Semiconductor Components Industries, LLC, 2012
January, 2012 − Rev. 4
1Publication Order Number:
MBRS2040LT3/D
MBRS2040LT3G,
NRVBS2040LT3G
Surface Mount
Schottky Power Rectifier
SMB Power Surface Mount Package
. . . employing the Schottky Barrier principle in a metal−to−silicon
power rectifier. Features epitaxial construction with oxide passivation
and metal overlay contact. Ideally suited for low voltage, high
frequency switching power supplies; free wheeling diodes and
polarity protection diodes.
Features
Compact Package with J−Bend Leads Ideal for Automated Handling
Highly Stable Oxide Passivated Junction
Guardring for Over−Voltage Protection
Low Forward Voltage Drop
ESD Ratings:
Human Body Model = 3B (> 16000 V)
Machine Model = C (> 400 V)
AEC−Q101 Qualified and PPAP Capable
NRVB Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements
All Packages are Pb−Free*
Mechanical Characteristics
Case: Molded Epoxy
Epoxy Meets UL94, VO at 1/8
Weight: 95 mg (approximately)
Maximum Temperature of 260C / 10 Seconds for Soldering
Cathode Polarity Band
Available in 12 mm Tape, 2500 Units per 13 inch Reel, Add “T3”
Suffix to Part Number
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Marking: BKJL
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
http://onsemi.com
Device Package Shipping†
ORDERING INFORMATION
SMB
CASE 403A
SCHOTTKY BARRIER
RECTIFIER
2.0 AMPERES
40 VOLTS
MARKING DIAGRAM
MBRS2040LT3G SMB
(Pb−Free)
2,500 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
NRVBS2040LT3G SMB
(Pb−Free)
2,500 /
Tape & Reel
BKJL = Specific Device Code
A = Assembly Location
Y = Year
WW = Work Week
G= Pb−Free Package
AYWW
BKJLG
G
(Note: Microdot may be in either location)
MBRS2040LT3G, NRVBS2040LT3G
http://onsemi.com
2
MAXIMUM RATINGS
Rating Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
40 V
Average Rectified Forward Current
(At Rated VR, TC = 103C)
IO2.0
A
Peak Repetitive Forward Current
(At Rated VR, Square Wave, 20 kHz, TC = 104C)
IFRM 4.0
A
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)
IFSM 70
A
Storage Temperature Tstg, TC−55 to +150 C
Operating Junction Temperature TJ−55 to +125 C
Voltage Rate of Change
(Rated VR, TJ = 25C)
dv/dt
10,000
V/ms
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
THERMAL CHARACTERISTICS
Characteristic Symbol Value Unit
Thermal Resistance — Junction−to−Lead (Note 1)
Thermal Resistance — Junction−to−Ambient (Note 2)
RJL
RJA
22.5
78
C/W
1. Minimum pad size (0.108 X 0.085 inch) for each lead on FR4 board.
2. 1 inch square pad size (1 x 0.5 inch for each lead) on FR4 board.
ELECTRICAL CHARACTERISTICS
Characteristic Symbol Value Unit
Maximum Instantaneous Forward Voltage (Note 3)
see Figure 2
(IF = 2.0 A)
(IF = 4.0 A)
VFTJ = 25C TJ = 125CVolts
0.43
0.50
0.34
0.45
Maximum Instantaneous Reverse Current (Note 3)
see Figure 4
(VR = 40 V)
(VR = 20 V)
