDS = 4.0V 690 800 930 mA

Current Limit Programming Accuracy VDS = 4.0V -12 12 %

Hot Swap Over-Voltage Protection

VIN OVP Threshold 60 65 70 V

VIN OVP Threshold, Hysteresis 3 V

Auxiliary Power Option

FAUX Threshold 8.1 8.7 9.5 V

FAUX Hysteresis 0.5 V

FAUX Pull Down Current 50 µA

RAUX Lower Threshold (I = 22 µA) RAUX Pin Rising 2.3 2.7 3.4 V

RAUX Lower Threshold Hysteresis 0.8 V

RAUX Upper Threshold (I = 250 µA) RAUX Pin Rising 5.4 6.2 7.4 V

RAUX Lower Threshold Current 14 22 30 µA

RAUX Upper Threshold Current 170 250 330 µA

PDI Thermal Shutdown(3)

Thermal Shutdown Temperature 165 °C

Thermal Shutdown Hysteresis 20 °C

Thermal Resistance

θJA Junction to Ambient PWP Package 40 °C/W

(3) Device thermal limitations may limit usable range.

Product Folder Links: LM5073

-40 -20 0 20 40 60 80 100 120

TEMPERATURE (°C)

DEFAULT CURRENT LIMIT (mA)

428

430

432

434

436

438

440

15 25 35 45 55 65 75 85 95 105 115

INPUT VOLTAGE (V)

0.0

1.4

INPUT CURRENT (mA)

0.2

0.4

0.6

0.8

1.0

1.2

-40 -20 0 20 40 60 80 100 120

TEMPERATURE (°C)

INRUSH CURRENT LIMIT (mA)

140

141

142

143

144

145

146

147

-40 -20 0 20 40 60 80 100 120

TEMPERATURE (°C)

580

620

PROGRAMMED DC CURRENT LIMIT (mA)

585

590

595

600

605

610

615

15 25 35 45 55 65 75 85 95 105 115

DCCL RESISTOR (k:)

100

200

300

400

500

600

700

800

900

PROGRAMMED DC CURRENT LIMIT (mA)

-40 -20 0 20 40 60 80 100 120

TEMPERATURE (°C)

30.5

31.5

DEFAULT UVLO THRESHOLD (V)

LM5073

www.ti.com

SNVS490C –MARCH 2007–REVISED APRIL 2013

Typical Performance Characteristics

Default UVLO Threshold vs Temperature DC Current Limit vs. DCCL Resistor

Figure 1. Figure 2.

Inrush Current Limit vs Temperature Programmed DC Current Limit vs Temperature

Figure 3. Figure 4.

Default DC Current Limit vs Temperature Input Current vs Input Voltage

Figure 5. Figure 6.

Product Folder Links: LM5073

VIN

7VEE

4RCLASS

9 RTN

12 nSD

1.25V

12V

24.5 k:

enable

FAUX

6DCCL

1.25V

front_aux

thermal_limit

UVLO

1.5V

2.5V

13 SD

2.5V

11 nPGOOD

14 RAUX

Auxiliary

Controller

classification

pgood

disable

signature

Hot Swap

MOSFET

Bias

Reference

UVLORTN

enable

UVLO

50 PA

1.25V +

-OVP

Gate

Controller

LM5073

SNVS490C –MARCH 2007–REVISED APRIL 2013

www.ti.com

Block Diagram

Figure 7. LM5073 Top Level Block Diagram

Product Folder Links: LM5073

LM5073

www.ti.com

SNVS490C –MARCH 2007–REVISED APRIL 2013

Description of Operation and Applications Information

The LM5073 integrates a fully IEEE 802.3af compliant PD interface with versatile auxiliary power support. When

combined with a separate DC-DC converter, it provides a complete power solution for Powered Devices (PD)

that connect to PoE systems.

The LM5073 provides the following features:

1. The input voltage rating up to 100V allows greater flexibility when selecting a transient surge suppressor to

protect the PD from voltage transients encountered in PoE applications.

2. The integration of the PD signature resistor, inrush current limit, programmable input voltage under-voltage

lock-out (UVLO), PD classification, and thermal shutdown simplifies PD implementation.

3. The PD interface accepts power from auxiliary sources including AC adapters and solar cells in various

configurations over a wide range of input voltages. Auxiliary power input can be programmed to be either

non-dominant or dominant over PoE power.

4. Programmable DC current limit to support PD applications requiring input currents up to 800 mA.

5. Complementary open drain outputs for controlling a DC-DC converter.

6. A power good flag pin allows an accurate power good delay to be programmed and provides the option of

driving a power good indicator LED.

