TD62382AFNG(5) - TOSHIBA - Datasheet.Live

TD62382AFNG

2006-06-13

TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic

TD62382AFNG

8ch Low Input Active Darlington Sink Driver

The TD62382AFNG is non-inverting transistor array which is

comprised of eight Low saturation output stages and PNP input

stages.

This device can be operated by source input voltage and is

suitable for operation with a 5-V general purposed logic IC such

as TTL, 5-V CMOS and 5-V Microprocessor which have sink

current output drivers.

Applications include relay, hammer, lamp and LED display

drivers.

Please observe the thermal condition for using.

The suffix (G) appended to the part number represents a Lead

(Pb)-Free product.

Features

• Low Saturation Output : 0.23 V (max)

@ Iout = 40 mA (max)

• Package type: SSOP18 pin (0.65 mm pitch)

• Output rating: 50 V (min)/50 mA (max)

• Low level active input

• Input compatible with TTL and 5-V CMOS

• Standard supply voltage

Pin Assignm en t (top view)

Schematics (each driver)

Note: The input and output parasi t i c diodes cannot be used as cl am p diodes.

Weight: 0.0 9 g (typ.)

1 2 34 5 6 7 8

18 17 16 15 14 13 12 11

O1 O2 O3 O4 O5 O6 O7 O8

I1 I2 I3 I4 I5 I6 I7 I8

VCC

GND

Input 14 kΩ

7 kΩ

VCC

Output

1 kΩ 20 kΩ

TD62382AFNG

2006-06-13

Absolute Maximum Ratings (Ta = 25°C)

Characteristics Symbol Rating Unit

Supply voltage VCC −0.5~7.0 V

Output sustaining voltage VCE (SUS) −0.5~50 V

Output current IOUT 50 mA/ch

Input voltage VIN −22~VCC + 0.5 V

Input current IIN 10 mA

Power dissipation PD (Note) 0.96 W

Operating temperature Topr −40~85 °C

Storage temperature Tstg −55~150 °C

Note: On Glass Epoxy PCB (50 × 50 × 1.6 mm Cu 40%)

Recomm end ed Operating Condi tions (Ta = −40~85°C)

Characteristics Symbol Test Condition Min Typ. Max Unit

Supply voltage VCC ⎯ 4.5 5.0 5.5 V

Output sustaining voltage VCE (SUS) ⎯ 0 ⎯ 50 V

DC 1 Circuit 0 ⎯ 40

Output current IOUT 8 Circuits 0 ⎯ 40

mA/ch

IN ⎯ −20 ⎯ V

Output on VIN (ON) ⎯ −20 ⎯ VCC −

3.5

Input voltage

Outp u t off VIN (OFF) ⎯ VCC −

0.3 ⎯ VCC +

0.5

Power dissipation PD (Note) ⎯ ⎯ ⎯ 0.4 W

Note: On Glass Epoxy PCB (50 × 50 × 1.6 mm Cu 40%)

Electrical Characteristics (Ta = 25°C)

Characteristics Symbol

Test

Circuit Test Condition Min Typ. Max Unit

Output leakage current ICEX 1

VCC = 5.5 V, IIN = 0 A

VOUT = 35 V, Ta = 75°C ⎯ ⎯ 100 µA

Output saturation voltage VCE (sat) 2

VCC = 4.5 V, VIN = 0.8 V

IOUT = 40 mA ⎯ ⎯ 0.23 V

VCC = 5.5 V, VIN = 0.4 V ⎯ −0.32 −0.45

Output on IIN (ON) 3

VCC = 5.5 V, VIN = −20 V ⎯ ⎯ −2.6 mA

Input current

Output off IIN (OFF) 4 ⎯ ⎯ ⎯ −40 µA

Input voltage (Output on) VIN (ON) 5 ⎯ −20 ⎯ VCC −

3.5 V

Output on ICC (ON) V

CC = 5.5 V, VIN = 0 V ⎯ ⎯ 6 mA/ch

Supply current Output off ICC (OFF) 6 VCC = VIN = 5. 5 V

Ta = 75°C ⎯ ⎯ 100 µA

Turn-on delay tON VOUT = 50 V

RL = 1 kΩ ⎯ 0.1 ⎯

Turn-off delay tOFF 7 VCC = 5 V

CL = 15 pF VOUT = 50 V

RL = 1 kΩ ⎯ 3.0 ⎯

µs

TD62382AFNG

2006-06-13

Test Circuit

1. ICEX 2. VCE (sat) 3. IIN (ON)

4. IIN (OFF) 5. VIN (ON ) 6. ICC

7. tON, tOFF

Note 1: Pulse width 50 µs, Duty cycle 10%

Output impedance 50 Ω, tr ≤ 10 ns, tf ≤ 5 ns

Note 2: CL includes probe and jig capacitance.

Precauti ons fo r Using

This IC does not include built-in protection circuits for excess current or overvoltage.

If this IC is subjected to excess current or overvoltage, it may be destroyed.

