IC SOCKETS FOR SMALL OUTLINE PACKAGE FEATURES 1. Requires no pattern changes when directly mounting an IC The foot patterns of SO package IC chips and of the socket are identical. Thus, the sockets can be used from prototyping to initial production, and during actual production the IC chips can be directly mounted to the PC L. Socket frame -- SO package IC chip Socket body 2. Achieves a mounting height of 5mm or less including the ICs height The maximum height is 5mm, even when taking into consideration the rise in cream solder and the ICs maximum height. Ideal for low-profile requirements. Socket height: SOP SOCKETS 3. Space saving The socket occupies an area only 1.25 times the size of the IC. High density mounting is possible even if the socket is used. 4. Automated mounting compatible The socket has an open flat construction on its top surface so that it can be picked up by an automated mounting machine using suction for automated mounting. APPLICATIONS 1. For initial production (prototyping to initial production stages, which use sockets for fast production of a new product) 2. For functional upgrades (situations requiring ROM replacement or LSI 4.5mm (28, 32, 40 contact) chip replacement) 4.2mm (8, 20, 24 contact) board without any changes to the PC board patterns. SPECIFICATIONS 1. Characteristics Item Specifications Canditions Rated current 0.5A Flectrical Insulation resistance Min. 1000MQ Using 500V DC megohmmeter characteristics Breakdown voltage 500V AC for 1 minute Detection current: 1mA ; Measured with YHP4328A. Contact resistance Max. 30m) Does not include conductor resistance of IC leads. Mechanical Shock resi B1m/s? (100G No interruption of t | h characteristics jock resistance 981m/s? { } jo interruption of current longer than 1 us : After 48 hours of exposure to humidity 75 to 80% R.H., H.S After test, contact resistance max. 30m2 temperature 40C+2C, concentration 31 ppm : After 48 hours of exposure to humidity 90 to 95% R.H., SO, After test, contact resistance max. 30m2 temperature 40C+2C, concentration 10+3ppm Humidit After test, contact resistance max. 30m, After 96 hours of exposure to humidity 90 to 95% R.H., y insulation resistance min. 100 MQ, temperature 40+2C After 5 cycles where 1 cycle consists of steps 1 to 4 Environmental Step | Temperature (C) | Time (minutes) characteristics : 1 5579 30 : After test, contact resistance max. 30mQ, 3 Thermal shock resistance insulation resistance min. 100MQ, 2 25730 Maximum 5 3), 8573 30 4 25r Maximum 5 Operating temperature 55C to +85C No freezing at low temperatures Soldering heat resistance Peak temperature of 245C Infrared reflow soidering 9 300C within 5 seconds Soldering iron 8, 14, 20, 24 contacts: SO package IC with nominal dimension 300 mit and 1.27mm pitch 20, 28 contacts: SO package IC with nominal dimension 375 mil and 1.27mm pitch 28, 32 contacts: SO package IC with nominal dimension 450 mil and 1.27mm pitch 32, 40 contacts: SO package IC with nominal dimnension 525 mil and 1.27mm pitch 44 contacts: SO package IC with nominal dimension 600 mil and 1.27mm pitch Suitable IC package 2. Materials and Surface Treatment Part name Material Surface treatment . Body Glass reinforced PPS (UL94V-0) _ Mol L olded plastic part Frame Glass reinforced PPS (UL94V-0) Contact Copper alloy SnPb plating over Ni for contact, SnPb plating over Ni for terminal 44AXS(6) Ordering Information by Package Style 1. SOP IC sockets are available in the following four package types: 2. Minimum ordering quantity for SOP IC sockets requiring high Small quantity for prototype Pack package (standard) dimensional accuracy for SMD terminals should be one package box Large quantity for volume production (automatic placement): to prevent terminal damage in transit. i - Tube package (standard) | Embossed tape package (for 3,000 pcs/lot or more) 3. The SOP IC socket is designed to secure the IC chip with a frame Tray package (for 5,000 pcs/lot or more) which is separate from the socket, so sockets and frames should be [_ ordered separately. 