© Semiconductor Components Industries, LLC, 2012
August, 2012 − Rev. 14
1Publication Order Number:
MC33375/D
MC33375, NCV33375 Series
300 mA, Low Dropout
Voltage Regulator with
On/Off Control
The MC33375 series are micropower low dropout voltage
regulators available in a wide variety of output voltages as well as
packages, SOT−223 and SOP−8. These devices feature a very low
quiescent current and are capable of supplying output currents up to
300 mA. Internal current and thermal limiting protection are provided
by the presence of a short circuit at the output and an internal thermal
shutdown circuit.
The MC33375 has a control pin that allows a logic level signal to
turn−off or turn−on the regulator output.
Due to the low input−to−output voltage differential and bias current
specifications, these devices are ideally suited for battery powered
computer, consumer, and industrial equipment where an extension of
useful battery life is desirable.
Features:
•Low Quiescent Current (0.3 A in OFF mode; 125 A in ON mode)
•Low Input−to−Output Voltage Differential of 25 mV at IO = 10 mA,
and 260 mV at IO = 300 mA
•Extremely Tight Line and Load Regulation
•Stable with Output Capacitance of only 0.33 F for 2.5 V Output
Voltage
•Internal Current and Thermal Limiting
•Logic Level ON/OFF Control
•Pb−Free Packages are Available
•NCV Prefix for Automotive and Other Applications Requiring Site
and Control Changes
Figure 1. Simplified Block Diagram
Vin
Thermal &
Anti−sat
Protection
54 K
Rint
This device contains 41 active transistors
1.23 V
V. Ref.
Vout
GND
On/Off
Block
On/Off
LOW DROPOUT
MICROPOWER VOLTAGE
REGULATOR
SOIC−8
D SUFFIX
CASE 751
SOT−223
ST SUFFIX
CASE 318E
4
1
ORDERING INFORMATION
See detailed ordering and shipping information in the
package dimensions section on page 11 of this data sheet.
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1
AYM
375xx G
G
MARKING
DIAGRAMS
A = Assembly Location
Y = Year
M = Date Code
L = Wafer Lot
W = Work Week
xx = Voltage Version
G= Pb−Free Package
1
8375xx
ALYW
G
1
8
(Note: Microdot may be in either location)
MC33375, NCV33375 Series
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2
Gnd
Vin Vout
4
123
ON/
OFF
Input
Gnd
Gnd
ON/OFF
Output
Gnd
Gnd
N/C
1
2
3
4
8
7
6
5
PIN CONNECTIONS
MAXIMUM RATINGS
Rating Symbol Value Unit
Input Voltage VCC 13 Vdc
Power Dissipation and Thermal Characteristics
TA = 25°C
Maximum Power Dissipation
Case 751 (SOP−8) D Suffix
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
Case 318E (SOT−223) ST Suffix
Thermal Resistance, Junction−to−Air
Thermal Resistance, Junction−to−Case
PD
RJA
RJC
RJA
RJC
Internally Limited
160
25
245
15
W
°C/W
°C/W
°C/W
°C/W
Output Current IO300 mA
Maximum Junction Temperature TJ150 °C
Operating Ambient Temperature Range TA−40 to +125 °C
Storage Temperature Range Tstg −65 to +150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
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3
ELECTRICAL CHARACTERISTICS (CL = 1.0 F, TA = 25°C, for min/max values TJ = −40°C to +125°C, Note 1)
Characteristic Symbol Min Typ Max Unit
Output Voltage IO = 0 mA to 250 mA
1.8 V Suffix TA = 25°C, Vin = [VO + 1] V
2.5 V Suffix
3.0 V Suffix
3.3 V Suffix
5.0 V Suffix
1.8 V Suffix Vin = [VO + 1] V, 0 < IO < 100 mA
2.5 V Suffix 2% Tolerance from TJ = −40 to +125°C
3.0 V Suffix
3.3 V Suffix
5.0 V Suffix
VO
1.782
2.475
2.970
3.267
4.950
1.764
2.450
2.940
3.234
4.900
1.80
2.50
3.00
3.30
5.00
−
−
−
−
−
1.818
2.525
3.030
3.333
5.05
1.836
2.550
