This document was generated on 02/27/2021
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number: 0737690100
Status: Active
Overview: HDM Backplane Connector System
Description: HDM Board-to-Board Stacking Header, High Rise Vertical, Press-Fit, Open End Option,
72 Circuits, Stack Height 15.05mm
Documents:
3D Model Product Specification PS-73780-999-001 (PDF)
Drawing (PDF) Packaging Specification PK-70873-0870-001 (PDF)
3D Model (PDF) RoHS Certificate of Compliance (PDF)
General
Product Family Backplane Connectors
Series 73769
Application Backplane, Mezzanine
Component Type PCB Header
Overview HDM Backplane Connector System
Product Name HDM
UPC 800753948020
Physical
Circuits (Loaded) 72
Circuits (maximum) 72
Color - Resin Black
Durability (mating cycles max) 200
First Mate / Last Break No
Guide to Mating Part No
Keying to Mating Part None
Material - Metal Phosphor Bronze
Material - Plating Mating Gold
Material - Plating Termination Tin-Lead
Material - Resin High Temperature Thermoplastic
Net Weight 12.780/g
Number of Columns 12
Number of Pairs Open Pin Field
Number of Rows 6
Orientation Vertical
PC Tail Length 3.50mm
PCB Locator No
PCB Retention None
PCB Thickness - Recommended 1.40mm
Packaging Type Tube
Pitch - Mating Interface 2.00mm
Plating min - Mating 0.762µm
Plating min - Termination 0.381µm
Polarized to PCB No
Stackable Yes
Surface Mount Compatible (SMC) Yes
Temperature Range - Operating -55° to +105°C
Termination Interface: Style Through Hole - Compliant Pin
Electrical
Current - Maximum per Contact 1.0A
Data Rate 1.0 Gbps
Real Signals (per 25mm) 72
Voltage - Maximum 100V AC
Series image - Reference only
EU ELV
Not Relevant
EU RoHS China RoHS
Compliant
REACH SVHC
Not Contained Per -
D(2020)9139-DC (19
Jan 2021)
Halogen-Free
Status
Low-Halogen
For more information, please visit Contact US
China ROHS Green Image
ELV Not Relevant
RoHS Phthalates Not Contained
Search Parts in this Series
73769 Series
Mates With
73632 HDM+ Board-to-Board Daughtercard
Receptacle. 73780 HDM Board-to-Board
Daughtercard Receptacle
Application Tooling | FAQ
Tooling specifications and manuals are
found by selecting the products below.
Crimp Height Specifications are then
contained in the Application Tooling
Specification document.
Global
Description Product #
Backplane Signal
Insertion Module
Press-In Tool for
2.00mm Pitch HDM*
Board-to-Board
Backplane Header
622008502
Solder Process Data
Lead-freeProcess Capability N/A
Material Info
Reference - Drawing Numbers
Packaging Specification PK-70873-0870-001
Product Specification PS-73780-999-001
Sales Drawing SD-73769-001-001
This document was generated on 02/27/2021
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