3. Ordering Information for Socket body and Frame Supplied in Embossed Tape Packages (Offered for on-demand production.) The part number should be suffixed with the 1. Pack Package Containing 5 pieces (Standard) 1) The part number for this pac- kage type should be suffixed with Oy SO letter P. the letter C. MS 1) Ordering quantity: 3,000 pcs/lot or more. Please consult 2) Minimum order quantity us for quantities below 3,000 pcs. The minimum order quantity is 5 pieces. For example, if you 2) Sockets and frames should be ordered separately (refer to order 5 pieces of the AXS608309C, you will receive 5 sets of the following TYPES.) sockets and frames in a single pack. 4. Tray Package 2. Tube Package (Standard) (Offered for on-demand production.) 1) The part number for this package type should be suffixed 1) Ordering quantity: 5,000 pes/lot or more. Please consult with the letter S. us for quantities below 5,000 pcs. 2) Minimum order quantity 2) Sockets and frames should be ordered separately. The minimum order quantity is 1 tube. For example, if you @ Socket model number: Replace suffix P in the sockets arder 50 pieces of the AXS60830985, you will receive 50 sets model numbers (supplied in embossed tape package) of sockets and frames in a single tube. with T. e.g. AXS608109P AXS608109T PRODUCT TYPES No. of contacts | Nomina! dimension Part No. ean ae carton No. of contacts | Nominal dimension Part No. a" cect cation 8 300 mil (7.62mm) | AXS608309C 8 300 mil (7.62mm) | AXS608309S 50 pcs. 300 pes. 14 300 mil (7.62mm) | AXS614309C 14 300 mil (7.62mm) | AXS614309S 25 pcs. 300 pes. 70 300 mil (7.62mm) | AXS620309C 20 300 mil (7.62mm) | AXS620309S 25 pes. 300 pes. 375 mil (9.53mm) | AXS620319C 375 mil (9.53mm) | AXS620319S 25 pcs. 300 pes. 24 300 mil (7.62mm) | AXS624309C 24 300 mil {7.62mm) | AXS624309S 25 pes. 300 pes. Standard | 375 mil (9.653mm) | AXS628319C 5 pes. 500 pes. Standard | 375 mil (9.53mm) | AXS628319S 20 pes. 300 pes. og | tame 450 mil (11.43mm) | AXS628329C (2 Sockets i) (100 packs) og tame 450 mil (11.43mm) | AXS628329S 20 pcs. 300 pes. ponterng 450 mil (11.43mm) | AXS628C329C ponterns 450 mil (1.4mm) | AXxS628C329S 20 pes. 300 pes. 32 450 mil (11.43mm) | AXS632329C 42 450 mil (11.43mm) ; AXS632329S 20 pcs. 300 pes. 525 mil (13.34mm) | AXS632339C 525 mil (13.34mm) . AXS632339S 20 pes. 300 pes. 40 525 mil (13.34mm) | AXS640339C 40 525 mil (13.34mm) ; AXS640339S 15 pcs. 300 pcs. 44 600 mil (15.24mm) | AXS644349C 44 600 mil (15.24mm) | AXS644349S 15 pes. 300 pes. Socket body e Frame No. of Nominal P. Tube package Vinyl bag : : art No. contacts dimensions No. of Nominal Packing quantity Packing quantity 8 300 mil (7.62mm) | AXS608109P contacts dimensions Part No. Stick Outer Part No. Vinyl Outer 14 300 mil (7.62mm) | AXS614109P carton package carton 20 300 mil (7.62mm) | AXS620109P 8 300 mil (7.62mm) | AXS60820 50 pes. 300 pcs. | AXS60820V 500 pcs. | 2,000 pcs. 375 mil (9.53mm) | AXS620119P 14 300 mil (7.62mm) | AXS61420 25 pes. | 300pcs. | AXS61420V 500 pcs. | 2,000 pcs. 24 300 mil (7.62mm) | AXS624109P 30 300 mil (7.62mm) | AXS62020 25 pes. | 300 