FAST RECOVERY DIODE 1.1A/100~200V /trr : 30nsec EC11FS1 EC11FS2 FEATURES Miniature Size, Surface Mount Device sy 200) 2 usr) TariRt scary Ultra - Fast Recovery 17 +1681 121,008 TR vTea | | ORCRU LAT Low Forward Voltage Drop ae [a 271.106) OO d | t+ Low Power Loss, High Efficiency High Surge Capability SOLDERLING PAD a o2u 100 Volts through 400 Volts Types Available Lie >" 008 oye Packaged in 12mm Tape and Reel ie Lot angy! 1s O59) 16: (163) Not Rolling During Assembly f 05) OMI THI! e0egy Dimensions in mm (Inches) Approx. Net Weight: 0.06 Grams MAXIMUM RATINGS [\. TYPE Voltage Rating ~ *ECL11FS1 ECLIFS2 Unit Symbol Repetitive Peak V-; Reverse Voltage RRM 100 200 v Non-Repetitive Peak Vv Reverse Voltage RSM 110 220 Vv Electrical Rating Symbol Condition Rating Unit re a Ceramic | 180 rect L Ceramic wave conduction Ta= 25C 1-1 es substrate Average Rectified Io . Tas 34C 1.0 A Output Current | mounted *. | 180 sinusoidal Glass-Epoxy | wave conduction - |. substrate4 - Ta= 25C 0.8 RMS Forward Current | Tp Ms) 1.57 A Peak One-cycle Forward 50Hz half : sine wave, 20 a Tpsm Surge Current non~repetitive fo Operating Junction | T. _ Temperature Range | IW 40 to 150 c Storage Temperature . - Range stg 40 to 150 c ELECTRICAL & THERMAL CHARACTERISTICS Characteristics Symbol Test Condition Max. Unit Peak Forward Voltage Vem Ipm=1.0A T- 25C 0.98 V Peak Reverse Current Ipm VRM= VRRM Ti* 25c 10 uA Reverse Recovery Time tir IpM= 1A ~di/at = 50A/uS Ta= 25C 30 ns . Ceramic substrate mounted* 108 Thermal Resistance, Rth(j-a) L- _ _ C/W junction to ambien Glass-Epoxy substrate mounted * 157 * Substrate Soldering Land= 2x 2mm For spare parts only (TUE Nihon inter Bectronics Corporation 458EC11FS1 EC11FS2 FIG.1-FORWARD CURRENT VS. FORWARD VOLTAGE G2 1.5 INSTANTANEOUS FORWARD CURRENT [A] 2 INSTANTANEOUS FORWARD VOLTAGE (V) FIG.4-AVERAGE FORWARO CURRENT VS. AMBIENT TEMPERATURE Alumina mounted Soldering Lasd 2um[] AVERAGE FORWARD CURRENT (A) AMBIENT TEMPERATURE (C) AVERAGE FORWARD POWER DISSIPATION (W) SURGE FORWARD CURRENT {A} FIG.2-AVERAGE FORWARD POWER DISSIPATION AVERAGE FORWARD CURRENT [A} FIG.5-SURGE CURRENT RATINGS PULSE DURATION [S) 459 AVERAGE FORWARD CURRENT [A) ss FIG.S-AVERAGE FORWARD CURRENT VS. AMBIENT TEMPERATURE 100 125 150 AMBIENT TEMPERATURE (C} (UP Nihon inter Bectronics Corporation