964976-8 - TE CONNECTIVITY

TLP785,TLP785F

1 2019-03-11

Toshiba Electronic Devices & Storage Corporation

1

2

3

4

1 : Anode

2 : Cathode

3 : Emitter

4 : Collector

TOSHIBA Photocoupler IRED & Photo−Transistor

TLP785, TLP785F

Office Equipment

Home Electric Appliances

Solid-State Relays

Switching Power Supplies

Contactless Controller Outputs

Simplex/Multiplex Data Transmission

The TOSHIBA TLP785 consists of a silicone phototransistor optically

coupled to an infrared emitting diode in a four lead plastic DIP (DIP4) with

having high isolation voltage

(AC: 5000 Vrms (min)).

TLP785F is a lead forming type for the long creepage surface mounting

of TLP785.

• TLP785: 7.62 mm pitch type DIP4

• TLP785F: 10.16 mm pitch type DIP4

• Collector-emitter voltage: 80 V (min)

• Current transfer ratio: 50% (min)

Rank GB: 100% (min)

• Isolation voltage: 5000 Vrms (min)

• UL-recognized : UL 1577, File No.E67349

• cUL-recognized :CSA Component Acceptance Service No.5A

File No.E67349

• VDE-approved : EN 60747-5-5 (Note 1)

• CQC-approved: GB4943.1, GB8898 China Factory

• SEMKO-approved : EN 62368-1

Note 1 : When a VDE approved type is needed,

please designate the Option(D4).

• Construction mechanical rating

7.62 mm Pitch

Standard Type

10.16 mm Pitch

TLPxxxF Type

Creepage distance 7.0 mm (min) 8.0 mm (min)

Clearance 7.0 mm (min) 8.0 mm (min)

Insulation thickness 0.4 mm (min) 0.4 mm (min)

Inner creepage distance 4.0 mm (min) 4.0 mm (min)

Unit:

mm

TOSHIBA

11-5L1

Weight: 0.25 g (typ.)

Unit:

mm

TOSHIBA

11-5L102

Weight: 0.25 g (typ.)

TLP785

TLP785F

Pin Configurations (top view)

Start of commercial production

2010-11

TLP785,TLP785F

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Current Transfer Ratio (Note)

Type Classification

(Note 1)

Current Transfer Ratio (%)

(IC / IF)

Marking of Classification

IF = 5mA, VCE = 5V, Ta = 25°C

Min

Max

TLP785

None 50 600 Blank

Rank Y 50 150 YE

Rank GR 100 300 GR

Rank BL 200 600 BL

Rank GB 100 600 GB

Rank YH 75 150 Y+

Rank GRL 100 200 G

Rank GRH 150 300 G+

Rank BLL 200 400 B

Note 1: e.g. rank GB: TLP785 (GB)

Note: Application type name for certification test, please use standard product type name, e.g.

TLP785 (GB): TLP785

Absolute Maximum Ratings (Note) (Ta = 25°C)

Characteristics Symbol Rating Unit

LED

Forward current IF 60 mA

Forward current derating (Ta ≥ 39°C) ΔIF / °C −0.7 mA / °C

Pulse forward current (Note 2) IFP 1 A

Power dissipation PD 90 mW

Power dissipation derating (Ta ≥ 39°C) ΔPD / °C −0.9 mW / °C

Reverse voltage VR 5 V

Junction temperature Tj 125 °C

Detector

Collector−emitter voltage VCEO 80 V

Emitter−collector voltage VECO 7 V

Collector current IC 50 mA

Power dissipation (single circuit) PC 150 mW

Power dissipation derating

(Ta ≥ 25°C) ΔPC / °C −1.5 mW / °C

Junction temperature Tj 125 °C

Operating temperature range Topr −55 to 110 °C

Storage temperature range Tstg −55 to 125 °C

Lead soldering temperature (10 s) Tsol 260 °C

Total package power dissipation PT 240 mW

Total package power dissipation derating

(Ta ≥ 25°C) ΔPT / °C −2.4 mW / °C

Isolation voltage (Note 3) BVS 5000 Vrms

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the

significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even

if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum

ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test

report and estimated failure rate, etc).

Note 2: Pulse Width: 100 μs or less, 100 Hz frequency

Note 3: AC, 60 s., R.H. ≤ 60%. Apply voltage to LED pin and detector pin together.