pcs. | AXS62020V 500 pes. | 2,000 pcs. ng | Standard | 375 mil_(9.53mm) | AXS628119P 375 mil (9.53mm) | AXS62021 25 pcs. | 300pces. | AXS62021V 500 pes. | 2,000 pcs. frame 450 mil (11.43mm) | AXS628129P 24 300 mil (7.62mm) | AXS62420 25 pes. | 300 pes. | AXS62420V 500 pes. | 2,000 pcs. 42 450 mil (11.43mm) | AXS632129P _ Standard | 375 mil (9.53mm) | AXS62821 25 pes. 300 pes. | AXS62821V 600 pcs. | 2,000 pcs. 525 mil (13.34mm) | AXS632139P ng | fame 450 mil (11.43mm) | AXS62822 20 pcs. | 300 pcs. | AXS62822V 500 pes. | 2,000 pcs. 40 $25 mil (13.34mm) | AXS640139P Centering | 450 mil (11.43mm) | AXS628C22 | 20pcs. | 300 pcs. | AxS628C22V | 500 pcs. | 2,000 pes. 44 600 mil (15.24mm) | AXS644149P frame 30 450 mil (11.43mm) | AXS63222 25 pcs. | 300 pcs. | AXS63222V 500 pes. | 2,000 pcs. Standard packing quantity: 3,000 pcs./lot. 525 mil (13.34mm) | AXS63223 20 pes. 300 pes. | AXS63223V 500 pes. | 2,000 pes. ; ; / 40 525 mil (13.34mm) | AXS64023 15 pes. | 300 pcs. | AXS64023V 500 pcs. | 2,000 pcs. Note: Tre socket that for 28 pin standard tran 44 600 mil (15.24mm) | AXS64424 | 15pcs. | 300 pcs. | AxSe4424V | 500 pcs. | 2,000 pcs. Common ordering number is AXS628129P. Note: The centering frame is used to secure small IC chips which cannot be secured with the standard frame (it has projections in the center). The standard frame is colored creamy gray and the centering frame is colored sky gray for easy identification. 45AXS(6) DATA 1. Distribution of initial contact resistance Sample: 280 terminais 2. Heat resistance test (body and frame attached) Sample: 40 terminals Conditions: Ambient temperature 95C +5C. 3. Thermal shock test (body and frame attached) Sample: 40 terminais Conditions: As shown in figure below = Quantity 6 7 8 9 10 11 12 13 14 15 16 (mQi ~ = Change of contact resistance, mQ Initial 100 200 300 400 500 (hours) ssc 5 min - miax. L390 min} #30 me prmercen cycle ee 25C -65C ~ Change of contact resistance, mQ Initial 50 100 | (cycles) 4. Humidity test (body and frame attached) Sampie: 40 terminals Conditions: Ambient temperature 40C 2C, humidity 90 to 95% RH 5. SO, test (body and frame attached) Sample: 40 terminais Conditions: Gas concentration 10ppm+3ppm, temperature 40C +2C, humidity 90 to 95% RH 6. H.S test (body and frame attached) Sample: 40 terminals Conditions: Gas concentration 3ppm+1 ppm, temperature 40C +2C, humidity 75 to 80% RH ~~ Change of contact resistance, m2. Initial 100 200 300 400 500 (hours) ~~ Change of contact resistance, m2. Initial 100 200 300 400 500 (hours) = Change of contact resistance, mO. Max x Min initial 100 200 300 400 500 (hours) 7. Saltwater spray test (body and frame attached) Sample: 40 terminais Conditions: Saltwater concentration 5%+1%, ambient temperature 35C +1C, continuous spraying ~-~ Change in contact resistance CONTACT RESISTANCE MEASUREMENT The test sample was connected as shown in the figure below. Initial 50 100 (hours) 46AXS(6) mm General to! lerance +0.3 DIMENSIONS A- p_ 3-0.15 1.272018 0.185 Recommended PC board pattern (mounting pad layout) @ 300 mil (7.62mm) 0.98 8, 14, 20, 24 contacts Be! + 1) Socket body Te 1279 abe 0765" fp a rn 4 nooougoooon * La | | 9.4"9" sent , i 6 mnax. 5 Ee 1.27 20.08 ee OOooogmoo000 a - 2. x we Dimension table (mm) wR we Terminal flatness No. of contacts A B et 8 9.15 | 3.81 x 14 12.96 | 7.62 ts 20 16.77 | 11.43 24 19.31 | 13.97 2) IC chip mounted on socket body (8, 20, 24 contacts) __ a _ | CTY T Dimension table (mm) No. of contacts A 8 9.95 a ia78 20 17.57 24 20.11 375 mil (9.53mm) 20, 28 contacts 1) Socket body 0.4520" + : 0.45*0" (Bze"5) ~ 0.185 1.27205 rot 11,483 Recommended PC board pattern (mounting pad layout) oF poonnei 0. 