TVS Diode Arrays (SPA(R) Diodes) Lightning Surge Protection- SLVU2.8-8 Series SLVU2.8-8 Series 2.8V 30A TVS Array RoHS Pb GREEN The SLVU2.8-8 was designed to protect low voltage, CMOS devices from ESD and lightning induced transients. There is a compensating diode in series with each low voltage TVS to present a low loading capacitance to the line being protected. These robust structures can safely absorb repetitive ESD strikes at 30kV (contact discharge) per IEC 61000-4-2 standard and can safely dissipate up to 30A (IEC 61000-4-5 2nd Edition, tP=8/20s) with very low clamping voltages. Features * ESD, IEC 61000-4-2, 30kV contact, 30kV air Pinout 8 7 6 5 * EFT, IEC 61000-4-4, 40A (5/50ns) * Lightning, IEC 61000-4-5 2nd Edition, 30A (8/20s) * Low capacitance of 2.6pF per line * Low leakage current of 0.1A (MAX) at 2.8V 1 2 Functional Block Diagram Pin 1.3.5.7 3 4 * SOIC-8 (JEDEC MO-012) pin configuration allows for protection of all 4 differential pair for 1GbE * AEC-Q101 qualified * RoHS Compliant and Lead Free * Moisture Sensitivity Level (MSL-1) Applications * 10/100/1000 Ethernet * Analog Inputs * WAN/LAN Equipment * Base Stations * Switching Systems * Desktops, Servers, and Notebooks Pin 2.4.6.8 Additional Information Datasheet (c) 2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/20/16 Resources Samples SP4021 Description TVS Diode Arrays (SPA(R) Diodes) Lightning Surge Protection- SLVU2.8-8 Series Thermal Information Absolute Maximum Ratings Parameter Peak Pulse Power (tP=8/20s) Rating Units 750 W Storage Temperature Range Peak Pulse Current (tP=8/20s) Parameter Rating Units -55 to 150 C 30 A Maximum Junction Temperature 150 C Operating Temperature -40 to 125 C 260 C Storage Temperature -55 to 150 C Maximum Lead Temperature (Soldering 20-40s) CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP = 25C) Parameter Symbol Test Conditions VRWM IR1A (Each Line) Reverse Breakdown Voltage VBR IT=2A (Each Line) 3.0 V Snapback Voltage VSB ISB=50mA 2.8 V Reverse Leakage Current ILEAK VR=2.8V (Each Line) 0.1 A VC IPP=5A, tP=8/20s (Each Line) IPP=24A, tP=8/20s (Each Line) 8.5 17 V Reverse Standoff Voltage Clamping Voltage1 Min IEC61000-4-2 (Contact) 30 IEC61000-4-2 (Air) 30 Typ ESD Withstand Voltage1 VESD Dynamic Resistance2 RDYN TLP tp=100ns, (Each Line) 0.3 CD VR=0V, f=1MHz (Each Line) 2.6 Diode Capacitance 1 Max Units 2.8 V kV 3.0 pF Note: 1 Parameter is guaranteed by design and/or device characterization. 2 Transmission Line Pulse (TLP) test setting : Std.TDR(50),tp=100ns, tr=0.2ns ITLP and VTLP averaging window: star t1=70ns to end t2=80ns Clamping Voltage vs. Peak Pulse Currennt (Each line) Capacitance vs. Reverse Bias (Each line) 4.0 30 25 3.0 Clamp Voltage-VC (V) &DSDF LWDQFH S) 3.5 2.5 2.0 1.5 1.0 0.5 0 0 0.4 0.8 1.2 1.6 Bias Voltage (V) 2 2.4 2.8 20 15 10 5 0 0 5 10 15 20 25 30 Peak Pulse Current-I PP (A) (c) 2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/20/16 TVS Diode Arrays (SPA(R) Diodes) Lightning Surge Protection- SLVU2.8-8 Series Negative Transmission Line Pulsing (TLP) Plot (Each line) 35 30 30 25 20 15 20 SP4021 25 TLP Current (A) TLP Current (A) Positive Transmission Line Pulsing (TLP) Plot (Each line) 15 10 10 5 5 0 0 0 5 10 15 -20 20 -15 -10 TLP Volts (V) 8/20 s Pulse Waveform 100% Percent of IPP 90% 80% 70% 60% 50% 40% 30% 20% 10% 5.0 0 Product Characteristics 110% 0% 0.0 -5 TLP Volts (V) 10.0 15.0 20.0 25.0 30.0 Lead Plating Matte Tin Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substrate material Silicon Body Material V-0 per UL 94 Molded Epoxy Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. All specifications comply to JEDEC SPEC MO-203 Issue A 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. Package surface matte finish VDI 11-13. Time (s) Soldering Parameters Pre Heat Pb - Free assembly - Temperature Min (Ts(min)) 150C - Temperature Max (Ts(max)) 200C - Time (min to max) (ts) 60 - 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 5C/second max TS(max) to TL - Ramp-up Rate 5C/second max Reflow - Temperature (TL) (Liquidus) - Temperature (tL) 217C 60 - 150 seconds Peak Temperature (TP) 260+0/-5 C Time within 5C of actual peak Temperature (tp) 20 - 40 seconds Ramp-down Rate 5C/second max Time 25C to peak Temperature (TP) 8 minutes Max. Do not exceed 260C (c) 2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/20/16 tP TP Temperature Reflow Condition Critical Zone TL to TP Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) 25 tS time to peak temperature Time Ordering Information Part Number Package Min. Order Qty. SLVU2.8-8BTG SOIC-8 2500 TVS Diode Arrays (SPA(R) Diodes) Lightning Surge Protection- SLVU2.8-8 Series Part Numbering System Part Marking System 8 7 6 5 SLVU2.8 -8 B T G G= Green T= Tape & Reel Package LF SLVU2.8-8BTG xxxxxxxxx B = SOIC-8 Series No. of channels 1 2 3 4 DATE CODE Package Dimensions -- Mechanical Drawings and Recommended Solder Pad Outline Package SOIC-8 Pins 8 JEDEC MS-012 Millimetres LF o Recommended Soldering Pad Outline (Reference Only) Inches Min Max Min Max A 1.35 1.75 0.053 0.069 A1 0.10 0.25 0.004 0.010 A2 1.25 1.65 0.050 0.065 B 0.31 0.51 0.012 0.020 c 0.17 0.25 0.007 0.010 D 4.80 5.00 0.189 0.197 E 5.80 6.20 0.228 0.244 E1 3.80 4.00 0.150 0.157 1.27 BSC e L 0.050 BSC 1.27 0.40 0.050 0.016 Embossed Carrier Tape & Reel Specification -- SOIC Package User Feeding Direction Pin 1 Location Symbol Millimetres Inches Min Max Min Max E 1.65 1.85 0.065 0.073 F 5.4 5.6 0.213 0.22 P2 1.9 2.1 0.075 0.083 D 1.5 1.6 0.059 0.063 1.50 Min D1 P0 10P0 W 3.9 0.059 Min 4.1 40.0 +/- 0.20 11.9 12.1 0.154 0.161 1.574 +/- 0.008 0.468 0.476 P 7.9 8.1 0.311 0.319 A0 6.3 6.5 0.248 0.256 B0 5.1 5.3 0.2 0.209 K0 2 2.2 0.079 0.087 t 0.30 +/- 0.05 0.012 +/- 0.002 (c) 2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/20/16