Hence, the utmost care must be taken when systems which incorporate this IC are designed.

Utmost care is necessary in the design of the output line, VCC and GND line since IC may be destroyed due to

short-circuit between outputs, air contamination fault, or fault by improper grounding.

Input

CL = 15 pF

(Note 2)

(Note 1)

VOUT

Pulse

generator

VCC = 5 V

Output

10% 10% 50%

tON tOFF

VIH = VCC

VOL

Input 50%

90% 90%

50 µs

Output 50% 50%

VCC

VIN (ON)

IOUT

VCC

VIN (OFF)

VCC

VIN

ICC

Open

VIN

VCC

IIN (ON)

VCC

VIN

IOUT

VCE (sat)

VCC ICEX

Open

VOUT

TD62382AFNG

2006-06-13

IOUT – VCE (sat)

VCC – ICC

VIN – VOUT

PD – Ta

IIN – VIN

Output saturation voltage VCE (sat) (V) Supply voltage VCC (V)

Output voltage VOUT (V) Ambient temperature Ta (°C)

Input voltage VIN (V)

Supply cu rre nt ICC (mA)

Output current IOUT (mA)

Power dissipation PD (W)

Input voltage VIN (V)

Input current IIN (mA)

0.240.08

0.04 0.16 0.20 0.12

100

VCC = 5 V

IIN = 0.3 mA

Ta = 25°C typ.

150 100 50

0.5

1.0

1.5 (1) On glass epoxy PCB

(50 × 50 × 1.6 mm Cu 40%)

(1)

−0.2

−0.3

1 4 3

−0.4

−0.1

Ta = 25°C typ.

VCC = 4.5 V

5.0

5.5

26 8

100

Out-pin open

Ta = 25° C typ.

1 bit ON

2 bit ON

3 bit ON

4 bit ON

5 bit ON

6 bit ON

7 bit ON

8 bit ON

3510

5 20 30 15

VCC = 5 V

IIN = 50 mA

Ta = 25°C typ.

TD62382AFNG

2006-06-13

Package Dimensions

Weight: 0.0 9 g (typ.)

TD62382AFNG

2006-06-13

Notes on Contents

1. Equivalent Circuits

The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory

purposes.

2. Test Circuits

Components in the test circuits are used only to obtain and confirm the device characteristics. These

components and circuits are not guaranteed to prevent malfunction or failure from occurring in the

application equipment.

IC Usage Considerati on s

Notes on Handling of ICs

(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be

exceeded, even for a moment. Do not exceed any of these ratings.

Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result

injury by explosion or combustion.

(2) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in

case of over current and/or IC failure. The IC will fully break down when used under conditions that

exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal

pulse noise occurs from the wiring or load, causing a large current to continuously flow and the

breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of

breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are

required.

(3) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the

design to prevent device malfunction or breakdown caused by the current resulting from the inrush

current at power ON or the negative current resulting from the back electromotive force at power OFF.

IC breakdown may cause injury, smoke or ignition.

Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable,

the protection function may not operate, causing IC breakdown. IC breakdown may cause injury,

smoke or ignition.

(4) Do not insert devices in the wrong orientation or incorrectly.

Make sure that the positive and negative terminals of power supplies are connected properly.

Otherwise, the current or power consumption may exceed the absolute maximum rating, and

exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result

injury by explosion or combustion.

In addition, do not use any device that is applied the current with inserting in the wrong orientation

or incorrectly even just one time.

(5) Carefully select external components (such as inputs and negative feedback capacitors) and load

components (such as speakers), for example, power amp and regulator.

If there is a large amount of leakage current such as input or negative feedback condenser, the IC

output DC voltage will increase. If this output voltage is connected to a speaker with low input

withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause

smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied

Load (BTL) connection type IC that inputs output DC voltage to a speaker directly.

TD62382AFNG

2006-06-13

Points to Remember on Handling of ICs

(1) Heat Radiation Design

In using an IC with large current flow such as power amp, regulator or driver, please design the

device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at

any time and condition. These ICs generate heat even during normal use. An inadequate IC heat

radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In

addition, please design the device taking into considerate the effect of IC heat radiation with

peripheral components.

(2) Back-EMF

When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to

the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power

supply is small, the device’s motor power supply and output pins might be exposed to conditions

beyond absolute maximum ratings. To avoid this problem, take the effect of back-EMF into

consideration in system design.

TD62382AFNG

2006-06-13

About solderability, following conditions were confirmed

• Solderability

(1) Use of Sn-37Pb solder Bath

· solder bath temperature

= 230°C

· dipping time

= 5 seconds

· the number of times = once

· use of R-type flux

(2) Use of Sn-3.0Ag-0.5Cu solder Bath

· solder bath temperature

= 245°C

· dipping time

= 5 seconds

· the number of times = once

· use of R-type flux

RESTRICTION S ON PRODUC T USE 060116EBA

• The information contained herein is subject to change wi th out notic e. 021023_D

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