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Recommended Operating Conditions (Note)

Characteristics Symbol Min Typ. Max Unit

Supply voltage VCC ― 5 24 V

Forward current IF ― 16 25 mA

Collector current IC ― 1 10 mA

Operating temperature Topr −25 ― 85 °C

Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the

device. Additionally, each item is an independent guideline respectively. In developing designs using this

product, please confirm specified characteristics shown in this document.

Individual Electrical Characteristics (Ta = 25°C)

Characteristics Symbol Test Condition Min Typ. Max Unit

LED

Forward voltage VF IF = 10 mA 1.0 1.15 1.3 V

Reverse current IR VR = 5 V ― ― 10 μA

Capacitance CT V = 0 V, f = 1 MHz ― 30 ― pF

Detector

Collector−emitter

breakdown voltage V(BR) CEO IC = 0.5 mA 80 ― ― V

Emitter−collector

breakdown voltage V(BR) ECO IE = 0.1 mA 7 ― ― V

Collector dark current ID(ICEO)

VCE = 24 V ― 0.01 0.1 μA

VCE = 24 V ,Ta = 85 °C ― 0.6 50 μA

Capacitance (collector to emitter) CCE V = 0 V, f = 1 MHz ― 6 ― pF

Coupled Electrical Characteristics (Ta = 25°C)

Characteristics Symbol Test Condition Min Typ. Max Unit

Current transfer ratio IC / IF

IF = 5 mA, VCE = 5 V

Rank GB

50 ― 600

%

100 ― 600

Saturated CTR IC / IF (sat)

IF = 1 mA, VCE = 0.4 V

Rank GB

― 60 ―

%

30 ― ―

Collector−emitter saturation voltage VCE (sat)

IC = 2.4 mA, IF = 8 mA ― ― 0.4

V

IC = 0.2 mA, IF = 1 mA

Rank GB

― 0.2 ―

― ― 0.4

Isolation Characteristics (Ta = 25°C)

Characteristics Symbol Test Condition Min Typ. Max Unit

Capacitance (input to output) CS VS = 0 V, f = 1 MHz ― 0.8 ― pF

Isolation resistance RS VS = 500 V, R.H. ≤ 60 % 1×1012 1014 ― Ω

Isolation voltage BVS AC, 60 s 5000 ― ― Vrms

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Switching Characteristics (Ta = 25°C)

Characteristics Symbol Test Condition Min Typ. Max Unit

Rise time tr

VCC = 10 V, IC = 2 mA

RL = 100 Ω

― 2 ―

μs

Fall time tf ― 3 ―

Turn−on time ton ― 3 ―

Turn−off time toff ― 3 ―

Turn−on time ton

RL = 1.9 kΩ (fig. 1)

VCC = 5 V, IF = 16 mA

― 1.5 ―

μs

Storage time ts ― 25 ―

Turn−off time toff ― 50 ―

Surface-Mount Lead Form Option

TOSHIBA 11-5L107

Weight: 0.25 g (typ.)

TOSHIBA 11-5L106

Weight: 0.24 g (typ.)

Unit: mm

TLP785(LF6)

TLP785F(LF7)

Unit: mm

IF

VCE

V

CC

ton

4.5

V

0.5 V

toff

t

s

VCC

V

CE

IF

R

L

fig. 1: Switching time test circuit

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Toshiba Electronic Devices & Storage Corporation

Option: Specifications for Embossed-Tape Packing; (TP6) / (TP7)

1. Applicable Package

Package Name Product Type

DIP4LF6 TLP785

DIP4LF7 TLP785F

2. Product Naming System

Type of package used for shipment is denoted by a symbol suffix after a product number. The method of

classification is as below.

(Example1)

TLP785 (BL−TP6,F

[[G]]/RoHS COMPATIBLE(Note)

Tape type

CTR Rank

Device name

(Example2)

TLP785F (BL−TP7,F

[[G]]/RoHS COMPATIBLE(Note)

Tape type

CTR Rank

Device name

Note: Please contact your Toshiba sales representative for details on environmental information such as the product's

RoHS compatibility.

RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the

restriction of the use of certain hazardous substances in electrical and electronics equipment.