7. Input line over voltage protection for downstream circuits, including the DC-DC converter.

DC-DC Converter Selection

A PD designed with LM5073 can be optimized for a variety of applications by selecting the DC-DC converter

from a wide range of topologies. Topology selection enables several design trade-offs including efficiency,

complexity, and cost.

For example, the LM5025 controller for the Active Clamp Forward topology can be paired with the LM5073 for

increased efficiency, especially at higher power levels. In cases where isolation is not required an LM5576

regulator with a built in buck switch provides a simple, low cost solution.

The 100V capability of the LM5073 protects against input voltage transients, especially in the case of a hot

swapping front auxiliary power. The LM5073 has built-in over-voltage protection such that a DC-DC converter

with input voltage rating as low as 65V can be safely used.

The DC-DC converter must have a soft start feature to control the input current during startup. The soft-start

process reduces the surge of inrush current and eliminates any tendency of the output voltage to overshoot

during startup. The converter should be started slowly enough such that the input current does not exceed the

PD interface hot swap MOSFET DC current limit or the current limit of the PSE, otherwise the PD will not start

correctly.

Modes of Operation

Per the IEEE 802.3af specification, when a PD is connected to a PoE system it transitions through several

operating modes in sequence including detection, classification (optional), turn-on inrush, and normal DC

operation. Each operating mode corresponds to a specific voltage range supplied from the PSE. Figure 8 shows

the IEEE 802.3af specified sequence of operating modes and the corresponding PD input voltages at the RJ-45

connector.

Current steering diode bridges are required for the PD interface to accept all allowable connections and polarities

of PoE voltage from the RJ-45 connector (see the example application circuit in Figure 17). The bridge voltage

drop will reduce the input voltage sensed by the LM5073. To ensure full compliance to the specification in all

operating modes, the LM5073 takes into account the voltage drop across the bridge diodes and responds

appropriately to the voltage received from the PoE cable. Table 1 presents the response in each operating mode

to voltages at the PD input connector and between the VIN and VEE pins.

Product Folder Links: LM5073

Signature

Resistor

VIN

VEE

LM5073

PoE Line

Input

PoE Line

Return

12V

Time

Full Power ApplicationClassificationDiscovery Power Removal

42V

36V

20.5V

14.5V

10V

2.7V

Voltage

LM5073

SNVS490C –MARCH 2007–REVISED APRIL 2013

www.ti.com

Figure 8. Sequence of PoE Operating Modes

Table 1. Operating Modes With Respect To Input Voltage

Voltage at PD Input Connector per LM5073 Input Voltage

Mode of Operation IEEE 802.3af (VIN pin to VEE pin)

Detection (Signature) 2.7V to 10.1V 1.5V to 10.0V

Classification 14.5V to 20.5V 12V to 23.5V

Startup Threshold 42V max 38V (UVLO Release, VIN Rising)

Normal Operation 36V to 57V 65V to 32V (UVLO, VIN Falling)

Detection Signature

In the detection mode, a PD must present a signature resistance between 23.75 kΩand 26.25 kΩto the PoE

power sourcing equipment. This signature impedance distinguishes the PD from non-PoE equipment to protect

the latter from being accidentally damaged by inadvertent application of PoE voltage levels. To simplify the circuit

implementation, the LM5073 integrates the signature resistor, as shown in Figure 9.

During the detection mode, the voltage across the VIN and VEE pins is less than 10V. Once detection mode is

complete, the LM5073 will disengage the signature resistor to reduce power loss in all other modes.

Figure 9. Detection Circuit With Integrated PD Signature Resistor

Product Folder Links: LM5073

VIN

RCLASS

Threshold

VEE

LM5073

to UVLO

RCLASS

PoE Line

Input

VIN=25V

1.25V

front_aux

rear_aux

thermal_limit

1.25V

PoE Line

Return

LM5073

www.ti.com

SNVS490C –MARCH 2007–REVISED APRIL 2013

Classification

Classification is an optional feature of the IEEE 802.3af specification. It is primarily used to identify the power

requirements of a particular PD. This feature will allow the PSE to allocate the appropriate available power to

each device on the network. Classification is performed by measuring the current flowing into the PD during this

mode. IEEE 802.3af specifies five power classes, each corresponding to a unique range of classification current,

as presented in Table 2. As shown in Figure 10, the LM5073 simplifies the classification implementation by

requiring a single external resistor connected between the RCLASS and VEE pins to program the classification

current. The resistor value required for each class is also given in Table 2.

