cExpress-BT COM Express(R) Compact Size Type 6 Module with Intel(R) AtomTM E3800 series or Celeron(R) Processor SoC Features Single, dual, quad-core Intel(R) AtomTM or Celeron(R) Processor SoC Up to 8GB Dual Channel DDR3L at 1333MHz VGA and two DDI channels (build option LVDS) Three PCIe x1, GbE Two SATA 3Gb/s, one USB 3.0, seven USB 2.0 Supports Smart Embedded Management Agent (SEMA(R)) functions Extreme Rugged operating temperature: -40C to +85C (build option) Specifications Core System CPU Single, dual, quad-core Intel(R) AtomTM or Celeron(R) Processor AtomTM E3845 1.91 GHz 542/792 (Turbo) 10W (4C/1333) AtomTM E3827 1.75 GHz 542/792 (Turbo) 8W (2C/1333) AtomTM E3826 1.46 GHz 533/667 (Turbo) 7W (2C/1066) AtomTM E3825 1.33 GHz 533 (No Turbo) 6W (2C/1066) AtomTM E3815 1.46 GHz 400 (No Turbo) 5W (1C/1066) AtomTM E3805 1.33 GHz (No GFX) 3W (2C/1066) Celeron(R) N2930 1.83/2.16 (Burst) GHz, 313/854 (Turbo) 7.5W (4C/1333) Celeron(R) J1900 2.0/2.42 (Burst) GHz, 688/854 (Turbo) 10W (4C/1333) Supports: Single, dual or quad Out-of-Order Execution (OOE) processor cores, Intel(R) VT-x, Intel(R) SSE4.1 and SSE4.2, Intel(R) 64 architecture, IA 32-bit , PCLMULQDQ Instruction DRNG, Intel(R) Thermal Monitor (TM1 & TM2) Note: Availability of features may vary between processor SKUs. Memory Dual channel non-ECC 1333/1066 MHz DDR3L memory up to 8GB in dual stacked SODIMM sockets Embedded BIOS AMI EFI with CMOS backup in 8MB SPI BIOS Video GPU Feature Support 7th generation Intel(R) graphics core architecture with four execution units supporting two independent displays 3D graphics hardware acceleration Supports DirectX 11, OCL 1.1, OGL ES Halt/2.0/1.1, OGL 3.2 Video decode hardware acceleration including support for H.264, MPEG2, MVC, VC-1, WMV9 and VP8 formats Video encode hardware acceleration including support for H.264, MPEG2 and MVC formats Digital Display Interface DDI1 supporting DisplayPort/HDMI/DVI (build option dual channel 18/24-bit LVDS support) DDI2 supporting DisplayPort/HDMI/DVI VGA Analog VGA supporting resolutions of up to 2560 x 1600 x 24bpp @60 Audio Chipset Cache Intel(R) HD Audio integrated in SoC Primary 32 KB, 8-way L1 instruction cache and 24 KB, 6-way L1 write-back data cache 2MB for E3845, N2930 and J1900 1MB for E3827, E3826, E3825 and E3805 512K for E3815 Located on carrier Express-BASE6 Expansion Busses 3 PCI Express x1 Gen2 (AB): Ianes 0/1/2; build option PCIe x4 (lose GbE) LPC bus, SMBus (system), I2C (user) Audio Codec Ethernet Intel(R) MAC/PHY: Intel(R) i210LM (MAC/PHY) Ethernet controller Interface: 10/100/1000 GbE connection SEMA Board Controller Supports: Voltage/Current monitoring, Power sequence debug support, AT/ ATX mode control, Logistics and Forensic information, Flat Panel Control, General Purpose I2C, Failsafe BIOS (dual BIOS), Watchdog Timer and Fan Control Debug Headers 40-pin multipurpose flat cable connector Use in combination with DB-40 debug module providing BIOS POST code LED, BMC access, SPI BIOS flashing, Power test points, Debug LEDs 26-pin XDP header for ICE debug of CPU/chipset Note: "build option" indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these "build option" part numbers will need to be newly created and this will result in production lead times. Specifications I/O Interfaces USB: 1x USB 3.0 (USB 0) 6x USB 1.1/2.0 (USB 1/2/3/4/5/6, ports 3-6 from USB hub) SATA: Two SATA 3 Gb/s ports Serial: 2 UART ports COM 0/1 (COM 0 support console redirection) eMMC: Build option soldered on module bootable eMMC flash storage 8 to 32 GB SDIO: On module mini SD card socket, eMMC feature may vary between OS GPIO: 4 GPO and 4 GPI Super I/O On carrier if needed (standard support for W83627DHG-P) TPM Chipset: Atmel AT97SC3204 (build option) Type: TPM 1.2 