SN54HC245, SN74HC245
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCLS131D − DECEMBER 1982 − REVISED AUGUST 2003
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
DWide Operating Voltage Range of 2 V to 6 V
DHigh-Current 3-State Outputs Drive Bus
Lines Directly or Up To 15 LSTTL Loads
DLow Power Consumption, 80-μA Max ICC
DTypical tpd = 12 ns
D±6-mA Output Drive at 5 V
DLow Input Current of 1 μA Max
3212019
910111213
4
5
6
7
8
18
17
16
15
14
B1
B2
B3
B4
B5
A3
A4
A5
A6
A7
A2
A1
DIR
B7
B6 OE
A8
GND
B8
VCC
SN54HC245 ...FK PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
DIR
A1
A2
A3
A4
A5
A6
A7
A8
GND
VCC
OE
B1
B2
B3
B4
B5
B6
B7
B8
SN54HC245 ...J OR W PACKAGE
SN74HC245 . . . DB, DW, N, NS, OR PW PACKAGE
(TOP VIEW)
description/ordering information
These octal bus transceivers are designed for asynchronous two-way communication between data buses. The
control-function implementation minimizes external timing requirements.
The devices allow data transmission from the A bus to the B bus or from the B bus to the A bus, depending on
the logic level at the direction-control (DIR) input. The output-enable (OE) input can be used to disable the
device so that the buses are effectively isolated.
ORDERING INFORMATION
TAPACKAGEORDERABLE
PART NUMBER
TOP-SIDE
MARKING
PDIP − N Tube of 20 SN74HC245N SN74HC245N
SOIC DW
Tube of 25 SN74HC245DW
HC245
SOIC − DW Reel of 2000 SN74HC245DWR HC245
40°Cto85°C
SOP − NS Reel of 2000 SN74HC245NSR HC245
−40°C to 85°CSSOP − DB Reel of 2000 SN74HC245DBR HC245
Tube of 70 SN74HC245PW
TSSOP − PW Reel of 2000 SN74HC245PWR HC245
TSSOP
PW
Reel of 250 SN74HC245PWT
HC245
CDIP − J Tube of 20 SNJ54HC245J SNJ54HC245J
−55°C to 125°CCFP − W Tube of 85 SNJ54HC245W SNJ54HC245W
LCCC − FK Tube of 55 SNJ54HC245FK SNJ54HC245FK
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright © 2003, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
SN54HC245, SN74HC245
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCLS131D − DECEMBER 1982 − REVISED AUGUST 2003
2POST OFFICE BOX 655303 DALLAS, TEXAS 75265
FUNCTION TABLE
INPUTS
OPERATION
OE DIR OPERATION
L L B data to A bus
LH A data to B bus
H X Isolation
logic diagram (positive logic)
DIR
OE
A1
B1
1
2
18
19
To Seven Other Channels
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, VCC −0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous output current, IO (VO = 0 to VCC) ±35 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous current through VCC or GND ±70 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Note 2): DB package 70°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DW package 58°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
N package 69°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
NS package 60°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PW package 83°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
SN54HC245, SN74HC245
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCLS131D − DECEMBER 1982 − REVISED AUGUST 2003
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
recommended operating conditions (see Note 3)
SN54HC245 SN74HC245
UNIT
MIN NOM MAX MIN NOM MAX UNIT
VCC Supply voltage 2 5 6 2 5 6 V
VCC = 2 V 1.5 1.5
VIH High-level input voltage VCC = 4.5 V 3.15 3.15 V
VIH
High level
input
voltage
VCC = 6 V 4.2 4.2
V
VCC = 2 V 0.5 0.5
VIL Low-level input voltage VCC = 4.5 V 1.35 1.35 V
VIL
Low level
input
voltage
VCC = 6 V 1.8 1.8
V
VIInput voltage 0 VCC 0 VCC V
VOOutput voltage 0 VCC 0 VCC V
VCC = 2 V 1000 1000
Δt/ΔvInput transition rise/fall time VCC = 4.5 V 500 500 ns
Δt/Δv
Input
transition
rise/fall
time
VCC = 6 V 400 400
ns
TAOperating free-air temperature −55 125 −40 85 °C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
V
TA = 25°C SN54HC245 SN74HC245
UNIT
PARAMETER TEST CONDITIONS VCC MIN TYP MAX MIN MAX MIN MAX UNIT
2 V 1.9 1.998 1.9 1.9
IOH = −20 μA4.5 V 4.4 4.499 4.4 4.4
VOH VI = VIH or VIL