During the classification mode, the voltage between the VIN and VEE pins is between 12V and 23.5V. In this

voltage range, the class resistor RCLASS is engaged by enabling the 1.25V buffer amplifier and MOSFET. After

classification is complete, the voltage from the PSE will increase to the normal operating voltage of the PoE

system (48V nominal). When VIN rises above 23.5V, the LM5073 will disengage the RCLASS resistor to reduce

on-chip power dissipation.

The classification feature is disabled when either the front or rear auxiliary power options are selected, as the

classification function is not required when power is supplied from an auxiliary source. The classification function

is also disabled when the LM5073 reaches the thermal shutdown temperature threshold (nominally 165°C). This

may occur if the LM5073 is operated at elevated ambient temperatures and the classification time exceeds the

IEEE 802.3af limit of 75 ms.

When the classification option is not required, simply leave the RCLASS pin open to set the PD to the default

Class 0 state. Class 0 requires that the PSE allocate the maximum IEEE 802.3af specified power of 15.4W

(12.95W at the PD input terminals) to the PD.

Table 2. Classification Levels and Required External Resistor Value

PD Max Power Level ICLASS Range LM5073

Class RCLASS Value

From To From To

0 (Default) 0.44W 12.95W 0 mA 4 mA Open

1 0.44W 3.84W 9 mA 12 mA 130Ω

2 3.84W 6.49W 17 mA 20 mA 71.5Ω

3 6.49W 12.95W 26 mA 30 mA 46.4Ω

4 Reserved Reserved 36 mA 44 mA 31.6Ω

Figure 10. PD Classification – Fulfilled With a Single External Resistor

Product Folder Links: LM5073

R2 =1.25V x R1

VUVLO

LM5073

SNVS490C –MARCH 2007–REVISED APRIL 2013

www.ti.com

Undervoltage Lockout (UVLO)

The LM5073 contains both programmable and default input Under Voltage Lock Out (UVLO) circuits. Figure 11

illustrates the block diagram of the LM5073 UVLO circuit. When the UVLO pin is connected to the VIN pin the

internal default thresholds and hysteresis are selected, requiring no external components to comply with the

IEEE 802.3af UVLO specifications. To program the UVLO threshold and hysteresis to custom values, use two

external resistors R1 and R2. Connecting an external resistor divider to the UVLO pin automatically overrides the

default UVLO settings.

The LM5073’s UVLO circuit continuously monitors the PoE input voltage between the VIN and VEE pins. When

the VIN voltage rises above the upper threshold, either default or programmed, the UVLO circuit will enable the

hot swap MOSFET and initiate the startup inrush sequence. During normal operating mode, when the VIN

voltage falls below the default or the programmed lower threshold, the LM5073 disables the PD by disabling the

hot swap MOSFET. A built-in 300 µs timer delays the disable signal, to prevent disabling the hot swap MOSFET

during intermittent transients.

The UVLO thresholds are determined by the following considerations. The PD can draw a maximum current of

400 mA during IEEE 802.3af PoE operation. This current will cause a voltage drop of up to 8V over a 100m long

Ethernet cable. The PD front-end current steering diode bridges may introduce an additional 2V drop. To ensure

successful startup at the minimum PoE voltage of 42V and to continue operation at the minimum requirement of

36V, as specified by IEEE 802.3af, these voltage drops must be taken into account. Accordingly, the LM5073

UVLO default thresholds are set to 38V, on the rising edge of VIN, and 31V on the falling edge of VIN. The 7V

nominal hysteresis of the default UVLO function, along with the inrush current limit (discussed in the next

section), prevents false starts and chattering during startup.

In addition to the default settings, the UVLO threshold and hyteresis can be programmed independently to

custom values. After selecting R1 to program the UVLO hysteresis, the ratio between R1 and R2 determines the

UVLO threshold. The resistors should be selected to satisfy the following relationships:

R1 = VHYS / 20 µA (1)

where

• VUVLO is the upper (positive going) trip point

• VHYS is the difference betweeen the upper and lower trip points (2)

The UVLO thresholds should not be programmed below the classification threshold or above the OVP threshold.

The UVLO signal will be overridden by the front auxiliary power option (see details in the FAUX section).

The UVLO function can also be used to implement a remote enable / disable function. Pulling the UVLO pin

down below the UVLO threshold disables the interface and the control outputs for the DC-DC converter.

