SKY77166 POWER AMPLIFIER MODULE FOR CDMA2000 (450-460 MHZ) ADVANCE DATA SHEET
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
200466A • Skyworks Proprietary and Confidential information. • Products and product information are subject to change without notice. • December 6, 2007 7
Figure 6. Pad Names and Configuration (Top View)
Figure 7. Typical Case Markings – 4 x 4 mm Package
Package and Handling Information
Because of its sensitivity to moisture absorption, this device
package is baked and vacuum-packed prior to shipment.
Instructions on the shipping container label must be followed
regarding exposure to moisture after the container seal is broken,
otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
The SKY77166 is capable of withstanding an MSL3/250 °C solder
reflow. Care must be taken when attaching this product, whether
it is done manually or in a production solder reflow environment.
If the part is attached in a reflow oven, the temperature ramp rate
should not exceed 3 °C per second; maximum temperature
should not exceed 250 °C. If the part is manually attached,
precaution should be taken to insure that the part is not subjected
to temperatures exceeding 250 °C for more than 10 seconds. For
details on attachment techniques, precautions, and handling
procedures recommended by Skyworks, please refer to Skyworks
Application Note: PCB Design and SMT Assembly/Rework,
Document Number 101752. Additional information on standard
SMT reflow profiles can also be found in the JEDEC Standard
J-STD-020.
Production quantities of this product are shipped in the standard
tape-and-reel format. For packaging details, refer to Skyworks
Application Note: Tape and Reel Information – RF Modules,
Document Number 101568.
Electrostatic Discharge Sensitivity
The SKY77166 is a Class 2 device. Figure 8 lists the Electrostatic
Discharge (ESD) immunity level for each non-ground pad of the
SKY77166 product. The numbers in Figure 8 specify the ESD
threshold level for each pad where the I-V curve between the pad
and ground starts to show degradation.
The ESD testing was performed in compliance with MIL-STD-
883E Method 3015.7 using the Human Body Model. If ESD
damage threshold magnitude is found to consistently exceed
2000 volts on a given pad, this so is indicated. If ESD damage
threshold below 2000 volts is measured for either polarity,
numbers are indicated that represent worst case values observed
in product characterization.
Various failure criteria can be utilized when performing ESD
testing. Many vendors employ relaxed ESD failure standards,
which fail devices only after “the pad fails the electrical
specification limits” or “the pad becomes completely
non-functional”. Skyworks employs most stringent criteria and
fails devices as soon as the pad begins to show any degradation
on a curve tracer.
Figure 8. ESD Sensitivity of Non-Ground Pads (Top View)