SMD CPU INDUCTORS MODEL NO. FEATURES: : SSC-1405 SERIES * DUST CORES ARE USED AT THE TOP PORTION AND NI-ZN FERRITE CORES AT THE BOTTOM PORTION * SUPERIOR QUALITY FOR AN AUTOMATED PRODUCTION LINE. * PICK AND PLACE COMPATIBLE. * TAPE AND REEL PACKING. APPLICATION : * NOTEBOOK COMPUTERS ELECTRICAL SPECIFICATION: INDUCTANCE (uH) 20% @ ADC DCR MAX (m) @ RATED CURRENT RATED CURRENT (A) SSC-1405-0R7 0.70 1.5 0.53 30 SSC-1405-1R1 1.1 2.4 0.95 24 SSC-1405-1R8 1.8 4.7 1.55 17 SSC-1405-2R6 2.6 7.0 2.15 15 PART NO INDUCTANCE (uH) TYP INDUCTANCE VS DC BIAS: SSC-1405-2R6 SSC-1405-1R8 SSC-1405-1R1 SSC-1405-0R7 SSC-1405 3.0 L(uH) 2.5 2.0 1.5 1.0 0.5 0.0 0 5 10 15 20 25 30 NOTE : TEST FREQUENCY: 100 KHZ,1VRMS. PHYSICAL DIMENSION : (UNIT:mm) TOLERANCE : 0.3 TAIPEI MULTIPOWER ELECTRONICS CO., LTD. 2ND. FL., 542-7 CHUNG-CHENG ROAD, HSIN-TIEN CITY,TAIPEI, TAIWAN ,R.O.C TEL : (02) 8667-2078 FAX : (02)8667-2006 PCB PATTERN B ADC PACKING Tape and Reel Orientation SSC-1405 -XXX TMP XXXX SSC-1405 -XXX TMP XXXX SSC-1405 -XXX TMP XXX SSC-1405 -XXX TMP XXXX USER DIRECTION OF FEED NOTE : Top view shown with cover tape removed. TAPE WIDTH REEL 24mm WIDTH COMPONENT 29.5mm PITCH UNITS 16mm PER REEL 400 TAPE SPECIFICATIONS: Carrier Tape Type : Conductive. Cover Tape Type : Antistatic. Cover Tape Adhesion to Carrier : 35 - 85 grams. REEL SPECIFICATIONS: Antistatic. Diameter (flange) : 13" (330.2mm) STANDARDS : All embossed carrier tape packaging will be accomplished in compliance with latest revision of EIA-481 "Taping of surface Mount Components for Automatic Placement". ENVIRONMENTAL PERFORMANCE ITEM 1 TEST Thermal Shock CONDITION One cycle shall consist of : (1) 30 minutes at temperature -30. (2) 15 seconds maximum at room ambient. (3) 30 minutes at temperature +125. (4) 15 seconds maximum at room ambient. Subject samples to 10 cycles. Test per applicable specification after a 4 hours stabilization at room ambient. 2 Vibration Inductance deviation within 3.0% after vibration for 1 hour. In each of three orientations at sweep vibration (105010Hz) with 1.5mm P-P amplitude. 3 Solderability Solder pot at 2305, with kester 1544 solder flux. 5 second 1 second. 4 Operating Dip parts into solder pot containing 63/37 molten alloy for Wetting must occur on a minimum of 90% of the terminations. -25 +105 ( coil contain heat) Temperature 5 Humidity Inductance deviation within5.0% After 96 hour in 9095% relative humidity at 402and 1 hour drying under normal condition. 6 2 Mechanical Shock Inductance deviation within5.0% after drop down with 981m/s (100G)shock. Attitude upon a rubber block method shock testing machine, for 1 time, in each of three orientations. B