Product Folder Links: LM5073

VIN

VEE

thermal_limit

UVLO

Default UVLO Threshold

VIN = 38V

Hysteresis = 7V

Hot Swap

MOSFET

UVLORTN enable

UVLO

1.25V +

OVP front_aux

classification

signature

To DC-DC

Converter

Return

LM5073

PoE Line

Return

PoE Line

Input

20 PA

9V int/ext UVLO

Gate

Controller

LM5073

www.ti.com

SNVS490C –MARCH 2007–REVISED APRIL 2013

Figure 11. Programmable and Default Input UVLO Functions

Over-Voltage Protection

To protect the downstream DC-DC converter from excessive voltage, the hot swap MOSFET is disabled when

the 65V (nominal) over-voltage protection (OVP) threshold is exceeded. This allows the 100V rated LM5073 to

work safely with a lower voltage rated DC-DC converter. The SD and nSD signals which enable the DC-DC

converter are delayed by the power good filter as shown in Figure 13. The DC-DC converter will continue to

operate through a short duration UVLO condition provided the power good filter does not expire and sufficient

voltage remains at the input to the DC-DC converter. When the input voltage returns to normal, the hot swap

MOSFET is re-enabled. Once the voltage between RTN and VEE is below 1.5V, power good will be re-asserted.

Inrush Current Limit

Inrush current limit is required to control the charging of the DC-DC converter input capacitors when power is first

applied. This reduces stress on components and prevents startup oscillations that would occur if unlimited

current were drawn from the PoE network.

According to IEEE 802.3af, the input capacitance of the PD power supply must be at least 5 µF (between the

VIN and RTN pins). Considering the capacitor tolerance and the effects of voltage and temperature, a nominal

capacitor value of at least 10 µF is recommended. The input capacitors remain discharged during detection and

classification modes of the PD interface. The hot swap MOSFET is turned on when the voltage between the VIN

and VEE pins rises above the UVLO release threshold. When enabled, the hot swap MOSFET delivers a

regulated inrush current of 150 mA to charge the input capacitors of the DC-DC converter.

The inrush current causes a voltage drop along the PoE Ethernet cable (20Ωmaximum) that reduces the input

voltage sensed by the LM5073. To avoid erratic turn-on (hiccups), the UVLO hysteresis must be greater than the

input voltage drop due to cable resistance. If the 7V default hysteresis is insufficient, it should be programmed to

a higher value.

Product Folder Links: LM5073

VEE

DCCL

to dc current limit

LM5073

RDCCL

1.25V

100 mA

IDC (mA) x 127 k:

RDCCL (k:) =

LM5073

SNVS490C –MARCH 2007–REVISED APRIL 2013

www.ti.com

DC Current Limit Programming

The LM5073 provides a default DC current limit of 440 mA nominal. This default limit is selected by leaving the

DCCL pin open.

The LM5073 allows the DC current limit to be programmed within the range of 150 mA to 800 mA. Figure 12

shows the method to program the DC current limit with an external resistor, RDCCL. The relationship between the

RDCCL value and the DC current limit, IDC, satisfies the following equation:

(3)

The maximum recommended DC current limit is 800 mA. While thermal analysis should be a standard part of

any power supply design, it may warrant additional attention if the DC current limit is programmed to values in

excess of 440 mA. The analysis should include evaluations of the dissipation capability of LM5073 package, heat

sinking properties of the PC board, ambient temperature, and other heat dissipation factors of the operating

environment.

Figure 12. Input DC Current Limit Programming via RDCCL

Power Good Operation

The nPGOOD pin serves as a power good flag. It can be used with a delay timing capacitor to delay the

assertion of the shutdown pins. It can also be used to drive an optional ‘powered from PoE’ indicator. The

voltage on the nPGOOD pin controls the shutdown pins used to enable the DC-DC converter. An internal 50 µA

pull-up current source will pull the nPGOOD pin up to about 4V. External loads (such as an LED) may pull the

output up to a maximum of 16V.

The power good status indicates that the input capacitors of the DC-DC converter are fully charged through the

hot swap MOSFET and the circuit is ready for the DC-DC converter to start up. The power good status is issued

by pulling down the nPGOOD pin to a logic low level relative to the RTN pin.

Once the power good status is established, the nPGOOD pin voltage will be pulled down quickly, and the two

DC-DC converter control outputs, SD and nSD, will change states. When the nPGOOD pin is low, the SD pin is

active low and the nSD pin is high impedance.