7679) whe I 8.50 max. a no nan _nonog0og000000 3.9 Dimension table (mm) 210.15 No. of Terminal flatness contacts A B 20 16.77 | 11.43 28 21.85 | 16.51 Dimension table (mm) No. of contacts B 20 17.87 | 4.30 28 | 22.95 4.50 47AXS(6) @ 450 mil (11.43mm) 28, 32 contacts 1) Socket body . PTH Ae tuks 0.4520! me pte 4.27205: q pt Terminal flatness mm General tolerance +0.3 Recommended PC board pattern (mounting pad layout) Bo! - 4.27298 0.7673" bocea ae | Dr 9.7 max. Conoo" | soooondi ooooo00 Dimension table (mm) No. of contacts A B c D E F 28 21.85 | 16.51 | 12.70 | 13.10 | 11.02 3.65 General tolerance +0.3 32 24.39 | 19.05 | 12.89 | 13.30 11.25 | 3.90 2) IC chip mounted on socket body i B | Dimension table (mm) { No. of contacts A B c 28 22.65 ; 12.83 4.15 32 | 25.49 | 13.92 | 4.58 rt Cc 525 mil (13.34mm) 32 contacts 1) Socket body pee] [| Terminal flatness Recommended PC board patiern (mounting pad layout) 19.057" 1.272005 4}+ 0.76-3" wh ooooo0o pooconar + + | | | 15.270 ' 11.6 max. 1.275005 oooonooggooooon 2) IC chip mounted on socket body 15.54 25.19 48AXS(6) @525 mil (13.34mm) 40 contacts 1) Socket body (40 contacts) mm General tolerance +0.3 Recommended PC board pattern (mounting pad layout) 24,.13701 4 1,2770.08 0.7673" 4 ooocoooooepooooCO0N8 } | 15.23' 11.6 max. map pe 1.272005 nooooo0ooo#ooooK0000 2) IC chip mounted on socket body 32.22 I 17 i |f i |e | s | CLES rood 600 mil (15.24mm) 44 contacts Recommended PC board pattern 1) Socket body ne eee oo {mounting pad layout) 4.272015 _r| 0.45*" 0.45! 1.272045 ~ (26.6770) ____-+} b+-______-- 26.67**" dnononnnjanononnn noomntpmmnconr Terminal flatness 2) IC chip mounted on socket body Note) Specifications described in this page are subject to change without notice. For details, please consult us.AXS(6) EMBOSS TAPE AND REEL mm Tape dimensions (Conforming to JIS C 0806-1990) Reel dimensions (Conforming to JIS C 0806-1990) Ato3 8 1.75 E% ! bec . 0 | Top cover tape 4 : r g Embossed carrier tape 8 _ rier | Sly te epee 2 \._ Embossed mounting hole a $1.53" Dimension Table (mm) Contact Nominal dimension Model No. A B c D E F Quantity count per reel 8 300 mil (7.62mm) AXS608109P 32.0 28.4 14.2 12.0 32.4 $330 1,000 pcs. 28 450 mil (11.43mm) AXS628129P 32.0 28.4 14.2 16.0 32.4 $330 1,000 pcs. 32 525 mil (13.34mm) AXS632139P 44.0 40.4 20.2 24.0 44.4 380 1,000 pes. Notes: 1. The above table only describes the main types. Please contact us regarding other types. 2. Dimensional figures supplied upon request. Socket Orientation with Respect to Direction of Embossed Tape Progress Direction of tape progress Type All products Socket Notch oriented on this side. FRAME INSTALLATION PROCEDURE 1. Place IC on the IC socket, put your finger on top of the IC and gently push and pull it along the longer side. Make sure the IC vibrates slightly in the socket as you push and pull it. 3. Snap the frame in the socket with your two thumbs and be sure to keep the frame in a horizontal position. Take care not to touch the top of the IC with your fingers. 2. Place a frame on the socket. Hold the frame with your two fingers and gently push and pull it along the longer side. Make sure the frame vibrates on the socket as you push and pull it. Se 4. Press each corner of the frame with your thumb or index finger to make sure the claws properly contact the socket. 