Power Standard Input: ATX = 12V5% / 5Vsb 5% or AT = 12V5% Wide Input: ATX = 5~20 V / 5Vsb 5% or AT = 5 ~20V Management: ACPI 4.0 compliant, Smart Battery support Power States: C0, C1, C1E, C4, C6 S0, S3, S4, S5 (Wake on USB S3 for port 0~7/S4 for port 0~3, WOL S3/S4/S5 ECO mode: Wake on USB S3/S4, WOL S3/S4/S5 Mechanical and Environmental Specification: PICMG COM.0: Rev 2.1 Type 6 Form Factor: Compact size: 95 mm x 95 mm Operating Temperature Standard: 0C to +60C Extreme RuggedTM: -40C to +85C (build option, AtomTM E38xx series only) Humidity 5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test Operating Systems Standard Support Windows 7/8 32/64-bit, Linux 32/64-bit Extended Support (BSP) WES7/8, Linux, VxWorks 32/64-bit WEC7 32-bit Note: "Build option" indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that part numbers for SKUs with "build options" will need to be created and may cause production lead times. Functional Diagram SODIMM 1~4 GB DDR3L non ECC Analog VGA LVDS eDP to LVDS Realtek eDP 2 lanes Single/dual channel 18/24-bit LVDS (optional) 3x USB 2.0/1.0 (ports 0~2) 1x USB 2.0/1.1 USB Hub 4x USB 2.0/1.1 (ports 3~6) Intel(R) AtomTM E3845 E3827 E3826 E3825 E3815 E3805 (No GFX) DDI1 (4 lanes) DP/eDP/TMDS Intel(R) Celeron(R) DDI2 (4 lanes) DP/eDP/TMDS N2930 J1900 "Baytrail" 3x PCIe x1 Gen2 (opt. 4x) (port 0,1,2) 1x USB 3.0 upgrade (port 0) XDP 26 PCIe x1 altern. route GbE i210 SODIMM 1~4 GB DDR3L non ECC PCIe x1 Gen2 (port 3) eMMC 8~32GB 2x SATA 3Gb/s (port 0/1) HD Audio UART0, UART1 Mini SD Socket TPM Atmel AT97SC3204 LPC bus 4x GP0 4x GPI SPI 0 BIOS GPIO PCA9535 SMBus GP I2C DDC I2C SPI_CS# SPI SEMA BMC SPI 1 BIOS LM73 Ordering Information Accessories cExpress-BT-E3845 Compact COM Express(R) Type 6 Module with Intel(R) AtomTM E3845 at 1.91 GHz Heat Spreaders cExpress-BT-E3827 Compact COM Express(R) Type 6 Module with Intel(R) AtomTM E3827 at 1.75 GHz cExpress-BT-E3826 Compact COM Express(R) Type 6 Module with Intel(R) AtomTM E3826 at 1.46 GHz HTS-cBT-B Heatspreader for cExpress-BT with threaded standoffs for bottom mounting HTS-cBT-BT Heatspreader for cExpress-BT with through hole standoffs for top mounting Passive Heatsinks cExpress-BT-E3825 Compact COM Express(R) Type 6 Module with Intel(R) AtomTM E3825 at 1.33 GHz cExpress-BT-E3815 Compact COM Express(R) Type 6 Module with Intel(R) AtomTM E3815 at 1.46 GHz cExpress-BT-E3805 Compact COM Express Type6 Module with Intel(R) AtomTM E3805 at 1.33 GHz cExpress-BT-J1900 Compact COM Express(R) Type 6 Module with Intel(R) Celeron(R) J1900 at 2.00 GHz cExpress-BT-N2930 Compact COM Express(R) Type 6 Module with Intel(R) Celeron(R) N2930 at 1.83 GHz THS-cBT-B Low profile heatsink for cExpress-BT with threaded standoffs for bottom mounting THSH-cBT-B High profile heatsink for cExpress-BT with threaded standoffs for bottom mounting Active Heatsink THSF-cBT-B High profile heatsink with Fan for cExpress-BT with threaded standoffs for bottom mounting (-40C to + 85C build option) Starter Kit COM Express Type 6 Starter Kit Plus COM Express formfactor starter kit with Express-BASE6 board, power supply, and accessory kit www.adlinktech.com All products and company name listed are trademarks or trade names of their respective companies. Updated Oct. 14, 2016. (c)2016 ADLINK Technology, Inc. All Rights Reserved. All specifications are subject to change without further notice. Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: ADLINK Technology: t2cExpress-BT-E3845 cExpress-BT-E3815 HTS-cBT-B cExpress-BT-N2920 t2cExpress-BT-E3815 cExpress-BTE3845 cExpress-BT-J1900 t2cExpress-BT-E3826 t2cExpress-BT-E3825 t2cExpress-BT-E3827 cExpress-BT-E3826 cExpress-BT-E3827 cExpress-BT-E3825 THSH-cBT-B THS-cBT-B HTS-cBT-BT cExpress-BT-N2930 THSF-cBT-B