The nPGOOD pin can be configured to perform multiple functions. As shown in Figure 13, it can be used to

implement a “Powered from PoE” indicator using an LED with a series current limiting resistor connected to a

positive supply less than 16V. This is useful when the auxiliary power source is directly connected to the input of

the DC-DC converter stage, a situation known as rear auxiliary power (see Auxiliary Power Options below). In

such a configuration, the nPGOOD pin will illuminate the LED when the PD is operating from PoE power but not

when it is powered from the auxiliary source. The “Powered from PoE” indicator is not applicable in systems

implementing the front auxiliary power configuration (see Auxiliary Power Options below) because both PoE and

auxiliary supply current pass through the hot swap MOSFET. In this configuration, the nPGOOD pin is active

when either PoE power or auxiliary power is applied.

Product Folder Links: LM5073

12 nSD

9RTN

13 SD

2.5V

11 nPGOOD

pgood

50 PA

LM5073

External Bias

RLED

CPGOOD

LED to indicate

"Powered from PoE"

rear aux

LM5073

www.ti.com

SNVS490C –MARCH 2007–REVISED APRIL 2013

Figure 13. "Powered-from-PoE" Indictor, Power Good Delay Timer and Shut Down Control Outputs

The nPGOOD pin can also be used to implement a delay timer by adding a capacitor from the nPGOOD pin to

the RTN pin. This delay timer will prevent the interruption of the DC-DC converter’s operation in the event of an

intermittent loss of power good status. This can be caused by PoE line voltage transients that may occur when

switching between normal PoE power and a backup supply (e.g. a battery or UPS). Such a condition will create a

new “hot swap” event if the backup supply voltage is greater than the PoE supply. Since the hot swap MOSFET

will likely limit current during such a sudden input voltage change, the nPGOOD pin will momentarily switch to

the high state. A capacitor on this pin will delay the transition of the nPGOOD pin to provide continuous operation

of the DC-DC converter during such transients. The power good filter delay time and capacitor value can be

selected with the following equation:

CPGOOD (nF) = 20 x tPG_DELAY (ms) (4)

For example, selecting 100 nF for CPGOOD, the delay time will be 5 ms. The delay required for continuous

operation will depend on the amplitude of the transient, the DC current limit, the load, and the total amount of

input capacitance. The nPGOOD delay timer will not ensure continuous operation if the hot swap MOSFET is in

current limit for an extended period, causing a thermal limit condition. This will result in a complete shutdown of

the DC-DC converter, though no elements in the system will be permanently damaged and normal operation will

resume momentarily.

The power good status also affects the default DC current limit. Should the sensed drain to source voltage of the

hot swap MOSFET (from RTN to VEE) exceed 2.5V, the LM5073 will increase the DC current limit from the

default 440 mA to 800 mA (High DCCL). This higher current limit will speed recovery from an input voltage

downward step, allowing continued operation of the PD. This higher current limit will remain in effect until one of

the following events occurs: (i) the power good status is lost for longer than tPG_Delay, at which time the DC-DC

converter will be disabled, (ii) the increased power dissipation in the hot swap MOSFET causes a thermal limit

condition as previously discussed, or (iii) the hot swap MOSFET drain to source voltage falls below 1.5V to re-

establish power good status. Note that if the DC current limit has been programmed externally with RDCCL (see

the DC Current Limit section), then the DC current limit will remain at the programmed level even when the

power good status is lost.

Product Folder Links: LM5073

VIN

UVLO

VEE

nSD

nPGOOD

RTN

UVLORTN

DCCL

RCLASS

FAUX

RAUX

+VDC-DC

SDDC-DC

LM5073

+PoE

-PoE

+FAUX

-FAUX

0.1 PF

LM5073

SNVS490C –MARCH 2007–REVISED APRIL 2013

www.ti.com

Enabling the External DC-DC Converter

The LM5073 has complementary active high (SD) and active low (nSD) shut down outputs that can be used with

any DC-DC converter that has an enable input. When nPGOOD pin is low (< 2.5V), the SD pin will be in the low

state and the nSD pin will be high impedance. In cases where the pull up internal to the DC-DC converter is

weak, an additional pull-up may be desirable for better noise immunity. Alternatively, the nSD output may be

connected to the UVLO or Soft Start pins of the DC-DC converter when a dedicated enable input is not available.

The open drain output will not interfere with normal operation of the DC-DC converter’s UVLO or Soft-Start.

The external pull-ups for the SD or nSD pins must limit the voltage at each pin to no more than 16V relative to

RTN, and limit the sink current to 1 mA or less.