3.060
3.366
5.100
Vdc
Line Regulation Vin = [VO + 1] V to 12 V, IO = 250 mA,
All Suffixes TA = 25°C
Regline −2.0 10 mV
Load Regulation Vin = [VO + 1] V, IO = 0 mA to 250 mA,
All Suffixes TA = 25°C
Regload −5.0 25 mV
Dropout Voltage (Note 3)
IO = 10 mA TJ = −40°C to +125°C
IO = 100 mA
IO = 250 mA
IO = 300 mA
Vin − VO
−
−
−
−
25
115
220
260
100
200
400
500
mV
Ripple Rejection (120 Hz) Vin(peak−peak) = [VO + 1.5] V to [VO + 5.5] V −65 75 −dB
Output Noise Voltage
CL = 1.0 FI
O = 50 mA (10 Hz to 100 kHz)
CL = 200 F
Vn
−
−
160
46
−
−
Vrms
CURRENT PARAMETERS
Quiescent Current ON Mode Vin = [VO + 1] V, IO = 0 mA IQOn −125 200 A
Quiescent Current OFF Mode IQOff −0.3 4.0 A
Quiescent Current ON Mode SAT Vin = [VO − 0.5] V, IO = 0 mA (Note 2)
1.8 V Suffix
2.5 V Suffix
3.0 V Suffix
3.3 V Suffix
5.0 V Suffix
IQSAT
−
−
−
−
−
1100
1100
1500
1500
1500
1500
1500
2000
2000
2000
A
Current Limit Vin = [VO + 1] V, VO Shorted ILIMIT −450 −mA
ON/OFF INPUTS
On/Off Input Voltage
Logic “1” (Regulator On) Vout = VO ± 2%
Logic “0” (Regulator Off) Vout < 0.03 V
Logic “0” (Regulator Off) Vout < 0.05 V (1.8 V Option)
VCTRL
2.4
−
−
−
−
−
−
0.5
0.3
V
THERMAL SHUTDOWN
Thermal Shutdown − − 150 −°C
1. Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
2. Quiescent Current is measured where the PNP pass transistor is in saturation. Vin = [VO − 0.5] V guarantees this condition.
3. For 1.8 V version VDO is constrained by the minimum input voltage of 2.5 V.
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4
DEFINITIONS
Load Regulation − The change in output voltage for a
change in load current at constant chip temperature.
Dropout Voltage − The input/output differential at which
the regulator output no longer maintains regulation against
further reductions in input voltage. Measured when the
output drops 100 mV below its nominal value (which is
measured at 1.0 V differential), dropout voltage is affected
by junction temperature, load current and minimum input
supply requirements.
Output Noise Voltage − The RMS AC voltage at the
output with a constant load and no input ripple, measured
over a specified frequency range.
Maximum Power Dissipation − The maximum total
dissipation for which the regulator will operate within
specifications.
Quiescent Current − Current which is used to operate the
regulator chip and is not delivered to the load.
Line Regulation − The change in output voltage for a
change in the input voltage. The measurement is made under
conditions of low dissipation or by using pulse techniques
such that the average chip temperature is not significantly
affected.
Maximum Package Power Dissipation − The maximum
package power dissipation is the power dissipation level at
which the junction temperature reaches its maximum value
i.e. 150°C. The junction temperature is rising while the
difference between the input power (VCC X ICC) and the
output power (Vout X Iout) is increasing.
Depending on ambient temperature, it is possible to
calculate the maximum power dissipation and so the
maximum current as following:
Pd +
T
J–T
A
RJA
The maximum operating junction temperature TJ is
specified at 150°C, if TA = 25°C, then PD can be found. By
neglecting the quiescent current, the maximum power
dissipation can be expressed as:
Iout +
P
D
V
CC –V
out
The thermal resistance of the whole circuit can be
evaluated by deliberately activating the thermal shutdown
of the circuit (by increasing the output current or raising the
input voltage for example).