IOH
20
μA
6 V 5.9 5.999 5.9 5.9 V
VOH
VI
VIH
or
VIL
IOH = −6 mA 4.5 V 3.98 4.3 3.7 3.84
V
IOH = −7.8 mA 6 V 5.48 5.8 5.2 5.34
2 V 0.002 0.1 0.1 0.1
IOL = 20 μA4.5 V 0.001 0.1 0.1 0.1
VOL VI = VIH or VIL
IOL
20
μA
6 V 0.001 0.1 0.1 0.1 V
VOL
VI
VIH
or
VIL
IOL = 6 mA 4.5 V 0.17 0.26 0.4 0.33
V
IOL = 7.8 mA 6 V 0.15 0.26 0.4 0.33
IIDIR or OE VI = VCC or 0 6 V ±0.1 ±100 ±1000 ±1000 nA
IOZ A or B VO = VCC or 0 6 V ±0.01 ±0.5 ±10 ±5μA
ICC VI = VCC or 0, IO = 0 6 V 8 160 80 μA
CiDIR or OE 2 V to 6 V 3 10 10 10 pF
SN54HC245, SN74HC245
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCLS131D − DECEMBER 1982 − REVISED AUGUST 2003
4POST OFFICE BOX 655303 DALLAS, TEXAS 75265
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
PARAMETER
FROM TO
TA = 25°C SN54HC245 SN74HC245
UNIT
PARAMETER
FROM
(INPUT)
TO
(OUTPUT) VCC MIN TYP MAX MIN MAX MIN MAX UNIT
2 V 40 105 160 130
t
p
dA or B B or A 4.5 V 15 21 32 26 ns
tpd
A
or
B
B
or
A
6 V 12 18 27 22
ns
2 V 125 230 340 290
ten OE A or B 4.5 V 23 46 68 58 ns
ten
OE
A
or
B
6 V 20 39 58 49
ns
2 V 74 200 300 250
tdis OE A or B 4.5 V 25 40 60 50 ns
tdis
OE
A
or
B
6 V 21 34 51 43
ns
2 V 20 60 90 75
ttA or B 4.5 V 8 12 18 15 ns
t
6 V 6 10 15 13
switching characteristics over recommended operating free-air temperature range, CL = 150 pF
(unless otherwise noted) (see Figure 1)
PARAMETER
FROM TO
TA = 25°C SN54HC245 SN74HC245
UNIT
PARAMETER
FROM
(INPUT)
TO
(OUTPUT) VCC MIN TYP MAX MIN MAX MIN MAX UNIT
2 V 54 135 200 170
t
p
dA or B B or A 4.5 V 18 27 40 34 ns
tpd
A
or
B
B
or
A
6 V 15 23 34 29
ns
2 V 150 270 405 335
ten OE A or B 4.5 V 31 54 81 67 ns
ten
OE
A
or
B
6 V 25 46 69 56
ns
2 V 45 210 315 265
ttA or B 4.5 V 17 42 63 53 ns
t
6 V 13 36 53 45
operating characteristics, TA = 25°C
PARAMETER TEST CONDITIONS TYP UNIT
Cpd Power dissipation capacitance per transceiver No load 40 pF
SN54HC245, SN74HC245
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCLS131D − DECEMBER 1982 − REVISED AUGUST 2003
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
VOLTAGE WAVEFORM
INPUT RISE AND FALL TIMES
50%50% 10%10%
90% 90% VCC
0 V
trtf
Input
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
50%
50%50% 10%10%
90% 90%
VCC
VOH
VOL
0 V
trtf
Input
In-Phase
Output
50%
tPLH tPHL
50% 50%
10% 10%
90%90% VOH
VOL
tr
tf
tPHL tPLH
Out-of-Phase
Output
50%
10%
90%
VCC
VCC
VOL
0 V
Output
Control
(Low-Level
Enabling)
Output
Waveform 1
(See Note B)
50%
tPZL tPLZ
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES FOR 3-STATE OUTPUTS
VOH
0 V
50%
50%
tPZH tPHZ
Output
Waveform 2
(See Note B)
VCC
Test
Point
From Output
Under Test
CL
(see Note A)
RL
VCC
S1
S2
LOAD CIRCUIT
PARAMETER CL
tPZH
tpd or tt
tdis
ten tPZL
tPHZ
tPLZ
1 kΩ
1 kΩ
50 pF
or
150 pF
50 pF
Open Closed
RLS1
Closed Open
S2
Open Closed
Closed Open
50 pF
or
150 pF
Open Open−−
NOTES: A. CL includes probe and test-fixture capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
D. The outputs are measured one at a time with one input transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
Figure 1. Load Circuit and Voltage Waveforms
PACKAGE OPTION ADDENDUM
www.ti.com 18-Oct-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
5962-8408501VRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8408501VR
A
SNV54HC245J
5962-8408501VSA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type -55 to 125 5962-8408501VS
A
SNV54HC245W
84085012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 84085012A
SNJ54HC
245FK
8408501RA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 8408501RA
SNJ54HC245J
8408501SA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type -55 to 125 8408501SA
SNJ54HC245W
JM38510/65503BRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
65503BRA
JM38510/65503BSA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type -55 to 125 JM38510/
65503BSA
M38510/65503BRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
65503BRA