Auxiliary Power Options

The LM5073 allows the PD to receive power from auxiliary sources like AC adapters and solar cells in addition to

the PoE enabled network. This is a desirable feature when the total system power requirements exceed the

PSE’s load capacity. Furthermore, with the auxiliary power option, the PD can be used in a standard Ethernet

(non-PoE) system.

For maximum versatility, the LM5073 accepts two different auxiliary power configurations. The first one, shown in

Figure 14, is the front auxiliary (FAUX) configuration in which the auxiliary source is “diode OR’d” with the voltage

available from the Ethernet connector. The second configuration, shown in Figure 15, is the rear auxiliary

(RAUX) option in which the auxiliary power bypasses the PoE interface altogether and is connected directly to

the input of the DC-DC converter through a diode. The FAUX option is desirable if the auxiliary power voltage is

similar to the PoE input voltage. However, when the auxiliary supply voltage is much lower than the PoE input

voltage, the RAUX option is more favorable because the current from the auxiliary supply is not limited by the hot

swap MOSFET DC current limit. A comparison of the FAUX and RAUX options is presented in Table 3. Note the

FAUX and RAUX pins are not reverse voltage protected. If the polarity of the auxiliary supply is not ensured, then

a series blocking diode should be added for reverse polarity protection.

Figure 14. The FAUX Configuration

Product Folder Links: LM5073

VIN

UVLO

VEE

nSD

nPGOOD

RTN

UVLORTN

DCCL

RCLASS

FAUX

RAUX

+VDC-DC

SDDC-DC

LM5073

+PoE

-PoE

+ RAUX

- RAUX

Select R value for

dominant or non-

dominant

47 nF

LM5073

www.ti.com

SNVS490C –MARCH 2007–REVISED APRIL 2013

Figure 15. The RAUX Configuration

Table 3. Comparison Between FAUX and RAUX Operation

Tradeoff FAUX Operation RAUX Operation

Hot Swap Protection / Current Limit Automatically provided by the hot swap Requires a series resistor to limit the inrush current

Protection MOSFET. during hot swap.

Limited to 13V by the signature detection

Minimum Auxiliary Voltage mode, or by the power requirement Only limited by 9V minimum input requirement.

(at the IC pins) (current limit).

Cannot be forced without external Can be forced with appropriate RAUX pin

Auxiliary Dominance Over PoE components. configuration.

Not applicable as power is delivered

Use of nPGOOD Pin as “Powered from through the hot swap interface in both Supported.

PoE” Indicator PoE and FAUX modes.

Excellent due to active MOSFET current

Transient Protection Fair due to passive resistor current limit.

limit and other voltage protection.

The term “Auxiliary Dominance” mentioned in Table 3 means that when the auxiliary power source is connected,

it will always power the PD regardless of the state of PoE power. “Aux dominance” is achievable only with the

RAUX option.

If the PD is not designed for aux dominance, either the FAUX or RAUX power sources will deliver power to the

PD only under the following two conditions: (i) If auxiliary power is applied before PoE power, it will prevent the

PSE from detecting the PD and will supply power indefinitely. This occurs because the PoE input bridge rectifiers

will be reverse biased, and no detection signature will be observed. Under this condition, when the auxiliary

supply is removed, power continuity will not be maintained because it will take some time for the PSE to perform

signature detection and classification before it will supply power. (ii) If auxiliary power is applied after PoE power

is already present and the auxiliary supply voltage is greater than the voltage received from the PSE, then the

auxiliary supply will power the PD. Under the second case, if the PSE and auxiliary supply voltages are

essentially equal, the load will be shared inversely proportional to the respective output impedances of each

supply. (Note: The output impedance of the PSE supply is increased by the cable series resistance).

If PoE power is applied first and has a higher voltage than the non-dominant aux power source, it will continue

powering the PD even when the aux power source becomes available. In this case, should PoE power be

removed, the auxiliary source will assume power delivery and supply the DC-DC converter loads without

interruption.

Product Folder Links: LM5073

VAUX - VRAUX

100 PA18V ± 4V

100 PA= 140 k:

LM5073

SNVS490C –MARCH 2007–REVISED APRIL 2013

www.ti.com

FAUX Option

With the FAUX option, the LM5073 hot swap MOSFET provides inrush and DC current limit protection for the

auxiliary power source. To select the FAUX configuration for an auxiliary voltage lower than nominal PoE

voltages, the FAUX pin must be forced above its high threshold to override the UVLO function.

