TL/F/9463
54F/74F32 Quad 2-Input OR Gate
December 1994
54F/74F32
Quad 2-Input OR Gate
General Description
This device contains four independent gates, each of which
performs the logic OR function.
Features
YGuaranteed 4000V minimum ESD protection
Commercial Military Package Package Description
Number
74F32PC N14A 14-Lead (0.300×Wide) Molded Dual-In-Line
54F32DM (Note 2) J14A 14-Lead Ceramic Dual-In-Line
74F32SC (Note 1) M14A 14-Lead (0.150×Wide) Molded Small Outline, JEDEC
74F32SJ (Note 1) M14D 14-Lead (0.300×Wide) Molded Small Outline, EIAJ
54F32FM (Note 2) W14B 14-Lead Cerpack
54F32LM (Note 2) E20A 20-Lead Ceramic Leadless Chip Carrier, Type C
Note 1: Devices also available in 13×reel. Use suffix eSCX and SJX.
Note 2: Military grade device with environmental and burn-in processing. Use suffix eDMQB, FMQB and LMQB.
Logic Symbol
IEEE/IEC
TL/F/9463–3
Connection Diagrams
Pin Assignment for
DIP, SOIC and Flatpak
TL/F/9463–2
Pin Assignment
for LCC
TL/F/9463–1
Unit Loading/Fan Out
54F/74F
Pin Names Description U.L. Input IIH/IIL
HIGH/LOW Output IOH/IOL
An,B
nInputs 1.0/1.0 20 mA/b0.6 mA
OnOutputs 50/33.3 b1 mA/20 mA
TRI-STATEÉis a registered trademark of National Semiconductor Corporation.
C1995 National Semiconductor Corporation RRD-B30M75/Printed in U. S. A.
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
Storage Temperature b65§Ctoa
150§C
Ambient Temperature under Bias b55§Ctoa
125§C
Junction Temperature under Bias b55§Ctoa
175§C
Plastic b55§Ctoa
150§C
VCC Pin Potential to
Ground Pin b0.5V to a7.0V
Input Voltage (Note 2) b0.5V to a7.0V
Input Current (Note 2) b30 mA to a5.0 mA
Voltage Applied to Output
in HIGH State (with VCC e0V)
Standard Output b0.5V to VCC
TRI-STATEÉOutput b0.5V to a5.5V
Current Applied to Output
in LOW State (Max) twice the rated IOL (mA)
ESD Last Passing Voltage (Min) 4000V
Note 1: Absolute maximum ratings are values beyond which the device may
be damaged or have its useful life impaired. Functional operation under
these conditions is not implied.
Note 2: Either voltage limit or current limit is sufficient to protect inputs.
Recommended Operating
Conditions
Free Air Ambient Temperature
Military b55§Ctoa
125§C
Commercial 0§Ctoa
70§C
Supply Voltage
Military a4.5V to a5.5V
Commercial a4.5V to a5.5V
DC Electrical Characteristics
Symbol Parameter 54F/74F Units VCC Conditions
Min Typ Max
VIH Input HIGH Voltage 2.0 V Recognized as a HIGH Signal
VIL Input LOW Voltage 0.8 V Recognized as a LOW Signal
VCD Input Clamp Diode Voltage b1.2 V Min IIN eb
18 mA
VOH Output HIGH 54F 10% VCC 2.5 IOH eb
1mA
Voltage 74F 10% VCC 2.5 V Min IOH eb
1mA
74F 5% VCC 2.7 IOH eb
1mA
V
OL Output LOW 54F 10% VCC 0.5 V Min IOL e20 mA
Voltage 74F 10% VCC 0.5 IOL e20 mA
IIH Input HIGH 54F 20.0
mA Max VIN e2.7V
Current 74F 5.0
IBVI Input HIGH Current 54F 100
mA Max VIN e7.0V
Breakdown Test 74F 7.0
ICEX Output HIGH 54F 250
mA Max VOUT eVCC
Leakage Current 74F 50
VID Input Leakage 74F 4.75 V 0.0 IID e1.9 mA
Test All Other Pins Grounded
IOD Output Leakage 74F 3.75 mA 0.0 VIOD e150 mV
Circuit Current All Other Pins Grounded
IIL Input LOW Current b0.6 mA Max VIN e0.5V
IOS Output Short-Circuit Current b60 b150 mA Max VOUT e0V
ICCH Power Supply Current 6.1 9.2 mA Max VOeHIGH
ICCL Power Supply Current 10.3 15.5 mA Max VOeLOW
2
AC Electrical Characteristics
74F 54F 74F
TAea
25§CTA,V
CC eMil TA,V
CC eCom
Symbol Parameter VCC ea
5.0V CLe50 pF CLe50 pF Units
CLe50 pF
Min Typ Max Min Max Min Max
tPLH Propagation Delay 3.0 4.2 5.6 3.0 7.5 3.0 6.6 ns
tPHL An,B
nto On3.0 4.0 5.3 2.5 7.5 3.0 6.3
Ordering Information
The device number is used to form part of a simplified purchasing code where the package type and temperature range are
defined as follows:
74F 32 S C X
Temperature Range Family Special Variations
74F eCommercial QB eMilitary grade device with
54F eMilitary environmental and burn-in
processing
Device Type XeDevices shipped in 13×reels
Package Code Temperature Range
PePlastic DIP CeCommercial (0§Ctoa
70§C)
DeCeramic DIP MeMilitary (b55§Ctoa
125§C)
FeFlatpak
LeLeadless Chip Carrier (LCC)
SeSmall Outline SOIC JEDEC
SJ eSmall Outline SOIC EIAJ
Physical Dimensions inches (millimeters)
20-Lead Ceramic Leadless Chip Carrier (L)
NS Package Number E20A
3
Physical Dimensions inches (millimeters) (Continued)
14-Lead Ceramic Dual-In-Line Package (D)
NS Package Number J14A
14-Lead (0.150×Wide) Molded Small Outline Package, JEDEC (S)
NS Package Number M14A
4
Physical Dimensions inches (millimeters) (Continued)
14-Lead (0.300×Wide) Molded Small Outline Package, EIAJ (SJ)
NS Package Number M14D
14-Lead (0.300×Wide) Molded Dual-In-Line Package (P)
NS Package Number N14A
5
54F/74F32 Quad 2-Input OR Gate
Physical Dimensions inches (millimeters) (Continued)
14-Lead Ceramic Flatpak (F)
NS Package Number W14B
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SEMICONDUCTOR CORPORATION. As used herein:
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systems which, (a) are intended for surgical implant support device or system whose failure to perform can
into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life
failure to perform, when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can effectiveness.
be reasonably expected to result in a significant injury
to the user.
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