3. Tape Dimensions

3.1 Orientation of Device in Relation to Direction of Tape Movement

Device orientation in the recesses is as shown in Figure 2.

Figure2 Device Orientation

3.2 Tape Packing Quantity:2000 devices per reel

Tape feed

P

1pin indication

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3.3 Empty Device Recesses Are as Shown in Table 1.

Table1 Empty Device Recesses

Standard Remarks

Occurrences of 2 or more

successive empty device

recesses

0 device

Within any given 40mm section of

tape, not including leader and trailer

Single empty device

recesses 6 devices (max) per reel Not including leader and trailer

3.4 Start and End of Tape

The start of the tape has 30 or more empty holes. The end of the tape has 50 or more empty holes.

3.5 Tape Specification

[1] TLP785(TP6) / TLP785F(TP7)

･Tape material: Synthetic Resin

･Dimensions: The tape dimensions are as shown in Figure 3.

Figure 3 Tape Forms

TP6 Type

TP7 Type

A

5.1±0.1

5.05±0.1

B

10.6±0.1

12.35±0.1

W

16.0±0.3

24.0±0.3

F

7.5±0.1

11.5±0.1

T

4.2±0.15

4.4±0.1

Unit: mm

TLP785,TLP785F

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Toshiba Electronic Devices & Storage Corporation

3.6 Reel Specification

[1] TLP785(TP6) / TLP785F(TP7)

･Material: Synthetic Resin

･Dimensions: The reel dimensions are as shown in Figure 4.

Figure 4 Reel Forms

4. Packing

Two reels of photocouplers are packed in a shipping carton.

5. Label Indication

The carton bears a label indicating the product number, the symbol representing classification of standard, the

quantity, the lot number and the Toshiba company name.

6. Ordering Information

When placing an order, please specify the product number, the CTR rank, the tape type and the quantity as

shown in the following example.

(Example)

TLP785(BL−TP6,F 4000pcs.

Quantity (must be a multiple of 4000)

[[G]]/RoHS COMPATIBLE(Note 1)

Tape type

CTR Rank

Device name

Note: The order code may be suffixed with a letter or a digit.

Please contact your nearest Toshiba sales representative for more details.

Note 1: Please contact your Toshiba sales representative for details on environmental information such as the product's

RoHS compatibility.

RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the

restriction of the use of certain hazardous substances in electrical and electronics equipment.

W1

W2

φ330 max

φ100±1.5

φ13.0±0.5

4.0±0.5

2.0±0.5

Unit: mm

TP6 Type TP7 Type

W1

16.5ｔｙｐ 24.4typ

W2 23max 30.4max

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7. Soldering and Storage

7.1. Precautions for Soldering

The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective of

whether a soldering iron or a reflow soldering method is used.

 When using soldering reflow

The soldering temperature profile is based on the package surface temperature.

(See the figure shown below, which is based on the package surface temperature.)

Reflow soldering must be performed once or twice.

The mounting should be completed with the interval from the first to the last mountings being 2 weeks.

Fig. 7.1 An Example of a Temperature Profile When Lead(Pb)-Free Solder Is Used

 When using soldering flow

Preheat the device at a temperature of 150 °C (package surface temperature) for 60 to 120 seconds.

Mounting condition of 260 °C within 10 seconds is recommended.

Flow soldering must be performed once.

 When using soldering Iron

Complete soldering within 10 seconds for lead temperature not exceeding 260 °C or within 3 seconds not

exceeding 350 °C

Heating by soldering iron must be done only once per lead.

7.2. Precautions for General Storage

 Avoid storage locations where devices may be exposed to moisture or direct sunlight.

 Follow the precautions printed on the packing label of the device for transportation and storage.

 Keep the storage location temperature and humidity within a range of 5°C to 35°C and 45% to 75%,

respectively.

 Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty

conditions.

 Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during

storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the solderability

of the leads.

 When restoring devices after removal from their packing, use anti-static containers.

 Do not allow loads to be applied directly to devices while they are in storage.

 If devices have been stored for more than two years under normal storage conditions, it is recommended

that you check the leads for ease of soldering prior to use.