Pulling up the FAUX pin will increase the default DC current limit to 800 mA. This increase in DC current limit is

desirable because higher current is required to support the PD output power at the lower input potentials often

delivered by auxiliary sources. In cases where the auxiliary supply voltage is comparable to the PoE voltage,

there is no need to pull-up the FAUX pin to override UVLO, and the default DC current limit remains at 440 mA.

However, if the DC current limit is externally programmed with RDCCL, the condition of the FAUX pin will not affect

the programmed DC current limit. In other words, the programmed DC current limit can be considered a “hard

limit” that will not vary in any configuration.

RAUX Option

The RAUX option is desirable when the auxiliary supply voltage is significantly lower than the PoE voltage or

when aux dominance is desired. The inrush and DC current limits of the LM5073 do not protect or limit the RAUX

power source, and an additional resistor in the RAUX input path will be needed to provide transient protection.

To select the RAUX option without aux dominance, simply pull up the RAUX pin to the auxiliary power supply

voltage through a high value resistor. Depending on the auxiliary supply voltage, the resistor value should be

selected such that the current flowing into the RAUX pin is approximately 100 µA when the pin is mid-way

between the lower and upper RAUX thresholds (approximately 4V). For example, with an 18V non-dominant rear

auxiliary supply, the pull up resistor should be:

(5)

If the PSE load capacity is limited and insufficient, aux dominance will be a desired feature to off-load PoE power

for other PDs that do not have auxiliary power available. Aux dominance is achieved by pulling the RAUX pin up

to the auxiliary supply voltage through a lower value (~5 kΩ) resistor that delivers at least 330 µA into the RAUX

pin. When this higher RAUX current level is detected, the LM5073 shuts down the PD interface. In aux dominant

mode, the auxiliary power source will supply the PD as soon as it is applied. PD operation will not be interrupted

when the aux power source is connected. The PoE source may or may not actually be removed by the PSE,

although the DC current from the network cable is effectively reduced to zero (<150 µA). IEEE 802.3af requires

the AC input impedance to be greater than 2 MΩto ensure PoE power removal. This condition is not satisfied

when the auxiliary power source is applied. The PSE may remove power from a port based on the reduction in

DC current. This is commonly known as DC Maintain Power Signature (DC MPS), a common feature in many

PSE systems.

When using the RAUX configuration, the hot swap MOSFET may become disabled which will cause a high

impedance at the VEE pin. To provide a high frequency, low impedance path for the IC’s substrate current from

VEE to RTN, the 0.1 µF signature capacitor is split equally between VIN to VEE, and VEE to RTN, as shown in

Figure 15. The two capacitors are effectively connected in parallel. This will not affect signature mode, and can

be used for all configurations.

It should be noted that rear auxiliary non-dominance does not imply PoE dominance. PoE dominance requires a

different circuit configuration if continuity of power is desired. Please contact Texas Instruments for support on

PoE dominant solutions.

Product Folder Links: LM5073

FAUX or

RAUX Pin

VEE or RTN

Front or Rear

AUX Input

I_ leak

Rpd

LM5073

www.ti.com

SNVS490C –MARCH 2007–REVISED APRIL 2013

A Note About FAUX and RAUX Pin False Input State Detection

The FAUX and RAUX pins are used to sense the presence of auxiliary power sources. The input voltage of each

pin must remain low when the auxiliary power sources are absent. However, the Or-ing diodes feeding the

auxiliary power are not ideal and exhibit reverse leakage current that can flow from the PoE input to both the

FAUX and RAUX pins. When PoE power is applied, these leakage currents may elevate the potentials of the

FAUX and RAUX pins to false logic states.

A failure mode may be observed when the power diode feeding the front auxiliary input leaks excessively. The

leakage current may elevate the voltage on the FAUX pin above the FAUX input threshold, which will force

UVLO release. This would certainly interrupt any attempt by the LM5073 PD interface to perform the signature or

classification functions.

When the power diode that feeds the rear auxiliary input leaks, the false signal could imply a rear auxiliary supply

is present. In this case, the internal hot swap MOSFET will be turned off. This would block PoE power flow and

prevent startup.

This leakage problem at the control input pins can be easily solved. As shown in Figure 15, an additional pull-

down resistor (Rpd) across each auxiliary power control input provides a path for the diode leakage current so

that it will not create false states on the FAUX or RAUX pins.

