Analog Devices Welcomes
Hittite Microwave Corporation
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For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
Mixers - siNGLe & DOUBLe BALANCeD - sMT
10
10 - 1
HMC560LM3
GaAs MMIC FUNDAMENTAL
SMT MIXER, 24 - 40 GHz
v02.0215
General Description
Features
Functional Diagram
Wide IF Bandwidth: DC - 17 GHz
Input IP3: +21 dBm
High LO/RF Isolation: 35 dB
Passive Double Balanced Topology
Leadless RoHS Compliant SMT Package, 25 mm2
Electrical Specications, TA = +25° C, IF = 1 GHz, LO = +13 dBm*
Typical Applications
The HMC560LM3 is ideal for:
• Test Equipment & Sensors
• Point-to-Point Radios
• Point-to-Multi-Point Radios
• Military & Space
The HMC560LM3 is a 24 - 40 GHz passive, double-
balanced MMIC mixer in a SMT leadless chip carrier
package. The mixer is fabricated in a GaAs MESFET
process, and can be used as a downconverter or
upconverter. The wide operating bandwidth allows this
device to be used across multiple radio bands with a
common platform. Excellent isolations are provided by
on-chip baluns. The HMC560LM3 requires no external
components and no DC bias. All data is with the non-
hermetic, epoxy sealed LM3 package mounted in a 50
Ohm test xture. Utilizing the HMC560LM3 eliminates
the need for wire bonding, thereby providing a
consistent connection interface for the customer,
and allowing the use of surface mount manufacturing
techniques.
Parameter Min. Typ. Max. Min. Typ. Max. Units
Frequency Range, RF & LO 24 - 36 36 - 40 GHz
Frequency Range, IF DC - 17 DC - 17 GHz
Conversion Loss 10 12 11 14 dB
Noise Figure (SSB) 10 12 11 14 dB
LO to RF Isolation 25 35 22 28 dB
LO to IF Isolation 23 30 18 25 dB
RF to IF Isolation 16 20 20 25 dB
IP3 (Input) 18 21 dBm
IP2 (Input) 50 40 dBm
1 dB Compression (Input) 13 15 dBm
* Unless otherwise noted, all measurements performed as downconverter
For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
Mixers - siNGLe & DOUBLe BALANCeD - sMT
10
10 - 2
Conversion Gain vs.
Temperature @ LO = +13 dBm
Conversion Gain vs. LO Drive
Isolation @ LO +13 dBm
Upconverter Performance
Conversion Gain @ LO = +13 dBm
IF Bandwidth @ LO = +13 dBm
HMC560LM3
v02.0215
-20
-15
-10
-5
0
24 26 28 30 32 34 36 38 40 42
+25 C
+85 C
-40 C
CONVERSION GAIN (dB)
RF FREQUENCY (GHz)
-20
-15
-10
-5
0
0 2 4 6 8 10 12 14 16 18 20
Conversion Gain
IF Return Loss
RESPONSE (dB)
FREQUENCY (GHz)
-20
-15
-10
-5
0
24 26 28 30 32 34 36 38 40 42
+7 dBm
+9 dBm
+11 dBm
+13 dBm
+15 dBm
CONVERSION GAIN (dB)
RF FREQUENCY (GHz)
-20
-15
-10
-5
0
24 26 28 30 32 34 36 38 40 42
CONVERSION GAIN (dB)
RF FREQUENCY (GHz)
-50
-40
-30
-20
-10
0
24 26 28 30 32 34 36 38 40 42
LO/RF
RF/IF
LO/IF
ISOLATION (dB)
FREQUENCY (GHz)
Return Loss @ LO = +13 dBm
-20
-15
-10
-5
0
24 26 28 30 32 34 36 38 40
RF
LO
RETURN LOSS (dB)
FREQUENCY (GHz)
GaAs MMIC FUNDAMENTAL
SMT MIXER, 24 - 40 GHz
For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
Mixers - siNGLe & DOUBLe BALANCeD - sMT
10
10 - 3
Input IP2 vs. LO Drive*
Input IP2 vs.
Temperature @ LO = +13 dBm*
Input IP3 vs.