IRTJ = 25C TJ = 100CmA
0.8
0.1
20
6.0
3. Pulse Test: Pulse Width 250 s, Duty Cycle 2.0%.
MBRS2040LT3G, NRVBS2040LT3G
http://onsemi.com
3
Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage
Figure 3. Typical Reverse Current Figure 4. Maximum Reverse Current
Figure 5. Current Derating Figure 6. Forward Power Dissipation
0
vF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
100
10
1.0
VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
0
1.0
0.1
400
VR, REVERSE VOLTAGE (VOLTS)
100E-3
10E-3
1.0E-3
100E-6
10E-6
1.0E-6
VR, REVERSE VOLTAGE (VOLTS)
20 600
TL, LEAD TEMPERATURE (C)
3.5
2.0
1.5
1.0
0.5
0
IO, AVERAGE FORWARD CURRENT (AMPS)
0.50
1.2
1.0
0.8
0.6
0.2
0
2.040
iF, INSTANTANEOUS FORWARD CURRENT (AMPS)
I
0.1
0.60.2 0.4 0.8 0.2 0.4 0.6 0.8
10
100
10 20 30
, AVERAGE FORWARD CURRENT (AMPS)IO
80 120100
2.5
1.0 1.5 2.5 3.0
0.4
PFO, AVERAGE POWER DISSIPATION (WATTS) IF, INSTANTANEOUS FORWARD CURRENT (AMPS)
, REVERSE CURRENT (AMPS)
R
400
VR, REVERSE VOLTAGE (VOLTS)
100E-3
10E-3
1.0E-3
100E-6
10E-6
1.0E-6
I
10 20 30
, MAXIMUM REVERSE CURRENT (AMPS)
R
140
3.0
TJ = 125C
TJ = 100C
TJ = -40C
TJ = 25C
TJ = 125C
TJ = 100C
TJ = 25C
TJ = 125C
TJ = 100C
TJ = 25C
TJ = 125C
TJ = 100C
TJ = 25C
SQUARE WAVE
dc
Ipk/Io = p
Ipk/Io = 5
Ipk/Io = 10
Ipk/Io = 20
Ipk/Io = 20
Ipk/Io = 10
Ipk/Io = 5
Ipk/Io = p
SQUARE WAVE
dc
100
MBRS2040LT3G, NRVBS2040LT3G
http://onsemi.com
4
Figure 7. Capacitance Figure 8. Typical Operating Temperature Derating*
Figure 9. Thermal Response Junction to Lead
Figure 10. Thermal Response Junction to Ambient
300
VR, REVERSE VOLTAGE (VOLTS)
1000
100
10
VR, DC REVERSE VOLTAGE (VOLTS)
25 400
105
85
75
65
1000.10.00001
T, TIME (s)
1.0
0.1
0.01
C, CAPACITANCE (pF)
T
R
155.0 10 20 25 35 40 30 355.0 10 2015
95
115
125
0.0001 0.001 0.01 1.0 10
, DERATED OPERATING TEMPERATURE ( C)
J
0.001
, TRANSIENT THERMAL RESISTANCE (NORMALIZED)
(T)
T, TIME (s)
1.0
0.1
0.01
R
0.001
, TRANSIENT THERMAL RESISTANCE (NORMALIZED)
(T)
* Reverse power dissipation and the possibility of thermal runaway must be considered when operating this device under any re-
verse voltage conditions. Calculations of TJ therefore must include forward and reverse power effects. The allowable operating
TJ may be calculated from the equation: TJ = TJmax − r(t)(Pf + Pr) where
r(t) = thermal impedance under given conditions,
Pf = forward power dissipation, and
Pr = reverse power dissipation
This graph displays the derated allowable TJ due to reverse bias under DC conditions only and is calculated as TJ = TJmax − r(t)Pr,
where r(t) = Rthja. For other power applications further calculations must be performed.
Rtja = 22.5C/W
42C/W
61C/W
78C/W
92C/W
Rtjl(t) = Rtjl*r(t)
50%
20%
10%
5.0%
2.0%
1.0%
1000.10.00001 1,0000.0001 0.001 0.01 1.0 10
Rtjl(t) = Rtjl*r(t)
50%
20%
10%
5.0%
2.0%
1.0%
TJ = 25C
MBRS2040LT3G, NRVBS2040LT3G
http://onsemi.com
5
PACKAGE DIMENSIONS
SMB
CASE 403A−03
ISSUE H
E
bD
c
L1
L
A
A1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.
2.261
0.089
2.743
0.108
2.159
0.085 ǒmm
inchesǓ
SCALE 8:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
DIM
A
MIN NOM MAX MIN
MILLIMETERS
1.90 2.20 2.28 0.075
INCHES
A1 0.05 0.10 0.19 0.002
b1.96 2.03 2.20 0.077
c0.15 0.23 0.31 0.006
D3.30 3.56 3.95 0.130
E4.06 4.32 4.60 0.160
L0.76 1.02 1.60 0.030
0.087 0.090
0.004 0.007
0.080 0.087
0.009 0.012
0.140 0.156
0.170 0.181
0.040 0.063
NOM MAX
5.21 5.44 5.60 0.205 0.214 0.220
HE
0.51 REF 0.020 REF
D
L1
HE
POLARITY INDICATOR
OPTIONAL AS NEEDED
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
MBRS2040LT3/D
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