TLP785,TLP785F

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Toshiba Electronic Devices & Storage Corporation

EN 60747-5-5 ‘Option: (D4)’

Attachment: Specification for EN 60747-5-5 option: (D4)

Types: TLP785, TLP785F

Type designations for ‘option: (D4) ’, which are tested under EN 60747 requirements.

e.g.: TLP785(D4-GR-LF6,F D4: EN 60747 option

GR: CTR rank name

LF6: standard lead bend name

F: [[G]]/RoHS COMPATIBLE(Note 1)

Note: Use TOSHIBA standard type number for safety standard application.

e.g. TLP785(D4-GR-LF6,F  TLP785

Note 1: Please contact your Toshiba sales representative for details on environmental information such as the product's

RoHS compatibility.

RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the

restriction of the use of certain hazardous substances in electrical and electronics equipment.

EN 60747 Isolation Characteristics

Description Symbol Rating Unit

Application classification

for rated mains voltage ≤ 300 Vrms

for rated mains voltage ≤ 600 Vrms

I−IV

I−III

―

Climatic classification

55 / 115 / 21 ―

Pollution degree 2 ―

Maximum operating insulation voltage

TLP785

VIORM

890

Vpk

TLP785F 1140

Input to output test voltage,

Vpr = 1.6×VIORM, type and sample test

tp = 10 s, partial discharge < 5pC

TLP785

Vpr

1424

Vpk

TLP785F 1824

Input to output test voltage,

Vpr = 1.875×VIORM, 100% production test

tp = 1 s, partial discharge < 5pC

TLP785

Vpr

1670

Vpk

TLP785F 2140

Highest permissible overvoltage

(transient overvoltage, tpr = 60s) VTR 8000 Vpk

Safety limiting values (max. permissible ratings in case of fault)

current (input current) Psi = 0mW

power (output or total power dissipation)

temperature

Isi

Psi

Ts

400

700

175

mA

mW

°C

Insulation resistance, VIO = 500 V, Ta=25°C Rsi ≥1012 Ω

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Insulation Related Specifications

7.62 mm pitch

TLPxxx type

10.16 mm pitch

TLPxxxF type

Minimum creepage distance Cr 7.0 mm 8.0 mm

Minimum clearance Cl 7.0 mm 8.0 mm

Minimum insulation thickness ti 0.4 mm

Comparative tracking index CTI 175

(1) If a printed circuit is incorporated, the creepage distance and clearance may be reduced below this

value. (e.g.at a standard distance between soldering eye centres of 7.5mm). If this is not permissible,

the user shall take suitable measures.

(2) This photocoupler is suitable for ‘safe electrical isolation’ only within the safety limit data.

Maintenance of the safety data shall be ensured by means of protective circuits.

VDE test sign: Marking on product

for EN 60747

Marking on packing

for EN 60747

Marking Example: TLP785, TLP785F

P

4

CTR Rank Marking

Lot No

.

Part No. (or abbreviation code)

4: Mark for option (D4)

1pin indication

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Toshiba Electronic Devices & Storage Corporation

Figure

1 Partial discharge measurement procedure according to EN 60747

Destructive test for qualification and sampling tests.

Method A

(for type and sampling tests,

destructive tests)

t1, t2

t3, t4

tp(Measuring time for

partial discharge)

tb

tini

V

VINITIAL(8kV)

V

pr(1424 V for TLP785)

(1824 V for TLP785F)

V

IORM(890 V for TLP785)

(1140 V for TLP785F)

0

t

1

t

ini

t3

t2

tP

t

b

t4

t

= 1 to 10 s

= 1 s

= 10 s

= 12 s

= 60 s

tP

V

pr

(1670 V for TLP785)

(2140 V for TLP785F)

V

IORM

(890 V for TLP785)

(1140 V for TLP785F)

V

t

t3

t4

tb

Figure

2 Partial discharge measurement procedure according to EN 60747

Non-destructive test for100% inspection.