Then you can calculate the power dissipation by
subtracting the output power from the input power. All
variables are then well known: power dissipation, thermal
shutdown temperature (150°C for MC33375) and ambient
temperature.
RJA +
T
J–T
A
P
D
MC33375, NCV33375 Series
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5
0
3.5
0
300
OUTPUT VOLTAGE (V)
INPUT VOLTAGE (V)
LOAD CURRENT (mA)
CL = 1.0 F
Vout = 3.3 V
TA = 25°C
Vin = 4.3 V
Figure 2. Line Transient Response Figure 3. Line Transient Response
Figure 4. Load Transient Response Figure 5. Load Transient Response
Figure 6. Output Voltage versus Input Voltage
OUTPUT VOLTAGE CHANGE (mV)
50 100 150 200 250 400
100
-100
-200
-500
-600
-700
-0.8
-0.6
-0.4
-0.2
-1.0
0.4
0
0.2
OUTPUT VOLTAGE CHANGE (V)
Vout
CHANGE
LOAD
CURRENT
-750
LOAD CURRENT (mA)
CL = 33.0 F
Vout = 3.3 V
TA = 25°C
Vin = 4.3 V
0 250 300
-0.11
-0.16
-0.01
0.14
OUTPUT VOLTAGE CHANGE (V)
Vout
CHANGE
LOAD CURRENT
200
-0.06
0.04
0.09
3.0
2.5
2.0
1.5
1.0
0.5
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
IL = 1 mA
IL = 250 mA
50 100 150
1
300
DROPOUT VOLTAGE (mV)
IO, OUTPUT CURRENT (mA)
10 100 1000
250
200
150
100
50
0
0
Vin, INPUT VOLTAGE (V)
TIME (S)
20 40 60 80 100 120 140 160 180 200
7
6
5
4
3
2
1
0-100
-50
0
50
100
150
200
OUTPUT VOLTAGE CHANGE (mV)
Vin
Vout
Figure 7. Dropout Voltage versus Output Current
0
Vin, INPUT VOLTAGE (V)
TIME (S)
50 100 150 200
7
6
5
4
3
2
1
0-20
-10
0
20
40
50
70
10
30
60
TA = 25°C
CL = 33 F
IL = 10 mA
Vout = 3.3 V
Vin
Vout
-400
-300
0
200
300 350
0.6
0.8
1.0
-650
-550
-450
-350
-250
-150
-50
50
150
250
350
TIME (S) TIME (S)
TA = 25°C
CL = 0.47 F
IL = 10 mA
Vout = 3.3 V
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6
Figure 8. Dropout Voltage versus Temperature Figure 9. Ground Pin Current versus
Input Voltage
Figure 10. Ground Pin Current versus
Ambient Temperature
Figure 11. Output Voltage versus Ambient
Temperature (Vin = Vout + 1V)
-40
8
0
I
TA (°C)
Vin (VOLTS)
23 8
10
6
4
2
0
7
5
4
3
2
1
0
-20 020 40 60 80 100 120 140
IL = 100 mA
IL = 250 mA
-40
2.5
V
TEMPERATURE (°C)
2.495
2.49
2.485
2.48
2.475
2.47
02585
(mA)
gnd
6
IL = 50 mA
(VOLTS)
out
IO = 0
IO = 250 mA
-40
300
TEMPERATURE (°C)
250
200
150
100
50
0
02585
DROPOUT VOLTAGE (mV)
IL = 10 mA
IL = 100 mA
IL = 250 mA
IL = 300 mA
1
8
12
I (mA)
gnd
IL = 300 mA
IL = 100 mA
IL = 50 mA
45 67
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7
Figure 12. Output Voltage versus Ambient
Temperature (Vin = 12 V)
Figure 13. Ripple Rejection Figure 14. Ripple Rejection
-40
2.5
V
TEMPERATURE (°C)
2.49
2.485
2.48
2.475
2.47
02585
(VOLTS)
out
IO = 0
IO = 250 mA
2.495
2.465
0.1
70
dB
FREQUENCY (kHz)
60
50
40
30
20
10
0
1 10 100
IL = 100 mA
IL = 250 mA
0.1
70
dB
FREQUENCY (kHz)
60
50
40
30
20
10
0
1 10 100
IL = 10 mA
IL = 1 mA
Figure 15. Enable Transient
0
5
VOLTAGE (V)
CL = 1.0 F
500100 200 400
4
3
2.5
1
0.5
0
1.5
2
3.5
4.5
300
TIME (S)
CL = 33 F
ENABLE