Temperature @ LO = +13 dBm*
Input P1dB vs.
Temperature @ LO = +13 dBm
Input IP3 vs. LO Drive*
* Two-tone input power = -10 dBm each tone, 1 MHz spacing.
HMC560LM3
v02.0215
0
10
20
30
40
50
60
70
80
24 26 28 30 32 34 36 38 40
+25 C
+85 C
-40 C
IIP2 (dBm)
RF FREQUENCY (GHz)
0
10
20
30
40
50
60
70
80
24 26 28 30 32 34 36 38 40
+9 dBm
+11 dBm
+13 dBm
+15 dBm
IIP2 (dBm)
RF FREQUENCY (GHz)
0
5
10
15
20
24 26 28 30 32 34 36 38 40
+25 C
+85 C
-40 C
P1dB (dBm)
RF FREQUENCY (GHz)
0
5
10
15
20
25
24 26 28 30 32 34 36 38 40
+25 C
+85 C
-40 C
IIP3 (dBm)
RF FREQUENCY (GHz)
0
5
10
15
20
25
24 26 28 30 32 34 36 38 40
+9 dBm
+11 dBm
+13 dBm
+15 dBm
IIP3 (dBm)
RF FREQUENCY (GHz)
Upconverter Performance
Input IP3 @ LO = +13 dBm
0
5
10
15
20
25
24 26 28 30 32 34 36 38 40
IIP3 (dBm)
RF FREQUENCY (GHz)
GaAs MMIC FUNDAMENTAL
SMT MIXER, 24 - 40 GHz
For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
Mixers - siNGLe & DOUBLe BALANCeD - sMT
10
10 - 4
Absolute Maximum Ratings
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Outline Drawing
NOTES:
1. MATERIAL: PLASTIC
2. PLATING: GOLD OVER NICKEL
3. ALL DIMENSIONS IN INCHES (MILLIMETERS)
4. ALL TOLERANCES ARE ±0.005 (±0.13)
5. ALL GROUNDS MUST BE SOLDERED TO PCB RF GROUND
6. • INDICATES PIN 1
RF / IF Input +25 dBm
LO Drive +23 dBm
IF DC Current ±2 mA
Channel Temperature 150 °C/W
Continuous Pdiss (T= 85 °C )
(derate 5.3 mW/ °C above 85 °C) 0.344 W
Thermal Resistance (RTH)
(channel to package bottom) 188 °C/W
Storage Temperature -65 to +150 °C
Operating Temperature -55 to +85 °C
HMC560LM3
v02.0215
MxN Spurious
Outputs as a Down Converter
nLO
mRF 01234
0xx -5 5
13025
258 48 49 58
378 73 63 83
488 85 89
RF = 24 GHz @ -10 dBm
LO = 25 GHz @ +13 dBm
All values in dBc below IF output power level.
GaAs MMIC FUNDAMENTAL
SMT MIXER, 24 - 40 GHz
For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
Mixers - siNGLe & DOUBLe BALANCeD - sMT
10
10 - 5
Pin Number Function Description Interface Schematic
1, 2, 3 N/C This pin may be connected to the PCB ground
or left unconnected.
4 RF This pin is DC coupled
and matched to 50 Ohms.
5 IF
This pin is DC coupled. For applications not requiring
operation to DC, this port should be DC blocked externally
using a series capacitor whose value has been chosen to
pass the necessary IF frequency range. For operation to DC,
this pin must not source or sink more than 2 mA of current or
part non-function and possible part failure will result.
6LO This pin is DC coupled
and matched to 50 Ohms.
GND Package base must be soldered to PCB RF ground.
Pin Descriptions
HMC560LM3
v02.0215 GaAs MMIC FUNDAMENTAL
SMT MIXER, 24 - 40 GHz
For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
Mixers - siNGLe & DOUBLe BALANCeD - sMT
10
10 - 6
Evaluation PCB
Evaluation Circuit Board Layout Design Details
Layout Technique Micro Strip to CPWG
Material Rogers 4003 with 1/2 oz. Cu
Dielectric Thickness 0.008” (0.20 mm)
Microstrip Line Width 0.018” (0.46 mm)
CPWG Line Width 0.016” (0.41 mm)
CPWG Line to GND Gap 0.005” (0.13 mm)
Ground Via Hole Diameter 0.008” (0.20 mm)
The grounded Co-Planar Wave Guide (CPWG) PCB input/output transitions allow use of Ground-Signal-Ground
(GSG) probes for testing. Suggested probe pitch is 400 mm (16 mils).