Method B

(for sample test,non-

destructive test)

t3, t4

tp(Measuring time for

partial discharge)

tb

= 0.1 s

= 1 s

= 1.2 s

Figure

3 Dependency of maximum safety ratings on ambient temperature

500

400

300

200

100

0

25

50

75

100

125

150

175

1000

800

600

400

200

0

Ta (°C)

Psi



 Isi

Isi

(mA)

Psi

(mW)

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I

F

-Ta

P

C

-Ta

F

orward current

IF (mA)

Collector power dissipation P

C (mW)

Ambient temperature Ta (˚C)

∆V

F

/∆Ta- I

F

IF- V F

Forward voltage temperature

coefficient

ΔVF/ΔTa ( m V/°C)

Forward current I

F (mA)

Forward current I

F

(mA)

Forward voltage V

F

(V)

IF P – V F P

Pulse forward current I

FP (mA)

Pulse forward voltage V

FP

(V)

0

20

40

60

80

100

-20 020 40 60 80 100 120

0

40

80

120

160

200

-20 020 40 60 80 100 120

-3

-2.6

-2.2

-1.8

-1.4

-1

-0.6

0.1 110 100

0.1

1

10

100

0.4 0.9 1.4 1.9

1

10

100

1000

00.4 0.8 1.2 1.6 22.4

Pulse width ≤ 10 μs

Repetitive frequency=100 Hz

Ta=25°C

This curve shows the maximum

limit to the forward current.

This curve shows the

maximum limit to the

collector power dissipation.

Ta=25˚C

NOTE: The above characteristics curves are presented for reference only and not guaranteed by production test,

unless otherwise noted.

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ICEO-Ta

I

C

- V

CE

Collector dark current ID

(μA )

Collector current I

C (mA)

Ambient temperature Ta (°C)

Collector-emitter voltage V

CE

(V)

IC- V CE

IC- I F

Collector current I

C (mA)

Collector current I

C (mA)

Collector-emitter voltage V

CE

(V)

IC/IF - I F

Forward current IF (mA)

Current transfer ratio IC / IF (%)

Forward current I

F

(mA)

0.0001

0.001

0.01

0.1

1

10

020 40 60 80 100

0

20

40

60

80

0 2 4 6 8 10

0

10

20

30

40

00.2 0.4 0.6 0.8 11.2

1

10

100

1000

0.1 110 100

5

10

50

30

20

15

Ta=25˚C

IF= 2 mA

Ta=25˚C

5

10

50

30

20

15

IF= 2 mA

VCE=5 V

VCE=0.4 V

Ta=25˚C

VCE =24 V

Ta=25˚C

VCE=5 V

VCE=0.4 V

NOTE: The above characteristics curves are presented for reference only and not guaranteed by production test,

unless otherwise noted.

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I

C

- Ta

V

CE(sat)

- Ta

Collector current I

C (mA)

Collector-Emitter saturation Voltage

VCE(sat) (V)

Ambient temperature Ta (°C)

Ambient temperature Ta ( °C)

Switching time - R

L

Switching time (μs)

Load resistance RL (kΩ)

0.1

1

10

100

-40 -20 020 40 60 80 100

0

0.04

0.08

0.12

0.16

0.2

-40 -20 020 40 60 80 100

1

10

100

1000

110 100

IF=5 mA,

IC=1 mA

IF=0.5 mA

5

1

10

20

t

off

Ta=25˚C

IF=16 mA

VCC=5 V

ts

ton

VCE=5 V

NOTE: The above characteristics curves are presented for reference only and not guaranteed by production test,

unless otherwise noted.

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RESTRICTIONS ON PRODUCT USE

Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as “TOSHIBA”.

Hardware, software and systems described in this document are collectively referred to as “Product”.

• TOSHIBA reserves the right to make changes to the information in this document and related Product without notice.

• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with

TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.

• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are

responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and

systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily

injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the

Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of

all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes

for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the

instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their

own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such

design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,

diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating

parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR

APPLICATIONS.

• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE

EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH

MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT

("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without

limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, lifesaving and/or life supporting medical

equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to

control combustions or explosions, safety devices, elevators and escalators, and devices related to power plant. IF YOU USE

PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your

TOSHIBA sales representative or contact us via our website.

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• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any

applicable laws or regulations.

• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any

infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to

any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.

• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE

FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY

WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR

LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND

LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO

SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS

FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.

• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or

vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.

• Do not use or otherwise make available Product or related software or technology for any military purposes, including without

limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile

technology products (mass destruction weapons). Product and related software and technology may be controlled under the

applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the

U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited

except in compliance with all applicable export laws and regulations.

• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of

Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled

substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES

OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.

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