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8
1.8 V Option
0.1
80
PSRR (dB)
f, FREQUENCY (kHz)
Figure 16. Output Voltage versus Temperature Figure 17. Output Voltage versus Input Voltage
Figure 18. Ground Current versus Load Current Figure 19. Quiescent Current versus Input Voltage
Figure 20. PSRR versus Frequency
60
50
40
30
20
10
0
110
100 1000
-40
VOUT, OUTPUT VOLTAGE (V)
TA, AMBIENT TEMPERATURE (°C)
-20 0 20 40 60 80 100 120
1.85
1.81
1.80
1.79
1.78
1.77
1.76
1.75
Figure 21. Enable Response
0
VOUT, OUTPUT VOLTAGE (V)
VCC, (V)
1346
2.0
1.8
1.6
0.8
0.6
0.4
0.2
0
TA = 25°C
ILOAD = 0 mA
1.84
1.83
1.82
ILOAD = 100 mA
25
1.4
1.2
1.0
0
Ignd, (mA)
ILOAD, (mA)
50 100 150 200 250 300 350
12
6
4
2
0
0
IQ
VCC, (V)
1346
140
120
40
20
0
TA = 25°C
ILOAD = 0 mA
10
8
25
100
80
60
TA = 25°C
VCC = 3 V
70
2 V
0 V
ENABLE
VOUT
VCC = 3 V
ILOAD = 1 mA
TA = 25°C
COUT = 1 F
( A)
0 5 10 15 20 25 30 35 40 45 50
t, TIME (s)
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9
1 mA
Figure 22. Load Transient Response
1.82 V
VCC = 3 V
ILOAD = 1 mA to 100 mA
TA = 25°C
1.80 V
1.78 V
100 mA
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
t, TIME (ms)
APPLICATIONS INFORMATION
LOADCout
Vout
Vin
Cin
GND
MC33375−xx
Figure 23. Typical Application Circuit
ON/OFF
The MC33375 regulators are designed with internal
current limiting and thermal shutdown making them
user−friendly. Figure 15 is a typical application circuit. The
output capability of the regulator is in excess of 300 mA,
with a typical dropout voltage of less than 260 mV. Internal
protective features include current and thermal limiting.
EXTERNAL CAPACITORS
These regulators require only a 0.33 F (or greater)
capacitance between the output and ground for stability for
1.8 V, 2.5 V, 3.0 V, and 3.3 V output voltage options. Output
voltage options of 5.0 V require only 0.22 F for stability.
The output capacitor must be mounted as close as possible
to the MC33375. If the output capacitor must be mounted
further than two centimeters away from the MC33375, then
a larger value of output capacitor may be required for
stability. A value of 0.68 F or larger is recommended. Most
type of aluminum, tantalum, or multilayer ceramic will
perform adequately. Solid tantalums or appropriate
multilayer ceramic capacitors are recommended for
operation below 25°C. An input bypass capacitor is
recommended to improve transient response or if the
regulator is connected to the supply input filter with long
wire lengths, more than 4 inches. This will reduce the
circuit’s sensitivity to the input line impedance at high
frequencies. A 0.33 F or larger tantalum, mylar, ceramic,
or other capacitor having low internal impedance at high
frequencies should be chosen. The bypass capacitor should
be mounted with shortest possible lead or track length
directly across the regulator’s input terminals. Figure 16
shows the ESR that allows the LDO to remain stable for
various load currents.