M38510/65503BSA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type -55 to 125 JM38510/
65503BSA
SN54HC245J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 SN54HC245J
SN74HC245DBLE OBSOLETE SSOP DB 20 TBD Call TI Call TI -40 to 85
SN74HC245DBR ACTIVE SSOP DB 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC245
SN74HC245DBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC245
SN74HC245DBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC245
SN74HC245DW ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC245
SN74HC245DWE4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC245
PACKAGE OPTION ADDENDUM
www.ti.com 18-Oct-2013
Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
SN74HC245DWG4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC245
SN74HC245DWR ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC245
SN74HC245DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC245
SN74HC245DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC245
SN74HC245N ACTIVE PDIP N 20 20 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type -40 to 85 SN74HC245N
SN74HC245N3 OBSOLETE PDIP N 20 TBD Call TI Call TI -40 to 85
SN74HC245NE4 ACTIVE PDIP N 20 20 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type -40 to 85 SN74HC245N
SN74HC245NSR ACTIVE SO NS 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC245
SN74HC245NSRE4 ACTIVE SO NS 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC245
SN74HC245NSRG4 ACTIVE SO NS 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC245
SN74HC245PW ACTIVE TSSOP PW 20 70 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC245
SN74HC245PWE4 ACTIVE TSSOP PW 20 70 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC245
SN74HC245PWG4 ACTIVE TSSOP PW 20 70 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC245
SN74HC245PWLE OBSOLETE TSSOP PW 20 TBD Call TI Call TI -40 to 85
SN74HC245PWR ACTIVE TSSOP PW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 85 HC245
SN74HC245PWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC245
SN74HC245PWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC245
SN74HC245PWT ACTIVE TSSOP PW 20 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC245
SN74HC245PWTE4 ACTIVE TSSOP PW 20 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC245
PACKAGE OPTION ADDENDUM
www.ti.com 18-Oct-2013
Addendum-Page 3
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
SN74HC245PWTG4 ACTIVE TSSOP PW 20 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC245
SNJ54HC245FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 84085012A
SNJ54HC
245FK
SNJ54HC245J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 8408501RA
SNJ54HC245J
SNJ54HC245W ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type -55 to 125 8408501SA
SNJ54HC245W
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
PACKAGE OPTION ADDENDUM
www.ti.com 18-Oct-2013
Addendum-Page 4
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54HC245, SN54HC245-SP, SN74HC245 :
Catalog: SN74HC245, SN54HC245
Military: SN54HC245
Space: SN54HC245-SP
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
Military - QML certified for Military and Defense Applications
Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74HC245DBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1
SN74HC245DWR SOIC DW 20 2000 330.0 24.4 10.8 13.3 2.7 12.0 24.0 Q1
SN74HC245NSR SO NS 20 2000 330.0 24.4 8.2 13.0 2.5 12.0 24.0 Q1
SN74HC245PWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1
SN74HC245PWT TSSOP PW 20 250 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 9-Sep-2013
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74HC245DBR SSOP DB 20 2000 367.0 367.0 38.0
SN74HC245DWR SOIC DW 20 2000 367.0 367.0 45.0
SN74HC245NSR SO NS 20 2000 367.0 367.0 45.0
SN74HC245PWR TSSOP PW 20 2000 364.0 364.0 27.0
SN74HC245PWT TSSOP PW 20 250 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 9-Sep-2013
Pack Materials-Page 2