Figure 16. Bypassing Resistor – Prevents False FAUX and RAUX Pin Signaling

Thermal Protection

The LM5073 includes internal thermal shutdown circuitry to protect the IC in the event the maximum junction

temperature is exceeded. This circuit prevents catastrophic overheating due to accidental overload of the hot

swap MOSFET or other circuitry. Typically, thermal shutdown is activated at 165°C, causing the hot swap

MOSFET and classification regulator to be disabled. The DC-DC converter control outputs will be disabled after

the power good timer has expired. The thermal protection is non-latching, therefore after the temperature drops

by the 20°C nominal hysteresis, the hot swap MOSFET is re-activated. If the cause of overheating has not been

eliminated, the circuit will oscillate in and out of the thermal shutdown mode.

Product Folder Links: LM5073

LM5073

SNVS490C –MARCH 2007–REVISED APRIL 2013

www.ti.com

Application Examples

The following are a few application examples. Figure 17 shows the typical LM5073 PD interface fully compliant to

IEEE802.3af.

Figure 17. Typical LM5073 PoE PDI

Figure 18 shows the LM5073 PD interface supporting front auxiliary power configuration. According to particular

application requirements, users can select an appropriate DC-DC converter to optimize the PD design. The

LM5025/26 active clamp forward converter evaluation board is recommended for a high efficiency, isolated

application; the LM5020 flyback converter evaluation board for a low cost, isolated application; and the LM5005

or LM5576 buck regulator evaluation boards for low cost, non-isolated design.

Figure 18. LM5073 PoE PDI with Front Auxiliary Power Support

Figure 19 shows the LM5073 PD interface supporting rear auxiliary power configuration. Similarly, users can

select a DC-DC converter to optimize the PD design. The LM5025/26 active clamp forward converter evaluation

board is recommended for a high efficiency, isolated application; the LM5020 flyback converter evaluation board

for a low cost, isolated application; and the LM5005/5567 buck regulator evaluation board for a low cost, non-

isolated design.

Product Folder Links: LM5073

LM5073

www.ti.com

SNVS490C –MARCH 2007–REVISED APRIL 2013

Additional features are included.

1. The optional common-mode and differential mode input filters are added to reduce the conducted emissions

below most applicable standards.

2. Two options for RAUX inrush limiting are offered, selectable with JMP2. Two resistors R1 and R2 form a low

cost solution, or a MOSFET limiter for a high performance solution.

3. Aux dominant is selectable by shorting JMP1. With JMP1 open, the circuit is not in aux dominant mode.

4. An optional LED1 indicates the PoE operating mode and it is enabled by connecting JMP7.

Figure 19. LM5073 PoE PDI with Rear Auxiliary Power Support

Figure 20 shows an example of LM5073 PD interface and LM5576 buck regulator for a low cost, non-isolated

application.

Product Folder Links: LM5073

LM5073

SNVS490C –MARCH 2007–REVISED APRIL 2013

www.ti.com

Figure 20. LM5073 in Isolated PD Design with LM5576 Buck Regulator

Product Folder Links: LM5073

LM5073

www.ti.com

SNVS490C –MARCH 2007–REVISED APRIL 2013

REVISION HISTORY

Changes from Revision B (April 2013) to Revision C Page

• Changed layout of National Data Sheet to TI format .......................................................................................................... 20

Product Folder Links: LM5073

PACKAGE OPTION ADDENDUM

www.ti.com 16-Oct-2016

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LM5073MH/NOPB OBSOLETE HTSSOP PWP 14 TBD Call TI Call TI -40 to 125 LM5073

LM5073MHX/NOPB OBSOLETE HTSSOP PWP 14 TBD Call TI Call TI -40 to 125 LM5073

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

PACKAGE OPTION ADDENDUM

www.ti.com 16-Oct-2016

Addendum-Page 2

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other

changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest

issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and

complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale

supplied at the time of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms

and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary

to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily

performed.

TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and

applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide

adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or

other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information

published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or

endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the

third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration

and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered

documentation. Information of third parties may be subject to additional restrictions.

Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service

voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.

TI is not responsible or liable for any such statements.

Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements

concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support

that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which

anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause

harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use

of any TI components in safety-critical applications.

In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to

help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and

requirements. Nonetheless, such components are subject to these terms.

No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties

have executed a special agreement specifically governing such use.

Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in

military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components

which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and

regulatory requirements in connection with such use.

TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of

non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

Products Applications

Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive

Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications

Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers

DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps

DSP dsp.ti.com Energy and Lighting www.ti.com/energy

Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial

Interface interface.ti.com Medical www.ti.com/medical

Logic logic.ti.com Security www.ti.com/security

Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense

Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video

RFID www.ti-rfid.com

OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com

Wireless Connectivity www.ti.com/wirelessconnectivity

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265