0
100
ESR (ohm)
LOAD CURRENT (mA)
100 200 30
0
10
1.0
0.1
Figure 24. ESR for Vout = 3.0V
Vout = 3.0 V
Cout = 1.0 F
Cin = 1.0 F
50 150 250
Stable Region
Applications should be tested over all operating
conditions to insure stability.
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10
THERMAL PROTECTION
Internal thermal limiting circuitry is provided to protect
the integrated circuit in the event that the maximum junction
temperature is exceeded. When activated, typically at
150°C, the output is disabled. There is no hysteresis built
into the thermal protection. As a result the output will appear
to be oscillating during thermal limit. The output will turn
off until the temperature drops below the 150°C then the
output turns on again. The process will repeat if the junction
increases above the threshold. This will continue until the
existing conditions allow the junction to operate below the
temperature threshold.
Thermal limit is not a substitute for proper
heatsinking.
The internal current limit will typically limit current to
450 mA. If during current limit the junction exceeds 150°C,
the thermal protection will protect the device also. Current
limit is not a substitute for proper heatsinking.
OUTPUT NOISE
In many applications it is desirable to reduce the noise
present at the output. Reducing the regulator bandwidth by
increasing the size of the output capacitor will reduce the
noise on the MC33375.
ON/OFF PIN
When this pin is pulled low, the MC33375 is off. This pin
should not be left floating. The pin should be pulled high for
the MC33375 to operate.
Figure 25. SOT−223 Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
60
80
100
120
140
160
180
0.4
0.6
0.8
1.0
1.2
1.4
1.6
010203025155.0
L, LENGTH OF COPPER (mm)
PD(max) for TA = 50°C
RJA, THERMAL RESISTANCE,
JUNCTION−TO−AIR (°CW)
PD, MAXIMUM POWER DISSIPATION (W)
Minimum
Size Pad
RJA
L
L
2.0 oz. Copper
ÎÎÎ
ÎÎÎ
ÎÎÎ
Figure 26. SOP−8 Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
R , THERMAL RESISTANCE,
JAθJUNCTION‐TO‐AIR ( C/W)°
30
50
70
90
110
170
0.4
0.8
1.2
1.6
3.2
02040503010
L, LENGTH OF COPPER (mm)
PD(max) for TA = 50°C
L
L
RJA
130
2.0
150
2.4
2.8
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
Graph Represents Symmetrical Layout
2.0 oz.
Copper
3.0
mm
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11
ORDERING INFORMATION
Device Type
Operating
Temperature Range,
Tolerance Package Shipping†
MC33375ST−1.8T3
1.8 V
(Fixed Voltage)
SOT−223
4000 / Tape & Reel
MC33375ST−1.8T3G SOT−223
(Pb−Free)
NCV33375ST1.8T3G*
MC33375D−2.5
2.5 V
(Fixed Voltage)
SOIC−8
98 Units / Rail
MC33375D−2.5G SOIC−8
(Pb−Free)
MC33375D−2.5R2 SOIC−8
2500 / Tape & Reel
MC33375D−2.5R2G SOIC−8
(Pb−Free)
NCV33375D−2.5R2G*
MC33375ST−2.5T3 SOT−223
4000 / Tape & Reel
MC33375ST−2.5T3G SOT−223
(Pb−Free)
MC33375D−3.0
3.0 V
(Fixed Voltage)
SOIC−8
98 Units / Rail
MC33375D−3.0G SOIC−8
(Pb−Free)
MC33375D−3.0R2 SOIC−8
2500 / Tape & Reel
MC33375D−3.0R2G 1% Tolerance
at TA = 25°C
SOIC−8
(Pb−Free)
MC33375ST−3.0T3 SOT−223
4000 / Tape & Reel
MC33375ST−3.0T3G 2% Tolerance at
TJ from −40 to +125°C
SOT−223
(Pb−Free)
MC33375D−3.3
3.3 V
(Fixed Voltage)
SOIC−8
98 Units / Rail
MC33375D−3.3G SOIC−8
(Pb−Free)
MC33375D−3.3R2 SOIC−8
2500 / Tape & Reel
MC33375D−3.3R2G SOIC−8
(Pb−Free)
NCV33375D−3.3R2G*
MC33375ST−3.3T3 SOT−223
4000 / Tape & Reel
MC33375ST−3.3T3G SOT−223
(Pb−Free)
NCV33375ST3.3T3G*
MC33375D−5.0
5.0 V
(Fixed Voltage)
SOIC−8
98 Units / Rail
MC33375D−5.0G SOIC−8
(Pb−Free)
MC33375D−5.0R2 SOIC−8
2500 / Tape & Reel
MC33375D−5.0R2G SOIC−8
(Pb−Free)
MC33375ST−5.0T3 SOT−223
4000 / Tape & Reel
MC33375ST−5.0T3G SOT−223
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NCV prefix for automotive and other applications requiring site and change controls.