5. To be sure, check visually from one side of the socket that the claws properly contact the socket. Same gap is 50AXS(6) [ Vendor-Classified Compatibility List for SOP IC Sockets The contents of this compatibility list are valid as of February, 1993. Please consult us for compatibility with other IC models. No. of Nominal dimensions Applicable ICs (IC maker: Part N contacts pplicable ICs maker: Part No.) 8 300 mil e FUJITSU: FPT-8P-MO1 TI: PS008 NEC: P8GH-50-300B1 NEC: P14GM-50-300B-2 HITACHI: FP-14D, FP-14DA 14 300 mil MITSUBISHI: 14P2W FUJITSU: FPT-14P-M04 * TOSHIBA: SOP14-P-300 MOTOROLA: 751A-02 #Tl: PS014 300 mil * NEC: P20GM-50-300B, C-2 HITACHI: FP-20DA, FP-20-DN 20 * MEC: SONF-20D 375 mil * NEC: P20GT-50-375B-2, P20GM-50-375B-3 FUJITSU: FPT-20P-M02 * MOTOROLA: 751D-03 24 300 mil * NEC: P24GM-50-300B-2 375 mil e NEC: P28GM-50-375B-2, P28GT-50-375B-2 e FUJITSU: FPT-28P-M01 MITSUBISHI: 28P2V-A MOTOROLA: 751F-02 28 Standard frame | TOSHIBA: SOP28-P-450 OKI IC: SOP28-P-430-K 450 mil * NEC: P28GM-50-450A1-2, P28GM-50-450A2-2 MEC: SOP028-P-0425 Centering frame} HITACHI: FP-28D, FP-28-DA SHARP: SOP28-P-450 e MITSUBISHI: 28P2W-A, 28P2W-C, 28P2W 450 mil e FUJITSU: FPT-32P-M02 * TOSHIBA: SOP32-P-450 30 * NEC: S32GM-50-525A-2 HITACHI: FP-32D 525 mil e MITSUBISHI: 32P2M-A e FUJITSU: FPT-32P-M03 . # TOSHIBA: SOP32-P-525 * OKI: SOP32-P-525-K 40 525 mil # HITACHI: FP-40D MITSUBISHI: 40P2M-A 44 600 mil e NEC: P44GX-50-600A e INTEL: 231369-80 Difference between Standard and Centering Frames The centering frame is used to secure {Cs which are too small to be secured with the standard frame. The centering frame has inward projections in the center portion. For easy identification, the centering frame is a sky gray color, whereas the standard frame is a creamy gray color. Standard Frame Centering frame |__| an (Creamy gray) (Sky gray) NOTES 1. Use a screen thickness of 0.2mm or 0.3mm during cream solder print- ing. 2. Perform soldering using infrared reflow at a peak surface temperature of the PC board not to exceed 245C. Recommended conditions for the reflow temperature profile are shown in the figure below. Temperature Peak temperature 245C or less : Preheating 150+10C 7 i 60 to 120 seconds -_>4 Time Recommended conditions for reflow temperature profile 3. Manuai soldering the SO packages @ Soldering iron and solder Use a small capacity soldering iron with a narrow tip and thin wire solder. Example) Capacity: 100V AC 15W Tip diameter: 1.0 to 1.2mm Tip shape: See figure on right Wire solder diameter: 0.6 to 0.8mm Soldering time Perform soldering quickly. Solder within 5 seconds using the soldering iron specified above. @ Soldering lf soldering is performed as shown below, there will be no danger of flux entry or plastic melting. Hold wire solder so tip touches here Keep angle as small as possible \ up to 45 b 7 T POUL ff l / Board, Pattern 4, If the ICs pin pitch is uneven, it might not fit into the socket or the IC may become damaged. Check the ICs pin pitch before insertion. 5. When setting the frame by hand, lock all arms to the socket body at the same time. Same time In case of 40, 44 contacts, there is a posibility that the frame is not firmly locked because of its swell in the middle. Please press by finger into the = marked direction shown in the following figure. 6. When removing the frame, use the special tool available from us designed for that purpose. When replacing an IC, be sure to use the special frame removal tool available from us. Do not apply excessive dis- placement to the arms on the frame. Doing so may result in damage. 7. Do not bend the pins. Doing so may result in damage. 8. Do not pull the pins with excessive force. Doing so may cause them to come off. 51