LM3 package mounted to evaluation PCB
HMC560LM3
v02.0215 GaAs MMIC FUNDAMENTAL
SMT MIXER, 24 - 40 GHz
For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
Mixers - siNGLe & DOUBLe BALANCeD - sMT
10
10 - 7
Suggested LM3 PCB Land Pattern
NOTES:
1. DIMENSIONS ARE IN INCHES [MILLIMETERS]
2. PAD WIDTH SHOWN IS FOR SOLDERING ONLY.
BEYOND SOLDERING AREA ALL CONDUCTORS THAT
CARRY RF AND MICROWAVE SIGNALS SHOULD
HAVE 50 OHM CHARACTERISTIC IMPEDANCE.
HMC560LM3
v02.01215 GaAs MMIC FUNDAMENTAL
SMT MIXER, 24 - 40 GHz
For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
Mixers - siNGLe & DOUBLe BALANCeD - sMT
10
10 - 8
Recommended SMT Attachment Technique
Preparation & Handling of the LM3 Millimeterwave Package for Surface Mounting
The HMC LM3 package was designed to be compatible with high
volume surface mount PCB assembly processes. The LM3 package
requires a specic mounting pattern to allow proper mechanical
attachment and to optimize electrical performance at millimeter wave
frequencies. This PCB layout pattern can be found on each LM3
product data sheet. It can also be provided as an electronic drawing
upon request from Hittite Sales & Application Engineering.
Follow these precautions to avoid permanent damage:
Cleanliness: Observe proper handling procedures to ensure clean
devices and PCBs. LM3 devices should remain in their original
packaging until component placement to ensure no contamination or damage to RF, DC & ground contact areas.
Static Sensitivity: Follow ESD precautions to protect against ESD strikes.
General Handling: Handle the LM3 package on the top with a vacuum collet or along the edges with a sharp pair
of bent tweezers. Avoiding damaging the RF, DC, & ground contacts on the package bottom. Do not apply excess
pressure to the top of the lid.
Solder Materials & Temperature Prole: Follow the information contained in the application note. Hand soldering is not
recommended. Conductive epoxy attachment is not recommended.
Solder Paste: Solder paste should be selected based on the user’s experience and be compatible with the metalization
systems used. See the LM3 data sheet Outline drawing for pin & ground contact metalization schemes.
Solder Paste Application: Solder paste is generally applied to the PCB using either a stencil printer or dot placement.
The volume of solder paste will be dependent on PCB and component layout and should be controlled to ensure
consistent mechanical & electrical performance. Excess solder may create unwanted electrical parasitics at high
frequencies.
Solder Reow: The soldering process is usually accomplished in a reow oven but may also use a vapor phase
process. A solder reow prole is suggested above.
Prior to reowing product, temperature proles should be measured using the same mass as the actual assemblies.
The thermocouple should be moved to various positions on the board to account for edge and corner effects and
varying component masses. The nal prole should be determined by mounting the thermocouple to the PCB at the
location of the device.
Follow solder paste and oven vendor’s recommendations when developing a solder reow prole. A standard prole
will have a steady ramp up from room temperature to the pre-heat temperature to avoid damage due to thermal shock.
Allow enough time between reaching pre-heat temperature and reow for the solvent in the paste to evaporate and the
ux to completely activate. Reow must then occur prior to the ux being completely driven off. The duration of peak
reow temperature should not exceed 15 seconds. Packages have been qualied to withstand a peak temperature of
235°C for 15 seconds. Verify that the prole will not expose device to temperatures in excess of 235°C.
Cleaning: A water-based ux wash may be used.
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TEMPERATURE (0C)
TIME (min)
HMC560LM3
v02.0215 GaAs MMIC FUNDAMENTAL
SMT MIXER, 24 - 40 GHz
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