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12
DEVICE MARKING
Device Version Marking (1st line)
MC33375, NCV33375 1.8 V 37518
MC33375, NCV33375 2.5 V 37525
MC33375 3.0 V 37530
MC33375, NCV33375 3.3 V 37533
MC33375 5.0 V 37550
TAPE AND REEL SPECIFICATIONS†
Device Reel Size Tape Width Quantity
MC33375D, NCV33375D 13″12 mm Embossed Tape 2500 Units
MC33375ST, NCV33375ST 13″8 mm Embossed Tape 4000 Units
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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13
PACKAGE DIMENSIONS
SOT−223 (TO−261)
CASE 318E−04
ISSUE N
1.5
0.059 ǒmm
inchesǓ
SCALE 6:1
3.8
0.15
2.0
0.079
6.3
0.248
2.3
0.091
2.3
0.091
2.0
0.079
SOLDERING FOOTPRINT*
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
A1
b1
D
E
b
e
e1
4
123
0.08 (0003)
A
L1
C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
HEDIM
A
MIN NOM MAX MIN
MILLIMETERS
1.50 1.63 1.75 0.060
INCHES
A1 0.02 0.06 0.10 0.001
b0.60 0.75 0.89 0.024
b1 2.90 3.06 3.20 0.115
c0.24 0.29 0.35 0.009
D6.30 6.50 6.70 0.249
E3.30 3.50 3.70 0.130
e2.20 2.30 2.40 0.087
0.85 0.94 1.05 0.033
0.064 0.068
0.002 0.004
0.030 0.035
0.121 0.126
0.012 0.014
0.256 0.263
0.138 0.145
0.091 0.094
0.037 0.041
NOM MAX
L1 1.50 1.75 2.00 0.060
6.70 7.00 7.30 0.264
0.069 0.078
0.276 0.287
HE
− −
e1
0°10°0°10°
q
q
L
L0.20 −−− −−− 0.008 −−− −−−
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14
PACKAGE DIMENSIONS
SOIC−8 NB
CASE 751−07
ISSUE AK
SEATING
PLANE
1
4
58
N
J
X 45_
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
A
BS
D
H
C
0.10 (0.004)
DIM
A
MIN MAX MIN MAX
INCHES
4.80 5.00 0.189 0.197
MILLIMETERS
B3.80 4.00 0.150 0.157
C1.35 1.75 0.053 0.069
D0.33 0.51 0.013 0.020
G1.27 BSC 0.050 BSC
H0.10 0.25 0.004 0.010
J0.19 0.25 0.007 0.010
K0.40 1.27 0.016 0.050
M0 8 0 8
N0.25 0.50 0.010 0.020
S5.80 6.20 0.228 0.244
−X−
−Y−
G
M
Y
M
0.25 (0.010)
−Z−
Y
M
0.25 (0.010) ZSXS
M
____
1.52
0.060
7.0
0.275
0.6
0.024
1.270
0.050
4.0
0.155
ǒmm
inchesǓ
SCALE 6:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
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