SMD
CPU INDUCTORS
MODEL NO. : SSC-1405 SERIES
FEATURES:
* DUST CORES ARE USED AT THE TOP PORTION AND NI-ZN FERRITE CORES AT
THE BOTTOM PORTION
* SUPERIOR QUALITY FOR AN AUTOMATED PRODUCTION LINE.
* PICK AND PLACE COMPATIBLE.
* TAPE AND REEL PACKING.
APPLICATION :
* NOTEBOOK COMPUTERS
ELECTRICAL SPECIFICATION: INDUCTANCE VS DC BIAS:
PART NO INDUCTANCE
(uH) ±20%
@ ADC
DCR
MAX
(mΩ)
INDUCTANCE
(uH) TYP
@ RATED CURRENT
RATED
CURRENT
(A)
SSC-1405-0R7 0.70 1.5 0.53 30
SSC-1405-1R1 1.1 2.4 0.95 24
SSC-1405-1R8 1.8 4.7 1.55 17
SSC-1405-2R6 2.6 7.0 2.15 15
NOTE : TEST FREQUENCY: 100 KHZ,1VRMS.
PHYSICAL DIMENSION : (UNIT:mm)
TOLERANCE : ±0.3 PCB PATTERN
台北沛波電子股份有限公司
TAIPEI MULTIPOWER ELECTRONICS CO., LTD.
2ND. FL., 542-7 CHUNG-CHENG ROAD,
HSIN-TIEN CITY,TAIPEI, TAIWAN ,R.O.C
TEL : (02) 8667-2078 FAX : (02)8667-2006
B
SSC-1405
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0 5 10 15 20 25 30 ADC
L(uH)
SSC-1405-2R6
SSC-1405-1R8
SSC-1405-1R1
SSC-1405-0R7
PACKING
Tape and Reel Orientation
NOTE : Top view shown with cover tape removed.
TAPE WIDTH REEL WIDTH COMPONENT PITCH UNITS PER REEL
24mm 29.5mm 16mm 400
TAPE SPECIFICATIONS:
Carrier Tape Type : Conductive.
Cover Tape Type : Antistatic.
Cover Tape Adhesion to Carrier : 35 - 85 grams.
REEL SPECIFICATIONS:
Antistatic.
Diameter (flange) : 13” (330.2mm)
STANDARDS : All embossed carrier tape packaging will be accomplished in compliance with latest revision of EIA-481
“Taping of surface Mount Components for Automatic Placement”.
ENVIRONMENTAL PERFORMANCE
ITEM TEST CONDITION
1
Thermal Shock One cycle shall consist of :
(1) 30 minutes at temperature –30℃.
(2) 15 seconds maximum at room ambient.
(3) 30 minutes at temperature +125℃.
(4) 15 seconds maximum at room ambient.
Subject samples to 10 cycles. Test per applicable specification after a 4 hours stabilization at room ambient.
2 Vibration Inductance deviation within ±3.0% after vibration for 1 hour.
In each of three orientations at sweep vibration (10∼50∼10Hz) with 1.5mm P-P amplitude.
3 Solderability Solder pot at 230℃±5℃, with kester 1544 solder flux. Dip parts into solder pot containing 63/37 molten alloy for
5 second ±1 second. Wetting must occur on a minimum of 90% of the terminations.
4 Operating
Temperature -25℃ ∼ +105℃ ( coil contain heat)
5 Humidity Inductance deviation within±5.0%
After 96 hour in 90∼95% relative humidity at 40±2℃and 1 hour drying under normal condition.
6 Mechanical Shock Inductance deviation within±5.0% after drop down with 981m/s2 (100G)shock.
Attitude upon a rubber block method shock testing machine, for 1 time, in each of three orientations.
B
USER DIRECTION OF FEED
SSC-1405
-XXX
TMP XXXX SSC-1405
-XXX
TMP XXXX SSC-1405
-XXX
TMP XXXX SSC-1405
-XXX
TMP XXX
